Automatic PCB (Printed Circuit Board) high-temperature adhesive tearing device and adhesive tearing process thereof

A technology of PCB board and high temperature glue, applied in the field of automation, can solve the problems of high labor cost, low glue tearing efficiency, and difficulty in tearing high temperature glue

Active Publication Date: 2017-02-22
SHENZHEN XING GRAIN AUTOMATION CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Affected by the number of connection holes on the PCB board and the setting position, it is difficult to realize the standardized automatic tearing action through the automatic mechanical structure when tearing the high temperature

Method used

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  • Automatic PCB (Printed Circuit Board) high-temperature adhesive tearing device and adhesive tearing process thereof
  • Automatic PCB (Printed Circuit Board) high-temperature adhesive tearing device and adhesive tearing process thereof
  • Automatic PCB (Printed Circuit Board) high-temperature adhesive tearing device and adhesive tearing process thereof

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Embodiment Construction

[0063] The present invention will be further described below in conjunction with accompanying drawing:

[0064] Such as Figure 1 to Figure 17 As shown, the technical scheme adopted by the present invention is as follows: a device for automatically tearing PCB board high-temperature glue, including a working platform 1 and a material belt 2, and the material belt 2 is arranged on the side of the working platform 1, so that the product A is transported in a straight line, and the working There is a turntable 4 on the platform 1, and the product A on the material belt 2 is transferred to the turntable 4, so as to tear off the high-temperature glue on the product A. It also includes a double-sheet adhesive tearing mechanism 5 and a first tearing mechanism arranged along the outer edge of the turntable 4. Single-sheet glue mechanism 6, the second single-sheet glue tearing mechanism 7, the back glue tearing mechanism 8, the disc glue tearing mechanism 9 and the loading and unloadin...

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PUM

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Abstract

The invention discloses an automatic PCB (Printed Circuit Board) high-temperature adhesive tearing device and an adhesive tearing process thereof. The automatic PCB high-temperature adhesive tearing device comprises a double-adhesive tearing mechanism, a first single-adhesive tearing mechanism, a second single-adhesive tearing mechanism, a back surface adhesive tearing mechanism, a wafer adhesive tearing mechanism and a charging and discharging mechanism, which are arranged in sequence along the outer edge of a rotary table, wherein the rotary table moves to carry out working position switching, so that a charging working position, a double-adhesive tearing working position, a first single-adhesive tearing working position, a second single-adhesive tearing working position, a back surface adhesive tearing working position, a wafer adhesive tearing working position and a discharging working position on the rotary table are rotated to the double-adhesive tearing mechanism, the first single-adhesive tearing mechanism, the second single-adhesive tearing mechanism, the back surface adhesive tearing mechanism, the wafer adhesive tearing mechanism and the charging and discharging mechanism in sequence through the charging and discharging mechanism, and furthermore, charging, double-adhesive tearing, first single-adhesive tearing, second single-adhesive tearing, back surface adhesive tearing, wafer adhesive tearing and discharging movements are carried out in sequence. By adopting the automatic PCB high-temperature adhesive tearing device, continuous adhesive tearing is automatically carried out, adhesive tearing automation and efficiency are effectively improved and the production cost is reduced.

Description

technical field [0001] The invention relates to the field of automation, in particular to an automatic high-temperature glue tearing device for PCB boards and a glue tearing process thereof. Background technique [0002] Automation refers to the process in which machines or devices are automatically operated or controlled according to predetermined procedures or instructions without human intervention, while mechanical automation is the process in which machines or devices are automatically controlled by mechanical means. In the electronics industry, the PCB board is an important component. It integrates the entire circuit control system and various functional modules of the product, and is the carrier for product function realization; Carry out the dipping operation so that the insulating glue covers the surface of the PCB board to form an insulating effect; since there are generally multiple connection holes on the PCB board, the inside of the connection hole is a conducti...

Claims

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Application Information

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IPC IPC(8): H05K3/28
CPCH05K3/288Y02W30/82
Inventor 杨凯宾兴章胜华刘校华
Owner SHENZHEN XING GRAIN AUTOMATION CO LTD
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