Solder wire extruding machine facilitating collection

Abstract

The utility model discloses a solder wire extruding machine convenient to collect, and belongs to the technical field of metal machining, the solder wire extruding machine comprises a machining table, an extruding device is arranged on one side of the machining table, a wire outlet is formed in the side, close to the machining table, of the extruding device, and a cooling box is arranged on one side of the upper surface of the machining table; through holes are symmetrically formed in the two sides of the cooling box, a cooling spray head is arranged on the inner top wall of the cooling box, a positioning block is fixedly installed on the side, located on the cooling box, of the upper surface of the machining table, an air cylinder is fixedly installed on one side of the positioning block, and a movable block is fixedly connected to the telescopic end of the air cylinder. According to the tin wire winding device, the motor drives the material collecting roller to rotate to wind and collect tin wires, the position of the moving block is adjusted through the air cylinder, the moving block slides back and forth along the sliding rod, and therefore the position of the wire guiding hole is adjusted, the tin wires can be evenly wound on the material collecting device, and the winding condition is effectively avoided.

Description

Technical Field

[0001] The present application relates to the technical field of metal processing, and in particular to a solder wire extruder that is convenient for collection. Background Art

[0002] The solder wire extruder is a device used to produce and process solder wire. In the production process of tin wire, the solder wire extruder mainly extrude the raw tin rod into a hollow tubular tin wire. During the extrusion, the molten rosin is pressed into the hollow cavity of the tin wire to obtain the finished solder wire. The solder wire has a certain length and diameter, and can be used in conjunction with an electric soldering iron or laser in the welding of electronic components.

[0003] In the patent document with the published announcement number CN208358090U, a solder wire collecting device for a solder wire extruder is provided. The fixing rod in the through hole is inserted into the fixing hole through the insertion column and the mounting groove to fix the support plate. When the support plate needs to be cleaned or replaced, the fixing rod is pulled to disengage from the fixing hole to release the fixation of the support plate, which makes it convenient to remove the support plate. The support plate after cleaning or replacement will not scratch the surface of the solder wire, thereby effectively ensuring the quality of the finished solder wire.

[0004] At present, a solder wire collecting device of a solder wire extruder has certain defects when in use. When the solder wire is wound and collected, the position relationship of the solder wire during the winding process cannot be adjusted, and winding is prone to occur, which affects the collection of the solder wire. Therefore, an improvement is now made to a solder wire extruder that is easy to collect. Utility Model Content

[0005] In view of the shortcomings of the prior art, the present application provides a solder wire extruder that is easy to collect, which overcomes the shortcomings of the prior art and aims to solve the problem that when the solder wire is wound and collected, the position relationship of the solder wire cannot be adjusted during the winding process, which easily causes winding and affects the collection of the solder wire.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a solder wire extruder that is easy to collect, comprising a processing table, an extrusion device is provided on one side of the processing table, a wire outlet is provided on the side of the extrusion device close to the processing table, a cooling box is provided on one side of the upper surface of the processing table, through holes are symmetrically provided on both sides of the cooling box, a cooling nozzle is provided on the inner top wall of the cooling box, a positioning block is fixedly installed on the upper surface of the processing table on one side of the cooling box, a cylinder is fixedly installed on one side of the positioning block, a moving block is fixedly connected to the telescopic end of the cylinder, a wire hole is provided inside the moving block, and a material collecting device is fixedly installed on the upper surface of the processing table on one side of the moving block.

[0007] By adopting the above technical scheme, the solder wire is squeezed out from the wire outlet through the provided extrusion device, the solder wire passes through the through hole into the interior of the cooling box, the solder wire is cooled down by spraying coolant through the provided cooling nozzle, the cooled solder wire passes through the through hole on the other side and then passes through the wire hole inside the moving block and is wound onto the receiving device, the position of the moving block is adjusted by telescopic movement of the provided cylinder, thereby adjusting the position of the wire hole, so that the solder wire can be evenly wound onto the receiving device, and winding is effectively avoided.

