Chip test transmission module and test equipment

Abstract

The utility model discloses a chip test transmission module and test equipment, and relates to the technical field of chip test. The chip test transmission module comprises a supporting frame, a horizontal direction driving mechanism, at least two vertical direction driving mechanisms and at least two suction nozzle supporting plates, a horizontal guide mechanism and a vertical guide mechanism are arranged on the supporting frame, and the horizontal direction driving mechanism and the vertical direction driving mechanism are both arranged on the supporting frame. Each suction nozzle supporting plate is in driving connection with the horizontal direction driving mechanism, the horizontal guide mechanism is in driving connection with the vertical direction driving mechanism, the suction nozzle supporting plates are arranged on the horizontal guide mechanism in a sliding mode, and the horizontal guide mechanism is arranged on the vertical guide mechanism in a sliding mode. According to the utility model, the at least two suction nozzle supporting plates are arranged, and the horizontal direction driving mechanism and the at least two vertical direction driving mechanisms simultaneously drive the plurality of suction nozzle supporting plates, so that the plurality of suction nozzle supporting plates can move synchronously to suck more chips at the same time, and the chip testing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a chip testing transmission module and testing equipment. Background Art

[0002] Chip testing is a testing process used to evaluate chip function and quality, including chip design verification, manufacturing process control, chip device testing, circuit parameter testing, functional testing and reliability testing. Chip testing aims to ensure chip performance, reliability and stability, and reduce chip failure rate. Currently, in the production and testing process of chips, in order to grab multiple chips at a time and improve the transportation efficiency of chips, nozzles are usually installed in rows on nozzle support plates. A nozzle support plate can pick up 16 chips at most for testing at the same time. When a nozzle support plate picks up more than 16 chips at the same time, it is easy to suck unstable, causing some chips to fall and be damaged. However, current testing equipment is usually only equipped with one nozzle support plate, which cannot pick up more chips at the same time, resulting in low chip testing efficiency. Utility Model Content

[0003] The utility model aims to provide a chip test transmission module and a test device to solve the technical problem that the test device in the prior art is usually only provided with one suction nozzle support plate and cannot suck more chips at the same time, resulting in low chip test efficiency.

[0004] The utility model provides a chip test transmission module, comprising a support frame, a horizontal direction driving mechanism, at least two vertical direction driving mechanisms and at least two suction nozzle support plates, the support frame is provided with a horizontal guiding mechanism and a vertical guiding mechanism, the horizontal direction driving mechanism and the vertical direction driving mechanism are both arranged on the support frame, each of the suction nozzle support plates is drivingly connected to the horizontal direction driving mechanism, the horizontal guiding mechanism is drivingly connected to the vertical direction driving mechanism, the suction nozzle support plate is slidably arranged on the horizontal guiding mechanism, and the horizontal guiding mechanism is slidably arranged on the vertical guiding mechanism.

[0005] As described above, the chip test transmission module, the horizontal driving mechanism includes a first driving motor, a first transmission screw and a first nut, the first driving motor is arranged on the support frame, the first transmission screw is horizontally rotatably arranged on the support frame, the first transmission screw is connected to the output end of the first driving motor, the first nut is movably sleeved on the first transmission screw, and the nozzle support plate is connected to the first nut to realize the horizontal movement of the nozzle support plate.

[0006] As described above, the chip testing transmission module, the vertical driving mechanism includes a second driving motor, a second transmission screw and a second nut, the second driving motor is arranged on the support frame, the second transmission screw is vertically rotatably arranged on the support frame, the second transmission screw is connected to the output end of the second driving motor, the second nut is movably sleeved on the second transmission screw, and the horizontal guide mechanism is connected to the second nut to realize the vertical movement of the nozzle support plate.

[0007] As described above, the chip test transmission module, the horizontal guide mechanism includes at least two first guide rails arranged front to back, the vertical guide mechanism includes at least two second guide rails arranged vertically, and a connecting frame is provided on the nozzle support plate, each of the connecting frames is slidably arranged on one of the first guide rails front to back, and each of the first guide rails is slidably arranged on one of the second guide rails up and down.

[0008] As described above, the chip test transmission module has two nozzle support plates and two vertical drive mechanisms. The two vertical drive mechanisms are respectively arranged at the left and right ends of the support frame, and the two nozzle support plates are arranged side by side on the left and right sides.

[0009] In the chip testing transmission module as described above, each of the nozzle support plates is provided with two nozzle trays, and the bottom wall of each of the nozzle trays is provided with a plurality of nozzles arranged in an array.

