Vehicle HPD uniform-temperature heat dissipation structure
By designing multiple openings and accommodating chambers in the heat dissipation structure of the power module, compressing the coolant flow rate and increasing the flow rate, the problem of uneven coolant temperature in the prior art is solved, and more efficient heat dissipation and temperature uniformity are achieved .
Patent Information
- Application Number
- CN202421093626.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-16
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-05-16
AI Technical Summary
Due to the large distance between coolant inlet and outlet of the existing power module, the coolant temperature rises and the heat dissipation effect decreases, and the temperature uniformity of each chip cannot be guaranteed.
An HPD uniform temperature heat dissipation structure for automotive use is designed, including a heat dissipation base plate, a heat dissipation water channel and a heat dissipation fin needle. By setting a plurality of first and second openings in the heat dissipation water channel, the flow rate of the coolant is compressed and the flow rate of the coolant is increased. And through the design of six accommodating chambers and heat dissipation areas, the temperature consistency of the coolant is ensured.
It improves the heat dissipation effect and temperature uniformity of the entire module, avoids the impact of the coolant after heat exchange, and ensures that the temperature between each chip is basically consistent.
Smart Images

Figure CN222365590U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation of power modules, in particular to a vehicle-used HPD uniform temperature heat dissipation structure. Background Art
[0002] The power module is a power electronic device that is packaged into a module according to a certain functional combination. With the rapid development of modern science and technology, the market demand for power modules is increasing rapidly, and the heat dissipation effect of the power module will affect the use of the module, so the heat dissipation problem of the power module has become a top priority. For example, Chinese patent CN201510885188.7 discloses a radiator for a power module, a radiator body, a radiator body is provided with a receiving groove; a coolant inlet connected to the receiving groove; a coolant outlet connected to the receiving groove, wherein the radiator body has a contact surface, and the contact surface is constructed to be able to seal contact with the substrate of the power module to form a heat dissipation cavity at the receiving groove. The radiator can form a heat dissipation cavity at the receiving cavity by providing a receiving groove on the radiator body so that the substrate of the power module can be sealed and connected to the contact surface. After the coolant flows into the heat dissipation cavity through the coolant inlet, it can dissipate heat and cool the power module, thereby improving the heat dissipation effect. However, due to the large distance between the coolant inlet and outlet, the temperature of the coolant rises near the outlet after heat exchange, which causes the heat dissipation effect there to decrease. This results in a large temperature difference between the chips and makes it impossible to ensure temperature uniformity. Utility Model Content
[0003] In view of this, the utility model provides a vehicle-used HPD uniform temperature heat dissipation structure to solve the above-mentioned problem.
[0004] A vehicle-used HPD uniform temperature heat dissipation structure includes a heat dissipation base plate, a heat dissipation water channel arranged on one side of the heat dissipation base plate, and a plurality of chips arranged on the heat dissipation base plate. The heat dissipation water channel includes a body, an inlet water channel opened inside the body, two outlet water channels respectively opened on both sides of the inlet water channel, and six accommodating chambers opened on the side of the body facing the heat dissipation base plate. At least six first openings are opened on the side of the inlet water channel facing the accommodating chamber, and the six first openings are respectively connected to the six accommodating chambers, and the cross-sectional area of the first opening is smaller than the cross-sectional area of the inlet water channel. The two outlet water channels are arranged parallel to the inlet water channel at intervals, and a water outlet is opened at one end of the outlet water channel close to the coolant inlet position, and the water outlet is connected to the outside of the body. At least three second openings are opened on the side of the two outlet water channels facing the accommodating chamber, and the six second openings are respectively connected to the six accommodating chambers.
[0005] Furthermore, a plurality of heat dissipation fins are arranged at intervals on one side of the heat dissipation bottom plate facing the heat dissipation water channel.
[0006] Furthermore, the cross-section of the heat dissipating fin pin may be in the shape of a rhombus or a square.
[0007] Furthermore, a plurality of the heat dissipation fins are divided into six heat dissipation areas, and the six heat dissipation areas are divided into two upper and lower columns and are arranged at intervals.
[0008] Furthermore, the six accommodating chambers correspond to the six heat dissipation areas respectively.
