Vacuum adsorption device and woodworking machining center
By using the control valve to switch the connection status of the vacuum pump in the vacuum adsorption device, the problem of 'running phenomenon' and processing errors in board processing are solved, and adsorption power and product quality are improved.
Patent Information
- Application Number
- CN202421131943.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-01-28
- Estimated Expiration
- 2034-05-22
AI Technical Summary
During the processing of the plate, as the cutting blade path increases, the negative pressure value in the vacuum area decreases, resulting in the plate being easily moved, and the "plate running phenomenon" occurs, which leads to processing errors and product quality declines.
The vacuum adsorption device including the first vacuum pump, the second vacuum pump, the gas pipe and the gas pipe and the control valve is used. When the preset scene appears in the vacuum area through the control valve Other parts are adsorbed to improve adsorption.
By absorbing the splitted area, the adsorption force is improved, the possibility of moving the board in the process of processing is reduced, the processing errors are reduced, and the quality of the product is improved.
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Figure CN222406203U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of woodworking machinery, and in particular to a vacuum adsorption device and a woodworking processing center. Background Art
[0002] When processing the plate, it is necessary to fix the plate on the workbench. The usual method of fixing the plate is to open multiple vacuum areas on the table. The vacuum areas are connected to the vacuum pump through the exhaust pipes set under the workbench. During processing, the vacuum pump works, and the plate is adsorbed and fixed on the workbench.
[0003] However, when the adsorption fixation method is used for processing, as the number of cutter paths for cutting the plate increases, the negative pressure value of the vacuum area also decreases (i.e., pressure relief occurs), and the adsorption force of the vacuum area on the plate gradually decreases. Therefore, in the process of cutting small plates (plates with a size of about 30mm*200mm or smaller) from the template plate, the small plate is easy to move, resulting in the "plate running phenomenon", which in turn causes the plate processing position to deviate from the preset position, resulting in processing errors and reducing product quality. Utility Model Content
[0004] The embodiment of the present application provides a vacuum adsorption device and a woodworking processing center, which can solve the problem that the existing board processing is prone to "board running phenomenon", resulting in processing errors and reducing product quality. In order to achieve this purpose, the embodiment of the present application provides the following solutions.
[0005] According to one aspect of an embodiment of the present application, a vacuum adsorption device is provided, including a first vacuum pump, a second vacuum pump, an exhaust pipeline and a control valve.
[0006] The vacuum pipeline includes a first pipeline and a second pipeline, the first vacuum pump is connected to the vacuum area through the first pipeline, the second vacuum pump is connected to the vacuum area through the second pipeline, and the vacuum area is used to adsorb the target plate;
[0007] The exhaust pipe is provided with the control valve, and the control valve is used to control the first pipe or the second pipe connected to the vacuum area to open when a first preset scene appears in the vacuum area, and to close the first pipe or the second pipe connected to other vacuum areas corresponding to the target plate. The first preset scene includes that the current part of the target plate corresponding to the vacuum area is processed or the previous part of the current part is processed, and the current part and the previous part are determined based on the processing order of the target plate.
[0008] In a possible implementation, it includes: a workbench and the vacuum adsorption device as described above, wherein a preset number of vacuum areas are provided on the workbench surface, and each of the vacuum areas is connected to the vacuum adsorption device.
[0009] In a possible implementation manner, each of the vacuum areas is connected to a different exhaust pipe.
[0010] In a possible implementation, the size of the vacuum area is smaller than the size of the adsorption area corresponding to the target plate, the adsorption area is adsorbed on the corresponding vacuum area, and the adsorption area is formed based on the processing method of the target plate on the table top.
[0011] In a possible implementation manner, both the first pipeline and the second pipeline are provided with the control valve.
[0012] In a possible implementation, the woodworking processing center further includes a processing tool and a detection module, and the detection module is connected to the control valve;
[0013] The detection module is used to send a signal indicating the occurrence of the first preset scene to the control valve corresponding to the vacuum area after detecting the occurrence of the first preset scene in the vacuum area, so that the control valve controls the first pipe or the second pipe corresponding to the vacuum area to open, and closes other first pipes or the second pipes corresponding to the target plate.
[0014] In a possible implementation manner, all the vacuum regions on the table have the same size, and the vacuum regions are arranged on the table at equal intervals.
