Electrical discharge machining apparatus

Abstract

The utility model relates to an electric discharge machining device which is used for carrying out an electric discharge machining procedure on a to-be-machined object. The electrical discharge machining apparatus includes a stage and an electrical discharge machining unit. The carrying table is used for carrying a to-be-machined object. The clamping piece on the carrying table is provided with a slit structure so that the to-be-machined object can be stably clamped. The to-be-processed object defines a processing target area. The electrical discharge machining unit performs an electrical discharge machining procedure on a machining target area of the to-be-machined object through the discharge electrode according to the machining parameters. And the electric discharge machining unit adjusts the actual output energy value so that the electric discharge machining program can be maintained in the target machining state. According to the electric discharge machining device, a deslagging unit is used for providing external force to assist in removing residues remaining in a machining groove. In addition, the insulation sleeve is used for wrapping the discharge electrode, so that cut loss can be reduced. According to the utility model, the problems caused by hardware in the prior art are overcome by improving the hardware.

Description

Technical Field

[0001] The utility model relates to a processing device, in particular to an electric discharge processing device. Background Art

[0002] With the booming development of the semiconductor industry, electrical discharge machining (EDM) technology has been commonly used to process ingots or wafers. EDM is a manufacturing technology that generates sparks by discharge to make the object to be processed into the desired shape. Dielectric material separates two electrodes and applies voltage to generate periodic and rapidly changing current discharge to process the above-mentioned object to be processed. EDM technology uses two electrodes, one of which is called the tool electrode, or the discharge electrode, and the other electrode is called the workpiece electrode, which is connected to the above-mentioned object to be processed. During the EDM process, there is no actual contact between the discharge electrode and the workpiece electrode.

[0003] When the potential difference between the two electrodes increases, the electric field between the two electrodes will also increase until the electric field strength is higher than the dielectric strength. At this time, dielectric collapse will occur, and current will flow through the two electrodes, melting and removing part of the material. When the current stops, new dielectric material will flow into the electric field between the electrodes, exclude the above-mentioned part of the material, and provide the dielectric insulation effect again. After the current flows, the potential difference between the two electrodes will return to the state before the dielectric collapse, so that a new dielectric collapse can be repeated. Since the above-mentioned discharge process will remove part of the material of the object to be processed, the distance between the electrode and the object to be processed will increase. When the distance continues to increase until the electric field strength is lower than the dielectric strength, it will cause a situation where discharge cannot be achieved, that is, the discharge machining process will be interrupted. Therefore, during the feed process of discharge machining, it is necessary to continuously adjust (reduce or increase) the above-mentioned distance in real time. However, in actual technology, it is impossible to directly measure the above-mentioned distance, and the distance can only be adjusted for various objects to be processed based on the operator's experience.

[0004] The roughness of the cutting surface formed by the existing EDM technology is poor, and there are quite a lot of surface cracks on the cutting surface, which may even extend in the non-cutting direction, resulting in a fracture effect in an unexpected direction. In addition, when the existing EDM technology is used to perform, for example, ingot cutting, it is necessary to use a clamping device to clamp the periphery of the ingot, that is, to radially clamp the side of the ingot to prevent rolling or displacement. However, the conventional technology can only cut the ingot exposed outside the clamping device, and cannot cut the area where the clamping device and the ingot overlap, so the conventional technology needs to be stopped and readjusted before cutting again.

[0005] Moreover, in the conventional crystal ingot cutting technology, since the thickness of the cut wafer is quite thin, the wafer cracking phenomenon often occurs in the conventional crystal ingot cutting technology. In addition, in the conventional EDM technology, the discharge electrode is easily adhered to the residue, resulting in uneven discharge (such as discharge cessation or excessive local current), and even easily causing damage to the electrode and the workpiece to be processed. It can be seen that the existing EDM technology still has a lot of room for improvement, and the problems of the existing technology are all caused by hardware. Utility Model Content

[0006] In view of this, one or more objects of the present invention is to provide an electrical discharge machining device that solves many problems of the above-mentioned conventional technology by improving hardware and relying on conventional software and programs.

[0007] To achieve the aforementioned purpose, the utility model proposes an electrical discharge machining device for performing an electrical discharge machining procedure on at least one object to be machined, so that the electrical discharge machining procedure is maintained at a target machining state, characterized in that it comprises: at least one carrier for carrying the object to be machined, the object to be machined defining at least one machining target area; and at least one electrical discharge machining unit, comprising at least one discharge electrode and a power supply unit, wherein the power supply unit provides a discharge energy to the discharge electrode at a discharge frequency, and the electrical discharge machining unit performs the electrical discharge machining procedure on the machining target area of ​​the object to be machined via the discharge electrode with at least one machining parameter, wherein the electrical discharge machining unit can adjust an actual output energy value according to the change state of the discharge frequency or the discharge energy during a discharge process of the electrical discharge machining procedure.

[0008] The discharge machining unit adjusts the discharge frequency and / or the discharge energy provided by the power supply unit to adjust the actual output energy value in real time when the discharge machining process is performed, so that the discharge machining process is maintained in the target machining state.

[0009] The electrical discharge machining unit adjusts the machining parameter to correspondingly adjust the actual output energy value in real time.

[0010] The EDM unit adjusts the processing parameter accordingly according to an internal or external feature of the object to be processed, so as to maintain the EDM process in the target processing state.

[0011] There are plural types of the processing parameters, and the discharge machining program selects at least one of the types of the processing parameters to adjust, so that the discharge machining program is maintained in the target machining state.

[0012] The target processing state is selected from a group consisting of a cutting speed, a material removal rate, a material consumption rate and a surface roughness of the object to be processed and a disconnection frequency of the discharge electrode.

[0013] The electrical discharge machining unit performs the electrical discharge machining procedure on the machining target area of ​​the object to be machined at a preset temperature, and the preset temperature is less than or equal to 100 degrees Celsius.

[0014] The electrical discharge machining unit performs the electrical discharge machining process on the machining target area of ​​the object to be machined in a temperature range, wherein the object to be machined has a substantially lowest resistivity in the temperature range.

[0015] The electrical discharge machining unit performs the electrical discharge machining procedure on the machining target area of ​​the object to be machined in a water solution.

[0016] Wherein, the object to be processed is a semiconductor material.

[0017] The carrier further comprises at least one clamping member, which is a slit structure. The clamping member applies radial or axial force to the object to be processed to fix the object to be processed.

[0018] The slit of the slit structure is selected from a group consisting of a closed type with no opening, a single-side opening type, and a double-side opening type.

[0019] The clamping member is a fixed or detachable single-side locking structure or double-side locking structure for clamping the object to be processed.

[0020] The slit structure has one or more slits, and each of the slits has the same or different spans.

[0021] The slit structure has one or more slits, and the distance between every two adjacent slits is the same or different.

[0022] The slit structure has at least one slit, and the slit has a non-equidistant span or an adjustable span.

[0023] The slit structure has a plurality of slits, and at least two of the plurality of slits are connected to each other.

[0024] The clamping member and the object to be processed are partially connected or bonded via a conductor or an insulator.

[0025] The conductor or the insulator is a solid medium, a soft medium or a viscose.

[0026] The electrical discharge machining device further comprises a slag removal unit for providing at least one external force to remove the residues generated when the discharge electrode performs the electrical discharge machining procedure on the object to be machined.

[0027] The external force is selected from one or more of the group consisting of air flow, water flow, ultrasonic vibration, piezoelectric vibration, suction and magnetic force.

[0028] The slag removal unit further comprises a guiding structure for guiding the external force to a processing groove of the discharge electrode in the processing target area of ​​the object to be processed during the discharge processing.

[0029] The guiding structure manually or automatically changes the position or angle of guiding the external force along with the discharge electrode performing the discharge machining process, thereby guiding the external force to an discharge machining position of the machining groove of the object to be machined where the discharge electrode is currently performing the discharge machining process.

[0030] The guide structure accompanies the discharge electrode in moving the processing groove of the processing target area of ​​the object to be processed, so as to synchronously fill and move to a discharge processing position on the processing groove of the processing target area where the discharge processing procedure has been completed.

[0031] The guiding structure is an external sealing baffle, which is used to cover an area on the processing target area of ​​the object to be processed that has not been subjected to the discharge processing procedure, and moves synchronously with the discharge electrode.

[0032] The guiding structure is a finger-fork structure corresponding to the processing groove on the processing target area of ​​the object to be processed.

[0033] The guiding structure is matched with a telescopic mechanism so as to automatically move synchronously with the discharge electrode to guide the external force.

[0034] The guiding structure is matched with a sensing component to adjust the guiding effect of the guiding structure according to a sensing result of the sensing component.

[0035] The EDM device further comprises a temperature control unit, which provides a heat source and / or a cold source when performing the EDM process, so as to directly or indirectly adjust the temperature of the object to be processed.

[0036] Wherein, the heat source is infrared, microwave or electric heater.

[0037] The cold source is used in combination with an antifreeze agent to prevent a processing environment of the electrical discharge machining unit from freezing.

[0038] The temperature control unit has a temperature sensor to determine whether a processing environment of the object to be processed reaches a target temperature, so as to maintain the processing environment at the target temperature.

[0039] Among them, ozone or bubbles are added to a processing environment of the electrical discharge machining unit to improve the processing efficiency by oxidation, softening or explosion.

[0040] The material of the discharge electrode is selected from the group consisting of copper, brass, molybdenum, tungsten, graphite, steel, aluminum, zinc, nickel and diamond.

[0041] The interior of the discharge electrode is a metal layer, and the discharge electrode has a dielectric material layer or a diamond layer covering the periphery of the metal layer.

[0042] In the discharge process of the electrical discharge machining procedure, the discharge electrode is used as a capacitance sensing component to provide a sensing capacitance value.