[0009] Furthermore, one end of the inlet water channel close to the water outlet is connected to the outside of the body.
[0010] Compared with the prior art, the HPD temperature-averaging heat dissipation structure for automobiles provided by the utility model compresses the flow of the coolant through the first opening, thereby increasing the flow rate of the coolant and improving the heat dissipation effect of the entire module. The six first openings and the six second openings can ensure that the temperature of the coolant just entering the six accommodating chambers is basically the same, thereby improving the temperature uniformity between the chips, and the inlet and outlet of the coolant are on the same side, avoiding the influence of the coolant after heat exchange, thereby further improving the temperature uniformity of the entire module. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a structural schematic diagram of the vehicle-use HPD uniform temperature heat dissipation structure provided by the utility model.
[0012] Figure 2 for Figure 1 Schematic diagram of the structure of the heat dissipation base plate of the automotive HPD uniform temperature heat dissipation structure.
[0013] Figure 3 for Figure 1 Schematic diagram of the cross-sectional structure of the heat dissipation channel of the automotive HPD uniform temperature heat dissipation structure. DETAILED DESCRIPTION
[0014] The following is a further detailed description of the specific embodiments of the present invention. It should be understood that the description of the embodiments of the present invention herein is not intended to limit the protection scope of the present invention.
[0015] like Figure 1As shown, it is a schematic diagram of the structure of the vehicle HPD uniform temperature heat dissipation structure provided by the utility model. The vehicle HPD uniform temperature heat dissipation structure includes a heat dissipation base plate 10, a heat dissipation water channel 20 arranged on one side of the heat dissipation base plate 10, and a plurality of chips 30 arranged on the heat dissipation base plate 10. It can be imagined that the vehicle HPD uniform temperature heat dissipation structure also includes some other functional modules, such as a power module, a welding module, etc., which are technologies already known to those skilled in the art and will not be described one by one here.
[0016] Please also read Figures 2 to 3 A plurality of heat dissipation fins 11 are arranged at intervals on one side of the heat dissipation base plate 10 facing the heat dissipation water channel 20. The cross-section of the heat dissipation fins 11 may be a rhombus or a square. The plurality of heat dissipation fins 11 are divided into six heat dissipation areas 12. The six heat dissipation areas 12 are divided into two upper and lower columns and are arranged at intervals, corresponding to each of the chips 30 on the heat dissipation base plate 10.
[0017] The heat dissipation water channel 20 includes a body 21 , an inlet water channel 22 opened inside the body 21 , two outlet water channels 23 opened on both sides of the inlet water channel 22 , and six accommodating chambers 24 opened on one side of the body 21 facing the heat dissipation base plate 10 .
[0018] The main body 21 has one side of the accommodating chamber 24 which abuts against and is fixedly connected to the heat dissipation base plate 10 , and the six accommodating chambers 24 correspond to the six heat dissipation areas 12 respectively, so that the heat dissipation fins 11 in the six heat dissipation areas 12 are respectively accommodated in the six accommodating chambers 24 .
[0019] One end of the inlet water channel 22 is in communication with the outside of the body 21, so as to guide the cooling liquid into the inside of the body 21. The inlet water channel 22 is located in the middle of the body 21, and at least six first openings 25 are opened on the side of the inlet water channel 22 facing the accommodating chamber 24, and the six first openings 25 are respectively in communication with the six accommodating chambers 24. In this way, the external cooling liquid flows into the inlet water channel 22, flows through the six first openings 25 to the six accommodating chambers 24, and contacts the heat dissipation fin pins 11, thereby achieving the purpose of heat dissipation.
[0020] The cross-sectional area of the first opening 25 is smaller than the cross-sectional area of the inlet water channel 22 , so when the coolant flows from the inlet water channel 22 through the first opening 25 into the accommodating chamber 24 , the flow rate of the coolant will become faster, thereby improving the heat dissipation effect of the module.