[0008] As a preferred technical solution of the present application, a sliding rod is slidably inserted inside the moving block, and both ends of the sliding rod are fixedly installed on the inner side of the positioning block. There are two sliding rods and they are symmetrically distributed about the cylinder.

[0009] By adopting the above technical solution, the position of the moving block is adjusted by telescopic movement of the provided cylinder, so that the moving block slides back and forth along the sliding rod. By providing the sliding rod, it can be ensured that the moving track of the moving block is stable and does not shake when moving.

[0010] As a preferred technical solution of the present application, the material receiving device includes a mounting block fixedly mounted on the upper surface of the processing table, a material receiving roller is rotatably connected to the inner side of the mounting block, a motor is fixedly mounted on the outer side of the mounting block, and one end of the material receiving roller is fixedly connected to the output end of the motor.

[0011] By adopting the above technical solution, the receiving roller is driven by the motor to rotate, and the receiving roller rotates to wind and collect the solder wire.

[0012] As a preferred technical solution of the present application, a circulating pump is fixedly installed on the lower surface of the processing table located on one side of the cooling box.

[0013] By adopting the above technical solution, the coolant in the cooling box is transported to the cooling nozzle through the circulation pump for operation, thereby realizing the recycling of the coolant.

[0014] As a preferred technical solution of the present application, the cooling box is provided with a through hole and a cleaning unit is arranged on a side close to the positioning block. The number of the cleaning units is two and they are symmetrically distributed about the through hole.

[0015] By adopting the above technical solution, the solder wire passing through the through hole is cleaned by the provided cleaning unit to remove impurities on the surface of the solder wire.

[0016] As a preferred technical solution of the present application, the cleaning unit includes a fixing plate fixedly installed on the outer wall of the cooling box, a spring is fixedly connected to one side of the fixing plate close to the through hole, the other end of the spring is fixedly connected to the cleaning plate, and a cleaning brush is provided on the outer surface of the cleaning plate.

[0017] By adopting the above technical solution, the position of the cleaning plate is adjusted by utilizing the elastic force of the spring, thereby adjusting the position of the cleaning brush so that the cleaning brush can fit on the outer surface of the solder wire to clean it, thereby ensuring the cleaning ability of the cleaning unit.

[0018] Beneficial effects of this application:

[0019] In the utility model, the solder wire is squeezed out from the wire outlet through the provided extrusion device, the solder wire passes through the through hole to enter the interior of the cooling box, the cooling liquid is sprayed by the provided cooling nozzle to cool the solder wire, the cooled solder wire passes through the through hole on the other side and then passes through the wire hole inside the moving block to be wound onto the receiving roller, the receiving roller is driven by a motor to rotate to wind and collect the solder wire, the position of the moving block is adjusted by telescopic movement of the provided cylinder, the moving block slides back and forth along the sliding rod, thereby adjusting the position of the wire hole, so that the solder wire can be evenly wound onto the receiving device, and winding is effectively avoided.

[0020] With reference to the following description and drawings, specific embodiments of the present invention are disclosed in detail, indicating the manner in which the principles of the present invention can be adopted. It should be understood that the embodiments of the present invention are not limited in scope thereby. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 This is a schematic diagram of the overall structure of this application;

[0022] Figure 2 This is a schematic diagram of the connection between the cylinder and the moving block of the present application;

[0023] Figure 3 This is a schematic diagram of the structure of the material receiving unit of the present application;

[0024] Figure 4 This is a schematic diagram of the internal structure of the cooling box of the present application;

[0025] Figure 5 This is a schematic diagram of the structure of the cleaning unit of the present application.

