Aluminum substrate convenient to splice

Abstract

The utility model relates to an aluminum substrate convenient to splice, and belongs to the technical field of aluminum substrates, the aluminum substrate convenient to splice comprises a substrate body and a heat dissipation plate which are spliced with each other, a splicing structure is arranged between the substrate body and the heat dissipation plate and used for achieving splicing installation, and a top pipe used for abutting against the substrate body is further fixedly installed at the top end of the heat dissipation plate. A splicing hole is formed in the middle of the base plate in a penetrating mode, and the splicing structure comprises an insertion pipe fixedly installed on the side face, facing the base plate, of the heat dissipation plate. According to the aluminum substrate convenient to splice, the substrate body and the heat dissipation plate are connected in an inserted mode through the inserting pipes and the splicing holes, meanwhile, the substrate body and the heat dissipation plate are connected in a spliced mode by buckling the buckles to the bayonets, and therefore the substrate body can be conveniently separated for tin soldering, and meanwhile the convenience of subsequent splicing connection is enhanced; and through the connection mode that the bending lugs and the blocking buckles are buckled with each other, the stability is improved after the substrate and the heat dissipation plate are spliced with each other, and the practicability of the device is improved.

Description

Technical Field

[0001] The present application relates to the technical field of aluminum substrates, and in particular to an aluminum substrate that is easy to splice. Background Art

[0002] Aluminum substrate is a substrate material with aluminum as the main component, which is usually used to manufacture electronic products, automotive parts, building materials, etc.

[0003] When an aluminum substrate is used as the substrate of an LED lamp, it usually has a multi-layer structure, including a substrate and a heat dissipation layer. The substrate serves as a carrier for the electrical connection of the lamp components. The lamp beads are installed on the aluminum substrate by soldering. Under normal operation, since the aluminum substrate dissipates heat very quickly, it is not easy to solder the lamp beads to the aluminum substrate by heating with a soldering iron. Therefore, it is necessary to separate the substrates in the aluminum substrate and heat them as a whole to melt the tin paste coated on the aluminum substrate to complete the welding.

[0004] The heat dissipation structure and the substrate in the aluminum substrate are usually manufactured in an integrated manner, which makes it difficult to split and weld the aluminum substrate, increasing the difficulty of welding. In this regard, an aluminum substrate that is easy to splice is proposed to solve the above-mentioned problem. Utility Model Content

[0005] In view of the deficiencies in the prior art, the present application provides an aluminum substrate that is easy to splice, and has advantages such as a multi-layer structure that is easy to disassemble and splice the aluminum substrate.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solutions: an aluminum substrate that is easy to splice, comprising a substrate and a heat sink that are spliced ​​to each other, a splicing structure is provided between the substrate and the heat sink for realizing splicing installation, and a top pipe for abutting the substrate is also fixedly installed on the top of the heat sink;

[0007] A splicing hole is formed through the middle of the substrate, and the splicing structure includes an insert pipe fixedly mounted on the heat sink facing a side of the substrate, and the insert pipe is inserted into the splicing hole;

[0008] The splicing structure also includes a buckle fixedly mounted on the top end of the insert tube, and the base plate is also provided with a bayonet located at the splicing hole, and the buckle is snap-connected to the bayonet.

[0009] Furthermore, the number of the buckles and the bayonet is three, and the three buckles are arranged at equal distances on the top end of the cannula.

[0010] Furthermore, a guide rod for guiding the top pipe is fixedly mounted on a side surface of the base plate facing the heat dissipation plate, and the guide rod is slidably connected to the top pipe.

[0011] Furthermore, extension ears are integrally extended from both side surfaces of the base plate and the heat sink, and the guide rod and the top pipe are respectively fixed on two groups of the extension ears.

[0012] Furthermore, bending ears are fixedly mounted on opposite side surfaces of the base plate and the heat sink, and the bending ears are arranged in an L shape.

[0013] Furthermore, U-shaped buckles are buckled on the vertical edges of the two bending ears.

[0014] Furthermore, a heat dissipation pack is fixedly mounted on the outside of the heat dissipation plate.

[0015] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0016] The aluminum substrate which is easy to splice is provided with a substrate and a heat sink which are plugged into each other through an insert tube and a splicing hole, and a buckle is buckled into a bayonet to complete the mutual splicing connection of the substrate and the heat sink, so that the substrate can be conveniently separated for soldering, and the convenience of subsequent splicing connection is enhanced. The connection mode of the bending ear and the stop buckle which are buckled into each other is provided, so that the stability of the substrate and the heat sink after being spliced ​​together is improved, and the practicality of the device is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of this application;

[0018] Figure 2 A top view of the structure of the substrate of the present application;

[0019] Figure 3 This is a schematic diagram of the structure of the heat sink of this application;

[0020] Figure 4 This is a structural stereogram of the substrate of the present application.

[0021] In the figure: 1. Base plate; 2. Heat sink; 3. Extension ear; 4. Guide rod; 5. Top pipe; 6. Splicing hole; 7. Bayonet; 8. Insert pipe; 9. Buckle; 10. Heat sink; 11. Bending ear; 12. Stop buckle. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0023] See also Figure 1-4In this embodiment, an aluminum substrate that is easy to splice includes a substrate 1 and a heat sink 2 that are spliced ​​together, wherein a heat sink 10 is fixedly installed on the outside of the heat sink 2 to improve the heat dissipation effect of the heat sink 2.

