Uniform temperature heat dissipation structure of vehicle power device

Abstract

The utility model relates to a uniform-temperature heat dissipation structure of a vehicle power device. The uniform-temperature heat dissipation structure comprises a heat dissipation bottom plate, a heat dissipation water channel arranged on one side of the heat dissipation bottom plate, and a plurality of chips arranged on the other side of the heat dissipation bottom plate. The heat dissipation water channel comprises a water channel body, a flow channel formed in the water channel body, a transverse boss arranged in the flow channel, at least three vertical bosses arranged on the transverse boss and at least six side wall bosses arranged at the two ends of the vertical bosses respectively. The height of the transverse boss is equal to the depth of the flow channel, the transverse boss is located in the middle of the flow channel, and the two ends of the transverse boss correspond to an inlet and an outlet of cooling liquid respectively. According to the structure, the three heat dissipation fin needles are distributed in the first area, the second area and the third area from sparse to dense to compensate the heat dissipation effect of the chips affected by the temperature of cooling liquid, so that the temperature difference between the chips is reduced, the reliability of the whole module is improved, and the service life of the whole module is prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of power modules, in particular to a uniform temperature heat dissipation structure of a vehicle power device. Background Art

[0002] The power module is a power electronic device that is packaged into a module according to a certain functional combination. With the rapid development of modern science and technology, the market demand for power modules is increasing rapidly, and the heat dissipation effect of the power module will affect the use of the module, so the heat dissipation problem of the power module has become a top priority. For example, Chinese patent CN201510885188.7 discloses a radiator for a power module, a radiator body, a radiator body is provided with a receiving groove; a coolant inlet connected to the receiving groove; a coolant outlet connected to the receiving groove, wherein the radiator body has a contact surface, and the contact surface is constructed to be able to seal contact with the substrate of the power module to form a heat dissipation cavity at the receiving groove. The radiator can form a heat dissipation cavity at the receiving cavity by providing a receiving groove on the radiator body so that the substrate of the power module can be sealed and connected to the contact surface. After the coolant flows into the heat dissipation cavity through the coolant inlet, it can dissipate heat and cool the power module, thereby improving the heat dissipation effect. However, after the coolant undergoes heat exchange, when it reaches the outlet, the temperature of the coolant rises, which causes the heat dissipation effect to decrease. This results in a large temperature difference between the front and rear of the power module, and the heat dissipation effect of the radiator can be further improved. Utility Model Content

[0003] In view of this, the utility model provides a uniform temperature heat dissipation structure of a vehicle power device to solve the above problems.

[0004] A uniform heat dissipation structure for automotive power devices, comprising a heat dissipation base plate, a heat dissipation water channel arranged on one side of the heat dissipation base plate, and a plurality of chips arranged on the other side of the heat dissipation base plate. The heat dissipation water channel comprises a water channel body, a flow channel opened on the water channel body, a transverse boss arranged in the flow channel, at least three vertical bosses arranged on the transverse boss, and at least six side wall bosses respectively arranged at both ends of the vertical boss. A plurality of heat dissipation fins are arranged at intervals on one side of the heat dissipation base plate facing the heat dissipation water channel, the height of the transverse boss is equal to the depth of the flow channel, the transverse boss is located in the middle of the flow channel, and its two ends correspond to the inlet and outlet of the coolant respectively. The three vertical bosses are arranged in parallel at intervals and perpendicular to the transverse bosses. The heat dissipation fins corresponding to the three vertical bosses are reduced in length and are respectively located in the center of the first, second and third regions. The width of the side wall boss is equal to the width of the vertical boss, and its height is equal to the height of the transverse boss.

[0005] Furthermore, the shape of the heat dissipation fin pins can be a cylindrical or elliptical cylindrical structure.

[0006] Furthermore, a plurality of heat dissipating fins are distributed in three regions, namely a first region, a second region, and a third region.

[0007] Furthermore, the density of the heat dissipating fins near the coolant inlet gradually increases toward the coolant outlet.

[0008] Furthermore, a side of the water channel body having the flow channel abuts against and is fixedly connected to a side of the heat dissipation base plate having the heat dissipation fins.

