Film tearing device for camera module

Abstract

The embodiment of the utility model provides a film tearing device for a camera module, relates to the technical field of camera module jigs, and is convenient for assisting an operator to improve the film tearing efficiency. Comprising a material clamping mechanism which comprises a clamping piece capable of moving in the preset direction and used for clamping PCBA; the film tearing mechanism is located below the material clamping mechanism and comprises a machine frame, a film tearing adhesive tape installation wheel, a first guide wheel set, a film tearing jacking buffering cushion block and an adhesive tape traction piece, and the film tearing adhesive tape installation wheel, the first guide wheel set, the film tearing jacking buffering cushion block and the adhesive tape traction piece are installed on the machine frame. The free end of the film tearing adhesive tape sequentially passes through the first guide wheel set and the upper surface of the film tearing jacking buffering cushion block and extends forwards to be tensioned to the adhesive tape traction piece. And the clamping piece clamping the PCBA moves to the position over the film tearing jacking buffer cushion block to be pressed downwards, so that a film on the surface of the PCBA is adhered to the film tearing adhesive tape passing through the upper surface of the film tearing jacking buffer cushion block, and the film is torn away from the surface of the PCBA under the action of lifting pulling force of the clamping piece.

Description

Technical Field

[0001] The present application relates to the technical field of camera module jigs, and in particular to a film tearing device used in camera modules. Background Art

[0002] With the continuous development of industrial manufacturing automation and intelligence, the demand for automation and replacing traditional manual operations has become an urgent need in the manufacturing industry. Especially in the field of precision manufacturing, such as the production of vehicle-mounted camera modules, the demand for improving efficiency and reducing labor costs is growing.

[0003] In the manufacturing process of vehicle-mounted camera modules, the sensor protective film on the PCBA (Printed Circuit Board Assembly, a printed circuit board that has been soldered and assembled with electronic components and devices) is usually removed by manual film tearing. The operator uses tweezers to clamp a corner of the protective film and pull it up to tear it off, which is inefficient. Utility Model Content

[0004] The utility model aims to provide a film-tearing device for a camera module, which is convenient for assisting operators to improve the film-tearing efficiency.

[0005] In order to achieve the above-mentioned invention object, the utility model provides the following technical solutions:

[0006] A film tearing device, comprising: a material clamping mechanism and a film tearing mechanism; wherein:

[0007] The material clamping mechanism comprises: a clamping member movable in a predetermined direction for clamping the PCBA;

[0008] The film tearing mechanism is located below the material clamping mechanism, and includes: a frame, film tearing tape installation wheels respectively installed on the frame, a first guide wheel group, a film tearing lifting buffer pad and a tape pulling piece, wherein a film tearing tape is installed on the film tearing tape installation wheel, and the free end of the film tearing tape passes through the first guide wheel group and the upper surface of the film tearing lifting buffer pad in sequence, and extends forward to be tensioned on the tape pulling piece;

[0009] The clamping member holding the PCBA is moved to the top of the film tearing and lifting buffer block and pressed down, so that the film on the surface of the PCBA is adhered to the film tearing tape passing through the upper surface of the film tearing and lifting buffer block, and is torn off the PCBA surface under the lifting and pulling force of the clamping member.

[0010] Optionally, the tape pulling member includes: a waste film recovery driving wheel installed on the frame, and the film tearing tape passing through the upper surface of the film tearing lifting buffer pad continues to extend forward and wrap around the circumferential surface of the waste film recovery driving wheel.

[0011] Optionally, the first guide wheel group includes at least one guide wheel, and the at least one guide wheel is located on the path between the film tearing tape installation wheel and the film tearing lifting buffer block; or,

[0012] The first guide wheel group includes at least two guide wheels, and the path formed by the at least two guide wheels and the film tearing lifting buffer pad is roughly in a "V" shape.

[0013] Optionally, the tearing tape installation wheel can be rotatably arranged on the frame, and a braking device is further provided between the tearing tape installation wheel and the first guide wheel group, and the free end of the tearing tape extends from the tearing tape installation wheel, passes through the braking device, and then is wound around the first guide wheel group; or,

[0014] The film-tearing tape installation wheel is a driving wheel capable of achieving braking, and the free end of the film-tearing tape extends from the film-tearing tape installation wheel and is wound around the first guide wheel set.