[0043] When the number of at least one of the discharge electrodes and the object to be processed is plural, the discharge machining procedure has plural machining feed speeds correspondingly, and the discharge machining unit uses the slowest one of the plural machining feed speeds as a common machining feed speed.

[0044] The carrier is a movable carrier, and the carrier uses the common processing feed speed as a moving speed.

[0045] There are a plurality of discharge electrodes, and each of the plurality of discharge electrodes has an independently controlled processing feed speed.

[0046] There are plural discharge electrodes and objects to be processed, and the plural discharge electrodes perform the discharge machining procedure on the same or different objects to be processed.

[0047] The discharge machining unit further comprises an insulating sleeve, which is arranged on the outer side of the discharge electrode and exposes at least one surface of the discharge electrode in a machining feed direction, so as to use the surface as a discharge surface of the discharge electrode during the discharge process.

[0048] The discharge surface exposed by the discharge electrode forms a discharge area substantially larger than the cross section of the insulation sleeve during the discharge process.

[0049] The relative positions of the insulating sleeve and the discharge electrode in a machining feed direction of the discharge machining process are fixed, and the relative positions of the insulating sleeve and the discharge electrode in a tension direction of the discharge electrode are movable.

[0050] The insulating sleeve includes a bottom plate and two side walls, the two side walls are located at both ends of the bottom plate to form a groove, a chamber is formed inside the groove to accommodate the discharge electrode, and the groove has an opening connected to the chamber to expose the discharge surface of the discharge electrode located in the chamber.

[0051] The insulating sleeve is sleeved on the outer side of the discharge electrode along a tension direction of the discharge electrode, and the insulating sleeve has one or more notches for providing water discharge and chip removal functions in the discharge machining process.

[0052] Wherein, a conformality degree between a clamping surface of the clamping member and a contour of the object to be processed changes correspondingly according to a clamping degree between the clamping member and the object to be processed, so as to correspondingly change a degree of attachment between the clamping surface of the clamping member and the contour of the object to be processed.

[0053] The power supply unit of the electrical discharge machining unit is integrated or separately configured on the electrical discharge machining device to supply a power source of the electrical discharge energy to the object to be machined.

[0054] The electrical discharge machining device further comprises a non-destructive detection device for detecting the object to be machined before, during or after the electrical discharge machining procedure.

[0055] The electrical discharge machining unit further comprises a vibration measuring unit for measuring the vibration value of the discharge electrode.

[0056] The electrical discharge machining unit further comprises a tension measuring unit for measuring the tension value of the discharge electrode.

[0057] As described above, the electrical discharge machining device according to the present invention has one or more advantages or technical effects:

[0058] (1) The present invention adopts conventional software and programs and, through improvements on the hardware, can adjust the actual discharge energy value of the discharge process according to the change state of the discharge frequency or discharge energy during the discharge process, so that the discharge machining process is maintained at a predetermined target machining state, thereby overcoming the problems of the above-mentioned prior art caused by the hardware.

[0059] (2) Through hardware improvements, the slag removal unit can provide external force to assist in removing the residue remaining in the processed groove.

[0060] (3) By improving the hardware, the guiding structure can correctly guide the external force provided by the slag removal unit to the discharge machining position of the current discharge machining procedure.

[0061] (4) By improving the hardware, the discharge electrode can be used as a capacitive sensing component to provide a sensed capacitance value in real time as a discharge feedback signal.

[0062] (5) By improving the hardware, the insulating sleeve covers the discharge electrode and exposes the discharge surface of the discharge electrode in the machining feed direction, which can reduce the kerf loss and improve the precision of discharge machining. Therefore, it can effectively improve the problem that the traditional discharge electrode and the object to be processed are prone to unexpected damage.

[0063] (6) Through the improvement of hardware, the insulating sleeve covering the discharge electrode can make the discharge electrode less vibrating, and can also enhance the external force for slag removal (such as water flow or air flow) to achieve the chip removal effect. The insulating sleeve can make the object to be processed (such as a wafer) less vibrating after cutting, reducing the risk of fragmentation. In addition, the insulating sleeve can use the external force for slag removal (such as water flow or air flow) to reduce the friction between the insulating sleeve and the discharge electrode to avoid damage to the discharge electrode. In addition, the insulating sleeve can also provide local heating at the same time.

[0064] (7) By improving the hardware, the insulating sleeve has a gap, which can not only improve the discharge machining effect of the discharge electrode, but also provide a slag removal function.

[0065] (8) Through the improvement of hardware, the clamping piece has a slit structure that can firmly clamp the object to be processed, and can effectively solve the problem that traditional discharge machining technology cannot cut the overlapping area between the clamping piece and the object to be processed. The locking structure can also achieve the effect of disassembly, assembly and adjustment.

[0066] (9) By improving the hardware, the clamping parts can be connected or bonded to the workpiece via a buffer member, which can effectively avoid the wafer cracking phenomenon that is often caused by traditional ingot cutting technology.

[0067] In order to enable you to have a further understanding and recognition of the technical features and technical effects of the utility model, a preferred embodiment and a detailed description are provided as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0068] Figure 1 It is a front view schematic diagram of the electrical discharge machining device of the present invention, which shows that the carrier carries the object to be processed via the carrier plate.

[0069] Figure 2 It is a front view schematic diagram of the electrical discharge machining device of the present invention, which shows that the carrier carries the object to be processed via the clamping member.

[0070] Figure 3 This is a top view of the electrical discharge machining device of the present invention, which shows that the carrier carries the object to be processed via the clamping member. Figure 3 (A) and Figure 3 (B) shows that the thickness of the gasket can be adjusted accordingly to adjust the span of the slit.

[0071] Figure 4is a cross-sectional schematic diagram of the discharge electrode of the electric discharge machining device of the utility model, wherein Figure 4 (A) shows that the discharge electrode is composed of a metal layer, Figure 4 (B) shows that the discharge electrode is composed of a metal layer and a diamond layer. Figure 4 (C) shows that the discharge electrode is composed of a metal layer and a dielectric material layer.

[0072] Figure 5 It is a top view schematic diagram of the discharge electrode of the electric discharge machining device of the present invention covered with an insulating sleeve, Figure 5 (A) and Figure 5 (C) shows that the processing groove has not yet been formed. Figure 5 (B) shows that a machining groove has been formed.

[0073] Figure 6 This is a front view schematic diagram of the discharge electrode of the electric discharge machining device of the present invention covered with an insulating sleeve. Figure 6 (A) and Figure 6 (C) shows that the processing groove has not yet been formed. Figure 6 (B) shows that a machining groove has been formed.

[0074] Figure 7 It is a top view schematic diagram of the electrical discharge machining device of the present invention performing an electrical discharge machining process in a tank body.

[0075] Figure 8 It is a top view schematically showing that the slits of the slit structure of the electrical discharge machining device of the present invention are connected to each other.

[0076] Fig. 9 The slit structure of the electric discharge machining device of the present invention is a top view schematic diagram of a slit structure of a closed type without an opening, wherein Fig. 9 (B) Compared to Fig. 9 (A) has more auxiliary holes.

[0077] Fig.10 The slit structure of the electric discharge machining device of the present invention is a top view schematic diagram of a slit type of a single-side opening type, wherein Fig.10 (A) Fig.10 (B) and Fig.10 (C) shows the clamping parts located above and on the side of the platform.

[0078] Fig.11 The slit structure of the electric discharge machining device of the present invention is a top view schematic diagram of a slit having a guide groove, wherein Fig.11 (A) Fig.11 (B) and Fig.11 (C) shows the clamping parts located above and on the side of the platform.

[0079] Fig.12This is a front view schematic diagram of the clamping member of the electric discharge machining device of the present invention as a single-side locking structure, wherein Fig.12 (A) Fig.12 (B) shows two types of clamping parts.

[0080] Fig.13 It is a front view schematic diagram of the clamping piece of the electric discharge machining device of the present invention using a buffer member to indirectly clamp the object to be processed.

[0081] Fig.14 The schematic diagram of the side view of the clamping member of the electric discharge machining device of the present invention clamping the object to be processed is shown in FIG. Fig.14 (A) shows the clamp directly clamping the workpiece. Fig.14 (B) shows that the clamping member indirectly clamps the workpiece.

[0082] Fig.15 It is a front view schematic diagram of the electric discharge machining device of the present invention having a slag removal unit.

[0083] Fig.16 This is a front view schematic diagram of the slag removal unit of the electric discharge machining device of the present invention performing slag removal operation, wherein Fig.16 (A) and Fig.16 (B) shows the slag removal unit using different slag removal patterns to perform slag removal actions.

[0084] Fig.17 It is a front view schematic diagram of a slag removal unit of an electrical discharge machining device of the present invention having a guide structure.

[0085] Fig.18 The utility model is a front view schematic diagram of the guide structure of the electric discharge machining device as an externally sealed baffle.

[0086] Fig.19 The utility model is a front view schematic diagram of the guide structure of the electric discharge machining device of the present invention being a finger-fork structure.

[0087] Fig. 20 The utility model is a front view schematic diagram showing that the guide structure of the electric discharge machining device is an arc structure.

[0088] Fig.21 It is a front view schematic diagram of the guide structure of the electric discharge machining device of the present invention in combination with the telescopic mechanism for guiding action.

[0089] Fig. 22 It is a front view schematic diagram of the guide structure of the electric discharge machining device of the present invention in combination with the sensing component for slag discharge detection.

