Bearing plate, layered cold plate structure, battery pack and electric equipment
By using a supporting plate structure including a water-cooling plate and a supporting plate in the battery pack, the problem of insufficient thermal management effect and load-carrying capacity of the traditional cooling plate is solved, achieving better thermal management and greater module power demand.
Patent Information
- Application Number
- CN202420269154.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-02
- Publication Date
- 2025-01-24
- Estimated Expiration
- 2034-02-02
AI Technical Summary
In traditional battery packs, the thermal management effect of the cooling plate depends on the uniform distribution of the runner and has limited load-bearing capacity, making it difficult to be suitable for module application scenarios under large weights.
The support plate structure including water -cooled and supporting boards is composed of the water -cooled plate and a flowway board. A roundabout runway is set on the flow tract. , Stack the support plate and water -cooled plate layer to enhance the support performance.
By optimizing the thermal management structure and enhancing support capabilities, better thermal management effects and greater module power needs have been achieved, which is suitable for larger application scenarios.
Smart Images

Figure CN222394890U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of battery packs, and specifically relates to a supporting plate, a layered cold plate structure, a battery pack and electrical equipment. Background Art
[0002] At present, in order to improve the internal space utilization and power demand, there is a double-layer module structure; in this structural form, a cooling plate is arranged at the bottom of the upper module to perform thermal management on the upper module. However, in traditional applications, the cooling plate at the bottom of the upper module is usually a harmonica tube structure, and the flow channel is in a straight-in and straight-out form. Therefore, the thermal management effect depends on the uniform distribution of the flow channel, and the optimization of the thermal management effect has great limitations; moreover, the harmonica tube has limited load-bearing capacity and cannot be applied to module application scenarios with heavy weights. Utility Model Content
[0003] In order to overcome at least one disadvantage of the above-mentioned prior art, the purpose of the present application is to provide a supporting plate, a layered cold plate structure, a battery pack and an electrical device.
[0004] The technical means adopted by this application to solve the above technical problems are:
[0005] On the one hand, the embodiment of the present application provides a support plate, including a water cooling plate and a support plate;
[0006] The water cooling plate comprises a cover plate and a flow channel plate, the flow channel plate is provided with a plurality of circuitous flow channels, and the cover plate and the flow channel plate overlap each other to form an overlapped area and a flow channel area;
[0007] The cover plate, the flow channel plate and the support plate are stacked in sequence, a plurality of support parts are arranged on the support plate corresponding to the overlapping area, and the overlapping area and the support parts are butted and connected.
[0008] In the embodiment scheme of the present application, by setting the cover plate and the flow channel plate, it is possible to facilitate the setting and application of the circuitous flow channel and realize the optimization setting of the thermal management effect; at the same time, by setting the support plate and making the water cooling plate and the support plate in a stacked installation setting form, the formed support plate can have better thermal management effect and better supporting performance, so that it can be suitable for module application scenarios with greater power demand.
[0009] In some embodiments, a countersunk blind rivet is provided between the overlapping area and the supporting portion.
[0010] In the embodiment scheme of the present application, the countersunk blind rivets are provided to facilitate the fixed connection between the water cooling plate and the support plate, thereby improving the reliability of the support plate after forming; and the provision of the countersunk blind rivets will not affect the provision of the battery cells on the water cooling plate, thereby achieving a better use effect.
[0011] In some embodiments, a groove is formed between the two support portions, and the flow channel area extends into the groove.
[0012] In the embodiment scheme of the present application, by setting the groove, it is easy to realize the extended installation setting form of the flow channel area, so that when supporting the force, the force is mainly borne by the overlapping area and the supporting part, which can facilitate improving the application protection effect of the flow channel area.
[0013] In some embodiments, flange structures are relatively arranged on the end surfaces of the water cooling plate.
[0014] In the embodiment of the present application, the flange structure is provided to facilitate the positioning of the battery cells arranged on the water cooling plate, and can also play the role of blocking glue and enhancing the force-bearing performance.