[0026] In the figure: 1. Processing table; 2. Cooling box; 3. Extrusion device; 4. Wire outlet; 5. Positioning block; 6. Moving block; 7. Wire hole; 8. Cylinder; 9. Material collecting device; 91. Mounting block; 92. Motor; 93. Material collecting roller; 10. Sliding rod; 11. Through hole; 12. Cooling nozzle; 13. Circulation pump; 14. Cleaning unit; 141. Fixed plate; 142. Spring; 143. Cleaning plate; 144. Brush. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0028] Reference Figure 1-5 A solder wire extruder convenient for collection comprises a processing table 1, an extrusion device 3 is arranged on one side of the processing table 1, a wire outlet 4 is arranged on the side of the extrusion device 3 close to the processing table 1, a cooling box 2 is arranged on one side of the upper surface of the processing table 1, through holes 11 are symmetrically opened on both sides of the cooling box 2, a cooling nozzle 12 is arranged on the inner top wall of the cooling box 2, a positioning block 5 is fixedly installed on the upper surface of the processing table 1 on one side of the cooling box 2, a cylinder 8 is fixedly installed on one side of the positioning block 5, a moving block 6 is fixedly connected to the telescopic end of the cylinder 8, a wire hole 7 is opened inside the moving block 6, and the upper surface of the processing table 1 is located on the moving A material receiving device 9 is fixedly installed on one side of the block 6. When in use, the solder wire is squeezed out from the wire outlet 4 by the provided extrusion device 3, and the solder wire passes through the through hole 11 to enter the interior of the cooling box 2. The solder wire is cooled by spraying coolant through the provided cooling nozzle 12. The cooled solder wire passes through the through hole 11 on the other side and then passes through the wire hole 7 inside the moving block 6 to be wound onto the material receiving device 9. The position of the moving block 6 is adjusted by telescopic movement of the provided cylinder 8, thereby adjusting the position of the wire hole 7, so that the solder wire can be evenly wound onto the material receiving device 9, effectively avoiding the occurrence of winding.

[0029] In this embodiment, if Figure 1-2 As shown, a sliding rod 10 is inserted into the interior of the moving block 6 for sliding movement. Both ends of the sliding rod 10 are fixedly mounted on the inner side of the positioning block 5. There are two sliding rods 10 and they are symmetrically distributed about the cylinder 8. When in use, the position of the moving block 6 is adjusted by telescopic movement of the set cylinder 8, so that the moving block 6 slides back and forth along the sliding rod 10. By setting the sliding rod 10, it can be ensured that the moving trajectory of the moving block 6 is stable and does not shake when moving.

[0030] In this embodiment, if Figure 1 and 3 As shown, the material collecting device 9 includes a mounting block 91 fixedly mounted on the upper surface of the processing table 1, a material collecting roller 93 is rotatably connected to the inner side of the mounting block 91, a motor 92 is fixedly mounted to the outer side of the mounting block 91, one end of the material collecting roller 93 is fixedly connected to the output end of the motor 92, and when in use, the material collecting roller 93 is driven to rotate by the motor 92, and the material collecting roller 93 rotates to wind and collect the solder wire.

[0031] In this embodiment, if Figure 1 and4 As shown, a circulation pump 13 is fixedly installed on the lower surface of the processing table 1 on one side of the cooling box 2. When in use, the cooling liquid inside the cooling box 2 is transported to the cooling nozzle 12 through the circulation pump 13 to realize the recycling of the cooling liquid.

[0032] In this embodiment, if Figure 1 , 4 As shown in Figure 5, the cooling box 2 has a through hole 11 and a cleaning unit 14 is provided on one side close to the positioning block 5. There are two cleaning units 14 and they are symmetrically distributed about the through hole 11. When in use, the solder wire passing through the through hole 11 is cleaned by the cleaning unit 14 to remove impurities on the surface of the solder wire.

