Carrier carrying tool for silicon wafer cleaning
By designing silicon wafer cleaning vehicle handling tools, using the fitting and positioning parts of hook parts and grooves, the problems of shaking and damage of traditional vehicles when taken out are solved, and fast and stable vehicle handling and silicon wafer protection are achieved.
Patent Information
- Application Number
- CN202420191089.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-01-26
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-01-26
AI Technical Summary
During the cleaning process of photovoltaic silicon wafers, traditional cleaning vehicles tend to shake when taken out of the acid tank or alkaline tank, causing the hanging lugs to take off and the vehicle to fall off, which in turn damages the silicon wafer.
A silicon wafer cleaning vehicle handling tool is designed, including left and right side plates, connecting rods, hook parts and grooves. Through the matching of hook parts and grooves and the design of positioning parts, the stability of the vehicle is ensured during the removal process. Avoid shaking.
It realizes the rapid and stable removal and placement of the cleaning vehicle from the cleaning tank, avoiding the shaking and damage of the vehicle, and improving the safety and efficiency of handling.
Smart Images
Figure CN222365569U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of silicon wafer processing, in particular to a silicon wafer cleaning carrier transport tool. Background Art
[0002] Currently in the field of photovoltaic power generation, it is necessary to perform a texturing treatment on the surface of photovoltaic silicon wafers. The current technologies include two types of processes: acid texturing and alkaline texturing. Both of the above processes require that the silicon wafers be placed in a cleaning carrier first, and then the cleaning carrier containing the silicon wafers is placed as a whole in an alkaline water pool or an acid water pool to allow the silicon wafers to fully react with the alkaline water or the acid water. When the texturing on the surface of the silicon wafer meets the process requirements, the cleaning carrier is taken out of the acid water pool or the alkaline water pool. When taking the cleaning carrier out of the acid water pool or the alkaline water pool, the traditional method is to hook the ears on the four corners of the cleaning carrier with hooks, and then take the entire cleaning carrier out of the acid water pool or the alkaline water pool. In the above process, the cleaning carrier is prone to shaking, causing the hook to fall out of the ear, thereby causing the cleaning carrier to fall, and then causing the silicon wafer placed in the cleaning carrier to break. Utility Model Content
[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a silicon wafer cleaning carrier transport tool, which can quickly take the cleaning carrier out of the cleaning tank and avoid shaking of the cleaning carrier during the taking-out process, thereby improving stability.
[0004] The technical solution of the utility model for solving the problems of the prior art is:
[0005] A silicon wafer cleaning carrier handling tool comprises a left side plate, a right side plate and connecting rods arranged on the left side plate and the right side plate, wherein hook members are arranged at both ends of the bottom of the left side plate and the right side plate; grooves cooperating with the hook members are arranged on both side plates of the cleaning carrier.
[0006] Preferably, the hook member is a connecting shaft, and the axial direction of the connecting shaft is perpendicular to the side surfaces of the left plate and the right plate.
[0007] Preferably, there are two grooves, namely a first groove and a second groove, wherein the first groove and the second groove are provided with a hook portion cooperating with the hook member.
[0008] Preferably, the left side plate and the right side plate are provided with positioning members, and the positioning members are located in the middle of the hook members on both sides of the same side plate; positioning grooves are provided on the side plates on both sides of the cleaning carrier at positions corresponding to the positioning members.
[0009] Preferably, the connecting rod is a telescopic rod structure.
[0010] Preferably, the connecting rods are in multiple groups, and the multiple groups of connecting rods are arranged in parallel and up and down.
[0011] Preferably, the left side plate and the right side plate are isosceles triangles; arc-shaped grooves are provided at the bottoms of the left side plate and the right side plate.
[0012] Preferably, the positioning member is located above the arc-shaped groove.
[0013] Preferably, the corners of the left side panel and the right side panel are rounded.
[0014] Preferably, a spacing adjustment structure is provided between the two hook members in the same side panel and the left panel or the right panel, and the spacing adjustment structure is used to adjust the spacing between the two hook members.
[0015] Compared with the prior art, the utility model has the following beneficial effects:
[0016] By adopting the silicon wafer cleaning carrier handling tool of the utility model, the cleaning carrier immersed in the cleaning tank can be quickly taken out, specifically: the silicon wafer cleaning carrier handling tool of the utility model is taken above the cleaning carrier, so that the left and right side panels are located on the outside of the two side panels of the cleaning carrier, and the hook parts at the bottom of the left and right side panels are located above the grooves of the two side panels of the cleaning carrier, and then the silicon wafer cleaning carrier handling tool of the utility model is driven vertically downward to move, so that the hook parts are located in the grooves, and then the silicon wafer cleaning carrier handling tool of the utility model is moved horizontally, so that the hook parts hook the grooves, so that the cleaning carrier can be vertically extracted, thereby taking the cleaning carrier out of the cleaning tank.