[0015] Optionally, a second guide wheel group is provided on the frame between the film tearing lifting buffer pad and the waste film recovery driving wheel, and the film tearing tape passing through the upper surface of the film tearing lifting buffer pad continues to extend through the second guide wheel group and is wound around the circumferential surface of the waste film recovery driving wheel.

[0016] Optionally, the second guide wheel set includes at least one guide wheel.

[0017] Optionally, a pressure sensor and a displacement sensor are provided on the film tearing lifting buffer block.

[0018] Optionally, the film tearing device further comprises: a laser mechanism and a flipping and positioning mechanism;

[0019] The laser mechanism is located on the side of the material clamping mechanism and the film tearing mechanism, and includes: a lifting module, a laser module installed on the lifting module, and the laser module includes a laser generator and a laser probe arranged at the end of the laser generator;

[0020] The flip positioning mechanism is located below the laser module and is slidably arranged between the laser mechanism and the film tearing mechanism, and comprises: a flip lifting module and a flip lifting platform located on the top of the flip lifting module, and a PCBA placement position is arranged on the flip lifting platform.

[0021] Optionally, a position switch for triggering the laser mechanism to emit a laser beam is provided on the sliding path of the flip positioning mechanism.

[0022] Optionally, the PCBA placement position is a placement groove with two ends open, and the groove wall length of the placement groove is smaller than the length dimension of the PCBA;

[0023] The flip positioning mechanism also includes: a flip clamp located above the flip lifting platform and a flip cylinder connected to the flip clamp and used to drive the flip clamp to work. The flip clamp is arranged correspondingly above and below the placement groove.

[0024] The film-tearing device for the camera module provided by the embodiment of the utility model cooperates with the material clamping mechanism and the film-tearing mechanism. When it is necessary to tear off the film on the surface of the PCBA, the material clamping mechanism is used to clamp the PCBA, and the film-tearing mechanism is moved along the slide rail to the position of the film-tearing lifting buffer block corresponding to the film-tearing lifting buffer block, so that the film on the surface of the PCBA is attached to the film-tearing tape on the upper surface of the film-tearing lifting buffer block, and the film-tearing tape is pulled and tensioned by the tape pulling member, and is torn off the PCBA surface under the lifting force of the clamping member, so as to realize automatic and rapid film-tearing. Therefore, it is convenient for the auxiliary operator to improve the efficiency of film-tearing, and the quality of film-tearing can be guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0026] Figure 1 This is a structural schematic diagram of a film-tearing device for a camera module according to an embodiment of the present application;

[0027] Figure 2 This is a structural schematic diagram of a film tearing mechanism according to an embodiment of the present application;

[0028] Figure 3 This is a structural schematic diagram of a film tearing mechanism according to another embodiment of the present application;

[0029] Figure 4 This is a structural schematic diagram of a film-tearing device for a camera module according to another embodiment of the present application;

[0030] Figure 5 for Figure 1 A front view of an embodiment of a material clamping mechanism;

[0031] Figure 6 for Figure 1 and Figure 5 A left view of an embodiment of a material clamping mechanism;

[0032] Figure 7 for Figure 1 A front view of an embodiment of a middle flip positioning mechanism;

[0033] Figure 8 for Figure 1 or Figure 7 A right side view of an embodiment of a middle flip positioning mechanism;

[0034] Fig. 9 for Figure 1 A schematic diagram of the structure of an embodiment of a laser mechanism;

[0035] Fig.10 for Figure 1 A schematic diagram of the structure of the middle flip positioning mechanism located at the laser position point of the laser mechanism;

[0036] Fig.11 for Figure 1 A top view of an embodiment of a middle flip positioning mechanism. DETAILED DESCRIPTION

[0037] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0038] In the following description of the embodiments of the present invention, the drawings used in the description of each embodiment may sometimes display the components in different scales in order to clearly display the components in the drawings. Therefore, in the present invention, the number, shape, size ratio of the components recorded in these drawings, as well as the relative position relationship of the components, the mutual position or connection relationship of the components are not limited to the form shown in the drawings.

[0039] See also Figures 1 to 4 The film-tearing device 100 for a camera module provided in the embodiment of the utility model is used for the process of tearing off the protective film of the camera module in the camera module manufacturing process, especially for tearing off the protective film of the vehicle-mounted camera module. The film-tearing device 100 includes: a material clamping mechanism 10 and a film-tearing mechanism 20.

