Inverter

Abstract

The utility model relates to an inverter, and relates to the field of inverter technology, the inverter comprises a shell, a circuit board and a heating element, the heating element is arranged on the circuit board, a dispensing groove is formed in the shell, the dispensing groove and the heating element are correspondingly arranged, a heat-conducting glue layer is arranged between the dispensing groove and the heating element, and the heat-conducting glue layer is arranged on the circuit board. And the heat-conducting glue layer directly conducts heat generated by the heating element to the shell to be dissipated. Through the arrangement of the dispensing groove and the heat-conducting glue layer, direct contact and heat transfer between the heating element and the shell are realized, and the heat dissipation efficiency is effectively improved; according to the scheme design that the dispensing grooves are formed in the shell and the dispensing grooves and the heating elements are correspondingly arranged, a heat-conducting glue layer can be only formed in the position corresponding to the heating elements, and the situation that the interior of the whole shell is filled with glue in a traditional full-glue-pouring mode is not needed, so that the dispensing amount can be reduced, a heat conduction path can be optimized, heat can be conducted and dissipated more quickly, and the service life of the shell is prolonged. Therefore, the heat dissipation effect of the inverter is improved.

Description

Technical Field

[0001] The present application relates to the field of inverter technology, and in particular to an inverter. Background Art

[0002] A microinverter is a device used in solar power generation systems, usually installed near solar panels; its main function is to convert the direct current generated by solar panels into alternating current and transmit it to the grid.

[0003] Microinverters generate heat when converting direct current generated by solar panels into alternating current. If the heat dissipation is poor, the temperature will rise, affecting the performance and stability of its internal components. At present, mainstream microinverter manufacturers generally adopt the design of upright heating elements. Specifically, the heating element is upright placed on the circuit board inside the microinverter shell, and then the shell is fully filled with thermal conductive potting glue, so that the thermal conductive potting glue fills the space between the heating element and the side wall of the shell.

[0004] When the heating element generates heat, the heat is transferred to the shell through the internal thermal conductive potting glue for heat dissipation. However, the thermal conductivity of the existing thermal conductive potting glue is usually low, and there is a certain distance between the heating element and the side wall of the shell, which makes the thermal conductive potting glue unable to quickly and effectively conduct and dissipate the heat; and a large amount of glue is required by the full potting method, thereby increasing the production cost. Therefore, it is urgent to develop an inverter with less glue and good heat dissipation effect. Utility Model Content

[0005] In order to develop an inverter that uses less glue and has good heat dissipation effect, the present application provides an inverter.

[0006] The inverter provided in this application adopts the following technical solution:

[0007] An inverter comprises a shell, a circuit board and a heating element, wherein the heating element is arranged on the circuit board, a glue dispensing groove is arranged in the shell, the glue dispensing groove is arranged corresponding to the heating element, a thermal conductive adhesive layer is arranged between the glue dispensing groove and the heating element, and the thermal conductive adhesive layer directly conducts the heat generated by the heating element to the shell for dissipation.

[0008] By adopting the above technical solution, when the inverter is working, the heating element will generate heat. At this time, since one side of the heating element inserted into the glue dispensing groove is in contact with the thermally conductive adhesive layer, the heat generated by the heating element can be directly transferred to the thermally conductive adhesive layer, and then transferred to the surface of the shell through the contact surface between the thermally conductive adhesive layer and the shell to be dissipated. The present application realizes direct contact and heat transfer between the heating element and the shell by setting the glue dispensing groove and the thermally conductive adhesive layer, thereby effectively improving the heat dissipation efficiency. Moreover, the design scheme of the corresponding setting of the glue dispensing groove and the heating element can form a thermally conductive adhesive layer only at the position corresponding to the heating element, without filling the entire shell with glue like the traditional full glue filling method, thereby reducing the amount of glue dispensing and optimizing the heat conduction path, so that the heat can be conducted and dissipated more quickly, thereby improving the heat dissipation effect of the inverter.

