Chip carrier breaking device

Abstract

The utility model relates to the technical field of optical chip testing, in particular to a chip carrier breaking device. The chip carrier breaking device comprises a base, a placing seat and a breaking assembly, wherein the placing seat and the breaking assembly are arranged on the base; the base is provided with a placing seat, the placing seat is provided with an accommodating groove for accommodating a chip carrier, and the depth of the accommodating groove is smaller than the length of the chip carrier, so that after the chip carrier is placed in the accommodating groove, a bonding pad part of the chip carrier is positioned outside the accommodating groove; the bonding pad part of the chip carrier is located on the moving path of the impact block, so that the impact block can be utilized to impact the bonding pad part of the chip carrier, and the bonding pad part is broken off. In this way, the bonding pad does not need to be partially packaged in the optical device during packaging, so that the size of the chip carrier needing to be packaged in the optical device is small, the chip carrier can be conveniently packaged in the optical device, and miniaturization of the optical device is facilitated.

Description

Technical Field

[0001] The utility model relates to the field of optical chip testing, in particular to a chip carrier breaking device. Background Art

[0002] Before mass production of optical devices, the optical chip needs to be tested to determine whether the optical chip can be used in optical devices based on the test results.

[0003] In order to test the optical chip, it is usually necessary to mount the optical chip on a chip carrier. The power-on device contacts the pad part on the chip carrier through a probe to complete the power-on requirement for testing the optical chip. If the test passes, the optical chip and the chip carrier will be packaged together into the optical device.

[0004] Due to the existence of the pad part, the chip carrier is relatively large in size, so the packaging of the chip carrier is relatively difficult. Occasionally, it is necessary to increase the size of the optical device to reduce the packaging difficulty, which is not conducive to the miniaturization of the optical device. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the utility model is to provide a chip carrier breaking device to solve the problem that the chip carrier in the prior art is relatively large in size, relatively difficult to package, and not conducive to the miniaturization of optical devices.

[0006] The chip carrier breaking device provided by the embodiment of the utility model includes: a base; a placement seat, which is installed on the base, and the placement seat is provided with a receiving groove, the receiving groove is used to receive the chip carrier equipped with an optical chip, the receiving groove has an adjacent area adjacent to the notch of the receiving groove, the depth of the receiving groove is smaller than the length of the chip carrier, so that the pad part of the chip carrier can be accommodated in the adjacent area; a breaking component, which includes a collision block, the collision block is movably connected to the base, and the adjacent area is located on the movable path of the collision block, so that the collision block can act on the pad part of the chip carrier and break the pad part of the chip carrier.

[0007] Optionally, the impact block is slidably connected to the base in a first direction; a through opening is also provided on the placement seat, and the through opening connects the accommodating groove with the external space of the placement seat in a second direction, and the second direction is perpendicular to the first direction; the chip carrier breaking device also includes a pressure component, and the pressure component includes a pressure block, which is slidably connected to the base in the second direction, and the pressure block is arranged in alignment with the through opening in the second direction.

[0008] Optionally, the pressure-applying assembly further includes: a spring, one end of which is connected to a side of the pressure block facing away from the accommodating groove; and a force-applying member, which is connected to the other end of the spring.

[0009] Optionally, a mounting groove is provided on a side of the force applying member facing the accommodating groove, and the spring is completely accommodated in the mounting groove.

[0010] Optionally, the pressure-applying assembly further includes: a first slide rail, which is disposed on the base along the second direction; a first slider, which is slidably connected to the first slide rail, and the pressure block is mounted on the first slider.

[0011] Optionally, a notch is provided on a side of the placement seat facing the base, and the notch is connected to a side of the placement seat facing the first sliding block, and the first sliding rail is at least partially accommodated in the notch.

[0012] Optionally, a surface of the impact block facing the adjacent area is an inclined surface, and in the direction of the bottom of the accommodating groove, the inclined surface gradually extends toward a direction approaching the adjacent area.