[0009] Compared with the prior art, the temperature-averaging heat dissipation structure of the automotive power device provided by the utility model compensates for the heat dissipation effect of the chip affected by the coolant temperature by distributing the three heat dissipation fins from sparse to dense in the first, second and third regions, thereby reducing the temperature difference between the chips to improve the reliability and life of the entire module. The transverse boss divides the flow channel into two, thereby increasing the overall flow rate of the coolant in the flow channel and reducing the junction temperature of the entire module. The vertical boss and the side wall boss compress the flow space where the coolant flows, thereby accelerating the flow rate of the coolant to improve the cooling and heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 The utility model is a schematic structural diagram of the uniform temperature heat dissipation structure of the vehicle power device.

[0011] Figure 2 for Figure 1 A schematic structural diagram of a heat dissipation base plate of a uniform temperature heat dissipation structure for automotive power devices.

[0012] Figure 3 for Figure 1 A schematic diagram of the structure of the heat dissipation channel of the uniform temperature heat dissipation structure of the automotive power device. DETAILED DESCRIPTION

[0013] The following is a further detailed description of the specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.

[0014] like Figure 1As shown, it is a schematic diagram of the structure of the uniform temperature heat dissipation structure of the automotive power device provided by the utility model. The uniform temperature heat dissipation structure of the automotive power device includes a heat dissipation base plate 10, a heat dissipation water channel 20 arranged on one side of the heat dissipation base plate 10, and a plurality of chips 30 arranged on the other side of the heat dissipation base plate 10. It can be imagined that the uniform temperature heat dissipation structure of the automotive power device also includes some other functional modules, such as a power module, a welding module, etc., which are technologies already known to those skilled in the art and will not be described one by one here.

[0015] Please also read Figures 2 to 3 A plurality of heat dissipation fins 11 are arranged at intervals on one side of the heat dissipation base plate 10 facing the heat dissipation water channel 20. The heat dissipation fins 11 may be in the shape of a cylindrical or elliptical cylindrical structure. The plurality of heat dissipation fins 11 are distributed in three regions, namely a first region 12, a second region 13, and a third region 14. Each region corresponds to the chip 30 arranged on the heat dissipation base plate 10.

[0016] The first area 12 is close to the inlet of the coolant, and the distribution of the heat sink pins 11 therein is sparser than that of the second and third areas 13 and 14, so that the coolant has relatively less contact with the heat sink pins 11 in the first area 12, so that the heat dissipation effect of the chip 30 corresponding to the first area 12 is not significant.

[0017] The second area 13 is located between the first and third areas 12 and 14, and the heat dissipation fins 11 therein are relatively sparse compared to the third area 14, so that the coolant has relatively more contact with the heat dissipation fins 11 in the second area 13, thereby making the heat dissipation effect corresponding to the chip 30 on the second area 13 more significant.

[0018] The third region 14 is close to the outlet of the coolant, and the heat sink pins 11 therein are most densely distributed, so that the coolant contacts the heat sink pins 11 in the third region 14 the most, thereby making the heat dissipation effect of the chip 30 on the corresponding third region 14 the most significant.

[0019] The density of the heat dissipation fins 11 near the coolant inlet gradually increases toward the coolant outlet, so that the coolant can still achieve good heat dissipation effect after heat exchange, thereby controlling the temperature difference between each chip 30 and improving the reliability and life of the entire module.

[0020] The heat dissipation water channel 20 includes a water channel body 21, a flow channel 22 opened on the water channel body 21, a horizontal boss 23 arranged in the flow channel 22, at least three vertical bosses 24 arranged on the horizontal boss 23, and at least six side wall bosses 25 respectively arranged at both ends of the vertical boss 24.

[0021] The side of the water channel body 21 having the flow channel 22 is abutted and fixedly connected to the side of the heat dissipation base plate 10 having the heat dissipation fins 11, and the heat dissipation fins 11 are completely accommodated in the flow channel 22, so that the coolant flowing through the flow channel 22 can pass through the heat dissipation fins 11, thereby achieving a heat dissipation effect.