[0009] In a specific possible implementation manner, the heating element is accommodated in the glue dispensing groove and is arranged in contact with the thermally conductive glue layer.

[0010] By adopting the above technical solution, the heating element is directly placed in the glue dispensing groove and is in closer contact with the thermal conductive adhesive layer, which helps to improve the thermal conductivity efficiency and conduct the heat to the shell more quickly; and the heating element is placed in the glue dispensing groove, which can improve the mechanical stability of the heating element and the circuit board, reduce displacement or damage caused by vibration or other external factors, and help improve the reliability and durability of the product.

[0011] In a specific implementation manner, the thickness of the thermally conductive adhesive layer between the heating element and the bottom of the adhesive dispensing groove is 2-3 mm.

[0012] By adopting the above technical solution and setting the thickness of the thermal conductive adhesive layer to 2-3mm, it can ensure that heat is transferred from the heating element to the shell surface more quickly, shorten the heat conduction path of the thermal conductive adhesive layer, and improve the heat dissipation efficiency; and while meeting the heat dissipation requirements, it can also reduce the amount of glue dispensed, making the overall design more economical and efficient.

[0013] In a specific possible implementation manner, the thermally conductive adhesive layer extends to the peripheral side of the heating element.

[0014] By adopting the above technical solution and utilizing the design of extending the thermally conductive adhesive layer to the peripheral side of the heating element, heat can be more quickly transferred to the thermally conductive adhesive layer and dissipated toward the shell, thereby optimizing the heat dissipation path; and the circumferential arrangement of the thermally conductive adhesive layer can enhance its fixation to the heating element, preventing movement or loosening during use, thereby improving the stability and reliability of the product.

[0015] In a specific possible implementation manner, a boss structure is provided in the housing, and the boss structure supports the circuit board.

[0016] By adopting the above technical solution and utilizing the design of the boss structure, the boss structure can serve as a supporting structure for the circuit board, optimizing the overall structural design, ensuring that the circuit board is firmly fixed in the housing, and preventing it from shaking or loosening during use.

[0017] In a specific possible implementation manner, a thermally conductive gel layer is provided between the circuit board and the boss structure.

[0018] By adopting the above technical solution, the thermally conductive gel layer can effectively conduct heat, transfer the heat generated by the circuit board to the boss structure, and then dissipate the heat to the housing or the external environment, thereby improving the overall heat dissipation effect.

[0019] In a specific possible implementation manner, the boss structure is provided with a mounting hole, and the circuit board is fixed to the boss structure through the mounting hole.

[0020] By adopting the above technical solution, the circuit board is fixed to the boss structure through the mounting holes, which can improve the stability and reliability of the circuit board installation, simplify the installation process, improve production efficiency, and facilitate later maintenance and replacement.

[0021] In a specific possible implementation manner, a heat dissipation fin structure is provided on the outer side of the shell, and the heat dissipation fin structure is arranged corresponding to the heating element.

[0022] By adopting the above technical solution, the heat dissipation fin structure can increase the surface area of ​​the shell in contact with the air, accelerate the heat generated by the heating element to dissipate out of the shell, improve the heat dissipation efficiency of the heating element, accelerate the heat transfer speed, reduce the operating temperature of the inverter, and extend the life of the inverter.

[0023] In a specific possible implementation manner, the shell includes a bottom shell and a sealing cover, one side of the bottom shell is provided with an opening, the sealing cover is sealed on the opening, and the sealing cover is detachably connected to the bottom shell.

[0024] By adopting the above technical solution, the opening of the shell and the detachably connected sealing cover are utilized to make the glue filling work in the glue dispensing groove inside the inverter more convenient, thereby improving the accuracy and efficiency of the glue filling work; and it is also possible to facilitate the installation and fixation of the circuit board and heating elements inside the inverter, thereby improving the overall production and assembly efficiency.