[0013] Optionally, the accommodating groove includes a first groove wall away from the impact block, and a first avoidance groove is provided on the first groove wall. The first avoidance groove is used to accommodate the optical chip and the wire connecting the chip carrier and the optical chip; the length of the chip carrier in the second direction is smaller than the length of the first avoidance groove in the second direction.

[0014] Optionally, the accommodating groove comprises two second groove walls arranged opposite to each other in the second direction, and the two second groove walls are each provided with a second avoidance groove, and the two second avoidance grooves are respectively used to accommodate two clamping arms of the clamping member.

[0015] Optionally, the breaking assembly also includes: a second slide rail, which is arranged on the base along the first direction; a second slider, which is slidably connected to the second slide rail; a support block, the bottom of which is mounted on the second slider, and the impact block is mounted on the top of the support block.

[0016] Compared with the prior art, the chip carrier breaking device provided by the embodiment of the utility model has the following beneficial effects: the chip carrier breaking device provided by the embodiment of the utility model includes a base, a placement seat installed on the base, and a breaking assembly; the placement seat is provided with a receiving groove for accommodating the chip carrier, the depth of the receiving groove is less than the length of the chip carrier, so after the chip carrier is placed in the receiving groove, the pad part of the chip carrier will be located outside the receiving groove, and the breaking assembly includes a collision block movably connected to the base, and the pad part of the chip carrier is on the active path of the collision block, so the collision block can be used to impact the pad part of the chip carrier, so that the pad part is broken. In this way, there is no need to package the pad part into the optical device during packaging, so that the volume of the chip carrier that needs to be packaged into the optical device will be relatively small, which is convenient for packaging the chip carrier into the optical device, and is conducive to the miniaturization of the optical device. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The specific implementation of the utility model will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0018] Figure 1 It is a three-dimensional schematic diagram of a chip carrier breaking device provided by an embodiment of the utility model;

[0019] Figure 2 It is a three-dimensional schematic diagram of the chip carrier, optical chip and wires;

[0020] Figure 3 yes Figure 2 The structure shown is installed in a three-dimensional schematic diagram of a chip carrier breaking device provided in an embodiment of the utility model;

[0021] Figure 4 yes Figure 3 a side view of the structure shown;

[0022] Figure 5 yes Figure 2 In the structure shown, a three-dimensional schematic diagram of the chip carrier after being broken off;

[0023] Figure 6 yes Figure 1 Another three-dimensional schematic diagram of the chip carrier breaking device shown;

[0024] Figure 7 yes Figure 2 The structure shown is installed in a three-dimensional schematic diagram of a placement seat provided in an embodiment of the utility model;

[0025] Figure 8 It is a three-dimensional schematic diagram of the pressure-applying assembly provided by the embodiment of the utility model after omitting the pressure block;

[0026] Fig. 9 yes Figure 1 A partial enlarged schematic diagram of position B in the middle;

[0027] Fig.10 It is a three-dimensional schematic diagram of the breaking assembly provided by an embodiment of the utility model.

[0028] The reference numerals in the figures are:

[0029] 100. Chip carrier breaking device;

[0030] 10. Base;

[0031] 11. Placement seat; 111. Accommodation groove; 1111. First groove wall; 1112. Second groove wall; 112. Through opening; 113. Notch; 114. First avoidance groove; 115. Second avoidance groove;

[0032] 12. Breaking assembly; 121. Impact block; 1211. Inclined surface; 122. Second slide rail; 1221. Second undercut structure; 123. Second slide block; 124. Support block; 125. Push plate;

[0033] 13. Pressure assembly; 131. Pressure block; 132. Spring; 133. Force member; 1331. Mounting slot; 134. First slide rail; 1341. First undercut structure; 135. First slide block;

[0034] 600, optical chip;

[0035] 700, chip carrier; 71, pad portion;

[0036] 800, adjacent area;

[0037] 900. Wire. DETAILED DESCRIPTION

[0038] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. Now, in conjunction with the accompanying drawings, a preferred embodiment of the present utility model is described in detail.

