Wafer positioning device

Abstract

The utility model discloses a wafer positioning device. The wafer positioning device comprises a supporting platform, an alignment mechanism and transparent glass, wherein the alignment mechanism and the transparent glass are stacked on the supporting platform; an attaching device used for attaching a wafer is arranged on the side, away from the alignment mechanism, of the transparent glass, and the alignment mechanism is matched with the attaching device to position the attaching device. The attaching device is accurate in alignment and good in uniformity, the warped wafer can be leveled and fixed to the transparent glass, and subsequent wafer tearing is facilitated.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor manufacturing, in particular to a wafer positioning device. Background Art

[0002] Domestic wafer production lines are mainly 8-inch and 12-inch wafers with relatively thin thickness, and single wafers often warp. When all the chips arranged in a wafer are stamped, the warping of the wafer will cause the stamping offset problem of several chips.

[0003] To improve the above problems, technicians usually stick a single wafer on glass with double-sided tape, flatten the wafer through the glass to support the wafer for stamping, and tear the wafer off the glass after stamping. However, in the prior art, the position of the double-sided tape is random and uneven. On the one hand, the flatness of the wafer cannot be guaranteed, and a few chips will still have stamping deviation. On the other hand, when the wafer is torn off, it is easy to cause breakage. Utility Model Content

[0004] One of the purposes of the utility model is to provide a wafer positioning device to solve the technical problems of wafer imprint deviation and wafer breakage in the prior art.

[0005] In order to achieve one of the purposes of the above-mentioned utility model, one embodiment of the utility model provides a wafer positioning device, including: a supporting platform, an alignment mechanism and transparent glass stacked on the supporting platform; an attaching device for pasting the wafer is arranged on the side of the transparent glass away from the alignment mechanism, and the alignment mechanism cooperates with the attaching device to position the attaching device.

[0006] As a further improvement of an embodiment of the utility model, the alignment mechanism includes a scale plate and / or an alignment identification plate, and the scale plate and / or the alignment identification plate are used as an alignment reference when the attaching device is attached to the transparent glass.

[0007] As a further improvement of an embodiment of the utility model, the alignment identification plate is arranged on the surface of the scale plate, and the surface of the scale plate has scale markings, and the scale markings are used as positioning references when the alignment identification plate is arranged on the scale plate.

[0008] As a further improvement of an implementation mode of the utility model, the alignment identification plate is consistent with the shape and size of the attaching device, and the attaching device is aligned and overlapped with the alignment identification plate when attached to the transparent glass.

[0009] As a further improvement of an embodiment of the utility model, the scale plate is made of metal material, the alignment identification plate is made of magnetic material, and the alignment identification plate can be adsorbed on the scale plate by magnetic attraction.

[0010] As a further improvement of an embodiment of the utility model, the scale marking includes a center position, a horizontal axis and a vertical axis that are perpendicular to each other, the center position is located at the intersection of the horizontal axis and the vertical axis, the scale marking is divided into a first quadrant, a second quadrant, a third quadrant and a fourth quadrant in sequence with the horizontal axis and the vertical axis as boundaries, and the five alignment identification plates are arranged one by one in the center position, the first quadrant, the second quadrant, the third quadrant and the fourth quadrant.

[0011] As a further improvement of one embodiment of the utility model, the scale mark has an exposed alignment area, in which the alignment mark plate of each quadrant is located in the middle of the corresponding quadrant in the horizontal and vertical directions, the horizontal direction is the extension direction of the horizontal coordinate axis, and the vertical direction is the extension direction of the vertical coordinate axis.

[0012] As a further improvement of an embodiment of the utility model, the support platform is provided with a step portion for placing the transparent glass.

[0013] As a further improvement of an implementation mode of the utility model, the support platform is provided with a groove for operation on the outer side of the corresponding step portion.

[0014] As a further improvement of one embodiment of the utility model, the support platform includes a first support seat and a second support seat that are stacked and assembled, the first support seat has a first through-area located in the middle, the second support seat has a second through-area located in the middle, and the area sizes of the first through-area and the second through-area are inconsistent.

[0015] Compared with the prior art, the utility model provides a wafer positioning device, in which the alignment mechanism and the attaching device are respectively arranged on opposite sides of the transparent glass. The alignment mechanism and the attaching device cooperate to position the attaching device. The attaching device has high positioning accuracy and good uniformity, which is conducive to flattening and fixing the warped wafer to the transparent glass, and is convenient for subsequent tearing off of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the stamping offset of some chips in a wafer in the prior art.

[0017] Figure 2-5 It is a schematic diagram of different angles of a wafer positioning device in one embodiment of the utility model.

