Semiconductor plastic package mold cleaning device

Abstract

The utility model provides a semiconductor plastic package mold cleaning device which comprises a mounting seat, a motor is arranged on the mounting seat, a rotating shaft of the motor is connected with a rotating shaft, an upper air blowing pipe and a lower air blowing pipe are arranged on the rotating shaft, and the upper air blowing pipe and the lower air blowing pipe are respectively provided with an air connector. According to the automatic blowing device, manual blowing is replaced by machine automatic blowing, the structure is simple, the space is not occupied, the operation is stable, the cost is low, the problem of manual blowing is ingeniously solved, the labor intensity of workers is reduced, the scalding risk is reduced, and the product quality is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning semiconductor plastic packaging equipment, in particular to a semiconductor plastic packaging mold cleaning device. Background Art

[0002] After the traditional manual semiconductor packaging machine completes the plastic encapsulation of each mold product, the worker needs to manually take the air gun deep into the mold to clean the upper and lower mold surfaces and remove the material chips on the mold surface. The temperature inside the mold is usually around 175℃ or even higher. The worker needs to go deep into the mold to clean the mold for each mold. If you are not careful, you will get burned. If the mold is not cleaned, the product will have quality problems such as loose plastic encapsulation, flash skin, and unfilled. Summary of the invention

[0003] Purpose of the invention: Without solving the above technical problems, the utility model provides a semiconductor plastic packaging mold cleaning device.

[0004] Technical solution: The utility model is a semiconductor plastic packaging mold cleaning device, including a mounting seat, a motor is arranged on the mounting seat, the rotating shaft of the motor is connected to the rotating shaft, an upper air blowing pipe and a lower air blowing pipe are arranged on the rotating shaft, and the upper air blowing pipe and the lower air blowing pipe are respectively provided with air joints.

[0005] Furthermore, an induction component is provided on the motor shaft, and the induction component cooperates with the sensor.

[0006] Furthermore, the induction component includes a fan-shaped component, the fan-shaped component is connected to the rotating shaft of the motor, and the sensor cooperates with the fan-shaped component.

[0007] Furthermore, the sensor is a photoelectric switch.

[0008] Furthermore, it also includes an electric control device, which is used to supply power to the device of the utility model and control the operation of components such as motors and sensors.

[0009] Furthermore, the electronic control device includes a speed regulating device for adjusting the rotation speed of the electric motor.

[0010] Furthermore, the upper air blowing pipe and the lower air blowing pipe both include an inner pipe and an outer pipe, the inner pipe is provided with at least one exhaust hole, the outer pipe is sleeved on the outside of the inner pipe, there is a gap between the outer pipe and the inner pipe, and the surface of the outer pipe has an air outlet groove.

[0011] Furthermore, the outer tube is rotatable relative to the inner tube.

[0012] Beneficial effects: Compared with the prior art, the semiconductor plastic packaging mold cleaning device of the utility model has the following beneficial effects:

[0013] The utility model replaces manual air blowing with automatic air blowing by a machine, has a simple structure, does not occupy space, operates stably and has low cost, cleverly solves the problem of manual air blowing, reduces the labor intensity of workers, reduces the risk of scalding, and greatly improves product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural schematic diagram of the utility model;

[0015] Figure 2 The schematic diagram of the support structure is shown in FIG.

[0016] Figure 3 It is a schematic diagram of the combined structure of the motor and the flagpole;

[0017] Figure 4 It is a structural schematic diagram of the combination of the rotating shaft and the upper blowing rod and the lower blowing rod;

[0018] Figure 5 It is a schematic diagram of the three-dimensional structure of the upper blowing pipe;

[0019] Figure 6 It is a schematic diagram of the front view structure of the upward blowing. DETAILED DESCRIPTION

[0020] The present invention will be further described below in conjunction with specific embodiments.

[0021] like Figure 1-4 As shown, a semiconductor plastic encapsulation mold cleaning device of the utility model comprises a mounting seat 1, on which a motor 2 is arranged, the rotating shaft of the motor 2 is connected to a rotating shaft 3, on which an upper air blowing pipe 4 and a lower air blowing pipe 5 are arranged, and air joints 6 are respectively arranged on the upper air blowing pipe 4 and the lower air blowing pipe 5. An induction component 7 is arranged on the rotating shaft of the motor 2, and the induction component 7 cooperates with a sensor 8. The induction component 7 comprises a fan-shaped component 71, and the fan-shaped component 71 is connected to the rotating shaft of the motor 2 through a connecting portion 72. The sensor 8 cooperates with the fan-shaped component 71, and the sensor 8 can be arranged on the motor 2. The sensor 8 is a photoelectric switch. It also comprises an electric control device, which is used to supply power to the device of the utility model and control the operation of components such as the motor and the sensor, and the electric control device comprises a speed regulating device for adjusting the rotation speed of the motor 2.

[0022] like Figure 5 , Figure 6As shown, the upper air blowing pipe 4 includes an inner tube 91 and an outer tube 92, and at least one exhaust hole 93 is provided on the inner tube 91. As a specific embodiment, four exhaust holes can be evenly distributed at equal angles along the axial direction of the inner tube 91; the outer tube 92 is sleeved on the outside of the inner tube 91, and the surface of the outer tube 92 has an exhaust groove 94. There is a gap between the outer tube 92 and the inner tube 91, and the gap is used for gas to flow from the exhaust hole 93 to the exhaust groove 94. The outer tube 92 can rotate relative to the inner tube 91, so that the outer tube 92 can be rotated to adjust the direction of the exhaust groove 94 to adjust the exhaust direction. The structure of the lower air blowing pipe 5 can be the same as the above-mentioned structure of the upper air blowing pipe 4, and will not be repeated.