[0033] In this embodiment, if Figure 1 , 4 As shown in 5, the cleaning unit 14 includes a fixing plate 141 fixedly mounted on the outer wall of the cooling box 2, a spring 142 is fixedly connected to one side of the fixing plate 141 close to the through hole 11, a cleaning plate 143 is fixedly connected to the other end of the spring 142, and a cleaning brush 144 is provided on the outer surface of the cleaning plate 143. When in use, the position of the cleaning plate 143 is adjusted by the elastic force of the spring 142, thereby adjusting the position of the cleaning brush 144, so that the cleaning brush 144 can fit on the outer surface of the solder wire to clean it, thereby ensuring the cleaning ability of the cleaning unit 14.

[0034] Working principle: when using a solder wire extruder that is easy to collect in the present application, the solder wire is squeezed out from the wire outlet 4 through the provided extrusion device 3, and the solder wire passes through the through hole 11 to enter the interior of the cooling box 2, and the cooling liquid is sprayed by the provided cooling nozzle 12 to cool the solder wire. When the cooled solder wire passes through the through hole 11 on the other side, the position of the cleaning plate 143 is adjusted by the elastic force of the spring 142, thereby adjusting the position of the cleaning brush 144 so that the cleaning brush 144 can fit on the outer surface of the solder wire for cleaning. After cleaning, the solder wire passes through the wire hole 7 inside the moving block 6 and is wound around the receiving roller 93. The receiving roller 93 is driven by the motor 92 to rotate to wind and collect the solder wire. The position of the moving block 6 is adjusted by the provided cylinder 8 through telescopic movement, so that the moving block 6 slides back and forth along the sliding rod 10, thereby adjusting the position of the wire hole 7, so that the solder wire can be evenly wound around the receiving device 9, effectively avoiding the occurrence of winding.

[0035] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A solder wire extruder that is easy to collect, characterized in that: The invention comprises a processing table (1), an extrusion device (3) is arranged on one side of the processing table (1), a wire outlet (4) is arranged on the side of the extrusion device (3) close to the processing table (1), a cooling box (2) is arranged on one side of the upper surface of the processing table (1), through holes (11) are symmetrically opened on both sides of the cooling box (2), a cooling nozzle (12) is arranged on the inner top wall of the cooling box (2), a positioning block (5) is fixedly installed on the upper surface of the processing table (1) at one side of the cooling box (2), a cylinder (8) is fixedly installed on one side of the positioning block (5), a moving block (6) is fixedly connected to the telescopic end of the cylinder (8), a wire hole (7) is opened inside the moving block (6), and a material receiving device (9) is fixedly installed on the upper surface of the processing table (1) at one side of the moving block (6).

2. A solder wire extruder for easy collection according to claim 1, characterized in that: A sliding rod (10) is slidably inserted inside the moving block (6), and both ends of the sliding rod (10) are fixedly mounted on the inner side of the positioning block (5). There are two sliding rods (10) and they are symmetrically distributed with respect to the cylinder (8).

3. A solder wire extruder for easy collection according to claim 1, characterized in that: The material receiving device (9) comprises a mounting block (91) fixedly mounted on the upper surface of the processing table (1); a material receiving roller (93) is rotatably connected to the inner side of the mounting block (91); a motor (92) is fixedly mounted to the outer side of the mounting block (91); and one end of the material receiving roller (93) is fixedly connected to the output end of the motor (92).

4. A solder wire extruder for easy collection according to claim 1, characterized in that: A circulating pump (13) is fixedly mounted on the lower surface of the processing table (1) at one side of the cooling box (2).

5. A solder wire extruder for easy collection according to claim 1, characterized in that: The cooling box (2) is provided with a through hole (11) and a cleaning unit (14) is arranged on a side close to the positioning block (5); the number of the cleaning units (14) is two and they are symmetrically distributed with respect to the through hole (11).

6. A solder wire extruder for easy collection according to claim 5, characterized in that: The cleaning unit (14) comprises a fixing plate (141) fixedly mounted on the outer wall of the cooling box (2); a spring (142) is fixedly connected to one side of the fixing plate (141) close to the through hole (11); the other end of the spring (142) is fixedly connected to a cleaning plate (143); and a cleaning brush (144) is provided on the outer surface of the cleaning plate (143).

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