[0039] The present utility model provides a chip carrier breaking device 100, such as Figure 1-Figure 5As shown, a chip carrier breaking device 100 includes a base 10, a placement seat 11 and a breaking assembly 12. The placement seat 11 is installed on the base 10, and a receiving groove 111 is provided on the placement seat 11. The receiving groove 111 is used to receive a chip carrier 700 equipped with an optical chip 600. The receiving groove 111 has an adjacent area 800 adjacent to the notch of the receiving groove 111. The depth of the receiving groove 111 is less than the length of the chip carrier 700, so that the pad portion 71 of the chip carrier 700 is accommodated in the adjacent area 800. The breaking assembly 12 includes a collision block 121, which is movably connected to the base 10, and the adjacent area 800 is located on the movable path of the collision block 121, so that the collision block 121 can act on the pad portion 71 of the chip carrier 700 and break the pad portion 71 of the chip carrier 700.

[0040] By implementing this embodiment, the chip carrier 700 can be placed in the receiving groove 111. Since the depth of the receiving groove 111 is less than the length of the chip carrier 700, the chip carrier 700 is only partially received in the receiving groove 111, and the other part (the pad part 71) is located at the adjacent area 800 outside the receiving groove 111. Since the adjacent area 800 is located on the moving path of the impact block 121, when the impact block 121 moves to the adjacent area 800, it will abut against the pad part 71 of the chip carrier 700 and apply a force to the chip carrier 700. When the impact block 121 applies a force to the chip carrier 700, the groove wall of the accommodating groove 111 applies a reverse force to the chip carrier 700, and the impact block 121, the groove wall of the accommodating groove 111 and the chip carrier 700 contact at different positions, so when the impact block 121 applies a force to the chip carrier 700 that reaches a certain value, the pad portion 71 of the chip carrier 700 will be broken off. The chip carrier 700 after being broken off is relatively small in size, which makes it easy to package the chip carrier 700 inside the optical device, and is conducive to miniaturization of the optical device.

[0041] It should be noted that the broken part is the pad part 71 of the chip carrier 700. The pad part 71 needs to contact the probe of the power-on device when the optical chip 600 is tested, so the pad part 71 is a necessary structure for the power-on test. However, after the chip carrier 700 is packaged into the optical device, a conductive wire (not shown in the figure) is generally used to connect the chip carrier 700. The conductive wire is relatively thin and can be connected to a position other than the pad (such as Figure 5The A position shown in the figure does not need to be connected to a pad of a relatively large size, so the pad portion 71 becomes an unnecessary structure. Breaking off the pad portion 71 will not only not affect the performance of the optical device, but also reduce the volume of the chip carrier 700, making it easier to package the chip carrier 700 inside the optical device, which is beneficial to the miniaturization of the optical device. The chip carrier breaking device 100 shown in this embodiment is for the purpose of breaking off the pad portion 71 of the chip carrier 700, reducing the volume of the chip carrier 700, making it easier to package the chip carrier 700 inside the optical device, which is beneficial to the miniaturization of the optical device.

[0042] It is worth mentioning that the moving path of the impact block 121 can be linear or arc-shaped, which is not limited in this embodiment.

[0043] refer to Figure 1-Figure 7 In a specific embodiment, the impact block 121 is in a first direction ( Figure 1 The placement seat 11 is slidably connected to the base 10 in the X direction as shown, and the placement seat 11 is also provided with a through hole 112, which is slidably connected to the base 10 in the second direction ( Figure 1 The accommodating groove 111 is connected to the external space of the placement seat 11 in the Y direction shown in the figure, and the second direction is perpendicular to the first direction. A chip carrier breaking device 100 also includes a pressure component 13, and the pressure component 13 includes a pressure block 131. The pressure block 131 is slidably connected to the base 10 in the second direction, and the pressure block 131 is arranged in alignment with the through hole 112 in the second direction.

[0044] Specifically, since the through hole 112 connects the accommodating groove 111 and the external space of the placement seat 11 in the second direction, the pressing block 131 is slidably connected to the base 10 in the second direction, and the pressing block 131 is arranged in alignment with the through hole 112 in the second direction, before the chip carrier 700 is broken by the impact block 121, the chip carrier 700 can be pressed by the pressing block 131 in the second direction to fix the chip carrier 700. After the chip carrier 700 is pressed by the pressing block 131, the impact block 121 is pushed to break the chip carrier 700, which can avoid unnecessary shaking of the chip carrier 700 when the impact block 121 contacts the chip carrier 700, thereby increasing the success rate and consistency of breaking the chip carrier 700.