[0023] Specifically, if Figure 1 As shown, the motor 2 is arranged on the vertical plate 11 of the mounting seat 1, the connecting portion 72 of the induction component 7 is sleeved on the rotating shaft of the motor 2, and the sensor 8 is located below the fan-shaped component 71. The motor 2 can be connected to the rotating shaft 3 through a coupling, and the rotating shaft 3 is connected to the mounting seat 1 through a bearing seat, and the rotating shaft of the motor 2, the coupling, and the rotating shaft 3 are coaxially arranged.

[0024] like Figure 3 As shown, the induction component 7 includes a connecting portion 72, and the connecting portion 72 is mounted on the rotating shaft of the motor 2. The connecting portion 72 is provided with a fan-shaped component 71, and the fan-shaped component 71 is used to cooperate with the sensor 8 to limit the rotation range of the motor 2. The sensor 8 can be arranged on the motor 2, or on the bracket 12 for fixing the motor 2, and is located below the fan-shaped component 71 to ensure that it can work in coordination with the fan-shaped component 71.

[0025] like Figure 2 As shown, the bracket 12 is installed in the long strip hole set in the vertical plate 11, so that its position can be adjusted up and down on the vertical plate 11, thereby adjusting the position of the motor 2. The position change of the motor 2 brings about the effect of changing the position of the upper blowing pipe 4 and the lower blowing pipe 5, which can adapt to mold cleaning work at different heights.

[0026] The gas connector 6 is connected to an external gas source, and a solenoid valve can be arranged between the external gas source and the gas connector 6 to adjust the gas on and off.

[0027] The motor 2, the solenoid valve, and the sensor 8 can be connected to the electronic control device, which can provide functions such as power supply, signal disconnection, and motor rotation speed control. As a specific implementation scheme, the power supply can be to provide a DC 24V to the solenoid valve and provide the power required for the motor to run. The signal disconnection is the electronic control device using PLC to control the on and off of the solenoid valve. When the upper air blowing pipe 4 and the lower air blowing pipe 5 are working, the electronic control device controls the motor 2 to work, and at the same time, the solenoid valve is energized to allow the external air source to supply air to the upper air blowing pipe 4 and the lower air blowing pipe 5. The upper air blowing pipe 4 and the lower air blowing pipe 5 supply air and rotate to enter the mold at the same time, and the upper and lower mold surfaces are blown and cleaned. The rotation position is determined by the position signal of the fan-shaped component 71 detected by the sensor 8. When the rotating shaft of the motor 2 rotates the range of the complete fan-shaped component 71, the cleaning is completed, and the electronic control device controls the motor 2 to rotate in the opposite direction. After the upper air blowing pipe 4 and the lower air blowing pipe 5 supply air to return to the initial position, the work is completed. Among them, the speed regulating device that controls the signal disconnection and the motor speed, and the control of the motor steering and the control of the sensor 8 can all be the PLC controller in the electronic control device.

[0028] When the utility model is in use, the upper air blowing pipe 4 and the lower air blowing pipe 5 are pre-set on the outside between the upper and lower molds of the mold to be cleaned. When the mold is opened after work, the upper and lower molds are separated. At this time, the device of the utility model controls the motor 2 to work through the electric control device, so that the upper air blowing pipe 4 and the lower air blowing pipe 5 rotate and enter between the upper and lower molds. At the same time, the external air source works, the solenoid valve is opened, and the upper air blowing pipe 4 and the lower air blowing pipe 5 blow air to the upper and lower molds respectively. At the same time, the motor 2 drives the upper air blowing pipe 4 and the lower air blowing pipe 5 to rotate between the upper and lower molds until the sensor 8 detects that the fan-shaped component 71 rotates to the limit position. The sensor 8 gives a signal, and the electric control device controls the motor 2 to rotate in the opposite direction through the PLC controller. After reaching the initial position, the air blowing cleaning work is completed. By controlling the opening of the solenoid valve, the size of the air blowing volume can be adjusted.

Claims

1. A semiconductor plastic packaging mold cleaning device, characterized in that: It comprises a mounting seat, on which a motor is arranged, the rotating shaft of the motor is connected to a rotating shaft, on which an upper air blowing pipe and a lower air blowing pipe are arranged, and air joints are respectively arranged on the upper air blowing pipe and the lower air blowing pipe.

2. A semiconductor plastic packaging mold cleaning device according to claim 1, characterized in that: The motor shaft is provided with an induction component, and the induction component cooperates with the sensor.

3. A semiconductor plastic packaging mold cleaning device according to claim 2, characterized in that: The induction component comprises a fan-shaped component, the fan-shaped component is connected to the rotating shaft of the motor, and the sensor cooperates with the fan-shaped component.

4. A semiconductor plastic packaging mold cleaning device according to claim 2 or 3, characterized in that: The sensor is a photoelectric switch.

5. The semiconductor plastic packaging mold cleaning device according to claim 1, characterized in that: Also includes an electronic control device.

6. A semiconductor plastic packaging mold cleaning device according to claim 5, characterized in that: The electronic control device comprises a speed regulating device for adjusting the rotation speed of the electric motor.

7. A semiconductor plastic packaging mold cleaning device according to claim 1, characterized in that: The upper air blowing pipe and the lower air blowing pipe both include an inner pipe and an outer pipe, the inner pipe is provided with at least one exhaust hole, the outer pipe is sleeved on the outer side of the inner pipe, there is a gap between the outer pipe and the inner pipe, and the surface of the outer pipe has an exhaust groove.

8. A semiconductor plastic packaging mold cleaning device according to claim 7, characterized in that: The outer tube is rotatable relative to the inner tube.

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