[0025] In a specific possible implementation manner, the bottom shell is provided with a wiring slot, the wiring slot is communicated with the opening, and the sealing cover seals the wiring slot.

[0026] By adopting the above technical solution, a wiring slot is provided on the bottom shell to provide a convenient installation channel for connecting the wiring of the inverter. The wires can be easily introduced into the inverter through the wiring slot to connect various circuits or external power supplies, thereby simplifying the inverter line installation process and improving work efficiency.

[0027] In summary, the present application includes at least one of the following beneficial technical effects:

[0028] 1. The inverter of the present application realizes direct contact and heat transfer between the heating element and the shell by setting the dispensing groove and the thermal conductive adhesive layer, effectively improving the heat dissipation efficiency. In addition, the dispensing groove and the heating element are set in a corresponding manner, so that the thermal conductive adhesive layer can be formed only around the heating element, without filling the entire shell with glue like the traditional full glue filling method, thereby reducing the amount of dispensing glue and optimizing the heat conduction path, so that the heat can be conducted and dissipated more quickly, thereby improving the heat dissipation effect of the inverter;

[0029] 2. The inverter of the present application utilizes the design of the boss structure, which can serve as a supporting structure for the circuit board, optimize the overall structural design, ensure that the circuit board is firmly fixed in the housing, and prevent it from shaking or loosening during use;

[0030] 3. The inverter of the present application utilizes a heat dissipation fin structure corresponding to the heating element arranged on the outer bottom wall of the shell, which can increase the surface area of ​​the shell in contact with the air, accelerate the dissipation of heat generated by the heating element out of the shell, improve the heat dissipation efficiency of the heating element, accelerate the heat transfer speed, reduce the operating temperature of the inverter, and extend the life of the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] Figure 1 It is a schematic diagram of the structure of the inverter according to an embodiment of the present application.

[0032] Figure 2 It is a cross-sectional view used to show the dispensing tank, circuit board, heating element and thermal conductive adhesive layer.

[0033] Figure 3 It is a structural schematic diagram used to show the boss structure and the dispensing groove.

[0034] Figure 4 It is a structural diagram used to show the structure of the heat sink fin.

[0035] Explanation of the reference numerals: 1. Shell; 11. Bottom shell; 111. Opening; 112. Wiring slot; 113. Threaded hole; 12. Sealing cover; 2. Circuit board; 3. Heating element; 4. Glue dispensing slot; 5. Thermal conductive glue layer; 6. Boss structure; 61. Mounting hole; 7. Thermal conductive gel layer; 8. Heat sink fin structure; 81. Heat sink; 9. Screw. DETAILED DESCRIPTION

[0036] As a power conversion device, the inverter will generate a certain amount of heat during operation. In order to ensure its stability and performance, an inverter with less glue and good heat dissipation effect is designed. Figure 1-4 This application is described in further detail.

[0037] Reference Figure 1 and Figure 2 The present application embodiment discloses an inverter, the inverter includes a housing 1, the housing 1 includes a bottom housing 11 and a sealing cover 12, one side of the bottom housing 11 is provided with an opening 111, the sealing cover 12 blocks the opening 111, the sealing cover 12 and the bottom housing 11 are detachably connected, in this embodiment, the sealing cover 12 includes but is not limited to being connected and fixed by screws 9; during installation, the sealing cover 12 is aligned with the opening 111 of the bottom housing 11 so that it can completely cover and block the opening 111, the sealing cover 12 is firmly fixed to the bottom housing 11 by screws 9 passing through the sealing cover 12 and cooperating with threaded holes 113 provided on the bottom housing 11, the design scheme of connecting the bottom housing 11 and the sealing cover 12 by screws 9 has the advantages of easy maintenance, simple installation, good sealing, and is suitable for the housing 1 structure design of electronic equipment such as inverters, and can facilitate the glue filling work inside the inverter housing 1;