[0045] refer to Figure 8In a specific embodiment, the pressure assembly 13 also includes a spring 132 and a force member 133. One end of the spring 132 is connected to the side of the pressure block 131 facing away from the accommodating groove 111, and the force member 133 is connected to the other end of the spring 132. By applying pressure to the force member 133, the spring 132 can be driven and then the pressure block 131 can be driven. The introduction of the spring 132 can play a role in buffering the force. Specifically, when the pressure block 131 applies pressure to the chip carrier 700, the spring 132 will deform and store energy, so that the pressure block 131 can provide a certain pressure to the chip carrier 700 to keep the chip carrier 700 fixed, while providing a buffer at the same time, and will not apply unlimited pressure to the chip carrier 700.

[0046] It is worth mentioning that different numbers of springs 132 can bring different stiffness and elastic force characteristics. This embodiment does not specifically limit the number of springs 132. Those skilled in the art can configure one, two or three springs 132 according to actual conditions.

[0047] refer to Figure 8 In a specific embodiment, a mounting groove 1331 is provided on a side of the force applying member 133 facing the receiving groove 111 , and the spring 132 is completely received in the mounting groove 1331 .

[0048] Specifically, the spring 132 is completely accommodated in the installation groove 1331, so that the spring 132 will be shielded by the force-applying member 133 and will not be exposed. This not only protects the spring 132 to a certain extent, but also makes the chip carrier breaking device 100 more beautiful.

[0049] refer to Figure 8 In one embodiment, the pressure assembly 13 further includes a first slide rail 134 and a first slider 135. The first slide rail 134 is disposed on the base 10 along the second direction, the first slider 135 is slidably connected to the first slide rail 134, and the pressure block 131 is mounted on the first slide rail 134. In this way, the pressure block 131 can be slidably connected to the base 10.

[0050] refer to Figure 8 In a specific embodiment, first hook-shaped structures 1341 are provided on both sides of the first slide rail 134 in the first direction. The distance between the two first hook-shaped structures 1341 in the first direction is smaller than the length of the first slider 135 in the first direction. In this way, the two first hook-shaped structures 1341 can be used to hook the first slider 135, so as to limit the first slider 135 from moving in a third direction ( Figure 1 Move in the Z direction).

[0051] refer to Figure 1 , Figure 7In one embodiment, a notch 113 is provided on a side of the placement seat 11 facing the base 10 , and the notch 113 is connected to a side of the placement seat 11 facing the first sliding block 135 , and the first sliding rail 134 is at least partially accommodated in the notch 113 .

[0052] Specifically, since the placement seat 11 is provided with a notch 113 and the first slide rail 134 is at least partially accommodated in the notch 113, compared with the embodiment in which the placement seat 11 is not provided with a notch 113, the pressure-applying assembly 13 and the placement seat 11 in this embodiment are more compact, which can effectively reduce the volume of a chip carrier breaking device 100.

[0053] refer to Figure 1 , Fig. 9 In one embodiment, the side of the impact block 121 facing the adjacent area 800 is an inclined surface 1211, which is oriented in the direction of the bottom of the receiving groove 111 ( Figure 1 In the Z direction), the inclined surface 1211 gradually extends toward the direction approaching the adjacent area 800.

[0054] Specifically, the side of the impact block 121 facing the adjacent area 800 is set as a slope 1211, so that when the chip carrier 700 is broken, the slope 1211 can be used to apply forces in two directions to the chip carrier 700 at the same time, one force breaks the chip carrier 700 forward, and the other force pushes the chip carrier 700 downward. The force pushing the chip carrier 700 downward can improve the flatness of the breaking position.

