Sensor device

Abstract

The utility model relates to the technical field of semiconductor luminescence, and discloses a sensor device, which comprises a substrate, an optical chip, a light-transmitting glue layer and an enclosure part. The optical chips are arranged on the substrate, and the number of the optical chips is at least two. The light-transmitting glue layer at least covers a part of the upper surface of the optical chip. The side face of the light-transmitting glue layer is provided with a reflecting face used for reflecting edge large-angle light. The enclosure part is arranged on the base plate. And the enclosure part is connected with the side surface of the light-transmitting adhesive layer, or is connected with the optical chip and the side surface of the light-transmitting adhesive layer. The side, away from the substrate, of the fence part extends to the position above the side face of the light-transmitting glue layer. The manufacturing method of the sensor device is simple, the light-transmitting glue layer and the enclosure part are simultaneously formed at one time, the production cost is low, and the production efficiency is high; the sensor device is high in light energy utilization rate, high in brightness and high in precision; the overall structure is stable and high in reliability.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor light emitting, and in particular relates to a sensor device. Background Art

[0002] A sensor device is a device that can detect light signals and convert them into electrical signals. Working principle: The sensor device is a collection of at least two or two groups of optical chips that emit and receive light. The light emitting chip emits a light beam, which passes through the optical system to irradiate the object to be measured. The light beam reflected or absorbed by the object passes through the optical system to irradiate the photosensitive area of ​​the photosensitive chip. The sensor device converts the light signal into an electrical signal, which is finally processed by the signal processing circuit and output. The structure and manufacturing method of the existing optical sensor device are as follows:

[0003] Prior art 1:

[0004] Step A1: Refer to Figure 5 At least two optical chips 2 are fixed on the substrate 1, and a transparent adhesive layer 3 is covered on the optical chip 2. The transparent adhesive layer 3 has the function of encapsulating the optical chip 2 and adjusting the outgoing light and the received light. The transparent adhesive layer 3 covers all the optical chips 2 as a whole, that is, the substrate 1 around the optical chip 2 is covered by the transparent adhesive layer 3.

[0005] Step A2: Refer to Figure 6 , grooves 5 are cut on the transparent adhesive layer 3 around the optical chip 2 and between adjacent optical chips 2. The substrate 4 in the area where the groove 5 is located is exposed, so that the enclosure 4 formed in the later process is directly connected to the substrate 1. This setting is because the adhesion between the enclosure 4 and the transparent adhesive layer 3 is not as strong as the adhesion between the enclosure 4 and the substrate 1, and the two are easy to separate, affecting the reliability of the product.

[0006] Step A3: Cover the enclosure 4 directly in the groove 5 or on the side and part of the top surface of the groove 5 and the adjacent light-transmitting adhesive layer 3 by dispensing, injection molding or molding, referring to Figure 7 The enclosure 4 has the function of preventing the emitted light / received light of different optical chips 2 from interfering with each other and preventing crosstalk.

[0007] The method of the prior art 1 adopts methods such as dispensing, injection molding or molding to directly form the enclosure 4 in the groove 5.

[0008] Prior art 2: Steps A1 and A2 are the same as prior art 1, except for step A3. Figure 8 Step A3: pre-fabricate the enclosure 4 matching the groove 5, apply adhesive to the bottom of the enclosure 4, insert the enclosure 4 into the groove 5 and glue it to the substrate 1, and form a Fig. 9 sensor devices.

[0009] The production process of the prior art 1 and 2 is complicated, and the groove 5 needs to be cut in advance. In particular, the prior art 2 requires high processing accuracy of the enclosure 4 and assembly accuracy of the enclosure 4 and the groove 5 due to the small size of the groove 5, which is difficult to process, and has low yield and production efficiency. At the same time, the area where the enclosure 4 of the prior art 1 is connected to the light-transmitting adhesive layer 3 is large, the stress is large, the adhesion is affected, and the structural reliability is poor.