[0038] Reference Figure 2 and Figure 3 The inverter further includes a circuit board 2 and a heating element 3. In the present embodiment, a heat dissipation space is reserved between the circuit board 2 and the sealing cover 12. The heating element 3 is arranged on the circuit board 2. The heating element 3 is located on the bottom side of the circuit board 2 close to the bottom shell 11. In the present embodiment, the heating element 3 includes but is not limited to a transformer and an electrolytic capacitor. A plurality of glue dispensing grooves 4 are arranged on the inner bottom of the bottom shell 11. The number, shape and size of the glue dispensing grooves 4 are designed according to the number, shape and size of the actual heating element 3. The glue dispensing grooves 4 are arranged corresponding to the heating element 3. In the present embodiment, two glue dispensing grooves 4 are arranged corresponding to the transformer and the electrolytic capacitor respectively.

[0039] A thermally conductive adhesive layer 5 is provided between the adhesive dispensing groove 4 and the heating element 3. In the present embodiment, the material of the thermally conductive adhesive layer 5 includes but is not limited to silica gel or a polymer-based material, wherein a thermally conductive filler such as aluminum oxide or silicon particles may be added to improve its thermal conductivity. The thermally conductive adhesive layer 5 may be in a liquid state, uniformly coated on the inner wall of the adhesive dispensing groove 4 and formed into an adhesive layer by curing after coating. The thermally conductive adhesive layer 5 may be in a semi-solid state, and the thermally conductive adhesive layer 5 is prepared in advance and filled into the adhesive dispensing groove 4.

[0040] The heating element 3 is accommodated in the dispensing groove 4 and is arranged in contact with the thermally conductive adhesive layer 5. The thermally conductive adhesive layer 5 directly conducts the heat generated by the heating element 3 to the housing 1 for dissipation. The heating element 3 is directly placed in the dispensing groove 4 and is in closer contact with the thermally conductive adhesive layer 5, which helps to improve the thermal conductivity efficiency and conduct the heat to the housing 1 more quickly. Moreover, the heating element 3 is accommodated in the dispensing groove 4, which can improve the mechanical stability of the heating element 3 and the circuit board 2, reduce displacement or damage caused by vibration or other external factors, and help to improve the reliability and durability of the product.

[0041] The heat-conducting adhesive layer 5 extends to the circumferential side of the heating element 3, thereby ensuring direct contact between the heat-conducting adhesive layer 5 and the heating element 3, maximizing the heat conduction, allowing the heat to be more quickly conducted to the heat-conducting adhesive layer 5 and dissipated toward the housing 1, thereby optimizing the heat dissipation path; and the circumferential arrangement of the heat-conducting adhesive layer 5 can enhance its fixation to the heating element 3, preventing movement or loosening during use, thereby improving the stability and reliability of the product;

[0042] The thickness of the thermal conductive adhesive layer 5 between the bottom of the heating element 3 and the bottom wall of the adhesive dispensing groove 4 is set to S (see Figure 2 As shown in the mark in the middle, S is 2-3mm. In the present embodiment, S may be but is not limited to 2.5mm. When pre-filling the dispensing groove 4 with glue, it is necessary to ensure that the thickness of the thermal conductive adhesive layer 5 coated on the bottom wall of the dispensing groove 4 is 2-3mm. This thickness design can effectively transfer the heat generated by the heating element 3 to the surface of the housing 1, shorten the heat conduction path of the thermal conductive adhesive layer 5, improve the heat dissipation efficiency, maintain the stability and performance of the inverter, and reduce the amount of glue while meeting the heat dissipation requirements, making the overall design more economical and efficient.