[0021] The two outlet water channels 23 are arranged in parallel with the inlet water channel 22, and one end of the outlet water channel 23 close to the coolant inlet position is provided with a water outlet 26, and the water outlet 26 is communicated with the outside of the body 21, so that the coolant is discharged from the body 21 through the water outlet 26. The distance between the outlet water channel 23 and the inlet water channel 22 is the width of one accommodating chamber 24, and the two outlet water channels 23 are respectively provided with at least three second openings 27 on one side facing the accommodating chamber 24, and the six second openings 27 are respectively communicated with the six accommodating chambers 24. In this way, the coolant after heat exchange in the accommodating chamber 24 can flow to the two outlet water channels 23 through the six second openings 27, and flow to the outside of the body 21 through the water outlet 26.
[0022] The coolant flows into the accommodating chamber 24 through the first opening 25 in the inlet water channel 22, and then converges in the outlet water channel 23 through the second opening 27, so that the temperature of the coolant just entering the six accommodating chambers 24 is basically the same, so that the heat dissipation is the same, and there is no need to perform heat exchange before performing heat dissipation operations in the next area, thereby ensuring the uniformity of the temperature of each chip 30. In addition, the inlet and outlet of the coolant are on the same side, avoiding the influence of the coolant after heat exchange, and further improving the uniformity of the temperature of the entire module.
[0023] The plurality of chips 30 are in a triangle shape, and are soldered on a DBC substrate by a primary reflow process, and then the DBC substrate is soldered on the heat dissipation base plate 10 by a secondary reflow process. The chip 30 itself is a prior art, and will not be described in detail here.
[0024] Compared with the prior art, the vehicle-use HPD temperature-averaging heat dissipation structure provided by the utility model compresses the flow of the coolant through the first opening 25, thereby increasing the flow rate of the coolant and improving the heat dissipation effect of the entire module. The six first openings 25 and the six second openings 27 can ensure that the temperature of the coolant just entering the six accommodating chambers 24 is basically the same, thereby improving the temperature uniformity between each of the chips 30, and the inlet and outlet of the coolant are on the same side, avoiding the influence of the coolant after heat exchange, thereby further improving the temperature uniformity of the entire module.
[0025] The above are only preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modification, equivalent substitution or improvement within the spirit of the present invention are included in the scope of the claims of the present invention.
Claims
1. A vehicle HPD uniform temperature heat dissipation structure, characterized in that: The vehicle-used HPD uniform temperature heat dissipation structure includes a heat dissipation base plate, a heat dissipation water channel arranged on one side of the heat dissipation base plate, and a plurality of chips arranged on the heat dissipation base plate. The heat dissipation water channel includes a main body, an inlet water channel opened inside the main body, two outlet water channels respectively opened on both sides of the inlet water channel, and six accommodating chambers opened on the side of the main body facing the heat dissipation base plate. At least six first openings are opened on the side of the inlet water channel facing the accommodating chamber, and the six first openings are respectively connected to the six accommodating chambers. The cross-sectional area of the first opening is smaller than the cross-sectional area of the inlet water channel. The two outlet water channels are arranged parallel to the inlet water channel and spaced apart. A water outlet is opened at one end of the outlet water channel close to the coolant inlet position, and the water outlet is connected to the outside of the main body. At least three second openings are opened on the side of the two outlet water channels facing the accommodating chamber, and the six second openings are respectively connected to the six accommodating chambers.
2. The vehicle-used HPD uniform temperature heat dissipation structure according to claim 1, characterized in that: A plurality of heat dissipation fin pins are arranged at intervals on one side of the heat dissipation bottom plate facing the heat dissipation water channel.
3. The vehicle-used HPD uniform temperature heat dissipation structure according to claim 2, characterized in that: The cross-section of the heat dissipating fin pin is in a rhombus or square shape.
4. The vehicle-used HPD uniform temperature heat dissipation structure according to claim 2, characterized in that: A plurality of the heat dissipation fins are divided into six heat dissipation areas, and the six heat dissipation areas are divided into two upper and lower rows and are arranged at intervals.
5. The vehicle-used HPD uniform temperature heat dissipation structure according to claim 4, characterized in that: The six accommodating chambers correspond to the six heat dissipation areas respectively.
6. The vehicle-used HPD uniform temperature heat dissipation structure according to claim 1, characterized in that: One end of the inlet water channel close to the water outlet is communicated with the outside of the body.
Citation Information
Patent Citations
Heat sink for power modules
CN106847769B