[0090] Description of reference numerals:

[0091] 10: Electrical discharge machining device

[0092] 20: Carrier

[0093] 21: Loading plate

[0094] 23a: First abutment component

[0095] 23b: Second abutment component

[0096] 24: Clamping parts

[0097] 25: Slit

[0098] 25a: Auxiliary hole

[0099] 27: Gasket

[0100] 29: Buffer component

[0101] 30: EDM unit

[0102] 32: Discharge electrode

[0103] 32a: Conductive material layer

[0104] 32b: Metal layer

[0105] 32c: Diamond layer

[0106] 32d: Dielectric material layer

[0107] 32e: Discharge surface

[0108] 33: Temperature control unit

[0109] 34: Power supply unit

[0110] 35: Temperature sensor

[0111] 36: Jig

[0112] 38: Tension measurement unit

[0113] 39: Vibration measurement unit

[0114] 40: Load-bearing components

[0115] 41: Slot

[0116] 50: Holding component

[0117] 64: Slag discharge unit

[0118] 64a: Thrust generating device

[0119] 64b: Suction generating device

[0120] 66: Guidance structure

[0121] 68: Telescopic mechanism

[0122] 69: Sensing components

[0123] 80: Non-destructive testing device

[0124] 100: Object to be processed

[0125] 110: Processing target area

[0126] 120: Processing groove

[0127] 123a: First contact portion

[0128] 123b: Second contact portion

[0129] 125: Guide groove

[0130] 132: Insulation sleeve

[0131] 132a: Base plate

[0132] 132b: Sidewall

[0133] 132c: Container

[0134] 132d: Opening

[0135] 134: Gap

[0136] 240: Locking structure

[0137] 242: Bolt

[0138] 244: Nut

[0139] A: Side

[0140] B: Discharge section

[0141] D: span

[0142] P1: Power supply

[0143] F, X, Y: Direction

[0144] F2: External force

[0145] F21: Thrust

[0146] F22: Suction

[0147] R: discharge area

[0148] r: cross section DETAILED DESCRIPTION

[0149] In order to facilitate understanding of the technical features, contents and advantages of the present invention and the effects that can be achieved, the present invention is hereby described in detail in the form of embodiments in conjunction with the drawings. The drawings used therein are only for illustration and auxiliary description purposes and may not be the actual proportions and precise configurations after the implementation of the present invention. Therefore, the proportions and configurations of the attached drawings should not be interpreted or limited to the scope of rights of the present invention in actual implementation. In addition, for ease of understanding, the same elements in the following embodiments are described with the same symbols.

[0150] In addition, the words used throughout the specification and claims generally have the ordinary meaning of each word used in the field, in the content disclosed herein, and in the specific content, unless otherwise noted. Certain words used to describe the utility model will be discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art in the description of the utility model.

[0151] The use of “first,” “second,” “third,” “fourth,” etc. in this document does not specifically refer to an order or sequence, nor is it used to limit the present invention. It is merely used to distinguish components or operations described with the same technical terms.

[0152] Secondly, the words "include", "including", "have", "contain" and the like used in this article are open terms, which mean including but not limited to.

[0153] The utility model proposes an electric discharge machining device for performing an electric discharge machining procedure on at least one object to be machined. In the utility model, the electric discharge machining device adopts conventional software and programs and can maintain the electric discharge machining procedure in a predetermined target machining state by improving the hardware such as the electric discharge machining unit and / or the clamping parts on the carrier and adopting conventional software and programs to adjust the actual discharge energy of the discharge process in real time according to the change state of the discharge frequency or discharge energy during the discharge process of the electric discharge machining procedure. A person with ordinary knowledge in the technical field to which the utility model belongs should be able to clearly know based on the disclosure of the utility model that the electric discharge machining device of the utility model is not an improvement on the software or program, but can maintain the electric discharge machining procedure in a predetermined target machining state by improving the hardware and relying on conventional software and programs. The present invention uses conventional software and programs to intelligently adjust the discharge energy (e.g., actual output energy) to maintain the EDM process at a predetermined target processing state (e.g., maintaining cutting speed, maintaining maximum material removal rate (MRR), maintaining no wire breakage, maintaining a predetermined surface roughness, maintaining a predetermined wire breakage frequency or other states, etc.). In addition, the EDM device of the present invention further improves the EDM efficiency by improving the structural design of the EDM unit and the carrier.

[0154] Figure 1 It is a front view schematic diagram of the electrical discharge machining device of the present invention, which shows that the carrier carries the object to be processed via the carrier plate. Figure 2 It is a front view schematic diagram of the electrical discharge machining device of the present invention, which shows that the carrier carries the object to be processed via the clamping member. Figure 3 This is a top view of the electrical discharge machining device of the present invention, which shows that the carrier carries the object to be processed via the clamping member. Figures 1 to 3 The EDM device 10 of the present invention comprises at least one carrier 20 and at least one EDM unit 30. The carrier 20 is used to carry at least one object 100 to be processed. The carrier 20 of the present invention is a fixed-position carrier, or a movable or rotatable carrier, wherein the carrier 20 of the present invention may selectively have a carrier plate 21 (such as Figure 1 ), or selectively omitting the carrier plate (e.g. Figure 2 and 3 The above-mentioned type of the carrier 20 is only an example and is not intended to limit the present invention.

[0155] The object to be processed 100 mentioned above can be any conductor or semiconductor material, such as an ingot or a wafer, or even any material suitable for electric discharge machining, and its shape is, for example, a block such as a cylindrical object or a sheet. The object to be processed 100 is defined with at least one processing target area 110, such as a single or multiple processing target areas 110. Taking semiconductor materials as an example, the object to be processed 100 is composed of a semiconductor material selected from the group consisting of silicon, gallium arsenide, indium phosphide, gallium nitride and silicon carbide. Taking multiple processing target areas 110 as an example, these processing target areas 110 are selectively located at any position suitable for processing in the object to be processed 100. The distance between these processing target areas 110 correspondingly defines (for example, the same as) the cutting thickness, thinning thickness or cutting spacing of the object to be processed 100, and its value is adjusted according to the actual process requirements, so it is not limited to being equal or unequal to each other.

[0156] Please continue to read Figures 1 to 3 The discharge machining unit 30 includes at least one discharge electrode 32 and at least one power supply unit 34. The discharge electrode 32 of the discharge machining unit 30 extends along the second direction Y, so that the discharge section B of the discharge electrode 32 is parallel to the second direction Y, wherein the second direction Y is respectively perpendicular to the first direction X and the machining feed direction F. The discharge section B of the discharge electrode 32 and the machining target area 110 of the object 100 to be machined move relative to each other in a reciprocating or cyclic manner (for example, along Figures 1 to 3The power supply unit 34 of the discharge machining unit 30 provides a power source P1 of discharge energy to the discharge electrode 32 and the object 100 to be processed in the discharge machining process, so as to apply discharge energy to the processing target area 110 of the object 100 to be processed via the discharge electrode 32 located in the discharge section B. The power supply unit 34 can be a set of power outputs or a plurality of sets of power outputs to supply the power source P1 mentioned above. The power supply unit 34 can also be electrically connected to the discharge electrode 32 in series or in parallel. As long as the discharge energy can be applied to the processing target area 110 of the object 100 to be processed via the discharge electrode 32, it can be applied to the present invention. In addition, in the present invention, the power supply unit 34 of the EDM unit 30 can be configured on the EDM device 10 in an integrated (integrated) or detachable (detachable) manner to supply the power supply P1 to the object 100 to be processed. For example, the configuration of the carrier 20 (and / or, together with the clamping member 24 thereon) and the power supply unit 34 can be, for example, an integrated (integrated) or detachable (detachable) design, wherein the carrier 20 can also selectively have a carrier plate 21. In other words, when the carrier 20 and the clamping member 24 thereon carry and clamp the object 100 to be processed, the power supply unit 34 configured in an integrated (integrated) manner with the carrier 20 (and / or, together with the clamping member 24 thereon) can directly supply the power supply P1 to the object 100 to be processed. Alternatively, the object 100 to be processed is first carried and clamped, and then the power supply unit 34 configured in a detachable (detachable) manner is used to supply the power supply P1 to the object 100 to be processed.

[0157] The power supply unit 34 of the EDM unit 30 provides a discharge energy to the discharge electrode 32 at a discharge frequency, so that the EDM unit 30 can perform an EDM process on the processing target area 110 of the object 100 to be processed on the carrier 20 along a processing feed direction F with at least one processing parameter through the discharge electrode 32, such as cutting (cutting), thinning (thinning) and / or grinding (Electric Discharge Grinding, EDG) and other EDM processes on the processing target area 110 of the object 100 to be processed. The present invention is not limited to the carrier 20 driving the object 100 to be processed to move toward the discharge electrode 32 of the EDM unit 30 or the EDM unit 30 driving the discharge electrode 32 to move toward the object 100 to be processed. As long as the discharge electrode 32 of the EDM unit 30 and the object 100 to be processed on the carrier 20 can perform relative movement along the processing feed direction F, the present invention can be applied. The EDM unit 30 of the present invention has a processing control component (e.g., a processor) (not shown), so as to drive the stage 20 to move or drive the discharge electrode 32 to move toward the object to be processed 100, for example, via a servo mechanism (e.g., a stepping motor) (not shown). Since the EDM unit 30 has a processing control component and drives the stage 20 or the discharge electrode 32 via a servo mechanism, which is a conventional technology, and a person with ordinary knowledge in the technical field to which the present invention belongs should be able to understand how the EDM unit 30 has a processing control component and operates with a servo mechanism based on the disclosure of the present invention, and should be able to clearly know that the EDM device of the present invention is not an improvement on software or programs, but is to maintain the EDM program in a predetermined target processing state by improving hardware and relying on conventional software and programs, so it is not further described here.

[0158] During the discharge process of the EDM procedure, when the structure of the discharge electrode 32 or the material removal rate of the object 100 to be processed changes, such as before the discharge electrode 32 is disconnected or when the material removal rate decreases, the discharge frequency or discharge energy (e.g., the discharge frequency or discharge energy per unit time) during the discharge process of the EDM procedure will change. The principle is that before the discharge electrode 32 is disconnected or when the material removal rate decreases (e.g., when the material of the position to be cut of the object 100 is harder or has lower conductivity), the normal discharge frequency will decrease and the arc discharge frequency will increase. The above-mentioned change in discharge frequency or discharge energy is, for example, the change in discharge frequency or discharge energy exceeds a predetermined threshold value, or the change in discharge frequency or discharge energy presents a trend, such as a trend of becoming lower, higher, rising or falling, or the ratio of normal discharge to arc discharge exceeds a predetermined threshold value.