[0015] In a possible implementation manner, the first pipeline and the second pipeline connected to the vacuum area are in different working states.
[0016] In one possible implementation, the size of the table top includes 7*10 feet, and the preset number includes 70.
[0017] In one possible implementation, the size of the vacuum area comprises 1*1 foot.
[0018] The beneficial effects of the technical solution provided by the embodiment of the present application are:
[0019] The vacuum adsorption device provided by the present application includes a first pipeline and a second pipeline. The first vacuum pump is connected to the vacuum area through the first pipeline, and the second vacuum pump is connected to the vacuum area through the second pipeline. The vacuum area is used to adsorb the target plate; the vacuum pipeline is provided with a control valve, and the control valve is used to control the first pipeline or the second pipeline corresponding to the vacuum area to open when the first preset scene appears in the vacuum area, and to close the other first pipelines or the second pipelines corresponding to the target plate. The first preset scene includes that the current part corresponding to the vacuum area in the target plate is processed or the previous part of the current part is processed. The current part and the previous part are determined based on the processing order of the target plate. The embodiment of the present application provides power for adsorbing the target plate through the first vacuum pump and the second vacuum pump, and when the target plate is processed, the power for adsorbing the processing area is provided by using one of the vacuum pumps alone. The embodiment of the present application can improve the adsorption force by adsorbing the processing area alone, reduce the possibility of the plate moving during the processing process, reduce the processing error of the plate, and improve the product quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for use in describing the embodiments of the present application.
[0021] Figure 1 A structural diagram of a vacuum adsorption device provided in an embodiment of the present application;
[0022] Figure 2 A structural diagram of an embodiment of a woodworking processing center provided by this application;
[0023] Figure 3 A schematic diagram of an embodiment of a setting method of a vacuum area provided in an embodiment of the present application;
[0024] Figure 4 A schematic diagram of the connection between the vacuum adsorption device and the vacuum area provided in an embodiment of the present application;.
[0025] Explanation of reference numerals: 11. first pipeline; 12. second pipeline; 21. first vacuum pump; 22. second vacuum pump; 3. control valve; 4. workbench; 41. vacuum area. DETAILED DESCRIPTION
[0026] The embodiments of the present application are described below in conjunction with the drawings in the present application. It should be understood that the implementation methods described below in conjunction with the drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions of the embodiments of the present application.
[0027] It will be understood by those skilled in the art that, unless specifically stated, the singular forms "one", "said", and "the" used herein may also include plural forms. It should be further understood that the terms "including" and "comprising" used in the embodiments of the present application refer to that the corresponding features can be implemented as the presented features, information, data, steps, operations, elements and / or components, but do not exclude the implementation of other features, information, data, steps, operations, elements, components and / or combinations thereof supported by the present technical field. It should be understood that when we say that an element is "connected" or "coupled" to another element, the one element may be directly connected or coupled to the other element, or it may refer to that the one element and the other element establish a connection relationship through an intermediate element. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein indicates at least one of the items defined by the term, for example, "A and / or B" indicates that it is implemented as "A", or is implemented as "A", or is implemented as "A and B".
[0028] In order to make the purpose, technical solutions and advantages of the present invention more clear, the implementation methods of the present invention will be further described in detail below with reference to the accompanying drawings.
[0029] The following describes several exemplary embodiments to illustrate the technical solutions of the embodiments of the utility model and the technical effects produced by the technical solutions of the utility model. It should be noted that the following embodiments can refer to, draw on or combine with each other, and the same terms, similar features and similar implementation steps in different embodiments will not be described repeatedly.
[0030] The vacuum adsorption device and woodworking processing center provided in the present application are intended to solve at least one technical problem existing in the prior art.
[0031] In an embodiment of the present application, a vacuum adsorption device is provided, which can be used to adsorb a plate during plate processing. Figure 1As shown, the vacuum adsorption device includes a first vacuum pump 21, a second vacuum pump 22, an exhaust pipe and a control valve 3, the exhaust pipe includes a first pipe 11 and a second pipe 12, the first vacuum pump 21 is connected to the vacuum area 41 through the first pipe 11, the second vacuum pump 22 is connected to the vacuum area 41 through the second pipe 12, and the vacuum area 41 is used to adsorb the target plate; the exhaust pipe is provided with a control valve 3, the control valve 3 is used to control the first pipe 11 or the second pipe 12 connected to the vacuum area 41 to open when a first preset scene appears in the vacuum area 41, and to close the first pipe 11 or the second pipe 12 connected to other vacuum areas 41 corresponding to the target plate, the first preset scene includes that the current part of the target plate corresponding to the vacuum area 41 is processed or the previous part of the current part is processed, and the current part and the previous part are determined based on the processing order of the target plate.