[0022] The height of the transverse boss 23 is equal to the depth of the flow channel 22. The transverse boss 23 is located in the middle of the flow channel 22, and its two ends correspond to the inlet and outlet of the coolant, respectively, so that the flow channel 22 is divided into two, thereby increasing the overall flow rate of the coolant in the flow channel 22 and reducing the junction temperature of the entire module.

[0023] The three vertical bosses 24 are arranged in parallel at intervals and perpendicular to the transverse boss 23. The heat dissipation fins 11 corresponding to the three vertical bosses 24 are reduced in length and are respectively located in the central positions of the first, second and third areas 12, 13 and 14, corresponding to the chip 30 arranged on the heat dissipation base plate 10. The width of the side wall boss 25 is equal to the width of the vertical boss 24, and its height is equal to the height of the transverse boss 23, so that the vertical boss 24 and the side wall boss 25 compress the flow space of the coolant flowing therethrough, thereby accelerating the flow speed of the coolant to improve the cooling and heat dissipation effect. And after the coolant impacts the side walls of the vertical boss 24 and the side wall boss 25, it can cause the coolant to form turbulence, increase water resistance, and further improve the heat dissipation effect.

[0024] Each chip 30 is connected by bonding wires and soldered on a copper sheet by primary solder reflow, and the copper sheet is soldered on the heat dissipation base plate 10 by secondary solder reflow. The chip 30 itself and the soldering technology are both existing technologies and will not be described in detail here.

[0025] Compared with the prior art, the temperature-balanced heat dissipation structure of the automotive power device provided by the utility model compensates for the heat dissipation effect of the chip 30 affected by the coolant temperature by distributing the three heat dissipation fins 11 from sparse to dense in the first, second and third regions 12, 13 and 14, thereby reducing the temperature difference between the chips 30 to improve the reliability and life of the entire module. The transverse boss 23 divides the flow channel 22 into two, thereby increasing the overall flow rate of the coolant in the flow channel 22 and reducing the junction temperature of the entire module. The vertical boss 24 and the side wall boss 25 compress the flow space where the coolant flows, thereby accelerating the flow rate of the coolant to improve the cooling and heat dissipation effect.

[0026] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention are included in the scope of the claims of the present invention.

Claims

1. A uniform temperature heat dissipation structure for a vehicle power device, characterized in that: The uniform temperature heat dissipation structure of the automotive power device includes a heat dissipation base plate, a heat dissipation water channel arranged on one side of the heat dissipation base plate, and a plurality of chips arranged on the other side of the heat dissipation base plate. The heat dissipation water channel includes a water channel body, a flow channel opened on the water channel body, a transverse boss arranged in the flow channel, at least three vertical bosses arranged on the transverse boss, and at least six side wall bosses respectively arranged at both ends of the vertical boss. A plurality of heat dissipation fins are arranged at intervals on one side of the heat dissipation base plate facing the heat dissipation water channel. If The heat sink pins are distributed in three areas, namely the first area, the second area, and the third area. The height of the horizontal boss is equal to the depth of the flow channel. The horizontal boss is located in the middle of the flow channel, and its two ends correspond to the inlet and outlet of the coolant respectively. The three vertical bosses are arranged in parallel at intervals and perpendicular to the horizontal boss. The lengths of the heat sink pins corresponding to the three vertical bosses are reduced and are respectively located in the central positions of the first, second, and third areas. The width of the side wall boss is equal to the width of the vertical boss, and its height is equal to the height of the horizontal boss.

2. The uniform temperature heat dissipation structure of a vehicle power device according to claim 1, characterized in that: The heat dissipation fin pins may be in the shape of a cylinder or an elliptical cylinder structure.

3. The uniform temperature heat dissipation structure of a vehicle power device according to claim 1, characterized in that: The density of the heat dissipating fins near the coolant inlet gradually increases toward the coolant outlet.

4. The uniform temperature heat dissipation structure of a vehicle power device according to claim 1, characterized in that: The side of the water channel body having the flow channel abuts against and is fixedly connected to the side of the heat dissipation base plate having the heat dissipation fins.

Images