[0018] Figure 6 It is a cross-sectional view of a wafer positioning device in one embodiment of the present invention.

[0019] Figure 7 It is an exploded schematic diagram of a wafer positioning device in one embodiment of the utility model. DETAILED DESCRIPTION

[0020] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0021] It should be noted that the term "comprises" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device that includes a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In addition, the terms "first", "second", "third", "fourth", etc. are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0022] The terms "connected", "connected to" or any other variants are intended to cover various relative positions in a connection relationship, so as to include direct connection or indirect connection. Among them, the direct connection can be formed by a gas pipeline, the indirect connection can be a connection relationship established by a device such as a valve body, a sensor, etc., can be a connection relationship established by a gas circuit component such as a brake control unit, or can be a connection relationship established by any other medium such as air.

[0023] Reference Figure 1 As shown, a wafer 200 provided in one embodiment of the utility model can be 8 inches or 12 inches, or even larger in size. The wafer is relatively thin and includes a plurality of chips 210 arranged at intervals. In the actual process, each chip needs to be laser stamped so that each chip 210 has a mark 211.

[0024] Continue to combine Figure 1 As shown, in the prior art, when the wafer 200 is flattened and fixed on the transparent glass by a plurality of double-sided tapes, due to the uneven position of the double-sided tapes, a small number of chips 210 still have the phenomenon of offset of the mark 211. The direction indicated by the arrow on the small number of chips in the middle is the offset direction of the mark 211.

[0025] Combination Figure 2 As shown, an embodiment of the utility model provides a wafer positioning device 100, including a supporting platform 10, an alignment mechanism 20 and a transparent glass stacked on the supporting platform 10; an attaching device for attaching the wafer is arranged on the side of the transparent glass away from the alignment mechanism 20, and the alignment mechanism 20 cooperates with the attaching device to position the attaching device.

[0026] In one embodiment, the alignment mechanism 20 is disposed on the supporting platform 10, and then the transparent glass is stacked and placed on the alignment mechanism 20. In this way, the alignment mechanism 20 below can be seen through the transparent glass. The alignment mechanism 20 should be able to provide reference position information. When an attaching device is set on the transparent glass, the attaching device can be accurately positioned by referring to the position information of the alignment mechanism 20.

[0027] In one embodiment, after the attaching device is attached to the transparent glass by the reference alignment mechanism 20, the wafer 200 is then attached and fixed to the side of the transparent glass away from the alignment mechanism 20. Thus, from bottom to top, they are: the alignment mechanism 20, the transparent glass, the attaching device, and the wafer 200. The attaching device is a double-sided adhesive tape with a relatively thin thickness, and there may be a small gap between the transparent glass and the wafer 200, but it does not affect the transparent glass's support for the wafer 200.

[0028] In this way, the attaching device attaches the wafer 20 accurately and evenly with reference to the alignment mechanism 20, and the wafer 200 can be supported on the transparent glass more evenly and evenly, and there will be no deviation during stamping; and after stamping, the wafer 200 can be easily torn off without causing breakage.

[0029] Combination Figure 3 , 6 -7, the support platform 10 is provided with a step portion 13 for placing transparent glass, and the step portion 13 is in an annular shape as a whole to adapt to the shape of the wafer. The step portion 13 has a circular support plane, and the transparent glass can be directly placed on the support plane of the step portion 13, and then the wafer 200 is placed on the transparent glass.

[0030] It is understandable that the height of the step portion 13 is greater than the thickness of the transparent glass and the wafer 200 as a whole. Thus, the wafer 200 is also located on the step portion 13 , which can simultaneously serve to limit the transparent glass and the wafer 200 .

[0031] The support platform 10 is provided with a groove 14 for operation on the outer side of the corresponding step portion 13, and the groove 14 is connected to the step portion 13. It is understandable that when the wafer 200 and the transparent glass need to be taken out, the groove 14 can provide a space for the operator to manually take out the objects. The support platform 10 should include at least two symmetrically arranged grooves 14 to facilitate taking out.

[0032] Preferably, the alignment mechanism 20 comprises a scale plate 30 and / or an alignment identification plate 40, and the scale plate 30 and / or the alignment identification plate 40 are used as an alignment reference when the attaching device is attached to the transparent glass.

[0033] In one embodiment, when the alignment mechanism 20 includes a scale plate 30, the scale plate 30 should have a scale mark. In practical applications, the position reference information where the attachment device needs to be attached can be simulated and calculated in advance according to the specific size and warpage degree of the wafer. For example, at least five locations of the corresponding wafer need to be attached, and at least five locations of the corresponding wafer correspond to specific coordinate positions of the scale mark. In this way, the attachment device is evenly and accurately attached to the corresponding location of the transparent glass by referring to the scale mark through the estimated coordinate position information.