[0043] During production, the thermal conductive adhesive layer 5 is partially pre-filled into the glue dispensing groove 4 in the bottom shell 11, and then the circuit board 2 is installed. At this time, the heating element 3 on the circuit board 2 is placed toward the bottom side of the bottom shell 11, so that the heating element 3 on the circuit board 2 is inserted into the corresponding glue dispensing groove 4 and fits with the thermal conductive adhesive layer 5 in the glue dispensing groove 4; then the sealing cover 12 is aligned with the opening 111 of the bottom shell 11 so that it can completely cover and block the opening 111, and the sealing cover 12 is firmly fixed on the bottom shell 11 by screws 9 passing through the sealing cover 12 and matching with the threaded holes 113 of the bottom shell 11, so as to complete the assembly of the inverter; when the inverter is working, the heating element 3 generates heat. At this time, since the heating element 3 is inserted into one side of the glue dispensing groove 4 and fits with the thermal conductive adhesive layer 5, the heat generated by the heating element 3 can be directly conducted to the thermal conductive adhesive layer 5, and then conducted to the surface of the shell 1 through the contact surface between the thermal conductive adhesive layer 5 and the shell 1 to dissipate;

[0044] The present application designs a solution of a glue dispensing groove 4 in combination with a pre-glue filling process, which can save 60% of the glue used compared to the existing full glue filling method; the setting of the glue dispensing groove 4 and the thermal conductive glue layer 5 can realize direct contact and heat transfer between the heating element 3 and the shell 1, effectively improve the heat dissipation efficiency, optimize the heat conduction path, and enable the heat to be conducted and dissipated more quickly, thereby improving the heat dissipation effect of the inverter; the design of the solution of the corresponding setting of the glue dispensing groove 4 and the heating element 3 can form the thermal conductive glue layer 5 only around the heating element 3, without filling the entire shell 1 with glue like the traditional full glue filling method, thereby reducing the amount of glue dispensing, and making the extrusion force on the glue when filling the space relatively small, and it is not easy to squeeze air into the glue liquid to form bubbles, thereby reducing the formation of bubbles; and the glue dispensing groove 4 combined with the pre-glue filling method does not require the additional design of glue injection ports and exhaust ports, so that the shell 1 of the inverter of the present application has a good sealing effect.

[0045] Reference Figure 2 and Figure 3 A boss structure 6 is provided on the inner bottom wall of the bottom shell, and the boss structure 6 supports the circuit board 2. In this embodiment, the boss structure 6 can also be used as a profiling structure of the glue layer filled with the non-heating component 3 in the shell 1 in the traditional full glue filling method. In this embodiment, an inner concave structure corresponding to the boss structure 6 is provided on the outside of the bottom shell 11;

[0046] On the one hand, the boss structure 6 can serve as a supporting structure for the circuit board 2, optimize the overall structure, ensure that the circuit board 2 is firmly fixed in the housing 1, prevent it from shaking or loosening during use, and improve the quality and reliability of the inverter; on the other hand, the boss structure 6 is equivalent to the contoured structure of the glue-dotting part at the position of the non-heat-generating element 3 in the original full-glue filling method, which can reduce the amount of glue used, reduce material costs, and reduce waste generation in the production process, meeting the requirements of sustainable development.

[0047] Reference Figure 2 and Figure 3 A thermally conductive gel layer 7 is provided between the circuit board 2 and the boss structure 6. The material of the thermally conductive gel layer 7 includes but is not limited to a thermally conductive gel of copper or aluminum metal nanoparticles. The thermally conductive gel layer 7 is bonded to the circuit board 2 and to the boss structure 6. In the present embodiment, the thermally conductive gel layer 7 includes but is not limited to being uniformly arranged along the top surface of the boss structure 6. The thermally conductive gel layer 7 can effectively conduct the heat generated by the circuit board 2 to the boss structure 6, and then conduct it to the surface of the housing 1 by the boss structure 6, so as to dissipate the heat more quickly, improve the heat dissipation efficiency, and prevent the equipment from being damaged due to overheating. In addition, the thermally conductive gel layer 7 can also provide additional mechanical support to further stabilize the position of the circuit board 2 in the housing 1, prevent it from moving or vibrating during transportation or use, and improve the reliability of the product.

