Frame and DBC substrate connecting structure and IPM intelligent module
By using the connection structure between the frame and the DBC substrate during the plastic sealing process, and using pressing pieces and clamps to fix the DBC substrate, the problem of substrate warping is solved, and the substrate after plastic sealing is flattened and product quality is improved.
Patent Information
- Application Number
- CN202420945208.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-04-30
AI Technical Summary
During the plastic sealing process, the DBC substrate is prone to lift due to lack of fixation, resulting in uneven plastic sealing and affecting product quality.
The connection structure between the frame and the DBC substrate is used, and the DBC substrate is fixed through the cooperation of pressing pieces and clamping parts to ensure that it remains flat during plastic sealing.
It effectively prevents the DBC substrate from lifting during the plastic sealing process, ensures that the substrate after plastic sealing is flat, improves product quality, and simplifies the process flow.
Smart Images
Figure CN222380577U_ABST
Abstract
Description
Technical Field
[0001] The utility model mainly relates to an IPM intelligent module, in particular to a connection structure between a frame and a DBC substrate and an IPM intelligent module. Background Art
[0002] like Figure 1 As shown, the IPM (Intelligent Power Module) intelligent module includes a frame 1 and a DBC substrate 2, wherein the frame 1 is provided with a low-voltage driver chip 5 and a high-voltage driver chip 6, and the DBC substrate 2 is provided with an FRD diode 3 and an IGBT chip 4. When welding, a soldering piece (SAC305 soldering piece or other soldering piece) is placed at the welding position of the DBC substrate 2, and the frame 1 is placed on it. The frame pins are pressed on the soldering piece, and the pins, soldering pieces, and the DBC substrate 2 are stacked together like a sandwich structure. After reflow soldering, the SAC305 melts and welds the frame pins and the DBC together. However, when performing plastic encapsulation, when the plastic encapsulation mold presses on both sides of the frame, because the other three sides of the DBC except the welding side are not fixed, when the plastic encapsulation mold applies pressure ( Figure 2 When the plastic mold in the sealing area 7) applies pressure, the side of the DBC that is not welded will be directly lifted up ( Figure 2 The DBC substrate 2 is provided with an FRD diode 3 and an IGBT chip 4.
[0003] In the prior art, the two sides of the DBC substrate are connected and fixed to the side pins of the frame by welding to solve the above technical problems, such as Figure 3 As shown, however, this method has the following disadvantages: two soldering points are added, and the flow and stress of the solder after melting during the reflow process will cause the soldering points to be uneven and of different heights. Additional stress points are added, and the stress magnitudes of the two stress points are different, which not only increases the cost, but also makes the DBC still uneven. Moreover, when the power module is running at high temperature, the additional stress points in these two places will also have a bad effect, and the improvement of DBC flatness is limited. Utility Model Content
[0004] The technical problem to be solved by the utility model is: in view of the technical problems existing in the prior art, the utility model provides a connection structure of a frame and a DBC substrate which has a simple structure and is used to fix the DBC substrate, and an IPM intelligent module.
[0005] In order to solve the above technical problems, the technical solution proposed by the utility model is:
[0006] A connection structure between a frame and a DBC substrate comprises a pressing sheet and a clamping piece, wherein the clamping piece is located on both sides of the DBC substrate, one end of the pressing sheet is tightly connected to the frame, and the other end of the pressing sheet is clamped to the clamping piece to fix the DBC substrate.
[0007] As a further improvement of the above technical solution:
[0008] The clamping part includes an inlay rivet, which is divided into an upper cylinder and a lower cylinder connected to each other. The diameter of the upper cylinder is larger than the diameter of the lower cylinder. The other end of the pressing sheet is provided with an inlay groove matched with the lower cylinder.
[0009] The diameter of the lower cylinder is D1 and the height is H1; the diameter of the upper cylinder is D2 and the height is H2; the diameter of the inlay groove is D3 and the height is H3; wherein D1≤D3 <D2。
[0010] Among them, H3=H1.
[0011] The clamping part includes an inlay rivet, which is divided into an upper column and a lower column connected to each other. The side length of the upper column is greater than the side length of the lower column. The other end of the pressing plate is provided with an inlay groove adapted to the lower column.
[0012] The clamping parts are located at two corners of the DBC substrate and are far away from the welding end of the DBC substrate.
[0013] The pressing sheet is in a bent shape.