[0040] The material clamping mechanism 10 includes: a clamping member 11 movable along a predetermined direction for clamping the PCBA; Figure 5 and Figure 6In some embodiments, the material gripping mechanism 10 can be a three-axis manipulator. Of course, it can also be a four-axis, five-axis or six-axis manipulator according to the task requirements, which is responsible for gripping the PCBA and moving it to the required position. Specifically, the three-axis manipulator mainly drives the screw module through a motor drive to achieve the purpose of mobile positioning. The three-axis manipulator in this device is a traditional mode, and the control of the spatial coordinate X / Y / Z position is achieved through three motor modules in the X direction, Y direction and Z direction. The main function of the three-axis manipulator is to pick up and place the product PCBA. The gripper of the three-axis manipulator adapts to the PCBA structure setting to effectively avoid the components on the PCBA to achieve picking, placing, and movement.

[0041] The film-tearing mechanism 20 is located below the material clamping mechanism 10 and is responsible for peeling the PCBA protective film from the surface of the PCBA. The film-tearing mechanism 20 mainly uses the adhesive tape bonding method to stick and tear off the PCBA protective film. It includes: a frame 21, film-tearing tape mounting wheels 22, a first guide wheel group 23, a film-tearing lifting buffer pad 24 and a tape pulling member respectively installed on the frame 21. A film-tearing tape 26 is installed on the film-tearing tape mounting wheel 22. The free end of the film-tearing tape 26 passes through the first guide wheel group 23 and the upper surface of the film-tearing lifting buffer pad 24 in turn, and extends forward to be tensioned on the tape pulling member; wherein the tape pulling member is used to play the role of pulling and tensioning the film-tearing tape 26. When the clamping member 11 is lifted up to separate the film from the PCBA surface, the tape pulling member mainly plays the role of limiting the tension of the film tearing tape, so as to prevent the film tearing tape from being pulled up together and causing the film tearing failure during the process of lifting the clamping member to tear the film. The tape pulling member can limit the tearing tape and improve the success rate of film tearing.

[0042] The clamping member 11 holding the PCBA is moved to the top of the film tearing lifting buffer block 24 and pressed down, so that the film on the surface of the PCBA is adhered to the film tearing tape 26 passing through the upper surface of the film tearing lifting buffer block 24, and is torn off the PCBA surface under the action of the lifting force of the clamping member.

[0043] The film-tearing tape 26 can be a common tape, or a tape with relatively strong viscosity such as 3M tape.

[0044] The film-tearing device 100 for the camera module provided by the embodiment of the utility model cooperates with the material clamping mechanism 10 and the film-tearing mechanism 20. When it is necessary to tear off the film on the surface of the PCBA, the material clamping mechanism 10 is used to clamp the PCBA, and move along the slide rail to the position of the film-tearing mechanism 20 corresponding to the film-tearing lifting buffer pad 24 and press down, so that the film on the surface of the PCBA is attached to the film-tearing tape 26 on the upper surface of the film-tearing lifting buffer pad 24, and the film-tearing tape is pulled and tensioned by the tape pulling member, and is torn off the PCBA surface under the lifting force of the clamping member 11, so as to realize automatic and rapid film-tearing. Therefore, it is convenient for the auxiliary operator to improve the efficiency of film-tearing, and the quality of film-tearing can be guaranteed.

[0045] Please see Figure 2 In some embodiments, the first guide wheel group 23 includes at least one guide wheel, and the at least one guide wheel is located on the path between the film tearing tape installation wheel 22 and the film tearing lifting buffer pad 24.

[0046] In this embodiment, the film tearing tape 26 is transmitted as follows: after coming out from the supply end, the film tearing tape 26 passes through the at least one guide wheel and extends to the film tearing lifting buffer pad 24, and completes the separation of the protective film and the PCBA surface under the lifting force of the clamping member 11.

[0047] During the process of lifting the clamping member 11 to tear off the film, the free end of the film-tearing tape needs to be pulled by a pulling and tensioning member to keep its position fixed.