[0015] On the other hand, an embodiment of the present application provides a layered cold plate structure, including a bottom cold plate and at least one of the supporting plates, wherein the supporting plate is arranged above the bottom cold plate, and the bottom cold plate is connected to the flow channel of the water-cooled plate.
[0016] In the embodiment of the present application, by arranging the support plate above the bottom cold plate, it is possible to form a layered cold plate structure, thereby realizing a layered layout of the module, improving space utilization and meeting power design requirements.
[0017] In some embodiments, a first bracket assembly is disposed between the bottom cold plate and the supporting plate, and the first bracket assembly includes a first vertical plate and a second vertical plate that are disposed parallel to each other;
[0018] The first vertical plate and the second vertical plate are respectively arranged on both sides of the supporting plate and connected to the supporting plate.
[0019] In the embodiment of the present application, by providing the first bracket assembly, a supporting connection relationship can be formed between the bottom cold plate and the supporting plate, thereby improving the application reliability of the layered cold plate structure.
[0020] In some embodiments, a plurality of stands are provided between the bottom cold plate and the support plate;
[0021] The supporting plate is provided with a plurality of connecting parts extending outward, and the connecting parts are overlapped and arranged on the stand.
[0022] In the embodiment of the present application, the stand is provided to further facilitate the installation of the support plate, so that the support plate can have better force stability.
[0023] In some embodiments, a second bracket assembly is disposed between the bottom cold plate and the supporting plate, and the second bracket assembly includes a first horizontal plate and a second horizontal plate that are disposed parallel to each other;
[0024] The first horizontal plate and the second horizontal plate are respectively arranged at the bottom of the vertical frame, and the two ends of the first horizontal plate and the second horizontal plate are respectively overlapped and arranged on the first vertical plate and the second vertical plate.
[0025] In the embodiment of the present application, the second bracket assembly is provided to facilitate the installation of the stand and to form a connection relationship with the first bracket assembly, thereby forming a supporting force system.
[0026] On the other hand, an embodiment of the present application provides a battery pack, in which the layered cold plate structure as described above is disposed.
[0027] In the embodiment of the present application, by applying the layered cold plate structure in the battery pack, it is possible to increase the upper limit of the weight bearing capacity of the modules in the battery pack and to achieve an optimized design of the thermal management effect.
[0028] On the other hand, the embodiment of the present application provides an electrical device, in which the layered cold plate structure as described above is arranged;
[0029] Or, a battery pack as described above is arranged therein.
[0030] In the embodiment scheme of the present application, by applying the layered cold plate structure or the battery pack on the electrical equipment, a larger module power layout setting can be achieved on the electrical equipment, thereby improving the cruising range of the electrical equipment; and the optimization limitations of the thermal management effect can be reduced, thereby improving the thermal management effect of the battery module. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0032] Figure 1 This is a schematic diagram of the cross-sectional structure of the support plate of this application.
[0033] Figure 2 This is a schematic diagram of the top view of the flow channel plate of this application.
[0034] Figure 3 This is a schematic diagram of the top view of the cover plate of this application.
[0035] Figure 4 This is a schematic diagram of the assembly of the layered cold plate structure of this application.
[0036] Figure 5 This is a schematic diagram of the installation structure of the support plate of this application.
[0037] Figure 6 This is a three-dimensional structural schematic diagram of the layered cold plate structure of the present application.
[0038] Figure 7 This is a side view structural schematic diagram of the layered cold plate structure of the present application.
[0039] Figure 8 This is a schematic diagram of the top view of the layered cold plate structure of the present application.
[0040] Marking Description:
[0041] 1-water cooling plate, 11-cover plate, 12-flow channel plate, 121-circumventive flow channel, 101-overlapping area, 102-flow channel area, 13-flanging structure, 14-connecting part;
[0042] 2-support plate, 21-support portion, 22-groove;
[0043] 3-bottom cold plate, 31-first vertical plate, 32-second vertical plate, 33-stand, 34-first horizontal plate, 35-second horizontal plate. DETAILED DESCRIPTION
[0044] In order to more clearly understand the above-mentioned objects, features and advantages of the present invention, the present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth in order to fully understand the present invention, and the embodiments described are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments in the present invention, all other embodiments obtained by ordinary technicians in the art without making creative work are within the scope of protection of the present invention.