[0032] Optionally, the target plate is adsorbed on the workbench 4 through at least two vacuum areas 41. When one of the areas in the target plate is to be processed, the vacuum area 41 corresponding to the area is connected to the first pipe 11 or the second pipe 12 and opened, and the first pipe 11 or the second pipe 12 connected to the vacuum areas 41 corresponding to other areas in the target plate are closed, so that the first vacuum pump 21 or the second vacuum pump 22 only provides adsorption force to the area of the target plate to be processed, thereby increasing the strength of the adsorption force and reducing the "board running phenomenon" of the plate in this area during processing.
[0033] Optionally, the first pipe 11 and the second pipe 12 connected to the vacuum area 41 can be in different working states, including any one of open and closed. Specifically, when the first preset scene appears in the vacuum area 41, the control valve 3 can also be used to control the second pipe 12 or the first pipe 11 connected to the vacuum area 41 to close, and open the second pipe 12 or the first pipe 11 connected to other vacuum areas 41 corresponding to the target plate, so as to keep the other parts of the target plate adsorbed on the workbench 4.
[0034] Optionally, when the second preset scene appears in the vacuum area 41, the control valve 3 controls the first pipe 11 or the second pipe 12 connected to the vacuum area 41 to close, and opens the second pipe 12 or the first pipe 11. The second preset scene includes that the target plate is placed in the position corresponding to the vacuum area 41 on the workbench 4 or the part of the target plate corresponding to the vacuum area 41 is processed.
[0035] Optionally, in order to further enhance the adsorption force of the area to be processed of the target plate, the first pipeline 11 and the second pipeline 12 corresponding to the area to be adsorbed can also be adjusted to an open state through the control valve 3.
[0036] Optionally, the vacuum area 41 is set on the table top of the workbench 4, and the specifications and sizes of the target plate placed on the table top can be various. The vacuum adsorption device controls the opening of the first pipe 11 or the second pipe 12 connected to the corresponding vacuum area 41 according to the position of the target plate on the table top.
[0037] In one embodiment, the table top has a specification size of 7*10 feet. The specification size of the target plate can be 7*10 feet, 7*9 feet, 6*8 feet, 4*9 feet, 4*8 feet and other types of sizes. During the processing of the target plate, the first pipe 11 connected to the corresponding vacuum area 41 is controlled to open according to the position of the target plate, and the power for adsorbing the target plate is provided by the first vacuum pump 21. In addition, as the processed part of the target plate changes (such as the completion of the previous part or the processing of the current part), the second pipe 12 connected to the corresponding vacuum area 41 (such as the second pipe 12 connected to the vacuum area 41 corresponding to the current part) is controlled to open accordingly, so as to reduce the possibility of "running board phenomenon" in the processed part by providing adsorption force to the vacuum area 41 alone through the second vacuum pump 22.
[0038] The vacuum adsorption device of the present application includes a first pipe 11 and a second pipe 12. The first vacuum pump 21 is connected to the vacuum area 41 through the first pipe 11, and the second vacuum pump 22 is connected to the vacuum area 41 through the second pipe 12. The vacuum area 41 is used to adsorb the target plate; the air extraction pipe is provided with a control valve 3, and the control valve 3 is used to control the first pipe 11 or the second pipe 12 corresponding to the vacuum area 41 to open when the first preset scene appears in the vacuum area 41, and to close the other first pipes 11 or the second pipes 12 corresponding to the target plate. The first preset scene includes that the current part corresponding to the vacuum area 41 in the target plate is processed or the previous part of the current part is processed. The current part and the previous part are determined based on the processing sequence of the target plate. The embodiment of the present application provides power for adsorbing the target plate through the first vacuum pump 21 and the second vacuum pump 22, and when the target plate is processed, the power for adsorbing the processing area is provided by using one of the vacuum pumps alone. The embodiment of the present application can improve the adsorption force by adsorbing the processing area alone, reduce the possibility of the plate moving during the processing, reduce the processing error of the plate, and improve the product quality.