[0048] In order to further improve the automation of film tearing, after the film tearing is completed, the torn protective film is removed from the upper surface of the film tearing lifting buffer pad to facilitate the next film tearing operation. Referring to 2 and 3, in some embodiments, the film tearing mechanism also includes: a waste film recovery driving wheel 25 installed on the frame, and the film tearing tape extending to the upper surface of the film tearing lifting buffer pad 24 continues to extend and wrap around the circumferential surface of the waste film recovery driving wheel 25. In this way, after a PCBA film tearing is completed, the film tearing tape with the protective film is pulled forward by the waste film recovery driving wheel 25, and the film tearing tape is wrapped around the circumferential surface of the waste film recovery driving wheel 25 for recovery, and a new section of the film tearing tape is pulled to the upper surface of the film tearing lifting buffer pad to facilitate the film tearing process of the next product.

[0049] Please see Figure 3 and Figure 4 In some other embodiments, the first guide wheel group 23 includes at least two guide wheels, and the path formed by the at least two guide wheels and the film tearing lifting buffer block 24 is roughly in a "V" shape.

[0050] In this embodiment, at least two guide wheels can be used to form the first guide wheel group 23. By adding at least one guide wheel, the restriction and traction on the movement of the film tearing tape 26 are strengthened, which can prevent the tape from being pulled off during the tearing process of the protective film. The film tearing effect is better than that of the previous embodiment.

[0051] In some embodiments, the film-tearing tape installation wheel 22 is a driving wheel capable of achieving braking, and the free end of the film-tearing tape 26 extends from the film-tearing tape installation wheel 22 and is wound around the first guide wheel set 23 .

[0052] In this embodiment, the belt transmission and braking are achieved by dual motors at the supply end and the recovery end.

[0053] Continue to view Figure 4 In some other embodiments, the film tearing tape mounting wheel 22 can be rotatably set on the frame 21, and a braking device 27 is also provided between the film tearing tape mounting wheel 22 and the first guide wheel group 23. Optionally, the braking device 27 is a magnetic powder brake; the free end of the film tearing tape 26 extends from the film tearing tape mounting wheel 22, passes through the braking device 27, and then is wound around the first guide wheel group 23.

[0054] In this embodiment, the motor of the waste film recovery driving wheel 25 rotates, and after the protective tear film tape is torn off, the magnetic powder brake is in a relaxed state, and the waste film recovery driving wheel 25 can drive the tape to continue conveying. After the conveying is completed, click to stop the rotation, and at the same time, the magnetic powder brake is powered on and changes from a relaxed state to a locked state. The tear film tape 26 is driven by the motor of the waste film recovery driving wheel 25, and the tape supply end is braked by the magnetic powder brake. Compared with the aforementioned dual-motor implementation structure, the cost is lower.

[0055] In order to improve the film tearing effect of the film tearing tape 26, in some embodiments, a second guide wheel group 28 is further provided on the frame 21 between the film tearing lifting buffer block 24 and the waste film recovery driving wheel 25. The film tearing tape 26 passing through the upper surface of the film tearing lifting buffer block 24 continues to extend and wrap around the circumferential surface of the waste film recovery driving wheel 25 through the second guide wheel group 28.

[0056] Specifically, the second guide wheel group 28 includes at least one guide wheel. For example, it can be a guide wheel such as Figure 2 As shown. It can also be two guide wheels, or in order to enhance the traction of the tape transmission, ensure that the tape is transmitted along a predetermined track, and improve the success rate of film tearing, three guide wheels are set, such as Figure 4 shown.

[0057] See also Figure 4 ,by Figure 4Taking an embodiment as an example, the working principle of the utility model is explained as follows: when installing the tape of the film tearing device 100, first unscrew the film tearing tape installation wheel 22 in a counterclockwise direction and install the tape. The direction of the free end of the tape extending out is shown by the "→" symbol in the figure. The sticky surface of the tape should be installed horizontally downward. The tape is installed and passes through the magnetic powder brake, the first guide wheel group 23, the film tearing lifting buffer pad 24, and the second guide wheel group 28 in sequence, and then is wound onto the waste film recovery drive wheel 25.

[0058] When the PCBA is clamped by the material clamping mechanism 10 to just above the film tearing lifting buffer block 24 and pressed downward, the protective film on the surface of the PCBA contacts the sticky surface of the film tearing tape, and the protective film is pasted and torn off from the surface of the PCBA by the stickiness of the tape. Then, the film tearing tape 26 is driven by the motor of the waste film recovery driving wheel 25 to roll and convey forward. The torn PCBA protective film is conveyed together with the tape and wound onto the circumferential surface of the waste film recovery driving wheel 25. When the tape is used up, the recycled PCBA protective film can be removed from the waste film recovery driving wheel 25.

