Nameplate substrate punching device
By introducing a buffer piston structure into the stamping device of the nameplate substrate, the problem that the edge strips of the nameplate substrate are easily crushed or broken during the stamping process in the prior art is solved, and higher yield and resource savings are achieved.
Patent Information
- Application Number
- CN202323579601.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-27
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2033-12-27
AI Technical Summary
In the existing nameplate substrate punching machine, the bottom surface of the upper mold is flat, which makes it difficult for the edge strips of the nameplate substrate to bear pressure evenly during the stamping process, and are easily crushed or broken, with low yield and serious waste.
A nameplate substrate punching device is designed, adopting a buffer piston structure, which is above the punching upper die, and is equipped with rectangular through holes and grooves on the bottom surface, and is embedded with springs and limit structures. The buffer piston shrinks when under stress. Return and eject, providing pressure buffering to prevent the edge strips of the nameplate substrate from being crushed or broken.
Through the design of the buffer piston, we ensure that the edge strips of the nameplate substrate are uniformly pressurized during the punching process, avoid crushing or breaking, which improves the yield rate and saves costs and resources.
Smart Images
Figure CN222430985U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of nameplate processing equipment, and in particular relates to a nameplate substrate punching device. Background Art
[0002] Punching machine is also called die cutting machine, die cutting machine, cutting machine and CNC punching machine. It uses steel, endless mold or steel wire (or template carved from steel plate) to cut printed products or paper bundles into certain shapes by applying a certain pressure. It is an important equipment for post-printing packaging processing. In the production process of nameplate labels, the printed labels are generally long strips of paper or metal strips. The long sheet of material to be cut is placed in the die cutting machine, and the die cutting machine cuts it to form a nameplate label.
[0003] The bottom surface of the upper die in the existing nameplate substrate punching machine is flat. During the punching process when the nameplate substrate is pressed down, it is easy to be crushed or broken due to the narrow edge strips and the pressure it bears from the upper die is difficult to ensure uniformity, resulting in low yield and serious waste. Utility Model Content
[0004] The utility model aims to solve the above problems existing in the prior art and provides a nameplate substrate punching device.
[0005] The utility model adopts the following technical solutions:
[0006] The nameplate substrate punching device includes a fixed seat, a punching upper die is arranged on the fixed seat, a support frame is also arranged on the fixed seat, a punching lower die is arranged on the support frame, and a driving mechanism for driving the punching upper die to move up and down is also arranged on the support frame. The punching upper die includes a lower pressing platform connected to the lifting mechanism, and rectangular through holes are provided on both sides of the bottom surface of the lower pressing platform for contacting and pressing the edge strips of the circuit board. The punching upper die also includes a stacking platform stacked on the top surface of the lower pressing platform, and a groove is arranged on the bottom surface of the stacking platform at a position corresponding to the rectangular channel. A buffer piston is arranged in the rectangular channel, and the upper end of the buffer piston extends into the groove, and the lower end of the buffer piston extends out of the bottom surface of the lower pressing platform.
[0007] Furthermore, the buffer piston is provided with a limiting structure for preventing the lower pressing platform from moving downward.
[0008] Furthermore, a spring is fixedly connected in the groove, and the buffer piston is also fixedly connected to the spring.
[0009] Furthermore, a plurality of upper support columns are fixedly connected to the bottom surface of the fixed seat, a connecting cross beam is arranged between the upper support columns, the lower end of the upper support column has a mounting groove, a lower support column is inserted into the mounting groove, an electric push rod is also fixedly connected to the mounting groove, and the output shaft of the electric push rod is fixedly connected to the lower support column.
[0010] Furthermore, the connecting beam is in a U-shaped structure, and a beam mounting seat for mounting the beam is provided on the upper support column. The beam mounting seat is in an L-shape that matches with both ends of the connecting beam, and the two ends of the connecting beam are fixedly connected to the beam mounting seat by screws.
[0011] The beneficial effects of the utility model are:
[0012] The buffer piston on the punching upper die in the nameplate substrate punching device has a buffering effect on the pressure on the edge strip of the nameplate substrate. The buffer piston retracts under force and pops out otherwise. In each punching operation, it can be ensured that the edge strip of the nameplate substrate will not be crushed or broken, and the production yield is high, which saves costs and resources. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a front view of the nameplate substrate punching device provided by the utility model.
[0014] Figure 2 It is a top view of the punching upper touch provided by the utility model.
[0015] Figure 3 It is a cross-sectional view of the punching upper die. DETAILED DESCRIPTION
[0016] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.
