The invention discloses an automatic PCB (
Printed Circuit Board) high-temperature
adhesive tearing device and an
adhesive tearing process thereof. The automatic PCB high-temperature
adhesive tearing device comprises a double-adhesive tearing mechanism, a first single-adhesive tearing mechanism, a second single-adhesive tearing mechanism, a back surface adhesive tearing mechanism, a
wafer adhesive tearing mechanism and a charging and discharging mechanism, which are arranged in sequence along the outer edge of a rotary table, wherein the rotary table moves to carry out working position switching, so that a charging working position, a double-adhesive tearing working position, a first single-adhesive tearing working position, a second single-adhesive tearing working position, a back surface adhesive tearing working position, a
wafer adhesive tearing working position and a discharging working position on the rotary table are rotated to the double-adhesive tearing mechanism, the first single-adhesive tearing mechanism, the second single-adhesive tearing mechanism, the back surface adhesive tearing mechanism, the
wafer adhesive tearing mechanism and the charging and discharging mechanism in sequence through the charging and discharging mechanism, and furthermore, charging, double-adhesive tearing, first single-adhesive tearing, second single-adhesive tearing, back surface adhesive tearing, wafer adhesive tearing and discharging movements are carried out in sequence. By adopting the automatic PCB high-temperature adhesive tearing device, continuous adhesive tearing is automatically carried out, adhesive tearing
automation and efficiency are effectively improved and the production cost is reduced.