[0159] In detail, the present invention improves the hardware and relies on conventional software and programs to measure or calculate whether the change in discharge frequency or discharge energy (e.g., discharge frequency or discharge energy per unit time) during the discharge process of the discharge machining program exceeds a predetermined threshold value (Threshold Value). If it exceeds, it means that the processing state of the discharge machining program (e.g., cutting speed, material removal rate, discharge electrode integrity or surface roughness, etc.) begins to change. Since the processing parameters of the discharge machining program and the intrinsic and extrinsic characteristics of the object to be processed will affect the degree of change of the above-mentioned discharge frequency or discharge energy, the present invention can improve the hardware and rely on conventional software and programs to adjust the actual output energy value corresponding to the processing parameters (e.g., the actual output energy value per unit time) in real time with a variety of adjustment schemes to maintain the discharge machining program in a predetermined target processing state (i.e., to avoid continuous changes in the processing state), such as maintaining a predetermined material removal rate (MRR), maintaining no disconnection, maintaining a predetermined surface roughness, maintaining a predetermined disconnection frequency or other states. Since the present invention can measure or calculate the discharge frequency or discharge energy by means of conventional discharge machining technology, and a person having ordinary knowledge in the technical field to which the present invention belongs should understand how to use the existing discharge machining technology to measure or calculate the change state of the discharge frequency or discharge energy based on the disclosure of the present invention rather than improving the software or program, the theoretical basis for measuring or calculating the discharge frequency or discharge energy and the measurement and calculation methods thereof are not further described herein.

[0160] By improving the hardware and relying on conventional software and programs, in the first adjustment scheme, the discharge machining unit 30 of the present invention adjusts the machining parameters such as the discharge frequency and / or discharge energy provided by the power supply unit 34, thereby correspondingly adjusting the actual output energy value corresponding to the machining parameter in real time when the discharge machining program is performed, so that the discharge machining program is maintained in a predetermined target machining state. Among them, the present invention can adjust the discharge energy, for example, by adjusting the voltage. By improving the hardware and relying on conventional software and programs, in the second adjustment scheme, the discharge machining unit 30 of the present invention adjusts the actual output energy value in real time by adjusting other machining parameters other than the discharge frequency and / or discharge energy, such as adjusting the numerical value of the machining parameter. For example, the first machining parameter numerical value is adjusted to the second machining parameter numerical value, so that the actual output energy value corresponding to the first machining parameter numerical value is adjusted to the actual output energy value corresponding to the second machining parameter numerical value. By improving the hardware and relying on the conventional software and program, the third adjustment scheme is to combine the first adjustment scheme with the second adjustment scheme, that is, to adjust the discharge frequency and / or discharge energy at the same time and adjust the first processing parameter value of other processing parameters to the second processing parameter value, so as to adjust the actual output energy value in real time accordingly. The types of processing parameters of the utility model include one or more of the orientation parameters, discharge electrical parameters, debris removal parameters, movement, tension parameters and vibration parameters. The orientation parameter is, for example, the processing direction of the discharge electrode relative to the object to be processed. The discharge electrical parameters include, for example, the discharge frequency and the discharge energy, and may also include, for example, one or more of the peak current (the maximum current passing between the two poles of the discharge electrode during discharge), the voltage when the object to be processed is far away from the discharge electrode, the discharge pulse duration, the discharge pulse rest time, and the gap voltage corresponding to the discharge gap. The debris removal parameter includes the flow rate of the debris removal liquid provided on the discharge electrode, and the debris removal liquid is, for example, water, preferably deionized water, and the debris removal liquid is, for example, provided between the two ends of the discharge electrode. The movement and tension parameters include one or more of the movement speed of the discharge electrode, the tension of the discharge electrode, and the vibration of the discharge electrode. In addition, the processing parameters of the present invention may also selectively include the feedback adjustment speed of the above-mentioned one or more processing parameters. For example, the present invention can perform data analysis on the processing states corresponding to the discharge machining procedures of different objects to be processed 100 according to a plurality of processing parameters by improving the hardware and relying on conventional software and programs, so as to obtain processing parameters that affect the processing states of different objects to be processed 100. The above-mentioned different objects to be processed 100, for example, include differences in intrinsic characteristics (such as doping concentration, resistivity, defects or flaws) or extrinsic characteristics (such as thickness), such as objects to be processed with different doping concentrations or resistivities, or objects to be processed with different thicknesses.In addition, the present invention can selectively make a correspondence table of the intrinsic and extrinsic characteristics of the above-mentioned object to be processed, the numerical value and type of the processing parameter, the processing state, the discharge frequency, the discharge energy and the actual output energy value by improving the hardware and relying on the conventional software and program. In this way, the present invention can select the optimal numerical value or type of the processing parameter from the above-mentioned correspondence table for adjustment according to the required target result (i.e., the target processing state). In short, the present invention can select at least one of the numerical values ​​and types of multiple processing parameters according to the correspondence table for adjustment by improving the hardware and relying on the conventional software and program, so as to maintain the discharge machining program in the target processing state. The above-mentioned processing state is, for example, selected from the group consisting of the cutting speed, material removal rate, material consumption rate and surface roughness of the object to be processed 100 and the disconnection frequency of the discharge electrode 32. In addition, the present invention can also selectively perform a non-destructive detection step on the object to be processed 100, thereby obtaining the above-mentioned intrinsic characteristics. Taking the above-mentioned internal characteristics as flaws or defects as an example, the present invention, by improving the hardware and relying on conventional software and programs, can selectively use a non-destructive detection device 80, such as an ultrasonic detection device, an X-ray detection device or an infrared detection device, to perform a non-destructive detection step on the object to be processed 100 before, during or after the EDM process (such as cutting) of the object to be processed 100. The internal state of the object to be processed 100 (such as an ingot or a wafer) before, during or after cutting, such as the location or degree of the defect or flaw, can be detected so as to make corresponding adjustments. The above-mentioned detection results can even be fed back to the EDM device to match this non-destructive detection and one or more of the above-mentioned processing parameters to obtain the optimal processing parameters.

[0161] Please continue to read Figures 1 to 3In the first embodiment, the two sides A of the discharge electrode 32 of the discharge machining unit 30 of the present invention are against the jig 36. The jig 36 is, for example, formed by correspondingly assembling at least two supporting members 40 and at least two holding members 50, but is not limited thereto. The two sides A of the discharge electrode 32 are respectively movably or fixedly against the two supporting members 40, so that the discharge section B of the discharge electrode 32 is suspended, so that the discharge machining process is performed on the machining target area 110 of the object 100 to be processed through the discharge section B. The holding member 50 is detachably or fixedly assembled with the supporting member 40. The fixture 36 is connected to a motion mechanism (e.g., a stepper motor) (not shown) through the holding member 50, wherein the motion mechanism is capable of rotating or moving the fixture 36. The discharge machining unit 30 can also drive the motion mechanism through the processing control component to work with the above-mentioned servo mechanism to make the discharge electrode 32 move back and forth or cyclically along the tension direction (Y axis) and move forward and backward along the machining feed direction (F axis). The discharge electrode 32 of the discharge machining unit 30 of the utility model can have a fixed tension value, or can have an adjustable tension value, for example, by using the above-mentioned motion mechanism (not shown) to make the two fixtures 36 produce relative displacement, such as moving in a direction close to each other or away from each other, thereby adjusting the tension value of the discharge electrode 32. The discharge machining unit 30 of the utility model can optionally have a tension measurement unit 38 for measuring the tension value of the discharge electrode 32. The tension measuring unit 38 can be, for example, a conventional commercialized tension meter, and thus will not be described in detail here. In addition, the present invention can also selectively have a vibration measuring unit 39 for measuring the vibration value of the discharge electrode 32. It can be seen from this that the electrical discharge machining device of the present invention is an improvement on the hardware and uses conventional software and programs, rather than an improvement on the software and programs.

[0162] The shape of the discharge electrode 32 is, for example, linear, sheet-like, or other various shapes. The number of the discharge electrodes 32 is, for example, one or more, and the number of the objects 100 to be processed can also be, for example, one or more. Among these discharge electrodes 32, each discharge electrode 32 can selectively have an independently controlled processing feed speed, and the retracting and releasing wire groups (such as the fixture 36) of each discharge electrode 32 can be independent or shared. Therefore, in the utility model, one or more discharge electrodes 32 can selectively, for example, respectively perform an electric discharge machining process on the same or different one or more objects 100 to be processed, that is, the electric discharge machining process can be performed on one or more processing target areas 110 on the same or different objects 100 to be processed. When one or more discharge electrodes 32 respectively perform an electric discharge machining process on the same or different one or more objects 100 to be processed, the electric discharge machining process will have a plurality of processing feed speeds accordingly. Therefore, the electric discharge machining unit 30 of the utility model adopts conventional software and programs and can selectively use, for example, the slowest one of these processing feed speeds as the common processing feed speed. Thus, these discharge electrodes 32 can have a common processing feed speed. In other words, when multiple discharge electrodes 32 process the same object 100 to be processed, the overall processing feed speed is determined by the slowest one. Similarly, since the object 100 to be processed is carried on the carrier 20, and if the carrier 20 is a movable carrier, the carrier 20 uses the above-mentioned common processing feed speed as the moving speed. However, the above is only an example and is not intended to limit the present invention. When the present invention performs the discharge machining process, these discharge electrodes 32 can also selectively have independently controlled processing feed speeds, thereby these discharge electrodes 32 can have their own processing feed speeds.