[0048] Reference Figure 3The boss structure 6 is provided with a mounting hole 61, and the circuit board 2 is fixed on the boss structure 6 through the mounting hole 61. In the present embodiment, the circuit board 2 includes but is not limited to being connected with the mounting hole 61 through a screw 9, and the screw 9 is arranged corresponding to the mounting hole 61. The screw 9 passes through the circuit board 2 and is then inserted into the mounting hole 61 and is threadedly connected with the mounting hole 61 to fix the circuit board 2 on the boss structure 6; the circuit board 2 is fixed to the boss structure 6 by the connection between the screw 9 and the mounting hole 61. The process of installing the circuit board 2 is relatively simple and quick, which reduces the time and complexity required for installation, improves production efficiency, and is also convenient for later maintenance and replacement; and it also makes the connection between the circuit board 2 and the boss structure 6 more reliable and stable, reduces the risk of failure caused by loose connection or falling off during use, thereby improving the stability and reliability of the installation of the circuit board 2.

[0049] Reference Figure 3 and Figure 4 A heat dissipation fin structure 8 is provided on the outer side of the housing 1. In this embodiment, the heat dissipation fin structure 8 is provided on the bottom shell 11 and on the outer bottom wall of the bottom shell 11. The heat dissipation fin structure 8 is provided corresponding to the heating element 3. The heat dissipation fin structure 8 includes a plurality of heat dissipation fins 81, and the heat dissipation fins 81 are evenly distributed along the circumference of the bottom shell 11, thereby ensuring that the heat is evenly distributed on the entire surface of the bottom shell 11, improving the heat dissipation efficiency, and avoiding failures caused by local overheating.

[0050] The heat dissipation fin structure 8 can increase the surface area of ​​the shell 1 in contact with the air, accelerate the dissipation of heat generated by the heating element 3 out of the shell 1, and by setting the heat dissipation fin structure 8 corresponding to the heating element 3, the heat sink 81 can directly absorb and conduct heat, and quickly transfer the heat to the heat sink 81 for dissipation, thereby improving the heat dissipation efficiency of the heating element 3, accelerating the heat transfer speed, reducing the operating temperature of the inverter, and extending the life of the inverter.

[0051] Reference Figure 3 The bottom shell 11 is provided with a wiring slot 112, the wiring slot 112 is communicated with the opening 111, and the sealing cover 12 closes the wiring slot 112; through the design of the wiring slot 112, a convenient installation channel is provided for connecting the wiring of the inverter, and the wires can be easily introduced into the inverter through the wiring slot 112 to connect various circuits or external power supplies, thereby simplifying the inverter line installation process and improving work efficiency, and the wires introduced through the wiring slot 112 can be arranged more neatly inside the inverter, reducing the possibility of circuit clutter and contact errors; and during the installation process, the wiring slot 112 is closed by the sealing cover 12, which can ensure the sealing and waterproofness of the inverter, effectively protect the internal circuit from the influence of the external environment, and improve the reliability and durability of the equipment.

[0052] The implementation principle of an inverter of the embodiment of the present application is as follows: the present application adopts a scheme design in which the glue dispensing groove 4 is correspondingly arranged with the heating element 3, and locally pre-fills the glue dispensing groove 4 with a thermally conductive glue layer 5, and designs a boss structure 6 as a contour structure of the glue dispensing part at the position of the non-heating element 3 in the original full glue filling method, so as to achieve the purpose of forming the thermally conductive glue layer 5 only around the heating element 3, without filling the entire shell 1 with glue like the traditional full glue filling method, thereby reducing the glue dispensing amount; at the same time, the setting of the glue dispensing groove 4 and the thermally conductive glue layer 5 can achieve direct contact and heat transfer between the heating element 3 and the shell 1, effectively improve the heat dissipation efficiency, and optimize the heat conduction path;