[0024] A splicing structure is provided between the substrate 1 and the heat sink 2 for realizing splicing installation. Meanwhile, in the splicing state, the devices are all made of aluminum material, which can effectively improve the heat dissipation effect of heat conduction from the substrate 1 to the heat sink 2.

[0025] In this embodiment, a splicing hole 6 is opened through the middle of the substrate 1, and the splicing structure includes a plug 8 fixedly installed on the side of the heat sink 2 facing the substrate 1, and the plug 8 is inserted into the splicing hole 6 to complete the mutual connection between the substrate 1 and the heat sink 2.

[0026] It should be noted that the splicing structure also includes a buckle 9 fixedly mounted on the top of the insert 8, and the base plate 1 is also provided with a bayonet 7 located at the splicing hole 6, and the buckle 9 is snapped into the bayonet 7, so that the insert 8 and the base plate 1 can be snapped together and spliced.

[0027] Preferably, the number of buckles 9 and bayonet holes 7 is three, and the three buckles 9 are arranged equidistantly on the top of the insertion tube 8. By surrounding the three buckles 9 into a triangle, the stability of the splicing between the insertion tube 8 and the splicing hole 6 is improved.

[0028] In this embodiment, a top pipe 5 for abutting the base plate 1 is fixedly mounted on the top of the heat sink 2. The top pipe 5 can limit the close relative positions of the heat sink 2 and the base plate 1, thereby ensuring that the buckle 9 can be located at the position of the bayonet 7.

[0029] In this embodiment, a guide rod 4 for guiding the top pipe 5 is fixedly installed on one side surface of the substrate 1 facing the heat sink 2. The guide rod 4 is slidably connected to the top pipe 5. The sliding of the guide rod 4 relative to the top pipe 5 improves the stability of the joint position between the substrate 1 and the heat sink 2.

[0030] It should be noted that extension ears 3 are integrally extended on both side surfaces of the substrate 1 and the heat sink 2, and the guide rods 4 and the top pipes 5 are respectively fixed on the two sets of extension ears 3 and connected through the extension ears 3, so that the guide rods 4 and the top pipes 5 can reduce the space occupied in the middle of the substrate 1 and the heat sink 2.

[0031] In this embodiment, bending ears 11 are fixedly installed on the opposite side surfaces of the substrate 1 and the heat sink 2. The bending ears 11 are L-shaped, and U-shaped stop buckles 12 are buckled on the vertical sides of the two bending ears 11. The stop buckles 12 are attached to the vertical sides of the two bending ears 11.

[0032] In a specific implementation, the blocking buckle 12 is buckled between the two bending ears 11, so that the relative movement of the mutually spliced ​​substrate 1 and the heat dissipation plate 2 is restricted, thereby achieving fixation.

[0033] The working principle of the above embodiment is:

[0034] When the substrate 1 needs to be soldered separately, the buckle 9 extending upward to the middle of the substrate 1 for buckling is squeezed to the middle of the splicing hole 6, so that the buckle 9 is disengaged from the position of the bayonet 7. At this time, the blocking buckle 12 used for restriction is taken out from between the two bending ears 11, so that the insert 8 can be slid out relative to the splicing hole 6, so that the substrate 1 and the heat sink 2 can be separated, so that the bottom of the substrate 1 can be exposed for heating and soldering. At the same time, during the assembly process, it is only necessary to slide the guide rods 4 and the top tubes 5 on both sides of the substrate 1 accordingly, so that the insert 8 can be aligned with the splicing hole 6 for splicing.

[0035] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0036] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. An aluminum substrate that is easy to splice, comprising a substrate (1) and a heat sink (2) that are spliced ​​together, characterized in that: A splicing structure is provided between the base plate (1) and the heat sink (2) for realizing splicing installation, and a top pipe (5) for abutting against the base plate (1) is also fixedly installed on the top of the heat sink (2); A splicing hole (6) is formed through the middle of the base plate (1), and the splicing structure comprises a plug (8) fixedly mounted on a side of the heat sink (2) facing the base plate (1), and the plug (8) is plugged into the splicing hole (6); The splicing structure also includes a buckle (9) fixedly mounted on the top end of the insert tube (8), and the base plate (1) is also provided with a bayonet (7) located at the splicing hole (6), and the buckle (9) is snap-connected to the bayonet (7).

2. The aluminum substrate that is easy to splice according to claim 1, characterized in that: The number of the buckles (9) and the bayonet (7) is selected to be three, and the three buckles (9) are arranged at equal distances on the top end of the insertion tube (8).

3. The aluminum substrate that is easy to splice according to claim 1, characterized in that: A guide rod (4) for guiding the top pipe (5) is also fixedly mounted on a side surface of the base plate (1) facing the heat dissipation plate (2), and the guide rod (4) is slidably connected to the top pipe (5).

4. The aluminum substrate that is easy to splice according to claim 3 is characterized in that: Extension ears (3) are integrally extended from both side surfaces of the base plate (1) and the heat sink (2), and the guide rod (4) and the top pipe (5) are respectively fixed on two groups of the extension ears (3).

5. The aluminum substrate that is easy to splice according to claim 1, characterized in that: A bending ear (11) is fixedly mounted on one side surface opposite to the base plate (1) and the heat dissipation plate (2), and the bending ear (11) is arranged in an L shape.

6. The aluminum substrate that is easy to splice according to claim 5, characterized in that: A U-shaped stop buckle (12) is buckled on the vertical edges of the two bending ears (11).

7. The aluminum substrate that is easy to splice according to claim 1, characterized in that: A heat dissipation bag (10) is fixedly mounted on the outside of the heat dissipation plate (2).

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