[0163] like Figure 4 As shown in (A), the discharge electrode 32 of the present invention can be composed of a conductive material layer 32a, wherein the material of the conductive material layer 32a is selected from the group consisting of copper, brass, molybdenum, tungsten, graphite, steel, aluminum, zinc, nickel and diamond. Or, as Figure 4 As shown in (B), the interior of the discharge electrode 32 is, for example, a metal layer 32b, and a diamond layer 32c is coated on the periphery of the metal layer 32b, thereby achieving the effect of grinding and polishing (i.e., grinding and polishing while discharging) during the discharge process. Or, as Figure 4As shown in (C), the interior of the discharge electrode 32 is, for example, a metal layer 32b, and a dielectric material layer 32d is coated on the periphery of the metal layer 32b, so that the discharge electrode 32 can be used as a capacitive sensing component during the discharge process, and can provide a sensing capacitance value as a discharge feedback signal by detecting the capacitance change during the discharge process in real time. The material of the above-mentioned dielectric material layer 32d is, for example, ceramic or Teflon, but is not limited to the above examples. The material of the above-mentioned metal layer 32b is, for example, selected from the group consisting of copper, brass, molybdenum, tungsten, steel, aluminum, zinc and nickel. The thickness of the discharge electrode 32 is less than about 300μm, and the thickness range is preferably about 30μm to about 300μm.

[0164] In addition, Figure 5 to Figure 6 As shown, Figure 5 (A) Figure 5 (C) Figure 6 (A) and Figure 6 (C) indicates that the discharge electrode 32 has not formed a processing groove 120 on the workpiece 100, and Figure 5 (B) and Figure 6(B) represents that the discharge electrode 32 has formed a processing groove 120 on the object 100 to be processed. The discharge machining unit 30 of the present invention selectively includes an insulating sleeve 132, and the insulating sleeve 132 is made of an electrically insulating material. The insulating sleeve 132 of the present invention is sleeved on the outer side of the discharge electrode 32 along the tension direction of the discharge electrode 32 (i.e., the Y-axis direction). This insulating sleeve 132 is not limited to being sleeved on the outer side of the discharge electrode 32 in a fixed or movable manner, whereby the relative position of the insulating sleeve 132 and the discharge electrode 32 in the tension direction can be fixed or relatively movable according to needs. The insulating sleeve 132 exposes at least one surface of the discharge electrode 32 in the processing feed direction F of the discharge machining process, so that the above-mentioned surface can be used as the discharge surface 32e of the discharge electrode 32 when the discharge process of the discharge machining process is performed. Among them, the insulating sleeve 132 partially covers the discharge electrode 32, but it is preferably to expose only the surface of the discharge electrode 32 in the processing feed direction F of the discharge machining process. The present invention uses an insulating sleeve 132 to cover the periphery of the discharge electrode 32 (i.e., the surface outside the machining feed direction F) in order to reduce the kerf loss (or material machining loss) and effectively improve the problem that the conventional discharge electrode 32 and the object 100 to be processed are prone to unexpected damage. In the present invention, the discharge area R formed by the discharge surface 32e exposed by the discharge electrode 32 during the discharge process is substantially larger than the cross-section r of the insulating sleeve 132, whereby the discharge electrode 32 and the insulating sleeve 132 can both enter the machining groove 120, which means that the discharge area R only needs to be slightly larger than the cross-section r of the insulating sleeve 132 to be applicable to the present invention. In other words, the present invention can improve the precision of the discharge machining and avoid the problem that the conventional discharge electrode 32 and the object 100 to be processed are prone to unexpected damage. For example, the insulating sleeve 132 includes a bottom plate 132a and two side walls 132b. The insulating sleeve 132 is disposed on the fixture 36 or the carrier 20 (eg, Figure 2) or on the surrounding environment of the object to be processed 100. The two side walls 132b are located at the two ends of the bottom plate 132a to form a groove 132c, wherein the two ends of the groove 132c are open ends, and the interior of the groove 132c forms a chamber for accommodating the discharge electrode 32, and the groove 132c has an opening 132d connected to the chamber, and the insulating sleeve 132 exposes the discharge surface 32e of the discharge electrode 32 located in the chamber through the opening 132d. In one embodiment, the relative position of the insulating sleeve 132 and the discharge electrode 32 in the machining feed direction F of the discharge machining process is, for example, fixed, and the relative position of the insulating sleeve 132 and the discharge electrode 32 in the tension direction of the discharge electrode 32 is, for example, movable. In short, the discharge electrode 32 is movably sleeved in the insulating sleeve 132, and both the insulating sleeve 132 and the discharge electrode 32 move along the processing feed direction F (e.g., longitudinal displacement), but only the discharge electrode 32 moves left and right, while the insulating sleeve 132 does not move left and right. However, the present invention is not limited to this, and in another embodiment, the relative positions of the insulating sleeve 132 and the discharge electrode 32 in the processing feed direction F of the discharge machining process and the tension direction of the discharge electrode 32 are, for example, fixed. In addition, although the insulating sleeve 132 preferably only exposes the surface of the discharge electrode 32 in the processing feed direction F, the present invention is not limited to this. For example, the insulating sleeve 132 of the present invention selectively has one or more notches 134 (e.g. Figure 6 (A) Figure 6 (B) Figure 6 (C)), for example, a plurality of micropores are located on the side wall 132b, and the groove 132c can be connected to the outside through these notches 134 to provide a slag removal (e.g., water or chip removal) function during the EDM process. The purpose of setting these notches is to discharge residues or water flow (i.e. Fig.17 The slag removal unit 64 described in the foregoing can generate an external force F2) and keep it away from the discharge electrode 32, so it is not limited to a specific orientation, position, size or quantity. As long as the insulating sleeve 132 can simultaneously protect the discharge electrode 32 and provide slag removal function, it can be applied to the present invention.

[0165] Please refer again Figures 1 to 3 and Figure 7In addition to being able to perform dry EDM machining on the object 100 in a dry machining environment such as a gaseous fluid environment or a vacuum environment, the EDM unit 30 of the present invention can also perform wet EDM machining on the object 100 in a wet machining environment by immersing the object 100 in the liquid in the tank 41 or spraying the liquid on the object 100. The liquid is, for example, an aqueous solution or an electrolyte. In detail, the EDM unit 30 of the present invention can perform an EDM procedure on a machining target area 110 of the object 100 in a liquid such as an aqueous solution or an electrolyte. Taking the liquid as an electrolyte as an example, the discharge electrode 32 is electrically connected to the power supply unit 34 (such as Figure 1 The cathode of the discharge electrode 32 is connected to the anode of the power supply unit 34, and the object to be processed 100 is electrically connected to the anode of the power supply unit 34, so that an electrolytic reaction can be generated during the discharge machining process. The utility model can prevent the metal components of the discharge electrode 32 from dissolving in the electrolyte during the discharge machining process by utilizing the cathodic protection phenomenon of the electrolytic reaction, thereby reducing the breakage of the discharge electrode 32. The electrolytic reaction can cause the water in the electrolyte to generate hydrogen on the machining target area 110 of the object to be processed 100. The generation of hydrogen bubbles helps to remove the residue in the machining groove 120 and improve the cleaning effect of the object to be processed 100. Moreover, by utilizing the principle that the same electrical properties will repel each other, the residues with the same negative charge can be prevented from adhering to the discharge electrode 32 or the machining groove 120.

[0166] The temperature range in which the EDM unit 30 of the present invention can perform the EDM process is, for example, less than or equal to about 100 degrees Celsius, that is, the preset temperature in which the EDM unit 30 of the present invention can perform the EDM process is any temperature value less than or equal to about 100 degrees Celsius. For example, the relatively low temperature range applicable to the present invention is, for example, from about 0 degrees Celsius to about 100 degrees Celsius, and for example, from about 22 degrees Celsius to about 100 degrees Celsius, and the above-mentioned preset temperature is any temperature value in this temperature range, such as room temperature. Since the processing environment temperature required for the EDM process of the present invention does not exceed 100 degrees Celsius at most, the present invention can even use a processing environment such as a tank body 41 with an aqueous solution to perform the EDM process, without using a traditional high-temperature oil solution, so it can greatly save energy consumption and improve convenience. In addition, the EDM unit 30 of the present invention further selectively includes a temperature control unit 33 for providing a heat source and / or a cold source when performing the EDM process. The heat source and / or the cold source may, for example, directly adjust the temperature of the object 100 to be processed, or indirectly adjust the temperature of the object 100 via the clamping member 24 (e.g. Figure 2 As shown), the guide structure 66 (as Fig.17 As shown), the carrier (as shown Figure 2 As shown), the discharge electrode 32 (as Figure 2 As shown), the carrier plate (as Figure 1 As shown), the insulating sleeve 132 (as Figure 5 as shown) and / or the liquid in the tank 41 (as shown Figure 7 The temperature of the object 100 to be processed is adjusted by various components of the EDM device such as a temperature sensor 35, so that the EDM process can be performed on the object 100 within the above-mentioned temperature range or the preset temperature. The temperature control unit 33 can include, for example, infrared rays, microwaves, or electric heaters as heat sources for heating components, and the temperature control unit 33 can also include, for example, refrigerators as cold sources for cooling components, wherein the cold source can be selectively used with antifreeze to prevent the processing environment of the EDM unit 30 (such as the above-mentioned aqueous solution) from freezing. In addition, the temperature control unit 33 has, for example, a temperature sensor 35, and the temperature control unit 33 can detect whether the processing environment of the object 100 to be processed has reached the target temperature (such as the above-mentioned temperature range or the preset temperature) through the temperature sensor 35, so as to maintain the processing environment at the target temperature. In addition, in order to further improve the processing efficiency, the present invention can also add ozone (e.g., gaseous or liquid) or bubbles (e.g., microbubbles) to the processing environment of the EDM unit 30 (e.g., the above-mentioned aqueous solution), by oxidation, softening or bursting (e.g., implosion), which can not only increase the EDM speed and improve the EDM quality, but also help to remove carbides or residues generated on the surface of the discharge electrode 32, thereby reducing the wear of the discharge electrode.