[0045] It should be noted that: unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art of the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Similar reference numerals and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of the present application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.
[0046] like Figure 1-8 As shown, a supporting plate is provided in the present embodiment, including a water-cooled plate 1 and a support plate 2, wherein the water-cooled plate 1 and the support plate 2 are stacked, and the water-cooled plate 1 is located above the support plate 2, and is used for installation and setting of battery cells or battery modules and for thermal management; the support plate 2 is used for improving the supporting bearing capacity of the water-cooled plate 1.
[0047] In some embodiments, the water cooling plate 1 includes a cover plate 11 and a flow channel plate 12, and a plurality of circuitous flow channels 121 are arranged on the flow channel plate 12. The cover plate 11 and the flow channel plate 12 overlap each other to form an overlapping area 101 and a flow channel area 102, and the circuitous flow channels 121 are located in the flow channel area 102.
[0048] In some embodiments, the cover plate 11 and the flow channel plate 12 may be welded, such as by brazing; the overlapped area 101 is a solid area after welding, and along the vertical direction, the overlapped area 101 and the flow channel area 102 do not overlap each other. Figure 1 shown.
[0049] In some embodiments, the cover plate 11 , the flow channel plate 12 and the support plate 2 are stacked from top to bottom; a plurality of support portions 21 are provided on the support plate 2 corresponding to the overlapping area 101 , and the overlapping area 101 and the support portions 21 are butted against each other.
[0050] By setting the cover plate 11 and the flow channel plate 12, it is convenient to set up and apply the circuitous flow channel 121. Compared with the structure of the harmonica tube cold plate in the traditional technology, the scheme of this embodiment can achieve the optimization setting of the thermal management effect. At the same time, by setting the support plate 2, and making the water-cooled plate 1 and the support plate 2 in a stacked installation setting form, the formed support plate can have a better thermal management effect and better support performance, so that it can be suitable for module application scenarios with greater power requirements, and the application scalability is better.
[0051] As an application example, a countersunk blind rivet is provided between the overlapping area 101 and the supporting portion 21 .
[0052] By setting the countersunk blind rivets, it is easy to achieve a fixed connection between the water-cooling plate 1 and the support plate 2, thereby improving the reliability of the support plate after forming; and the setting of the countersunk blind rivets will not affect the setting of the battery cells or battery modules on the water-cooling plate 1, thereby achieving a better use effect.
[0053] As one application example, the support portion 21 is convexly disposed on the top end surface of the support plate 2 and is disposed in a long strip shape; a groove 22 is formed between the two support portions 21. The flow channel area 102 extends into the groove 22. Figure 5 shown.
[0054] In some embodiments, the bottom wall of the circuitous flow channel 121 and the bottom wall of the groove 22 can be arranged to fit each other, and in this case, the support plate 2 can form an integral support for the water-cooling plate 1 .
[0055] In some embodiments, a gap may be provided between the bottom wall of the circuitous flow channel 121 and the bottom wall of the groove 22 . In this case, the supporting bearing function is mainly provided by the abutting connection between the overlapping area 101 and the supporting portion 21 .
[0056] By setting the groove 22, it is easy to realize the extended installation setting form of the flow channel area 102, so that when the water cooling plate 1 is supported and subjected to force, the force is mainly borne by the overlapping area 101 and the supporting part 21, which can facilitate improving the application protection effect of the flow channel area 102.
[0057] As one application example, a flange structure 13 is relatively arranged on the end surface of the water-cooling plate 1; wherein the setting position of the flange structure 13 can refer to Figure 1 and Figure 3 as shown in .