[0017] In this regard, the silicon wafer cleaning carrier handling tool of the utility model has the following advantages:
[0018] (1) The silicon wafer cleaning carrier handling tool of the utility model can be quickly loaded on the cleaning carrier, so that the cleaning carrier can be quickly placed in the cleaning tank or taken out from the cleaning tank.
[0019] (2) When the silicon wafer cleaning carrier transport tool of the utility model is used to transport the cleaning carrier, the left and right side plates can limit the two sides of the cleaning carrier, thereby preventing the hook parts in the silicon wafer cleaning carrier transport tool of the utility model from falling out of the groove of the cleaning carrier, making it difficult for the cleaning carrier to shake when the silicon wafer cleaning carrier transport tool of the utility model is transporting the cleaning carrier, and the stability is better.
[0020] (3) The silicon wafer cleaning carrier handling tool of the present invention has better versatility and is suitable for existing cleaning carriers on the market. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1-Figure 2 It is a three-dimensional structural schematic diagram of the silicon wafer cleaning carrier handling tool (when carrying the cleaning carrier) of the utility model from two different viewing angles.
[0022] Figure 3 It is a schematic diagram of the structure when the hook member and the groove cooperate.
[0023] Figure 4-Figure 5 It is a schematic diagram of the three-dimensional structure of the cleaning vehicle from two different perspectives.
[0024] Figure 6-Figure 7 It is a three-dimensional structural schematic diagram of the silicon wafer cleaning carrier handling tool of the utility model from two different viewing angles. DETAILED DESCRIPTION
[0025] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.
[0026] See also Figure 1-Figure 7 The silicon wafer cleaning carrier handling tool 1 of the utility model comprises a left side plate 101, a right side plate 101 and connecting rods 102 arranged on the left side plate 101 and the right side plate 101, wherein the connecting rods 102 are divided into two groups, and the two groups of connecting rods 102 are arranged in parallel and up and down; hooks 103 are arranged at both ends of the bottom of the left side plate 101 and the right side plate 101; grooves cooperating with the hooks 103 are arranged on the side plates on both sides of the cleaning carrier 2.
[0027] In this embodiment, the hook member 103 is a connecting shaft, and the axial direction of the connecting shaft is perpendicular to the side surfaces of the left plate 101 and the right plate 101; there are two grooves, namely the first groove 201 and the second groove 203, wherein the first groove 201 and the second groove 203 are provided with a bent hook portion that cooperates with the hook member 103.
[0028] See also Figure 1-Figure 7The left side plate 101 and the right side plate 101 are provided with positioning members 104, and the positioning members 104 are located in the middle of the hook members 103 on both sides; positioning grooves 202 are provided on the side plates on both sides of the cleaning carrier 2 at positions corresponding to the positioning members 104. Through the positioning member 104 and the positioning groove 202, the loading of the silicon wafer cleaning carrier handling tool 1 of the present invention can be quickly positioned, that is, the silicon wafer cleaning carrier handling tool 1 of the present invention is driven to move downward so that the hook member 103 is located in the groove, and then the silicon wafer cleaning carrier handling tool 1 of the present invention is moved horizontally so that the hook member 103 hooks the groove. At this time, if the positioning member 104 contacts the positioning groove 202, it indicates that the hook member 103 is located directly below the curved hook portion of the groove. Then, it is only necessary to lift up the silicon wafer cleaning carrier handling tool 1 of the present invention to load the silicon wafer cleaning carrier handling tool 1 of the present invention into the cleaning carrier 2, thereby realizing the subsequent transportation of the cleaning carrier 2. Vice versa, when it is necessary to remove the silicon wafer cleaning carrier handling tool 1 of the present invention from the cleaning carrier 2, it is only necessary to drive the silicon wafer cleaning carrier handling tool 1 of the present invention to move downward, and when the positioning member 104 contacts the positioning groove 202, move the silicon wafer cleaning carrier handling tool 1 of the present invention horizontally in the opposite direction, and then lift the silicon wafer cleaning carrier handling tool 1 of the present invention upward to achieve the separation of the silicon wafer cleaning carrier handling tool 1 of the present invention from the cleaning carrier 2.
[0029] See also Figure 1-Figure 7 Since the triangle has stability, the left side plate 101 and the right side plate 101 are set to an isosceles triangle structure, and the three corners of the isosceles triangle structure are rounded; at the same time, the bottom of the left side plate 101 and the right side plate 101 are provided with arc-shaped grooves; the positioning member 104 is located above the arc-shaped groove.