[0167] In addition, if Figure 2 and Figure 3 As shown, the carrier 20 of the electrical discharge machining device 10 of the present invention selectively includes at least one clamping member 24, and the clamping member 24 is radially (such as Figure 2 and Figure 3As shown) or axially apply force to the object to be processed 100 to fix the object to be processed 100. The clamping member 24 of the present invention may, for example, include a first abutting component 23a and a second abutting component 23b, wherein the first abutting component 23a and the second abutting component 23b respectively have a first abutting portion 123a and a second abutting portion 123b, respectively, for respectively abutting two opposite sides of the object to be processed 100, such as two opposite sides in the radial direction. At least one of the first abutting component 23a and the second abutting component 23b of the clamping member 24 of the present invention (e.g., both) has one or more slits 25 to form a slit structure, and the span D of the slit 25 is, for example, substantially greater than the width of the discharge electrode 32, thereby allowing the discharge electrode 32 to penetrate into the clamping member 24 through the slit 25. When the clamping member 24 clamps the object 100 to be processed, the slit 25 correspondingly exposes the processing target area 110 of the object 100 to be processed, and the position of the slit 25 corresponds to the position of the processing groove 120, for example, the slit 25 and the processing groove 120 are both distributed along the processing feed direction F. The utility model can move the discharge electrode 32 along the slit 25 so as to perform the discharge machining process on the processing target area 110 of the object 100 to be processed clamped by the clamping member 24, and the processing groove 120 can be formed on the processing target area 110 of the object 100 to be processed. The shapes of the first abutting portion 123a and the second abutting portion 123b can be similar, the same or different from each other, and can be, for example, a plane shape, an arc surface shape, a curved surface shape or other shapes, and preferably correspond to the shape of the object 100 to be processed. For example, if the object 100 to be processed is a round ingot, the first abutting component 23a and the second abutting component 23b respectively abut the radial sides of the object 100 to be processed, and the first abutting portion 123a and the second abutting portion 123b may be, for example, arc-shaped, and may even be partially or completely conformal to the contour of at least a portion of the periphery of the object 100 to be processed, thereby better and more firmly clamping the object 100 to be processed. In addition, the degree to which the clamping member 24 of the present invention fits the object 100 to be processed (or, the degree to which it conforms to the object 100 to be processed) varies accordingly according to the clamping degree between the clamping member 24 and the object 100 to be processed. For example, the contour of the clamping surface of the clamping member 24 (e.g., the surface of the first abutment portion 123a and the second abutment portion 123b) can change accordingly with the surface contour of the object 100 to be processed, thereby adjusting the degree of conformality between the clamping surface of the clamping member 24 and the peripheral contour of the object 100 to be processed according to the degree of clamping.In a feasible application example, the outer layer of the clamping member 24 is a clamping surface, and the outer layer is a deformable structure such as a soft surface layer or a flexible surface layer, or a deformable structure with restoring force, and the inner layer of the clamping member 24 is a support member, which is a structure that is not easily deformed. Therefore, before, during, and after the clamping member 24 locks the object 100 to be processed, the degree of attachment of the clamping member 24 to the object 100 to be processed is different, so the degree of attachment of the clamping surface of the clamping member 24 to the contour of the object 100 to be processed can be changed accordingly according to the degree of clamping. That is, when the clamping member 24 completely locks the object 100 to be processed, the degree of attachment (conformity) between the clamping surface of the clamping member 24 and the contour of the object 100 to be processed reaches the highest.

[0168] In addition, in the present invention, the number of the slits 25 of the clamping member 24 can be one or more, wherein these slits 25 can be independent of each other (such as Figure 3 As shown), or at least two slits 25 are connected to each other (as shown Figure 8 As shown in the figure, the discharge electrode 32 can be moved from one slit 25 to another slit 25 through the connecting design, so as to form a plurality of processing grooves 120 at different positions accordingly, without disassembling the structure of the clamping member 24 or reintroducing the discharge electrode 32.

[0169] The clamping member 24 of the present invention has a slit structure that can be used to firmly clamp the object 100 to be processed, for example, to clamp the upper and lower ends of the object 100 to be processed (such as Figure 2 As shown in FIG. 1 , the discharge electrode 32 can pass through the slit 25 of the slit structure and perform an electric discharge machining process on the workpiece 100 along the extending direction of the slit 25 to form a machining groove 120, thereby preventing the discharge electrode 32 from damaging the clamping member 24. In the present invention, the shape of the slit 25 is selected from a closed type without an opening (such as Fig. 9 (A) and Fig. 9 (B)), single-side opening type (such as Fig.10 (A) and Fig.10 (B)) and double-sided opening type (as shown Figure 3 Among them, taking the single-side opening type or double-side opening type as an example, if the carrier 20 of the present invention has a corresponding single-side or double-side opening (such as Fig.10 (A) and Fig.11 (A)), it is helpful for the discharge electrode 32 to penetrate into the slit 25, but the utility model is not limited thereto, and the carrier 20 may not have a corresponding single-sided or double-sided opening, or the clamping member 24 of the utility model may also be located at the side of the carrier 20 (such as Fig.10 (B) Fig.10 (C) Fig.11 (B) and Fig.11(C)), thereby facilitating the discharge electrode 32 to penetrate into the slit 25. The slit structure of the present invention is not limited to a specific size, material, number of slit openings or setting orientation. As long as the carrier 20 and / or the clamping member 24 can clamp the object 100 to be processed during the discharge machining process, it falls within the scope of protection requested by the present invention. In other words, the span of the slit 25 of the slit structure and the spacing between multiple slits 25 are not limited to being the same or different. In addition, the slits 25 of the clamping member 24 of the present invention are not limited to having equidistant spans, and the slits 25 may also selectively have non-equidistant spans (such as Fig.11 (A) and Fig.11 (B) or Fig. 9 (B)), for example, the span at the end edge (e.g., the threading end) of the same slit 25 is greater than the span in the middle (e.g., the EDM end) of the slit to form a guide groove 125, and the edge of the guide groove 125 can also be selectively designed to be an outward convex arc shape (e.g., Fig.11 (B)) or concave arc shape (e.g. Fig.11 (C)), thereby facilitating the introduction of the discharge electrode 32 into the slit 25 of the clamping member 24. In addition, taking the non-equidistant span as an example, the clamping member 24 (slit structure) of the present invention may also selectively have an auxiliary hole 25a connected to the slit 25, wherein the auxiliary hole 25a is, for example, located on one side or both sides of the slit 25 (e.g. Fig. 9 (B)). Thus, the present invention allows the discharge electrode 32 to be inserted into the auxiliary hole 25a first, and then the discharge electrode 32 is moved from the auxiliary hole 25a to the slit 25, so that the discharge electrode 32 can be more easily inserted into the slit 25 of the clamping member 24. The slit 25 of the clamping member 24 of the present invention is not limited to having a fixed span, and the slit 25 can also selectively have an adjustable span. For example, the clamping member 24 of the present invention can selectively have at least one gasket 27 (such as Figure 3 As shown), the gasket 27 is located in the slit 25 of the clamping member 24 and respectively supports the two side walls of the slit 25. Therefore, by changing the thickness of the gasket 27, the span of the slit 25 can be adjusted (such as Figure 3 (A)). Since the purpose of the gasket 27 is to adjust the span of the slit 25, the length of the gasket 27 is not particularly limited. However, if the length of the gasket 27 extends from the first abutting component 23a to the second abutting component 23b (such as Figure 2 As shown), the clamping member 24 can also provide additional structural stability.

[0170] In addition, in the present invention, the clamping member 24 is not limited to being fixed or detachably located on the carrier 20. Taking the detachable design as an example, the first abutting component 23a and the second abutting component 23b of the clamping member 24 can be detachably connected to each other by means of a lock-in structure 240, which can be a single-sided lock-in structure (such as Fig.12 (A) and Fig.12 (B) The two forms of the clamping member 24 shown) or the double-sided locking structure (such as Figure 2 As shown), the second abutment component 23b below can also be selectively connected, for example, by means of a locking structure 240 (such as Fig.12 The clamping member 24 of the present invention can not only detachably clamp the object 100 to be processed by means of the locking structure 240, but also adjust the size of the clamping opening of the clamping member 24 according to the size of the object 100 to be processed. The locking structure 240 includes, for example, but not limited to, a bolt 242 and a nut 244 (such as Figure 2 and Fig.12 The locking structure 240 of the present invention can be replaced by any structural design that enables the clamping member 24 to clamp the detachable object 100 according to actual needs, that is, as long as the detachable effect can be achieved, it belongs to the scope of protection requested by the present invention.

[0171] In the present invention, the clamping member 24 can be used in addition to direct contact (such as Figure 2 and Fig.14 In addition to the method of clamping the object 100 by means of indirect contact (such as Fig.13 and Fig.14(B)) to clamp the object 100 to be processed. Taking indirect contact as an example, the clamping member 24 is partially connected or bonded to the object 100 to be processed via a buffer member 29, wherein the material of the buffer member 29 is, for example, a conductor or an insulator, and it can be, for example, a solid medium, a soft medium or an adhesive. For example, the buffer member 29 can be, for example, a conductive or non-conductive adhesive layer, or the buffer member 29 can also be a conductive (such as copper foil) or non-conductive soft pad, thereby providing abutment and buffering effects at the same time. In the present utility model, the buffer member 29 can also be selectively fixed on the first abutting component 23a and the second abutting component 23b of the clamping member 24, or the buffer member 29 can also be selectively fixed on the object 100 to be processed, or the buffer member 29 can also be selectively detachably located between the first abutting component 23a of the clamping member 24 and the object 100 to be processed and detachably located between the second abutting component 23b and the object 100 to be processed. For example, the clamping member 24 uses copper foil as the buffer component 29, so as to clamp a partial area of ​​the object to be processed 100 (such as a crystal ingot) through the copper foil (e.g., about 100 μm thick). Therefore, the utility model allows the partial area of ​​the object to be processed 100 to be cut (such as a wafer) to not be in direct contact with the clamping member 24, thereby effectively avoiding the wafer breakage phenomenon often produced in traditional crystal ingot cutting technology.