[0058] The flange structure 13 can be used to limit the battery cells or battery modules arranged on the water cooling plate 1, and can also play the role of blocking glue and enhancing the force bearing performance.
[0059] In addition, if Figure 4-8 As shown, the present embodiment also provides a layered cold plate structure, including a bottom cold plate 3 and at least one of the supporting plates, wherein the supporting plate is arranged above the bottom cold plate 3, and the bottom cold plate 3 is connected to the flow channel of the water-cooled plate.
[0060] In some embodiments, the number of the supporting plate can be set to one, and in this case the supporting plate is arranged above the bottom cold plate 3 .
[0061] In some embodiments, the number of the supporting plates can be set to two or more, and in this case, the two or more supporting plates are arranged in upper and lower layers above the bottom cold plate 3 .
[0062] In some embodiments, the number of the supporting plates can be set to two or more, and there are at least two supporting plates located on the same horizontal plane and arranged above the bottom cold plate 3.
[0063] In some embodiments, the flow channels of the bottom cold plate 3 and the water-cooled plate 1 are both formed by stamping.
[0064] By arranging the support plate above the bottom cold plate 3, it is convenient to form a layered cold plate structure, thereby realizing a layered layout arrangement of the module, improving space utilization and meeting power design requirements.
[0065] As one application example, a first bracket assembly is arranged between the bottom cold plate 3 and the supporting plate; wherein the first bracket assembly includes a first vertical plate 31 and a second vertical plate 32 which are arranged parallel to each other, and the first vertical plate 31 and the second vertical plate 32 are respectively arranged on both sides of the supporting plate and connected to the support plate 2.
[0066] In some embodiments, the tops of the first vertical plates 31 and the second vertical plates 32 are connected to the support plate 2 , and the bottoms of the first vertical plates 31 and the second vertical plates 32 are connected to and disposed on the bottom cold plate 3 .
[0067] By providing the first bracket assembly, a supporting connection relationship can be formed between the bottom cold plate 3 and the supporting plate, thereby improving the application reliability of the layered cold plate structure.
[0068] As an application example, a plurality of vertical frames 33 are provided between the bottom cold plate 3 and the supporting plate; a plurality of connecting portions 14 extending outward are provided on the supporting plate, and the connecting portions 14 are overlapped and provided on the vertical frames 33 .
[0069] In some embodiments, the first vertical plate 31 and the second vertical plate 32 are respectively disposed on two opposite sides of one of the supporting plates, and the stand 33 is disposed on the other two opposite sides of the supporting plate. Figure 5 shown.
[0070] By providing the stand 33, the installation of the support plate can be further facilitated, so that the support plate can have better stress stability.
[0071] As one application example, a second bracket assembly is arranged between the bottom cold plate 3 and the supporting plate; wherein, the second bracket assembly includes a first horizontal plate 34 and a second horizontal plate 35 which are arranged parallel to each other, the first horizontal plate 34 and the second horizontal plate 35 are respectively arranged at the bottom of the vertical frame 33, and the two ends of the first horizontal plate 34 and the second horizontal plate 35 are respectively overlapped and arranged on the first vertical plate 31 and the second vertical plate 32.
[0072] In some embodiments, the stand 33 can be arranged in an "H" shape or a "U" shape; when installed, the connecting portion 14 is overlapped and arranged in the upper end notch of the stand 33, and the bottom of the stand 33 is installed on the first horizontal plate 34 and the second horizontal plate 35. Figure 5 shown.
[0073] In some embodiments, the first transverse plate 34 , the second transverse plate 35 and the bottom cold plate 3 may be arranged to be merely in contact with each other, so that part of the gravity may act on the bottom cold plate 3 .
[0074] In some embodiments, a gap may be provided between the first transverse plate 34, the second transverse plate 35 and the bottom cold plate 3, such as Figure 7 As shown; at this time, the force exerted on the stand 33 and the first horizontal plate 34 and the second horizontal plate 35 is borne by the first vertical plate 31 and the second vertical plate 32.