[0053] During production, the glue dispensing groove 4 in the bottom shell 11 is partially pre-filled with thermally conductive potting glue and cured to form a glue layer, ensuring that the thickness of the thermally conductive glue layer 5 formed on the bottom wall of the glue dispensing groove 4 is 2-3 mm; at the same time, the thermally conductive gel layer 7 is covered on the boss structure 6 in the bottom shell 11; then the circuit board 2 is installed, and the heating element 3 on the circuit board 2 is placed toward the bottom side of the bottom shell 11, so that the heating element 3 on the circuit board 2 is inserted into the corresponding glue dispensing groove 4 and fits with the thermally conductive glue layer 5 in the glue dispensing groove 4. At the same time, the circuit board 2 will contact the boss structure 6 and fit the thermal conductive gel layer 7 thereon, and then the screw 9 is passed through the circuit board 2 and inserted into the mounting hole 61 to be threadedly connected with the mounting hole 61, so as to fix the circuit board 2 on the boss structure 6; finally, the sealing cover 12 is aligned with the opening 111 of the bottom shell 11 so that it can completely cover and block the opening 111, and the sealing cover 12 is fixed to the bottom shell 11 by passing the screw 9 through the sealing cover 12 and matching with the threaded hole 113 of the bottom shell 11, so as to complete the assembly of the inverter;

[0054] When the inverter is working, the heating element 3 will generate heat. At this time, since the heating element 3 is inserted into one side of the glue dispensing groove 4 and fits with the thermal conductive adhesive layer 5, the heat generated by the heating element 3 can be directly conducted to the thermal conductive adhesive layer 5, and then conducted to the shell 1 through the contact surface between the thermal conductive adhesive layer 5 and the shell 1 to dissipate. At this time, the heat dissipation fin structure 8 arranged on the outer bottom wall of the shell 1 can increase the surface area of ​​the shell 1 contacting the air, and the heat sink 81 can directly absorb and conduct heat, and quickly transfer the heat to the heat sink 81 to dissipate the heat from the shell 1; at the same time, the thermal conductive gel layer 7 can effectively conduct the heat generated by the circuit board 2 to the boss structure 6, and then conduct it to the surface of the shell 1 by the boss structure 6, and directly absorb and conduct the heat through the heat sink 81, and quickly transfer the heat to the heat sink 81 to dissipate the heat from the shell 1.

[0055] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An inverter, characterized in that: It includes a shell, a circuit board and a heating element. The heating element is arranged on the circuit board. A glue dispensing groove is arranged in the shell. The glue dispensing groove is arranged corresponding to the heating element. A thermal conductive adhesive layer is arranged between the glue dispensing groove and the heating element. The thermal conductive adhesive layer directly conducts the heat generated by the heating element to the shell for dissipation.

2. The inverter according to claim 1, characterized in that: The heating element is accommodated in the glue dispensing groove and is arranged in contact with the thermally conductive glue layer.

3. The inverter according to claim 2, characterized in that: The thickness of the thermally conductive adhesive layer between the heating element and the bottom of the adhesive dispensing groove is 2-3 mm.

4. The inverter according to claim 3, characterized in that: The thermal conductive adhesive layer extends to the peripheral side of the heating element.

5. The inverter according to claim 1, characterized in that: A boss structure is provided in the shell, and the boss structure supports the circuit board.

6. The inverter according to claim 5, characterized in that: A heat-conducting gel layer is provided between the circuit board and the boss structure.

7. The inverter according to claim 5, characterized in that: The boss structure is provided with a mounting hole, and the circuit board is fixed on the boss structure through the mounting hole.

8. The inverter according to claim 1, characterized in that: A heat dissipation fin structure is disposed on the outer side of the shell, and the heat dissipation fin structure is disposed corresponding to the heating element.

9. The inverter according to claim 1, characterized in that: The housing comprises a bottom shell and a sealing cover. An opening is formed on one side of the bottom shell. The sealing cover is sealed on the opening. The sealing cover is detachably connected to the bottom shell.

10. The inverter according to claim 9, characterized in that: The bottom shell is provided with a wiring slot, the wiring slot is communicated with the opening, and the sealing cover seals the wiring slot.

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