[0055] refer to Fig. 9 In one embodiment, the accommodating groove 111 includes a first groove wall 1111 away from the impact block 121, and a first avoidance groove 114 is provided on the first groove wall 1111. The first avoidance groove 114 is used to accommodate the optical chip 600 and the wire 900 connecting the chip carrier 700 and the optical chip 600. The length of the chip carrier 700 in the second direction is less than the length of the first avoidance groove 114 in the second direction.

[0056] Specifically, since the length of the chip carrier 700 in the second direction is smaller than the length of the first avoidance groove 114 in the second direction, when the impact block 121 impacts the chip carrier 700, the chip carrier 700 will be constrained by the first groove wall 1111 and cannot enter the first avoidance groove 114. In addition, since the optical chip 600 and the wire 900 connecting the chip carrier 700 and the optical chip 600 are both accommodated in the first avoidance groove 114, when the impact block 121 impacts the chip carrier 700, it will not impact the wire 900 and the optical chip 600, thereby effectively avoiding damage to the wire 900 and the optical chip 600.

[0057] refer to Fig. 9In one embodiment, the accommodating groove 111 includes two second groove walls 1112 arranged opposite to each other in the second direction, and the two second groove walls 1112 are each provided with a second avoidance groove 115, and the two second avoidance grooves 115 are respectively used to accommodate two clamping arms (not shown in the figure) of the clamping member (not shown in the figure).

[0058] Specifically, after the chip carrier 700 is broken, the chip carrier 700 needs to be taken out and packaged into the optical device. Since the chip carrier 700 is located in the receiving groove 111, it is not easy to take out. In order to solve this technical problem, the second avoidance groove 115 is provided on the two second groove walls 1112 in this embodiment, so that the two clamping arms of the clamping member can be respectively inserted into the two second avoidance grooves 115 to clamp the chip carrier 700.

[0059] Exemplarily, the clamping member is a pair of tweezers, and the two clamping arms of the tweezers are respectively inserted into the two second avoidance grooves 115, and then the two clamping arms of the tweezers are pinched with force, so that the chip carrier 700 can be clamped with the two clamping arms, and then a force is applied away from the accommodating groove 111, so that the chip carrier 700 can be taken out with the tweezers, which is very convenient.

[0060] refer to Fig.10 In one embodiment, the breaking component 12 further includes a second slide rail 122 and a second slider 123. The second slide rail 122 is disposed on the base 10 along the first direction, and the second slider 123 is slidably connected to the second slide rail 122. In order to enable the adjacent area 800 to be located on the moving path of the impact block 121, the breaking component 12 is further provided with a support block 124, the bottom of the support block 124 is mounted on the second slider 123, and the impact block 121 is mounted on the top of the support block 124, so that the support block 124 can be used to raise the impact block 121, so that the adjacent area 800 can be located on the moving path of the impact block 121. When the impact block 121 is pushed, the second slider 123 will slide on the second slide rail 122 along the first direction, thereby realizing the sliding connection between the impact block 121 and the base 10.

[0061] refer to Fig.10 In a specific embodiment, second inverted hook structures 1221 are provided on both sides of the second slide rail 122 in the second direction, and the distance between the two second inverted hook structures 1221 in the second direction is smaller than the length of the second slider 123 in the second direction. In this way, the two second inverted hook structures 1221 can be used to hook the second slider 123 to limit the movement of the second slider 123 in the third direction.

[0062] refer to Fig.10In one embodiment, a plurality of support blocks 124 are provided, and the plurality of support blocks 124 are arranged at intervals in the first direction. Compared with the embodiment in which only one support block 124 is provided, the plurality of support blocks 124 can provide more stable support for the impact block 121, and increase the stability of the impact block 121 when it moves. The plurality of support blocks 124 can be two, three, or more than three, and this embodiment is not limited here, as long as the stability of the impact block 121 when it moves can be increased.

[0063] refer to Fig.10 In one embodiment, the breaking assembly 12 further includes a push plate 125, which is installed on a side of the impact block 121 facing away from the adjacent area 800. The projection area of ​​the push plate 125 in the first direction is larger than that of the impact block 121.