[0039] The present application provides a woodworking processing center, such as Figure 1-4 As shown, the woodworking processing center includes a workbench 4 and the vacuum adsorption device as described above, the workbench 4 is provided with a preset number of vacuum areas 41 on the table, and each vacuum area 41 is connected to the vacuum adsorption device. The target board on the table is adsorbed by the vacuum adsorption device.
[0040] Optionally, each vacuum region 41 is connected to a different exhaust pipe, and each vacuum region 41 extracts air from the vacuum region 41 through an independent exhaust pipe, thereby achieving separate control of the state of each vacuum region 41 .
[0041] Optionally, the number of first pipes 11 and second pipes 12 connected to each vacuum area 41 can be the same, both one or more, or different numbers can be set according to the size of the adsorption force or the structure of the workbench 4. The first pipe 11 and the second pipe 12 are both provided with a control valve 3, and the control valve 3 controls the on-off of the pipe where it is located.
[0042] Optionally, in order to adapt to target plates of various specifications and sizes, the size of the vacuum area 41 is smaller than the size of the adsorption area corresponding to the target plate. During processing, the adsorption area is adsorbed on the corresponding vacuum area 41, which is formed based on the processing method of the target plate on the table, and the processing method includes at least one of the target plate placement method, tool path, and target plate specifications and sizes. The characteristic that the vacuum area 41 on the table is smaller than the size of the corresponding adsorption area enables the adsorption area to effectively cover the vacuum area 41 during the processing of the target plate, reducing the possibility that the vacuum area 41 is not used, thereby avoiding the need to artificially seal the unused vacuum area 41 through plugs and sealing strips, reducing the operating steps in plate processing, and improving plate processing efficiency.
[0043] Optionally, the woodworking processing center also includes processing tools and a detection module, and the detection module is connected to the control valve 3; the detection module is used to send a signal of the occurrence of the first preset scene to the control valve 3 corresponding to the vacuum area 41 after detecting the occurrence of the first preset scene in the vacuum area 41, so that the control valve 3 controls the first pipe 11 or the second pipe 12 connected to the vacuum area 41 to open, and close other first pipes 11 or second pipes 12 corresponding to the target board.
[0044] Optionally, the processing tool is a tool for cutting the target plate, and the detection module can send a signal indicating the first preset scene to the control valve 3 according to the position and movement path of the tool. The detection module can be set separately relative to the control valve 3, or can be integrated in the control valve 3. The control valve 3 uses the detection module to realize automatic control of the on and off of the exhaust pipe, thereby improving the intelligent operation of the woodworking processing center.
[0045] Optionally, all vacuum regions 41 on the table have the same size, and the vacuum regions 41 are arranged on the table at equal intervals.
[0046] In one embodiment, the size of the table top includes 7*10 feet, the preset number includes 70, and can also be 60, 80, 90 and other numbers, and the size of the vacuum area 41 includes 1*1 foot. Specifically, the 1*1 foot vacuum area 41 is distributed in a rectangular arrangement on the 7*10 foot table top.
[0047] The woodworking processing center of the present application is further described below through the specific working mode of the woodworking processing center.
[0048] In one embodiment, the target plate is a 2*2 foot plate, and four 1*1 foot vacuum areas 41 of A, B, C, and D on the table are required, so the control valves 3 corresponding to the other vacuum areas 41 are all in a closed state. The specific processing steps are as follows:
[0049] Step 1: Close all vacuum areas 41, that is, the four surfaces of the workbench have no adsorption force.
[0050] Step 2: Place the 2*2 foot plate on the four 1*1 foot vacuum areas 41 of A, B, C, and D on the four sides of the workbench.
[0051] Step 3: Open the four control valves 3 A1, B1, C1, and D1 corresponding to the four vacuum areas 41 of A, B, C, and D, so that the first vacuum pump 21 generates adsorption force on the 2*2 foot plate.
[0052] Step 4: When the tool is processing in area A, the A1 control valve 3 is closed and the A2 control valve 3 is opened, so that the first vacuum pump 21 provides adsorption force for areas B, C, and D, and the second vacuum pump 22 provides adsorption force for area A alone. Therefore, the adsorption force in area A is stronger, and the probability of "board running" when the tool cuts small-sized plates in area A is greatly reduced.