[0172] like Fig.15 As shown, since the discharge electrode 32 generates residues when performing the discharge machining process on the workpiece 100, the discharge machining unit 30 of the present invention selectively further includes a deslagging unit 64. When the discharge machining unit 30 performs the discharge machining process on the workpiece 100, the deslagging unit 64 is used to provide one or more external forces F2 to remove the residues generated by the discharge electrode 32 applying the discharge energy to the workpiece 100. The application direction or application position of the external force F2 generated by the deslagging unit 64 is adjusted to correspond to the shape of the workpiece 100, so that the application direction or application position of the external force F2 corresponds to the discharge section B of the discharge electrode 32. The deslagging unit 64 can be, for example, one or more selected from the group consisting of an airflow generator, a waterflow generator, an ultrasonic generator, a piezoelectric oscillator, a suction generating component, and a magnetic generating component. The external force F2 can be, for example, one or more selected from the group consisting of airflow, waterflow, ultrasonic oscillation, piezoelectric oscillation, suction, and magnetic force. The slag removal unit 64 is not limited to being disposed on the fixture 36 or the stage 20, and can even be disposed around the discharge section B of the electrode 32. Fig.15 , Fig.16 (A) Fig.16As shown in (B), the slag removal unit 64 is a thrust generating device 64a, such as a water flow generator such as a water jet or an air flow generator such as an air jet and / or a suction generating device 64b (such as a water pump, etc.), for example, the slag removal unit 64 can be set on the fixture 36 or the carrier 20, or set on the surrounding environment of the object to be processed 100, wherein the thrust generating device 64a and the suction generating device 64b are respectively located on two opposite sides of the object to be processed 100, and generate two external forces F2 (thrust F21 and suction F22) in different directions. The thrust generating device 64a and the suction generating device 64b can respectively push and remove the residue generated during the discharge process of the electric discharge machining process, so as to effectively improve the effect of removing the residue. Among them, the suction generating device 64b is preferably set on the movement path of the residue pushed by the external force F2. Moreover, the present invention is not limited to the simultaneous use of the thrust generating device 64a and the suction generating device 64b, that is, the present invention can use the thrust generating device 64a or the suction generating device 64b alone, as long as it helps to remove the residue, it falls within the scope of protection requested by the present invention.

[0173] In addition, Fig.17 As shown, the slag removal unit 64 of the EDM unit 30 of the present invention optionally further includes a guide structure 66 for guiding the external force F2 (e.g., thrust) generated by the slag removal unit 64 to the processing groove 120 on the processing target area 110 of the object to be processed 100, thereby producing the effect of assisting slag removal. The guide structure 66 can be, for example, disposed on the fixture 36 or the carrier 20 (e.g., Figure 2 The guide structure 66 is a baffle, and is, for example, an externally sealed baffle (such as Fig.18 ), for covering the area on the processing target area 110 of the object 100 that has not been subjected to the EDM process, and synchronously moving the position of the discharge electrode 32. The guide structure 66 is, for example, a finger-fork structure (such as Fig.18 and Fig.19 As shown in FIG. 1 , the interdigitated structure has one or more interdigitated baffles corresponding to the processing grooves 120 on the processing target area 110 of the object 100 to be processed. The cross-sectional shape of the interdigitated structure can be, for example, a straight line or a curved line, and can be, for example, a straight line (such as Fig.17 As shown), arc (as Fig. 20 as shown) or U-shaped (as Fig.18 as shown) and other curves.

[0174] In the present invention, the guide structure 66 is manual (such as Fig.17 as shown) or automatic (as shown Fig.18As shown, the discharge electrode 32 that is performing the discharge machining process changes the position or angle of the guided external force, thereby guiding the external force F2 (such as water flow or air flow, etc.) provided by the slag removal unit 64 to the discharge electrode 32 at the discharge machining position of the machining groove 120 of the object 100 to be processed that is currently performing the discharge machining process. In addition, the guide structure 66 of the utility model can be a filling baffle, which can, for example, move along the machining feed direction F. For example, the guide structure 66 of the utility model is, for example, the discharge electrode 32 that is performing the discharge machining process moves in the machining groove 120 of the machining target area 110 of the object 100 to be processed, thereby synchronously moving along the machining feed direction F in a filling manner to the discharge machining position on the machining groove 120 of the machining target area 110 where the discharge machining process has been completed. As shown Fig.18 and Fig.21 As shown, in one embodiment, the guide structure 66 may be, for example, a telescopic baffle. The guide structure 66 is equipped with a telescopic mechanism 68 and has a telescopic elastic force, so as to automatically or manually move synchronously with the discharge electrode 32 to guide the external force F2, and, for example, when the discharge electrode 32 performs the discharge machining process, it automatically maintains the processing groove 120 adjacent to or against the processing target area 110 of the object to be processed 100, for example, adjacent to or against the outer side or inner side of the processing groove 120 of the object to be processed 100. Among them, the guide structure 66 (telescopic baffle) and the telescopic mechanism 68 may, for example, achieve the effect of automatic telescopic extension by means of a spring or a telescopic rod (e.g., a sleeve-type telescopic rod), such as Fig.21 In addition, the guide structure 66 of the present invention can also be selectively used in combination with Figure 7 The structure shown in the figure allows the guide structure 66 to be selectively Figure 7 The position and angle of the slit 25 shown are adjusted to achieve the effect of guiding external force.

[0175] In addition, Fig. 22 The guiding structure 66 of the present invention can also be optionally matched with a sensing component 69, which is used to detect the slag discharge status or the external force F2 guiding status, and can be a sensing component such as a residue quantity sensor, an airflow sensor or a water flow sensor, etc., for adjusting the angle or position of the guiding structure 66 according to the sensing result of the sensing component 69, so as to achieve optimized slag discharge effect and guiding effect.

[0176] In summary, the electrical discharge machining device of the present invention has the following advantages:

[0177] (1) The present invention adopts conventional software and programs and, through improvements on the hardware, can adjust the actual discharge energy value of the discharge process according to the change state of the discharge frequency or discharge energy during the discharge process, so that the discharge machining program can be maintained at a predetermined target machining state, thereby overcoming the problems caused by the hardware in the above-mentioned prior art.

[0178] (2) Through hardware improvements, the slag removal unit can provide external force to assist in removing the residue remaining in the processed groove.

[0179] (3) By improving the hardware, the guiding structure can correctly guide the external force provided by the slag removal unit to the discharge machining position of the current discharge machining procedure.

[0180] (4) By improving the hardware, the discharge electrode can be used as a capacitive sensing component to provide a sensed capacitance value in real time as a discharge feedback signal.

[0181] (5) By improving the hardware, the insulating sleeve covers the discharge electrode and exposes the discharge surface of the discharge electrode in the machining feed direction, which can reduce the kerf loss and improve the precision of discharge machining. Therefore, it can effectively improve the problem that the traditional discharge electrode and the object to be processed are prone to unexpected damage.

[0182] (6) Through the improvement of hardware, the insulating sleeve covering the discharge electrode can make the discharge electrode less vibrating, and can also enhance the external force for slag removal (such as water flow or air flow) to achieve the chip removal effect. The insulating sleeve can make the object to be processed (such as a wafer) less vibrating after cutting, reducing the risk of fragmentation. In addition, the insulating sleeve can use the external force for slag removal (such as water flow or air flow) to reduce the friction between the insulating sleeve and the discharge electrode to avoid damage to the discharge electrode. In addition, the insulating sleeve can also provide local heating at the same time.

[0183] (7) By improving the hardware, the insulating sleeve has a gap, which can not only improve the discharge machining effect of the discharge electrode, but also provide a slag removal function.

[0184] (8) Through the improvement of hardware, the clamping piece has a slit structure that can firmly clamp the object to be processed, and can effectively solve the problem that traditional discharge machining technology cannot cut the overlapping area between the clamping piece and the object to be processed. The locking structure can also achieve the effect of disassembly, assembly and adjustment.

[0185] (9) By improving the hardware, the clamping parts can be connected or bonded to the workpiece via a buffer member, which can effectively avoid the wafer cracking phenomenon that is often caused by traditional ingot cutting technology.

[0186] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or changes made to the present invention without departing from the spirit and scope of the present invention shall be included in the appended claims.

Claims

1. An electrical discharge machining device for performing an electrical discharge machining process on at least one object to be machined, so that the electrical discharge machining process is maintained at a target machining state, characterized in that: Include: At least one carrier for carrying the object to be processed, wherein the object to be processed is defined with at least one processing target area; and At least one discharge machining unit comprises at least one discharge electrode and a power supply unit, wherein the power supply unit provides a discharge energy to the discharge electrode at a discharge frequency, and the discharge machining unit performs the discharge machining procedure on the machining target area of ​​the object to be machined via the discharge electrode with at least one machining parameter, wherein the discharge machining unit can adjust an actual output energy value according to the change state of the discharge frequency or the discharge energy during a discharge process of the discharge machining procedure.

2. The electrical discharge machining device according to claim 1, characterized in that: The discharge machining unit adjusts the discharge frequency and / or the discharge energy provided by the power supply unit to adjust the actual output energy value in real time when the discharge machining process is performed, so that the discharge machining process is maintained at the target machining state.