[0064] Specifically, the force application area of ​​the impact block 121 is relatively small, which makes it inconvenient to apply force and easily causes injuries to operators. In order to solve this technical problem, the present embodiment provides a push plate 125 on the side of the impact block 121 facing away from the adjacent area 800. The operator can use the push plate 125 to drive the impact block 121. Since the projection area of ​​the push plate 125 in the first direction is larger than that of the impact block 121, it is easier to apply force and is less likely to cause injuries to operators.

[0065] Optionally, the breaking assembly 12 further includes a linear drive member. After the chip carrier 700 is placed in the receiving groove 111 , the linear drive member is activated to drive the impact block 121 to impact the chip carrier 700 , thereby breaking off the pad portion 71 of the chip carrier 700 .

[0066] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present utility model rather than to limit it. For those skilled in the art, the technical solutions described in the above embodiments can be modified, or some of the technical features therein can be replaced by equivalents; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present utility model.

Claims

1. A chip carrier breaking device, characterized in that: include: Pedestal; A placement seat, which is installed on the base, and is provided with a receiving groove, the receiving groove is used to receive a chip carrier equipped with an optical chip, the receiving groove has an adjacent area adjacent to the notch of the receiving groove, the depth of the receiving groove is less than the length of the chip carrier, so that the pad portion of the chip carrier is received in the adjacent area; The breaking component includes a striking block, which is movably connected to the base, and the adjacent area is located on the movable path of the striking block, so that the striking block can act on the pad part of the chip carrier and break the pad part of the chip carrier.

2. The chip carrier breaking device according to claim 1, characterized in that: The impact block is slidably connected to the base in the first direction; a through opening is also provided on the placement seat, and the through opening connects the accommodating groove with the external space of the placement seat in the second direction, and the second direction is perpendicular to the first direction; the chip carrier breaking device also includes a pressure component, and the pressure component includes a pressure block, which is slidably connected to the base in the second direction, and the pressure block is arranged in alignment with the through opening in the second direction.

3. The chip carrier breaking device according to claim 2, characterized in that: The pressure applying component also includes: A spring, one end of which is connected to a side of the pressing block facing away from the accommodating groove; A force applying member is connected to the other end of the spring.

4. The chip carrier breaking device according to claim 3, characterized in that: A mounting groove is provided on one side of the force applying member facing the accommodating groove, and the spring is completely accommodated in the mounting groove.

5. The chip carrier breaking device according to claim 2, characterized in that: The pressure applying component also includes: a first slide rail, which is arranged on the base along the second direction; The first sliding block is slidably connected to the first sliding rail, and the pressing block is mounted on the first sliding block.

6. The chip carrier breaking device according to claim 5, characterized in that: A notch is provided on a side of the placement seat facing the base, and the notch is connected to a side of the placement seat facing the first sliding block, and the first sliding rail is at least partially accommodated in the notch.

7. The chip carrier breaking device according to any one of claims 1 to 6, characterized in that: A side of the impact block facing the adjacent area is an inclined surface, and in the direction of the bottom of the accommodating groove, the inclined surface gradually extends toward the direction approaching the adjacent area.

8. The chip carrier breaking device according to any one of claims 2 to 6, characterized in that: The accommodating groove includes a first groove wall away from the impact block, and a first avoidance groove is provided on the first groove wall. The first avoidance groove is used to accommodate the optical chip and the wire connecting the chip carrier and the optical chip; the length of the chip carrier in the second direction is smaller than the length of the first avoidance groove in the second direction.

9. The chip carrier breaking device according to any one of claims 2 to 6, characterized in that: The accommodating groove comprises two second groove walls arranged opposite to each other in the second direction, and the two second groove walls are each provided with a second avoidance groove, and the two second avoidance grooves are respectively used to accommodate two clamping arms of the clamping member.

10. The chip carrier breaking device according to any one of claims 2 to 6, characterized in that: The breaking assembly also includes: a second slide rail, which is arranged on the base along the first direction; a second sliding block, slidably connected to the second sliding rail; The bottom of the support block is mounted on the second sliding block, and the impact block is mounted on the top of the support block.

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