[0059] In some embodiments, the film tearing lifting buffer block 24 is provided with a pressure sensor and a displacement sensor.

[0060] It is understandable that during the film tearing process of PCBA, the material clamping mechanism 10 is first controlled, for example, the X / Y position of the three-axis manipulator is directly above the film tearing lifting buffer block 24. At this time, the PCBA protective film must be completely within the projection range of the film tearing lifting buffer block 24, and then the Z axis of the three-axis manipulator is controlled to descend, gradually contacting the film tearing tape 26 on the upper surface of the film tearing lifting buffer block 24, and ensuring that the film tearing tape 26 can cover the PCBA protective film. At this time, the displacement sensor and pressure sensor are used to monitor the downward pressure of the three-axis manipulator to ensure the film tearing effect. Among them, when the film tearing lifting buffer block 24 is not in contact with the PCBA at the lower end of the three-axis manipulator, the value of the pressure sensor should be zero.

[0061] It is understandable that during the film tearing process, the camera module, specifically the protective film of the sensor, will directly contact the buffer block of the film tearing device 100, so it will exert a certain pressure on the sensor. Since the sensor is very fragile, it is necessary to monitor the pressure of contact with the sensor. Therefore, by providing a displacement sensor 241 and a pressure sensor 242 on the film tearing lifting buffer block 24, the displacement and pressure data during the film tearing contact process are output in real time and monitored, which can avoid damage to the sensor during the film tearing process.

[0062] In addition, the lifting block in direct contact with the product sensor is set as a film tearing lifting buffer pad 24, which has sufficient buffering effect while ensuring the normal conveying of the tape. Specifically, the film tearing lifting buffer pad 24 realizes downward pressure buffering through a compression spring, and the displacement sensor realizes position detection during the compression process of the compression spring.

[0063] Continue to view Figure 1 , the film tearing device 100 also includes: a laser mechanism 30 and a flip positioning mechanism 40;

[0064] See also Fig. 9 The laser mechanism 30 is located on the side of the material clamping mechanism 10 and the film tearing mechanism 20, and includes: a lifting module 31, a laser module 32 installed on the lifting module 31, and the laser module 32 includes a laser generator 321 and a laser probe 322 arranged at the end of the laser generator 321; if only the tape is used to stick the protective film to the PCBA, and then the film is torn off by pulling force, the success efficiency of film tearing may be affected. According to research findings: the failure of sticking and tearing off with tape is correlated with the smoothness of the protective film surface, and the protective film is resistant to tape.

[0065] To solve the above problem, the surface of the protective film needs to be roughened. Experimental verification shows that surface treatment using a cold light source, LED laser, can increase the surface roughness of the protective film, thereby ensuring the success rate of film tearing. In order to improve the success rate of film tearing of the film tearing device 100, in this embodiment, a laser mechanism 30 is provided to implement cold light irradiation to increase the roughness of the protective film, and combined with the transmission movement and tensioning cooperation of the strong adhesive tape, the protective film of the camera module can be effectively removed, thereby greatly improving the success rate of film tearing.

[0066] like Figure 1 , Figure 7 , Figure 8 and Fig.10 As shown, the flip positioning mechanism 40 is located below the laser module 32 and is slidably arranged between the laser mechanism 30 and the film tearing mechanism 20, including: a flip lifting module 41 and a flip lifting platform 42 located on the top of the flip lifting module 41, and a PCBA placement position 43 is provided on the flip lifting platform 42.

[0067] In this embodiment, the flipping and positioning mechanism 40 is responsible for positioning and flipping the PCBA. First, the PCBA clamped by the material clamping mechanism 10 is placed in the PCBA placement position 43, then flipped and positioned, and then driven by a cylinder or the like to slide to the laser point position of the laser probe 322 for protective film laser. After the laser is completed, it is flipped 180 degrees. After flipping, the PCBA faces downward, which is convenient for the subsequent film tearing tape 26 to stick and tear the film.