[0053] Step 5, when the tool is about to enter other areas for processing, such as when the tool moves from area A to area B, the B1 control valve 3 is closed in advance and the B2 control valve 3 is opened in advance; after the tool enters area B, the A1 control valve 3 is opened and the A2 control valve 3 is closed.
[0054] The present application realizes further subdivision of the vacuum area, a new connection method and intelligent control of the vacuum pump through the above-mentioned embodiments, which can effectively solve the problems of insufficient utilization of vacuum adsorption performance and "plate running phenomenon" of small plates.
[0055] The terms "first", "second", "third", "fourth", "1", "2", etc. (if any) in the specification and claims of this application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than that shown or described in the drawings.
[0056] It should be understood that, although each operation step is indicated by arrows in the flowchart of the embodiment of the present application, the implementation order of these steps is not limited to the order indicated by the arrows. Unless clearly stated herein, in some implementation scenarios of the embodiment of the present application, the implementation steps in each flowchart can be performed in other orders according to demand. In addition, some or all of the steps in each flowchart may include multiple sub-steps or multiple stages based on actual implementation scenarios. Some or all of these sub-steps or stages may be executed at the same time, and each sub-step or stage in these sub-steps or stages may also be executed at different times respectively. In different scenarios of execution time, the execution order of these sub-steps or stages may be flexibly configured according to demand, and the embodiment of the present application does not limit this.
[0057] The above is only an optional implementation method for some implementation scenarios of the present application. It should be pointed out that for ordinary technicians in this technical field, without departing from the technical concept of the solution of the present application, other similar implementation methods based on the technical ideas of the present application are also within the protection scope of the embodiments of the present application.
Claims
1. A vacuum adsorption device, characterized in that: It includes a first vacuum pump, a second vacuum pump, an exhaust pipeline and a control valve, The exhaust pipeline includes a first pipeline and a second pipeline, the first vacuum pump is connected to the vacuum area through the first pipeline, the second vacuum pump is connected to the vacuum area through the second pipeline, and the vacuum area is used to adsorb the target plate; The exhaust pipe is provided with the control valve, and the control valve is used to control the first pipe or the second pipe connected to the vacuum area to open when a first preset scene appears in the vacuum area, and to close the first pipe or the second pipe connected to other vacuum areas corresponding to the target plate. The first preset scene includes that the current part of the target plate corresponding to the vacuum area is processed or the previous part of the current part is processed, and the current part and the previous part are determined based on the processing order of the target plate.
2. A woodworking processing center, characterized in that: include: A workbench and the vacuum adsorption device as claimed in claim 1, wherein the workbench surface is provided with a preset number of vacuum areas, and each of the vacuum areas is connected to the vacuum adsorption device.
3. The woodworking processing center according to claim 2, characterized in that: The exhaust pipes connected to each of the vacuum areas are different.
4. The woodworking processing center according to claim 2, characterized in that: The size of the vacuum area is smaller than the size of the adsorption area corresponding to the target plate, and the adsorption area is adsorbed on the corresponding vacuum area. The adsorption area is formed based on the processing method of the target plate on the table top.
5. The woodworking processing center according to claim 4, characterized in that: The control valve is disposed on both the first pipeline and the second pipeline.
6. The woodworking processing center according to claim 2, characterized in that: The woodworking processing center also includes a processing tool and a detection module, and the detection module is connected to the control valve; The detection module is used to send a signal indicating the occurrence of the first preset scene to the control valve corresponding to the vacuum area after detecting the occurrence of the first preset scene in the vacuum area, so that the control valve controls the first pipe or the second pipe corresponding to the vacuum area to open, and closes other first pipes or the second pipes corresponding to the target plate.
7. The woodworking processing center according to claim 2, characterized in that: All the vacuum regions in the table have the same size, and the vacuum regions are arranged on the table at equal intervals.
8. The woodworking processing center according to claim 7, characterized in that: The first pipeline and the second pipeline connected to the vacuum area are in different working states.
9. The woodworking processing center according to claim 2, characterized in that: The size of the table top includes 7*10 feet, and the preset number includes 70.
10. The woodworking processing center according to claim 9, characterized in that: The dimensions of the vacuum area include 1*1 feet.
Citation Information
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