[0034] In one embodiment, when the alignment mechanism 20 includes an alignment identification plate 40, the alignment identification plate 40 should be pre-simulated and positioned and arranged in the support platform 10, and the attaching device is attached to the position of the alignment identification plate 40 to ensure that the attaching device is evenly and accurately attached to the transparent glass.

[0035] In one embodiment, when the alignment mechanism 20 has both a scale plate 30 and an alignment identification plate 40, the alignment identification plate 40 is disposed on the surface of the scale plate 30, and the surface of the scale plate 30 has a scale mark, and the scale mark is used as a positioning reference when the alignment identification plate 40 is disposed on the scale plate. In this way, for different wafers, the alignment identification plate 40 is first positioned on the scale plate 30 through the scale mark, which is conducive to the accuracy of the positioning of the alignment identification plate 40. In practice, five alignment identification plates 40 are disposed for each wafer.

[0036] The alignment identification plate 40 is consistent in shape and size with the attaching device. When the attaching device is attached to the transparent glass, it is aligned and overlapped with the alignment identification plate 40. In this way, the attaching device can directly refer to the position of the alignment identification plate 40 to achieve accurate attachment of the attaching device.

[0037] In one embodiment, the scale plate 30 is made of metal material, and the alignment mark plate 40 is made of magnetic material, and the alignment mark plate 40 can be adsorbed on the scale plate 30 by magnetic attraction, so that the alignment mark plate 40 can be adjusted at any time to adapt to wafers 200 with different warping degrees.

[0038] In one embodiment, combining Figure 4-5 As shown, the scale marks are arranged in a grid shape, and the spacing between adjacent grid lines is one centimeter. In this way, the reference adjustment unit is smaller, and the position of the alignment mark plate 40 can be adjusted more accurately.

[0039] The scale mark includes a center position C, a mutually perpendicular horizontal axis X and a vertical axis Y, the center position C is located at the intersection of the horizontal axis X and the vertical axis Y, the scale mark is divided into the first quadrant Q1, the second quadrant Q2, the third quadrant Q3 and the fourth quadrant Q4 in sequence with the horizontal axis and the vertical axis as the boundary, and the five alignment identification plates 40 are arranged one by one at the center position C, the first quadrant Q1, the second quadrant Q2, the third quadrant Q3 and the fourth quadrant Q4.

[0040] Thus, the center of the wafer and the four quadrants around the center are evenly provided with alignment marks 40, which is conducive to evenly leveling the entire wafer 200 for stamping. And setting five alignment marks 40 is not too many, which is convenient for subsequent removal of the wafer 200.

[0041] The scale plate 30 has an exposed alignment area 31, in which the alignment identification plate 40 of each quadrant is located in the middle of the corresponding quadrant in both the horizontal and vertical directions, the horizontal direction being the extension direction of the horizontal coordinate axis, and the vertical direction being the extension direction of the vertical coordinate axis.

[0042] More specifically, the alignment area 31 corresponding to the scale plate 30 is the area corresponding to the transparent glass and the wafer 200, and the alignment identification plate 40 is placed in the middle of the corresponding quadrant in the alignment area 31. In other words, on the one hand, the distance between the alignment identification plates 40 between adjacent quadrants is moderate, neither too close nor too far; on the other hand, the alignment identification plate 40 at the center position is neither too close nor too far from the alignment identification plates 40 in the four quadrants; in summary, the distance between the multiple alignment identification plates 40 is moderate, and the uniformity of the arrangement is improved. In this way, the distance between the multiple attachment devices is also moderate, which improves the uniformity of the arrangement of the attachment devices.

[0043] refer to Figure 6-7 As shown, the support platform 10 includes a first support seat 11 and a second support seat 12 that are stacked and assembled. The first support seat 11 has a first through-region 110 located in the middle, and the second support seat 12 has a second through-region 120 located in the middle. The areas of the first through-region 110 and the second through-region 120 are inconsistent.

[0044] The first through-region 110 and the second through-region 120 match the sizes of an eight-inch wafer and a twelve-inch wafer, respectively. Thus, the opposite sides of the wafer positioning device 100 can be suitable for eight-inch wafers and twelve-inch wafers, respectively.