[0075] In some embodiments, the support plate, the first vertical plate 31, the second vertical plate 32, the stand 33, the first horizontal plate 34, and the second horizontal plate 35 can all be formed by extrusion, so as to reduce the overall weight while ensuring the force.
[0076] By setting up the second bracket assembly, it is possible to facilitate the installation of the stand 33 and simultaneously form a connection relationship with the first bracket assembly, thereby forming a supporting force system.
[0077] On the other hand, this embodiment also provides a battery pack, in which the layered cold plate structure is arranged.
[0078] By applying the layered cold plate structure in the battery pack, it is possible to increase the upper limit of the weight bearing capacity of the modules in the battery pack and to achieve an optimized design of the thermal management effect.
[0079] On the other hand, this embodiment also provides an electrical device, in which the layered cold plate structure as described above is arranged;
[0080] Alternatively, a battery pack as described above is arranged in the electrical equipment.
[0081] In some embodiments, the electrical equipment includes transportation vehicles such as automobiles.
[0082] By applying the layered cold plate structure or the battery pack on the electrical equipment, a larger module power layout setting can be achieved on the electrical equipment, thereby improving the cruising range of the electrical equipment; and the optimization limitations of the thermal management effect can be reduced, thereby improving the thermal management effect of the battery module.
[0083] The above description is only a specific implementation mode of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various modifications and changes. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should also be included in the scope of protection of the present application. Therefore, the scope of protection of the present application shall be based on the scope of protection of the claims.
[0084] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.
Claims
1. A support plate, characterized in that: Including water cooling plate and support plate; The water cooling plate comprises a cover plate and a flow channel plate, the flow channel plate is provided with a plurality of circuitous flow channels, and the cover plate and the flow channel plate overlap each other to form an overlapped area and a flow channel area; The cover plate, the flow channel plate and the support plate are stacked in sequence, a plurality of support parts are arranged on the support plate corresponding to the overlapping area, and the overlapping area and the support parts are butted and connected.
2. The support plate according to claim 1, characterized in that: Countersunk blind rivets are arranged between the overlapping area and the supporting portion.
3. The support plate according to claim 1 or 2, characterized in that: A groove is formed between the two support parts, and the flow channel area extends into the groove.
4. The support plate according to claim 3, characterized in that: The end surfaces of the water cooling plates are oppositely provided with flange structures.
5. A layered cold plate structure, characterized in that: It comprises a bottom cold plate and at least one supporting plate as described in any one of claims 1 to 4 above, wherein the supporting plate is arranged above the bottom cold plate, and the flow channel of the bottom cold plate is connected with that of the water cooling plate.
6. The layered cold plate structure according to claim 5, characterized in that: A first bracket assembly is arranged between the bottom cold plate and the supporting plate, and the first bracket assembly includes a first vertical plate and a second vertical plate which are arranged parallel to each other; The first vertical plate and the second vertical plate are respectively arranged on both sides of the supporting plate and connected to the supporting plate.
7. The layered cold plate structure according to claim 6, characterized in that: A plurality of stands are arranged between the bottom cold plate and the supporting plate; The supporting plate is provided with a plurality of connecting parts extending outward, and the connecting parts are overlapped and arranged on the stand.
8. The layered cold plate structure according to claim 7, characterized in that: A second bracket assembly is arranged between the bottom cold plate and the supporting plate, and the second bracket assembly includes a first horizontal plate and a second horizontal plate which are arranged parallel to each other; The first horizontal plate and the second horizontal plate are respectively arranged at the bottom of the vertical frame, and the two ends of the first horizontal plate and the second horizontal plate are respectively overlapped and arranged on the first vertical plate and the second vertical plate.
9. A battery pack, characterized in that: A layered cold plate structure as described in any one of claims 5 to 8 is arranged therein.
10. An electrical device, characterized in that: A layered cold plate structure as described in any one of claims 5 to 8 is arranged therein; Or, a battery pack as described in claim 9 is arranged therein.