[0017] In order to illustrate the technical solution of the present invention, specific embodiments are provided below for illustration.
[0018] For the convenience of explanation, only the parts related to the embodiment of the present utility model are shown.
[0019] Combination Figure 1As shown, the nameplate substrate punching device includes a fixed seat 1, on which an upper punching die 2 is arranged, and a support frame 3 is also arranged on the fixed seat, on which a lower punching die 4 is arranged, and on the support frame a driving mechanism for driving the upper punching die to move up and down is also arranged, and the upper punching die includes a lower pressing platform 21 connected to the lifting mechanism, and rectangular through holes 22 are provided on both sides of the bottom surface of the lower pressing platform for contacting and pressing the edge strips of the circuit board, and the upper punching die also includes a stacking platform 23 stacked on the top surface of the lower pressing platform, and a groove 24 is arranged on the bottom surface of the stacking platform at a position corresponding to the rectangular channel, and a spring 25 is fixedly connected in the groove, and a buffer piston 26 is arranged in the rectangular channel, and the upper end of the buffer piston extends into the groove, and the buffer piston is also fixedly connected to the spring, and the lower end of the buffer piston extends out of the bottom surface of the lower pressing platform, and the buffer piston is provided with a limiting structure 27 for blocking the lower pressing platform from descending. The buffer piston has a buffering effect on the pressure on the edge strip of the nameplate substrate. The buffer piston retracts under force and pops out. In each punching operation, it can ensure that the edge strip of the nameplate substrate will not be crushed or broken, and the production yield is high, saving costs and resources. The driving mechanism can be a hydraulic cylinder, an electric telescopic rod, etc.
[0020] Combination Figure 2-3 As shown, as a preferred structure, a plurality of upper support columns 5 are fixedly connected to the bottom surface of the fixed seat, and a connecting beam 6 is arranged between the upper support columns. The lower end of the upper support column has a mounting groove, and a lower support column 7 is inserted in the mounting groove. An electric push rod is also fixedly connected in the mounting groove, and the output shaft of the electric push rod is fixedly connected to the lower support column. The connecting beam is in a U-shaped structure, and a beam mounting seat 8 for mounting the beam is arranged on the upper support column. The beam mounting seat is in an L-shape that matches with the two ends of the connecting beam, and the two ends of the connecting beam are fixedly connected to the beam mounting seat by screws. The electric push rod can drive the upper support column to move up and down, thereby changing the height of the nameplate substrate punching device, which is convenient for punching operations. The two ends of the U-shaped connecting beam match with the L-shaped beam mounting seat and are connected by screws, which improves the fixing effect of the connecting beam and the beam mounting seat.
[0021] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the present utility model.
Claims
1. A nameplate substrate punching device, comprising a fixing seat, characterized in that: A punching upper die is arranged on the fixed seat, a support frame is also arranged on the fixed seat, a punching lower die is arranged on the support frame, and a driving mechanism for driving the punching upper die to move up and down is also arranged on the support frame, the punching upper die includes a lower pressing platform connected to the lifting mechanism, rectangular through holes are provided on both sides of the bottom surface of the lower pressing platform for contacting and pressing the edge strips of the circuit board, the punching upper die also includes a stacking platform stacked on the top surface of the lower pressing platform, a groove is arranged on the bottom surface of the stacking platform at a position corresponding to the rectangular channel, a buffer piston is arranged in the rectangular channel, the upper end of the buffer piston extends into the groove, and the lower end of the buffer piston extends out of the bottom surface of the lower pressing platform.
2. The nameplate substrate punching device according to claim 1, characterized in that: The buffer piston is provided with a limiting structure for preventing the lower pressing platform from descending.
3. The nameplate substrate punching device according to claim 1 or 2, characterized in that: A spring is fixedly connected in the groove, and the buffer piston is also fixedly connected to the spring.
4. The nameplate substrate punching device according to claim 1, characterized in that: A plurality of upper support columns are fixedly connected to the bottom surface of the fixing seat, a connecting cross beam is arranged between the upper support columns, a mounting groove is provided at the lower end of the upper support column, a lower support column is inserted into the mounting groove, an electric push rod is also fixedly connected to the mounting groove, and the output shaft of the electric push rod is fixedly connected to the lower support column.
5. The nameplate substrate punching device according to claim 4, characterized in that: The connecting crossbeam is in a U-shaped structure. A crossbeam mounting seat for mounting the crossbeam is provided on the upper support column. The crossbeam mounting seat is in an L-shape that matches with both ends of the connecting crossbeam. The two ends of the connecting crossbeam are fixedly connected to the crossbeam mounting seat by screws.