[0045] refer to Figure 4-5As shown, the first support seat 11 and the second support seat 12 are respectively provided with a step portion 13 and a groove 14. The step portion 13 of the first support seat 11 and the step portion 13 of the second support seat 12 are arranged opposite to each other. When the support platform 10 needs to switch to level wafers 200 of different sizes, the support platform 10 needs to be flipped.

[0046] The scale plate 30 is disposed between the first support seat 11 and the second support seat 12, and two sides of the scale plate 30 are respectively exposed to the first through-area 110 and the second through-area 120, so as to respectively correspond to the first alignment area 311 and the second alignment area 312. Therefore, the area sizes of the first alignment area 311 and the second alignment area 312 are also different, so as to perform alignment settings for wafers 200 of different sizes.

[0047] The alignment area 31 includes the first alignment area 311 and the second alignment area 312 . In other words, whether corresponding to a 12-inch wafer or an 8-inch wafer, the alignment identification plate 40 is correspondingly arranged in the middle of the first alignment area 311 or the second alignment area 312 corresponding to the quadrant.

[0048] The alignment identification plate 40 is usually elliptical, and is set to different sizes corresponding to wafers 200 of different sizes. In specific applications, an ellipse of about 5 cm long and 3.5 cm wide can be used for a twelve-inch wafer, and the error range can be between 0.5 cm and 1 cm. An ellipse of about 4 cm long and 2.5 cm wide can be used for an eight-inch wafer, and the error range can be between 0.5 cm and 1 cm.

[0049] The beneficial effects of the utility model are as follows: a positioning mechanism 20 is provided, and the attaching device is attached with reference to the positioning mechanism 20, the attaching device has high position accuracy and good uniformity, the wafer 200 is more flat, and there will be no offset during stamping; after stamping, the attaching device is positioned evenly, which is convenient for tearing off the wafer 200 and reducing the probability of fragmentation; the positioning mechanism 20 includes a scale plate 30 and an alignment identification plate 40, the attaching device and the alignment identification plate 40 are completely aligned and overlapped, and the positioning accuracy is higher.

[0050] It can be formed by referring to any of the technical solutions provided above, and will not be described in detail here.

[0051] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0052] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wafer positioning device, characterized in that: It comprises a supporting platform, an alignment mechanism and transparent glass stacked on the supporting platform; a pasting device for pasting wafers is arranged on the side of the transparent glass away from the alignment mechanism, and the alignment mechanism cooperates with the pasting device to position the pasting device.

2. The wafer positioning device according to claim 1, characterized in that: The alignment mechanism comprises a scale plate and / or an alignment identification plate, and the scale plate and / or the alignment identification plate are used as an alignment reference when the attaching device is attached to the transparent glass.

3. The wafer positioning device according to claim 2, characterized in that: The alignment identification plate is arranged on the surface of the scale plate, and the surface of the scale plate has scale markings, and the scale markings are used as positioning references when the alignment identification plate is arranged on the scale plate.

4. The wafer positioning device according to claim 2, characterized in that: The alignment identification plate and the attaching device have the same shape and size, and the attaching device is aligned and overlapped with the alignment identification plate when attached to the transparent glass.

5. The wafer positioning device according to claim 2, characterized in that: The scale plate is made of metal material, the alignment identification plate is made of magnetic material, and the alignment identification plate can be adsorbed on the scale plate by magnetic attraction.

6. The wafer positioning device according to claim 3, characterized in that: The scale marking includes a center position, a horizontal axis and a vertical axis that are perpendicular to each other. The center position is located at the intersection of the horizontal axis and the vertical axis. The scale marking is divided into a first quadrant, a second quadrant, a third quadrant and a fourth quadrant in sequence with the horizontal axis and the vertical axis as boundaries. The five alignment identification plates are arranged one by one at the center position, the first quadrant, the second quadrant, the third quadrant and the fourth quadrant.

7. The wafer positioning device according to claim 6, characterized in that: The scale plate has an exposed alignment area, in which the alignment identification plate of each quadrant is located in the middle of the corresponding quadrant in both the horizontal and vertical directions, the horizontal direction being the extension direction of the horizontal coordinate axis, and the vertical direction being the extension direction of the vertical coordinate axis.

8. The wafer positioning device according to claim 1, characterized in that: The supporting platform is provided with a step portion for placing the transparent glass.

9. The wafer positioning device according to claim 8, characterized in that: The support platform is provided with a groove for operation on the outer side of the corresponding step portion.

10. The wafer positioning device according to claim 1, characterized in that: The support platform includes a first support seat and a second support seat that are stacked and assembled. The first support seat has a first through-region located in the middle, and the second support seat has a second through-region located in the middle. The areas of the first through-region and the second through-region are inconsistent.

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