[0068] In some embodiments, a position switch for triggering the laser mechanism 30 to emit a laser beam is provided on the sliding path of the flip positioning mechanism 40. Thus, when the flip positioning mechanism 40 slides to the laser point position, the position switch can automatically trigger the laser mechanism 30 to laser the PCBA in the placement position of the flip positioning mechanism 40.

[0069] Among them, the laser mechanism 30 starts lasering when receiving the signal that the flip and transverse cylinder 46 is in place. The coverage of the laser is defined according to the size of the product (PCBA). Technical personnel in this field can determine the laser coverage area as needed. Generally, the laser coverage area must be greater than 60% and less than 90% of the protective film area.

[0070] The height of the laser head from the PCBA surface can be achieved by adjusting the height of the laser generator 321 by adjusting the height adjustment valve above the laser lifting module 31 so that the laser is at an appropriate height from the product surface.

[0071] In some embodiments, the PCBA placement position 43 is a placement slot with open ends, and the length of the slot wall of the placement slot is smaller than the length dimension of the PCBA; when the PCBA is placed in the placement slot, the length direction of the PCBA is consistent with the length direction of the slot wall, and the two ends of the PCBA extend out from the open ends of the placement slot.

[0072] Continue to view Figure 7 , Figure 8 and Fig.11 The flip positioning mechanism 40 also includes: a flip clamp 44 located above the flip lifting platform 42 and a flip cylinder 45 connected to the flip clamp 44 and used to drive the flip clamp 44 to work, and the flip clamp 44 is arranged corresponding to the upper and lower parts of the placement groove.

[0073] When the PCBA is placed horizontally in the placement slot, the length direction of the PCBA is placed in line with the length direction of the slot wall, and the two ends of the PCBA extend out of the open end of the placement slot. At this time, the front side of the PCBA (the side with electronic components installed) faces upward, and the flip cylinder 45 drives the flip clamp 44 to clamp the PCBA, and the flip lifting platform descends (the initial state is the lifting state). Driven by the flip transverse cylinder 46, the flip positioning mechanism as a whole moves transversely toward the laser mechanism. When it moves to the laser point of the laser mechanism, after the laser mechanism performs laser treatment on the protective film on the front side of the PCBA, it moves back to its original position. The flip cylinder 45 rotates 180° in a predetermined direction, driving the flip clamp 44 to flip accordingly, so that the front side of the PCBA is set downward. Afterwards, the material clamping mechanism 10 takes the PCBA to the top of the film tearing mechanism for film tearing.

[0074] In addition, in order to facilitate the installation of the PCBA in the placement slot, the accommodation space formed between the two side walls of the placement slot is a structure that is wide at the top and narrow at the bottom. Specifically, there is a gap between the PCBA and the two side walls of the placement slot. The setting of the gap is mainly to facilitate the placement of the product. After the PCBA is placed in the placement slot, the product can be initially positioned without a large deviation.

[0075] Generally, the traditional manual film tearing method is to use tweezers to clamp and pull up a corner of the protective film. This film tearing method requires manpower, which increases the manpower input cost and is also extremely inefficient. In addition, in the camera module assembly workshop, the exposed sensor is very easy to be contaminated by dust in the air, so the dust needs to be strictly controlled. The manual tearing action cannot effectively control the risk of dust falling.

[0076] The film-tearing device 100 for a camera module provided in the embodiment of the present invention realizes automatic film-tearing and improves the efficiency of film-tearing by designing a replaceable mechanical device to perform a tearing action.

[0077] Furthermore, the film tearing device 100 is improved, for example, including a laser mechanism 30, matched with a laser probe 322, to facilitate the implementation of the surface roughening operation of the sensor protective film, so that the protective film can be adhered to the tape and then torn off, so as to achieve a better tearing effect.

[0078] It should be noted that the specific movement and clamping implementation method of the material clamping mechanism 10, the lateral movement and flipping implementation method of the flipping and positioning mechanism 40, the translation of the laser mechanism 30 and the adjustment of the height position of the laser generator 321, etc. in the present application are technologies well known in the art. In order to highlight that the innovative purpose of the present application is the improvement of the device structure, the procedural implementation method of the movement of the above-mentioned components will no longer be described in detail in the text, but this does not affect the feasibility of the present application.