[0014] The utility model also discloses an IPM intelligent module, comprising a frame and a DBC substrate, wherein the frame and the DBC substrate are connected via the connection structure of the frame and the DBC substrate as described above to fix the DBC substrate.
[0015] As a further improvement of the above technical solution:
[0016] The frame is provided with a low-voltage driving chip and a high-voltage driving chip.
[0017] The DBC substrate is provided with an FRD diode and an IGBT chip.
[0018] Compared with the prior art, the advantages of the utility model are:
[0019] During the plastic sealing process, when the plastic sealing mold presses the two sides of the frame, the DBC substrate is fixed by the cooperation between the pressing sheet and the clamping piece, so that it will not warp during the packaging process. The DBC substrate after plastic sealing is flat, thereby ensuring product quality; and the overall structure of the clamping piece is simple and easy to implement. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 It is a schematic diagram of the structure after the frame and the DBC substrate are welded in the prior art.
[0021] Figure 2 It is a schematic diagram of the warping of the DBC substrate in the prior art.
[0022] Figure 3 A structural diagram of adding welding points in the prior art.
[0023] Figure 4 This is a diagram showing an embodiment of the connection structure of the utility model in a specific application.
[0024] Figure 5 This is one of the structural schematic diagrams of the connection structure of the utility model in the first embodiment.
[0025] Figure 6 This is the second structural diagram of the connection structure of the utility model in the first embodiment.
[0026] Figure 7 This is the third structural diagram of the connection structure of the utility model in the first embodiment.
[0027] Figure 8 This is the fourth structural diagram of the connection structure of the utility model in the first embodiment.
[0028] Fig. 9 This is a three-dimensional structural diagram of the connection structure of the utility model in the second embodiment.
[0029] Fig.10 This is a main structural diagram of the connection structure of the utility model in the second embodiment.
[0030] Fig.11 This is a top view of the connection structure of the utility model in the third embodiment.
[0031] Fig.12 This is one of the main structural diagrams of the connection structure of the utility model in the third embodiment.
[0032] Fig.13 This is the second main structural diagram of the connection structure of the utility model in the third embodiment.
[0033] Legend: 1. Frame; 2. DBC substrate; 3. FRD diode; 4. IGBT chip; 5. Low-voltage driver chip; 6. High-voltage driver chip; 7. Plastic mold pressure application area; 8. Warping area; 9. Clip; 10. Inlay rivet; 11. Inlay groove; 12. Pressing piece. DETAILED DESCRIPTION
[0034] The utility model is further described below in conjunction with the accompanying drawings and specific embodiments.
[0035] Embodiment 1:
[0036] As Figure 4-8 shown, the connection structure between the frame of the embodiment of the present invention and the DBC substrate includes a pressing piece 12 and a clamping member 9. The clamping member 9 is located on both sides of the DBC substrate 2. One end of the pressing piece 12 is firmly connected to the frame 1, and the other end of the pressing piece 12 is clamped with the clamping member 9 to fix the DBC substrate 2, thereby ensuring the flatness of the DBC substrate 2 during plastic encapsulation.
[0037] Specifically, as Figure 6 shown, the clamping member 9 includes an inlaid rivet 10. The inlaid rivet 10 is divided into an upper cylinder and a lower cylinder connected together. The diameter of the upper cylinder is larger than that of the lower cylinder. The other end of the pressing piece 12 is provided with an inlaid groove 11 (the grooving direction is consistent with the length direction of the pressing piece 12) adapted to the lower cylinder. Wherein the diameter of the lower cylinder is D1, the height is H1; the diameter of the upper cylinder is D2, the height is H2; the diameter of the inlaid groove 11 is D3, the height is H3; and D1≤D3<D2; H3 = H1. By matching the dimensions between the inlaid groove 11 and the lower cylinder (both the diameter and the height are the same), the reliability of the clamping is ensured.
[0038] Specifically, the clamping member 9 is located at the two corner positions of the DBC substrate 2 and is far from the welding end of the DBC substrate 2. Through the above arrangement of the specific position of the clamping member 9, the fixation of the DBC substrate 2 can be maximally realized, and the reliability of the fixation is ensured.
[0039] Furthermore, the pressing piece 12 is bent. Through the bent pressing piece 12, the normal clamping between the pressing piece 12 and the clamping member 9 can be ensured, and at the same time, the pressing piece 12 can maintain a certain pressing force on the DBC substrate 2.