[0010] In addition, the large-angle edge light of the prior art 1 and 2 is reflected multiple times between the enclosure 4 and the optical chip 2, and most of it is absorbed by the optical chip 2, with very little emitted from the front of the optical chip 2, resulting in light energy loss.

[0011] Based on the above, the problem to be solved at present is: to provide a light sensor device with a simple and efficient manufacturing method, a stable structure, high light energy utilization rate and good precision. Utility Model Content

[0012] The utility model aims to provide a sensor device, aiming to solve the problems in the prior art that the sensor device has complex manufacturing process, low production efficiency, low light energy utilization, poor light control effect and low accuracy.

[0013] The utility model is implemented as follows: a sensor device comprises:

[0014] substrate;

[0015] An optical chip, which is disposed on the substrate, and the number of the optical chips is at least 2;

[0016] A light-transmitting adhesive layer, which at least covers a portion of the upper surface of the optical chip; a side surface of the light-transmitting adhesive layer is provided with a reflecting surface for reflecting edge large-angle light;

[0017] A blocking portion is arranged on the substrate; the blocking portion is connected to the side of the light-transmitting adhesive layer, or is connected to the side of the optical chip and the light-transmitting adhesive layer; the blocking portion extends from a side away from the substrate to above the side of the light-transmitting adhesive layer.

[0018] Furthermore, the light-transmitting adhesive layer covers part or all of the upper surface of the optical chip; or the light-transmitting adhesive layer covers the upper surface and part of the side surfaces of the optical chip, or the light-transmitting adhesive layer covers the upper surface and all the side surfaces of the optical chip.

[0019] Furthermore, the light-transmitting adhesive layer is not higher than the enclosure portion.

[0020] Furthermore, the upper surface of the light-transmitting adhesive layer is a curved surface or a flat surface.

[0021] Furthermore, the optical chip includes a light-emitting chip and a photosensitive chip.

[0022] Compared with the prior art, the sensor device provided by the utility model has the following beneficial effects:

[0023] The manufacturing method that can be adopted by the utility model is as follows: a light-transmitting glue is molded onto part or all of the upper surface of the optical chip 2, or the upper surface and side of the optical chip 2. At the same time, black glue or other material glue is injected around the optical chip 2 and the mold by dispensing or other methods, and the black glue or other material glue is formed by natural flow or molding or other methods. After solidification, the mold is removed, and the light-transmitting glue layer 3 and the enclosure 4 are formed at one time.

[0024] 1. The utility model omits step A2 in the prior art 1 and 2, and completes step A1 and step A3 in the same process, that is, the light-transmitting adhesive layer 3 and the enclosure 4 are formed at the same time, which simplifies the process, saves production costs, and greatly improves production efficiency.

[0025] 2. The light-transmitting adhesive layer 3 of the utility model is smaller in volume than the prior art 1 and 2, which saves space, reduces the connection area between the light-transmitting adhesive layer 3 and the enclosure 4, and greatly reduces the stress between the two; at the same time, the connection area between the enclosure 4 and the substrate 1 is increased, so the structure of the utility model is more stable and reliable.

[0026] 3. The side of the light-transmitting adhesive layer 3 is set as a reflective surface 31 for reflecting large-angle light from the edge. The reflective surface 31 is an inverted cone-shaped plane or curved surface, that is, the side of the light-transmitting adhesive layer 3 is set as a plane or curved surface at a certain angle to the upper surface of the optical chip 2. The large-angle light from the edge is incident on the reflective surface 31 and reflected. The reflected light propagates in the direction close to the optical axis and finally emerges from the front of the optical chip 2 or is incident on the photosensitive area. This setting utilizes the large-angle light that is not easily utilized at the edges, improves the utilization rate of light energy, and improves the overall brightness, further improving the detection accuracy of the sensor device. At the same time, the setting of the first reflective surface 31 can reduce the light output angle range, which is easy for optical design. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the cross-sectional structure of the sensor device provided by the utility model;

[0028] Figure 2 It is a schematic cross-sectional structure diagram of the first embodiment of the sensor device provided by the utility model;