[0079] It should be noted that, in this article, the terms "upper", "lower" and other terms indicating orientation or positional relationship are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the utility model. Unless otherwise clearly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. Relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply that there is any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of more restrictions, the elements defined by the phrase "comprising a ..." do not exclude the existence of other identical elements in the process, method, article or device comprising the elements. For ordinary technicians in this field, it can be understood by specific circumstances.

[0080] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A film-tearing device for a camera module, characterized in that: The film tearing device comprises: a material clamping mechanism and a film tearing mechanism; The material clamping mechanism comprises: a clamping member movable along a predetermined direction for clamping the PCBA; The film-tearing mechanism is located below the material clamping mechanism and includes: a frame, film-tearing tape installation wheels, a first guide wheel group, a film-tearing lifting buffer pad, and a tape pulling piece respectively installed on the frame. The film-tearing tape installation wheel is installed with a film-tearing tape, and the free end of the film-tearing tape passes through the first guide wheel group and the upper surface of the film-tearing lifting buffer pad in sequence, and extends forward to be tensioned on the tape pulling piece; The clamping member holding the PCBA is moved to the top of the film tearing and lifting buffer block and pressed down, so that the film on the surface of the PCBA is adhered to the film tearing tape passing through the upper surface of the film tearing and lifting buffer block, and is torn off the PCBA surface under the lifting and pulling force of the clamping member.

2. The film-tearing device for a camera module according to claim 1, characterized in that: The tape pulling member comprises: a waste film recovery driving wheel installed on the frame, and the film tearing tape passing through the upper surface of the film tearing lifting buffer pad continues to extend forward and wrap around the circumferential surface of the waste film recovery driving wheel.

3. The film-tearing device for a camera module according to claim 1 or 2, characterized in that: The first guide wheel group includes at least one guide wheel, and the at least one guide wheel is located on the path between the film tearing tape installation wheel and the film tearing lifting buffer pad; or, The first guide wheel group includes at least two guide wheels, and the path formed by the at least two guide wheels and the film tearing lifting buffer block is roughly in a "V" shape.

4. The film-tearing device for a camera module according to claim 3, characterized in that: The tearing tape installation wheel is rotatably arranged on the frame, and a brake device is also arranged between the tearing tape installation wheel and the first guide wheel group, and the free end of the tearing tape extends from the tearing tape installation wheel, passes through the brake device, and then winds around the first guide wheel group; or, The film-tearing tape installation wheel is a driving wheel capable of achieving braking, and the free end of the film-tearing tape extends from the film-tearing tape installation wheel and is wound around the first guide wheel set.

5. The film-tearing device for a camera module according to claim 2, characterized in that: A second guide wheel group is also provided on the frame between the film tearing lifting buffer pad and the waste film recovery driving wheel. The film tearing tape on the upper surface of the film tearing lifting buffer pad continues to extend through the second guide wheel group and is wound around the circumferential surface of the waste film recovery driving wheel.

6. The film-tearing device for a camera module according to claim 5, characterized in that: The second guide wheel set includes at least one guide wheel.

7. The film tearing device according to claim 1, characterized in that: The film tearing lifting buffer block is provided with a pressure sensor and a displacement sensor.

8. The film-tearing device for a camera module according to claim 1, characterized in that: The film tearing device also includes: a laser mechanism and a flipping and positioning mechanism; The laser mechanism is located on the side of the material clamping mechanism and the film tearing mechanism, and includes: a lifting module, a laser module installed on the lifting module, and the laser module includes a laser generator and a laser probe arranged at the end of the laser generator; The flip positioning mechanism is located below the laser module and is slidably arranged between the laser mechanism and the film tearing mechanism, and comprises: a flip lifting module and a flip lifting platform located on the top of the flip lifting module, and a PCBA placement position is arranged on the flip lifting platform.

9. The film-tearing device for a camera module according to claim 8, characterized in that: A position switch for triggering the laser mechanism to emit a laser beam is provided on the sliding path of the flip positioning mechanism.

10. The film-tearing device for a camera module according to claim 8, characterized in that: The PCBA placement position is a placement groove with two ends open, and the groove wall length of the placement groove is smaller than the length dimension of the PCBA; The flip positioning mechanism also includes: a flip clamp located above the flip lifting platform and a flip cylinder connected to the flip clamp and used to drive the flip clamp to work. The flip clamp is arranged correspondingly above and below the placement groove.

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