[0030] As a preferred solution, the connecting rod 102 is a telescopic rod structure, which is used to adapt to cleaning carriers 2 of different lengths, and a spacing adjustment structure is provided between the two hook members 103 in the same side panel of the silicon wafer cleaning carrier handling tool 1 of the present invention and the left panel 101 or the right panel 101, and the spacing adjustment structure is used to adjust the spacing between the two hook members 103, thereby adapting to cleaning carriers 2 of different widths; wherein, the spacing adjustment structure can adopt an existing structure, such as a slide groove and a slider structure, and when the hook member 103 is adjusted to a suitable position, the slider is locked to fix the hook member 103, thereby realizing the adjustment of cleaning carriers 2 of different widths.
[0031] See also Figure 1-Figure 7 The working principle of the silicon wafer cleaning carrier handling tool 1 of the utility model is:
[0032] By adopting the silicon wafer cleaning carrier handling tool 1 of the utility model, the cleaning carrier 2 immersed in the cleaning tank can be quickly taken out, specifically: the silicon wafer cleaning carrier handling tool 1 of the utility model is taken above the cleaning carrier 2, so that the left and right side panels 101 are located on the outside of the two side panels of the cleaning carrier 2, and the hook components 103 at the bottom of the left and right side panels 101 are located above the grooves of the two side panels of the cleaning carrier 2, and then the silicon wafer cleaning carrier handling tool 1 of the utility model is driven vertically downward to move, so that the hook components 103 are located in the grooves, and then the silicon wafer cleaning carrier handling tool 1 of the utility model is moved horizontally, so that the hook components 103 hook the grooves, so that the cleaning carrier 2 can be vertically extracted, thereby taking the cleaning carrier 2 out of the cleaning tank and carrying it. When it is necessary to remove the silicon wafer cleaning carrier handling tool 1 of the present invention from the cleaning carrier 2, it is only necessary to drive the silicon wafer cleaning carrier handling tool 1 of the present invention downward; then move the silicon wafer cleaning carrier handling tool 1 of the present invention horizontally in the opposite direction, and then lift the silicon wafer cleaning carrier handling tool 1 of the present invention upward to achieve the separation of the silicon wafer cleaning carrier handling tool 1 of the present invention from the cleaning carrier 2.
[0033] The above is a preferred implementation mode of the present invention, but the implementation mode of the present invention is not limited by the above content. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principle of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.
Claims
1. A silicon wafer cleaning carrier handling tool, characterized in that: It includes a left side plate, a right side plate and connecting rods arranged on the left side plate and the right side plate, wherein hooks are arranged at both ends of the bottom of the left side plate and the right side plate; grooves cooperating with the hooks are arranged on both side plates of the cleaning carrier.
2. The silicon wafer cleaning carrier handling tool according to claim 1, characterized in that: The hook member is a connecting shaft, and the axial direction of the connecting shaft is perpendicular to the side surfaces of the left side plate and the right side plate.
3. The silicon wafer cleaning carrier handling tool according to claim 1, characterized in that: There are two grooves, namely a first groove and a second groove, wherein the first groove and the second groove are provided with a hook portion that cooperates with the hook member.
4. The silicon wafer cleaning carrier handling tool according to claim 1, characterized in that: The left side plate and the right side plate are provided with positioning members, and the positioning members are located in the middle of the hook members on both sides of the same side plate; the side plates on both sides of the cleaning carrier are provided with positioning grooves at positions corresponding to the positioning members.
5. The silicon wafer cleaning carrier handling tool according to claim 1, characterized in that: The connecting rod is a telescopic rod structure.
6. The silicon wafer cleaning carrier transport tool according to claim 5, characterized in that: The connecting rods are divided into multiple groups, and the multiple groups of connecting rods are arranged in parallel and up and down.
7. The silicon wafer cleaning carrier transport tool according to claim 4, characterized in that: The left side plate and the right side plate are isosceles triangles; arc-shaped grooves are arranged at the bottom of the left side plate and the right side plate.
8. The silicon wafer cleaning carrier transport tool according to claim 7, characterized in that: The positioning member is located above the arc-shaped groove.
9. The silicon wafer cleaning carrier transport tool according to claim 6, characterized in that: The corners of the left side plate and the right side plate are rounded.
10. The silicon wafer cleaning carrier transport tool according to claim 1, characterized in that: A spacing adjustment structure is provided between the two hook members in the same side plate and the left side plate or the right side plate, and the spacing adjustment structure is used to adjust the spacing between the two hook members.