[0029] Figure 3 It is a cross-sectional structural schematic diagram of the second embodiment of the sensor device provided by the utility model;

[0030] Figure 4 It is a schematic cross-sectional structure diagram of the third embodiment of the sensor device provided by the utility model;

[0031] Figure 5 is a schematic diagram of the state after the step A1 of the optical sensor device manufacturing method of the prior art is implemented;

[0032] Figure 6 is a schematic diagram of the state after the step A2 of the sensor device manufacturing method of the prior art is implemented;

[0033] Figure 7 It is a schematic diagram of the state after the step A3 of the sensor device manufacturing method of the prior art 1 is implemented;

[0034] Figure 8 It is a schematic diagram of the implementation process of step A3 of the sensor device manufacturing method of the prior art II;

[0035] Fig. 9 It is a schematic diagram of the state after the step A3 of the sensor device manufacturing method of the prior art 2 is implemented;

[0036] In the figure: 1-substrate; 2-optical chip; 3-light-transmitting adhesive layer; 31-reflecting surface; 4-enclosing part; 5-groove. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0038] The implementation of the present utility model is described in detail below in conjunction with specific embodiments.

[0039] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present utility model, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0040] Reference Figure 1-4 As shown, it is a preferred embodiment provided by the utility model.

[0041] The sensor device includes a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3 and a blocking portion 4. Figure 1. The optical chip 2 is arranged on the substrate 1, and the number of the optical chips 2 is at least 2. The optical chip 2 includes a light-emitting chip for emitting light and a photosensitive chip for receiving light. The optical chip 2 can also be arranged as a combination of several groups of optical chip 2 arrays. The light-transmitting adhesive layer 3 at least covers the upper surface of the optical chip 2, and is used to encapsulate the optical chip 2 and optically adjust the emitted light / received light. The light-transmitting adhesive layer 3 covers the following ways: 1. Only covers part or all of the upper surface of the optical chip 2, refer to Figure 3 and Figure 1 ; 2. Cover the upper surface and part of the side of the optical chip 2, refer to Figure 2 ; 3. Cover the upper surface and all sides of the optical chip 2, refer to Figure 4 According to the desired optical shaping effect, the upper surface of the light-transmitting adhesive layer 3 can be set to be a curved surface or a flat surface.

[0042] The side of the light-transmitting adhesive layer 3 is provided with a reflective surface 31 for reflecting large-angle edge light. The reflective surface 31 is a plane or a curved surface in the shape of an inverted cone, that is, the side of the light-transmitting adhesive layer 3 is set as a plane or a curved surface at a certain angle to the upper surface of the optical chip 2. The above-mentioned setting increases the angle of incidence, and the reflected light propagates in the direction close to the optical axis, and finally emerges from the front of the optical chip 2 or is incident on the photosensitive area of ​​the optical chip 2. This setting utilizes the large-angle edge light that is not easily utilized on the edges around, improves the utilization rate of light energy, improves the overall brightness, and further improves the accuracy of the sensor device. At the same time, the setting of the first reflective surface 31 can reduce the light output angle range, which is easy for optical design.

[0043] The enclosure 4 is used to separate the optical chips 2 to prevent light interference between different optical chips 2, which affects the accuracy and reliability of the sensor device. The enclosure 4 is arranged around the optical chip 2 and the transparent adhesive layer 3. Specifically, it includes: 1. The enclosure 4 tightly covers the side of the transparent adhesive layer 3. Figure 3 ; 2. The enclosure portion 4 tightly covers the side of the light-transmitting adhesive layer 3 and part of the side of the optical chip 2, refer to Figure 2 ; 3, the enclosure portion 4 tightly covers the side of the light-transmitting adhesive layer 3 and all the sides of the optical chip 2, refer to Figure 1 The side of the enclosure 4 away from the substrate 1 extends to the upper side of the side of the light-transmitting adhesive layer 3 and surrounds the upper surface of the light-transmitting adhesive layer 3 to prevent light from leaking. Preferably, the highest point of the light-transmitting adhesive layer 3 is not higher than the highest point of the enclosure 4.