[0040] When the present utility model is subjected to plastic encapsulation, when the plastic encapsulation mold presses on both sides of the frame 1, the DBC substrate 2 is fixed through the cooperation of the inlaid rivet 10, the pressing piece 12 and the inlaid groove 11, so that it will not warp during the encapsulation process, and the DBC substrate 2 after plastic encapsulation is flat, thereby ensuring the product quality.
[0041] The embodiment of the present utility model also discloses an IPM intelligent module, which includes a frame 1 and a DBC substrate 2. The frame 1 and the DBC substrate 2 are connected through the connection structure between the frame 1 and the DBC substrate 2 as described above to fix the DBC substrate 2. In addition, a low-voltage driving chip 5 and a high-voltage driving chip 6 are provided on the frame 1; an FRD diode 3 and an IGBT chip 4 are provided on the DBC substrate 2. The IPM intelligent module of the present utility model includes the connection structure as described above and also has the advantages as described in the above connection structure.
[0042] Embodiment 2:
[0043] In this embodiment, if Figure 9-10 As shown, the upper and lower cylinders are replaced by upper and lower columns, and the diameter of the cylinders corresponds to the side length of the square column, which can also ensure the reliability of the clamping. Other contents not mentioned are the same as those in the first embodiment and will not be repeated here.
[0044] Embodiment three:
[0045] In this embodiment, if Figure 11-13 As shown, the other end of the pressing sheet 12 is provided with an inlay groove 11 adapted to the lower cylinder, and the groove direction is perpendicular to the length direction of the pressing sheet 12. The arrangement of the inlay groove 11 facilitates the clamping connection with the clamping member 9 on the DBC substrate 2, and the operation is simple. Other contents not described are the same as those in the first embodiment, and will not be repeated here.
[0046] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0047] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0048] In the present invention, unless otherwise clearly specified and limited, the terms "assemble", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0049] The above are only preferred implementations of the utility model. The protection scope of the utility model is not limited to the above embodiments. All technical solutions under the idea of the utility model belong to the protection scope of the utility model. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the utility model should be regarded as the protection scope of the utility model.
Claims
1. A connection structure between a frame and a DBC substrate, characterized in that: It comprises a pressing sheet (12) and a clamping piece (9), wherein the clamping piece (9) is located on both sides of the DBC substrate (2), one end of the pressing sheet (12) is tightly connected to the frame (1), and the other end of the pressing sheet (12) is clamped to the clamping piece (9) to fix the DBC substrate (2).
2. The connection structure between the frame and the DBC substrate according to claim 1, characterized in that: The clamping part (9) comprises an inlay rivet (10), wherein the inlay rivet (10) is divided into an upper cylinder and a lower cylinder which are connected to each other, wherein the diameter of the upper cylinder is greater than the diameter of the lower cylinder, and the other end of the pressing sheet (12) is provided with an inlay groove (11) which is matched with the lower cylinder.
3. The connection structure between the frame and the DBC substrate according to claim 2, characterized in that: The diameter of the lower cylinder is D1 and the height is H1; the diameter of the upper cylinder is D2 and the height is H2; the diameter of the inlay groove (11) is D3 and the height is H3; wherein D1≤D3 <D2。 4. The connection structure between the frame and the DBC substrate according to claim 3, characterized in that: Among them, H3=H1.
5. The connection structure between the frame and the DBC substrate according to claim 1, characterized in that: The clamping part (9) comprises an inlay rivet (10), wherein the inlay rivet (10) is divided into an upper column and a lower column which are connected to each other, the side length of the upper column is greater than the side length of the lower column, and the other end of the pressing plate (12) is provided with an inlay groove (11) which is matched with the lower column.
6. The connection structure between the frame and the DBC substrate according to any one of claims 1 to 5, characterized in that: The clamping parts (9) are located at two corners of the DBC substrate (2) and are far away from the welding end of the DBC substrate (2).
7. The connection structure between the frame and the DBC substrate according to any one of claims 1 to 5, characterized in that: The pressing sheet (12) is in a bent shape.
8. An IPM intelligent module, comprising a frame (1) and a DBC substrate (2), characterized in that: The frame (1) and the DBC substrate (2) are connected via the connection structure between the frame (1) and the DBC substrate (2) as claimed in any one of claims 1 to 7 to fix the DBC substrate (2).
9. The IPM intelligent module according to claim 8, characterized in that: The frame (1) is provided with a low-voltage driving chip (5) and a high-voltage driving chip (6).
10. The IPM intelligent module according to claim 8, characterized in that: The DBC substrate (2) is provided with an FRD diode (3) and an IGBT chip (4).