3. The electrical discharge machining device according to claim 1, characterized in that: The electrical discharge machining unit adjusts the machining parameter to correspondingly adjust the actual output energy value in real time.

4. The electrical discharge machining device according to claim 3, characterized in that: The electrical discharge machining unit adjusts the machining parameter accordingly according to an internal or external feature of the object to be machined, so as to maintain the electrical discharge machining process at the target machining state.

5. The electrical discharge machining device according to claim 4, characterized in that: There are plural types of the processing parameters, and the discharge machining program selects at least one of the types of the processing parameters to adjust, so that the discharge machining program is maintained at the target machining state.

6. The electrical discharge machining device according to claim 1, characterized in that: The target processing state is selected from a group consisting of a cutting speed, a material removal rate, a material consumption rate and a surface roughness of the object to be processed and a disconnection frequency of the discharge electrode.

7. The electrical discharge machining device according to claim 1, characterized in that: The electrical discharge machining unit performs the electrical discharge machining procedure on the machining target area of ​​the object to be machined at a preset temperature, and the preset temperature is less than or equal to 100 degrees Celsius.

8. The electrical discharge machining device according to claim 1, wherein: The electrical discharge machining unit performs the electrical discharge machining process on the machining target area of ​​the object to be machined in a temperature range, wherein the object to be machined has a substantially lowest resistivity in the temperature range.

9. The electrical discharge machining device according to claim 7 or 8, characterized in that: The electrical discharge machining unit performs the electrical discharge machining procedure on the machining target area of ​​the object to be machined in a water solution.

10. The electrical discharge machining device according to claim 9, characterized in that: The object to be processed is a semiconductor material.

11. The electrical discharge machining device according to claim 1, characterized in that: The carrier further comprises at least one clamping member, which is a slit structure. The clamping member applies radial or axial force to the object to be processed to fix the object to be processed.

12. The electrical discharge machining device according to claim 11, characterized in that: The slit of the slit structure is selected from a group consisting of a closed type with no opening, a single-side opening type, and a double-side opening type.

13. The electrical discharge machining device according to claim 11, characterized in that: The clamping member is a fixed or detachable single-side locking structure or double-side locking structure for clamping the object to be processed.

14. The electrical discharge machining device according to claim 11, wherein: The slit structure has one or more slits, and each of the slits has the same or different spans.

15. The electrical discharge machining device according to claim 11, characterized in that: The slit structure has one or more slits, and the distance between every two adjacent slits is the same or different.

16. The electrical discharge machining device according to claim 11, characterized in that: The slit structure has at least one slit, and the slit has a non-equidistant span or an adjustable span.

17. The electrical discharge machining device according to claim 11, characterized in that: The slit structure has a plurality of slits, and at least two of the plurality of slits are connected to each other.

18. The electrical discharge machining device according to claim 11, characterized in that: The clamping member and the object to be processed are partially connected or bonded via a conductor or an insulator.

19. The electrical discharge machining device according to claim 18, characterized in that: The conductor or the insulator is a solid medium, a soft medium or a viscose.

20. The electrical discharge machining device according to claim 1, characterized in that: The invention also comprises a slag removal unit for providing at least one external force to remove the residues generated when the discharge electrode performs the discharge machining procedure on the object to be processed.

21. The electrical discharge machining device according to claim 20, characterized in that: The external force is selected from one or more of the group consisting of air flow, water flow, ultrasonic vibration, piezoelectric vibration, suction and magnetic force.

22. The electrical discharge machining device according to claim 20, characterized in that: The slag removal unit further comprises a guiding structure for guiding the external force to a machining groove of the discharge electrode for performing the discharge machining procedure on the machining target area of ​​the object to be machined.

23. The electrical discharge machining device according to claim 22, characterized in that: The guiding structure manually or automatically changes the position or angle of guiding the external force along with the discharge electrode performing the discharge machining process, so as to guide the external force to an discharge machining position of the machining groove of the object to be machined where the discharge electrode is currently performing the discharge machining process.

24. The electrical discharge machining device according to claim 22, characterized in that: The guide structure accompanies the discharge electrode in moving position in the processing groove of the processing target area of ​​the object to be processed, so as to synchronously move to a discharge processing position on the processing groove of the processing target area where the discharge processing procedure has been completed.

25. The electrical discharge machining device according to claim 22, characterized in that: The guiding structure is an external sealing baffle plate, which is used to cover an area on the processing target area of ​​the object to be processed where the discharge processing procedure has not been performed, and moves synchronously with the discharge electrode.

26. The electrical discharge machining device according to claim 22, characterized in that: The guiding structure is a finger-fork structure corresponding to the processing groove on the processing target area of ​​the object to be processed.

27. The electrical discharge machining device according to claim 22, characterized in that: The guiding structure is matched with a telescopic mechanism so as to automatically move synchronously with the discharge electrode to guide the external force.

28. The electrical discharge machining device according to claim 22, characterized in that: The guiding structure is matched with a sensing component to adjust the guiding effect of the guiding structure according to a sensing result of the sensing component.

29. The electrical discharge machining device according to claim 1, 7 or 8, characterized in that: The invention also comprises a temperature control unit, which is used to provide a heat source and / or a cold source when the discharge machining process is performed, so as to directly or indirectly adjust the temperature of the object to be processed.

30. The electrical discharge machining device according to claim 29, characterized in that: The heat source is infrared, microwave or electric heater.

31. The electrical discharge machining device according to claim 29, characterized in that: The cold source is used with antifreeze to prevent a processing environment of the electrical discharge machining unit from freezing.

32. The electrical discharge machining device according to claim 29, characterized in that: The temperature control unit has a temperature sensor to determine whether a processing environment of the object to be processed reaches a target temperature, so as to maintain the processing environment at the target temperature.

33. The electrical discharge machining device according to claim 1, characterized in that: Ozone or bubbles are added to a processing environment of the EDM unit to improve processing efficiency by oxidation, softening or explosion.

34. The electrical discharge machining device according to claim 1, characterized in that: The material of the discharge electrode is selected from the group consisting of copper, brass, molybdenum, tungsten, graphite, steel, aluminum, zinc, nickel and diamond.

35. The electrical discharge machining device according to claim 1, characterized in that: The interior of the discharge electrode is a metal layer, and the discharge electrode has a dielectric material layer or a diamond layer covering the periphery of the metal layer.

36. The electrical discharge machining device according to claim 35, characterized in that: During the discharge process of the electrical discharge machining procedure, the discharge electrode is used as a capacitance sensing component to provide a sensing capacitance value.

37. The electrical discharge machining device according to claim 1, characterized in that: When the number of at least one of the discharge electrodes and the object to be processed is plural, the discharge machining procedure has plural machining feed speeds correspondingly, and the discharge machining unit uses the slowest one of the plural machining feed speeds as a common machining feed speed.

38. The electrical discharge machining device according to claim 37, characterized in that: The carrier is a movable carrier, and the carrier uses the common processing feed speed as a moving speed.

39. The electrical discharge machining device according to claim 1 or 37, characterized in that: There are a plurality of discharge electrodes, and each of the plurality of discharge electrodes has an independently controlled processing feed speed.

40. The electrical discharge machining device according to claim 1 or 37, characterized in that: The number of the discharge electrodes and the objects to be processed are both plural, and the plural discharge electrodes perform the discharge machining procedure on the same or different objects to be processed.

41. The electrical discharge machining device according to claim 1, characterized in that: The discharge machining unit further comprises an insulating sleeve, which is disposed on the outer side of the discharge electrode and exposes at least one surface of the discharge electrode in a machining feed direction, so as to use the surface as a discharge surface of the discharge electrode during the discharge process.

42. The electrical discharge machining device according to claim 41, characterized in that: A discharge area formed by the discharge surface exposed by the discharge electrode during the discharge process is substantially larger than the cross section of the insulation sleeve.

43. The electrical discharge machining device according to claim 41, characterized in that: The relative positions of the insulating sleeve and the discharge electrode in a machining feed direction of the discharge machining process are fixed, and the relative positions of the insulating sleeve and the discharge electrode in a tension direction of the discharge electrode are movable.

44. The electrical discharge machining device according to claim 41, characterized in that: The insulating sleeve includes a bottom plate and two side walls, wherein the two side walls are located at two ends of the bottom plate to form a receiving groove, and a receiving chamber is formed inside the receiving groove to accommodate the discharge electrode, and the receiving groove has an opening connected to the receiving chamber to expose the discharge surface of the discharge electrode located in the receiving chamber.

45. The electrical discharge machining device according to claim 41, characterized in that: The insulating sleeve is sleeved on the outer side of the discharge electrode along a tension direction of the discharge electrode, and the insulating sleeve has one or more notches for providing water discharge and chip removal functions in the discharge machining process.

46. ​​The electrical discharge machining device according to claim 11, characterized in that: A conformal degree between a clamping surface of the clamping member and a contour of the object to be processed changes accordingly according to a clamping degree between the clamping member and the object to be processed, so as to correspondingly change an adhesion degree between the clamping surface of the clamping member and the contour of the object to be processed.

47. The electrical discharge machining device according to claim 1, characterized in that: The power supply unit of the electrical discharge machining unit is integrated or separately arranged on the electrical discharge machining device to supply a power source of the electrical discharge energy to the object to be machined.

48. The electrical discharge machining device according to claim 1, characterized in that: The invention also comprises a non-destructive detection device for detecting the object to be processed before, during or after the discharge machining procedure.

49. The electrical discharge machining device according to claim 1, characterized in that: The discharge machining unit further comprises a vibration measuring unit for measuring the vibration value of the discharge electrode.

50. The electrical discharge machining device according to claim 1, characterized in that: The electrical discharge machining unit further comprises a tension measuring unit for measuring the tension value of the discharge electrode.

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