[0044] The covering manner of the optical chips 2 and the light-transmitting adhesive layer 3 in each sensor device of the present invention, as well as the connection manner of the optical chip 2 and the enclosure 4 can be the same or different, and the above-mentioned arrangements are all within the scope of the present invention.

[0045] Embodiment 1: The sensor device includes a substrate 1, an optical chip 2, a light-transmitting adhesive layer 3 and a blocking portion 4, referring to Figure 2. The optical chips 2 include two and are arranged on the substrate 1. The upper surface and part of the side of the optical chip 2 are tightly covered with a light-transmitting adhesive layer 3. A reflective surface 31 is arranged on the side of the light-transmitting adhesive layer 3. The upper surface of the light-transmitting adhesive layer 3 is arranged as a convex curved surface. The enclosure 4 is arranged on the substrate and surrounds each optical chip 2 and the corresponding light-transmitting adhesive layer 3. The lower part of the enclosure 4 tightly covers the side of the light-transmitting adhesive layer 3 and part of the side of the optical chip 2, and the upper part of the enclosure 4 extends to above the side of the light-transmitting adhesive layer 3 and surrounds the upper surface of the light-transmitting adhesive layer 3.

[0046] Example 2: Reference Figure 3 , which is mainly different from the first embodiment, the upper surface of one optical chip 2 is tightly covered with a light-transmitting adhesive layer 3, and part of the upper surface of another optical chip 2 is tightly covered with a light-transmitting adhesive layer 3. The lower part of the enclosure 4 tightly covers the side surface and the reflective surface 31 of one optical chip 2, and tightly covers the side surface, part of the upper surface, and the reflective surface 31 of another optical chip 2. The upper part of the enclosure 4 extends to the upper part of the side surface of the light-transmitting adhesive layer 3, and surrounds the upper surface of the light-transmitting adhesive layer 3. Other settings are the same as those of the first embodiment.

[0047] Example 3: Reference Figure 4 , which is mainly different from the first embodiment, the upper surface and all the side surfaces of the optical chip 2 are tightly covered with the light-transmitting adhesive layer 3. The lower part of the enclosure 4 tightly covers the side surface of the light-transmitting adhesive layer 3, and the upper part of the enclosure 4 extends above the side surface of the light-transmitting adhesive layer 3 and surrounds the upper surface of the light-transmitting adhesive layer 3. The other configurations are the same as the first embodiment.

[0048] This does not limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A sensor device, characterized in that: include: substrate(1); An optical chip (2) disposed on the substrate (1), the number of the optical chips (2) being at least 2; A light-transmitting adhesive layer (3) which at least covers a portion of the upper surface of the optical chip (2); a side surface of the light-transmitting adhesive layer (3) is provided with a reflecting surface (31) for reflecting edge large-angle light; A blocking portion (4) is provided on the substrate (1); the blocking portion (4) is connected to a side surface of the light-transmitting adhesive layer (3), or is connected to a side surface of the optical chip (2) and the light-transmitting adhesive layer (3); and the blocking portion (4) extends from a side of the substrate (1) to above the side surface of the light-transmitting adhesive layer (3).

2. The sensor device according to claim 1, characterized in that The light-transmitting adhesive layer (3) covers part or all of the upper surface of the optical chip (2); or the light-transmitting adhesive layer (3) covers the upper surface and part of the side surfaces of the optical chip (2); or the light-transmitting adhesive layer (3) covers the upper surface and all the side surfaces of the optical chip (2).

3. The sensor device according to claim 1, characterized in that: The light-transmitting adhesive layer (3) is not higher than the enclosure portion (4).

4. The sensor device according to claim 1, characterized in that The upper surface of the light-transmitting adhesive layer (3) is a curved surface or a flat surface.

5. The sensor device according to claim 1, characterized in that: The optical chip (2) comprises a light-emitting chip and a photosensitive chip.

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