[0010] In the chip testing transmission module as described above, a vacuum adsorption hole is provided on the bottom wall of the suction nozzle.

[0011] In the chip testing transmission module as described above, the suction nozzle is a flexible suction nozzle.

[0012] In the chip test transmission module as described above, the first transmission screw is arranged horizontally front and back on the support frame.

[0013] The utility model also provides a testing device, comprising the chip testing transmission module as described above.

[0014] Implementing the embodiments of the present utility model will have the following beneficial effects:

[0015] In the utility model, the chip test transmission module includes a support frame, a horizontal driving mechanism, at least two vertical driving mechanisms and at least two nozzle support plates. The support frame is provided with a horizontal guiding mechanism and a vertical guiding mechanism. The horizontal driving mechanism and the vertical driving mechanism are both arranged on the support frame. Each nozzle support plate is connected to the horizontal driving mechanism by driving. The horizontal guiding mechanism is connected to the vertical driving mechanism by driving. The nozzle support plate is slidably arranged on the horizontal guiding mechanism, and the horizontal guiding mechanism is slidably arranged on the vertical guiding mechanism. By arranging at least two nozzle support plates, and the horizontal driving mechanism and at least two vertical driving mechanisms simultaneously drive the multiple nozzle support plates, the multiple nozzle support plates can move synchronously to absorb more chips at the same time, thereby improving the chip test efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a structural schematic diagram of a chip test transmission module according to an exemplary embodiment;

[0018] Figure 2 is a schematic structural diagram of two nozzle support plates according to an exemplary embodiment.

[0019] Among them: 1. support frame; 11. first guide rail; 12. second guide rail; 2. nozzle support plate; 21. nozzle plate; 211. nozzle; 212. vacuum adsorption hole; 3. first drive motor; 4. first transmission screw; 5. second drive motor; 6. second transmission screw. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0023] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0025] See also Figure 1-Figure 2The utility model provides a chip test transmission module, including a support frame 1, a horizontal driving mechanism, at least two vertical driving mechanisms and at least two nozzle support plates 2. The support frame 1 is provided with a horizontal guiding mechanism and a vertical guiding mechanism. The horizontal driving mechanism and the vertical driving mechanism are both arranged on the support frame 1. Each nozzle support plate 2 is connected to the horizontal driving mechanism by driving, and the horizontal guiding mechanism is connected to the vertical driving mechanism by driving. The nozzle support plate 2 is slidably arranged on the horizontal guiding mechanism, and the horizontal guiding mechanism is slidably arranged on the vertical guiding mechanism. By arranging at least two nozzle support plates 2, and the horizontal driving mechanism and at least two vertical driving mechanisms simultaneously drive multiple nozzle support plates 2, multiple nozzle support plates 2 can be moved synchronously to absorb more chips at the same time, thereby improving chip testing efficiency.

[0026] It should be noted that the multiple vertical driving mechanisms are started and stopped synchronously, and can drive different nozzle support plates 2 to move synchronously in the vertical direction.

[0027] Further, the horizontal driving mechanism includes a first driving motor 3, a first transmission screw 4 and a first nut, the first driving motor 3 is arranged on the support frame 1, the first transmission screw 4 is horizontally rotatably arranged on the support frame 1, the first transmission screw 4 is connected to the output end of the first driving motor 3, the first nut is movably sleeved on the first transmission screw 4, and the nozzle support plate 2 is connected to the first nut to realize the horizontal movement of the nozzle support plate 2. Specifically, the horizontal driving mechanism also includes a first synchronous belt, a first gear is provided on the output shaft of the first driving motor 3, a second gear is provided on the first transmission screw 4, and the two ends of the first synchronous belt are respectively sleeved on the first gear and the second gear, so that the first driving motor 3 drives the first transmission screw 4 to rotate, and during the rotation of the first transmission screw 4, the first nut drives the nozzle support plate 2 to move on the first transmission screw 4.

[0028] Furthermore, the first transmission screw rod 4 is arranged on the support frame 1 in a front-to-back transverse direction, so that the nozzle support plate 2 can move forward and backward.

[0029] Further, the vertical driving mechanism includes a second driving motor 5, a second transmission screw 6 and a second nut. The second driving motor 5 is arranged on the support frame 1. The second transmission screw 6 is vertically rotatably arranged on the support frame 1. The second transmission screw 6 is connected to the output end of the second driving motor 5. The second nut is movably sleeved on the second transmission screw 6. The horizontal guide mechanism is connected to the second nut to realize the movement of the nozzle support plate 2 in the vertical direction. Specifically, the vertical driving mechanism also includes a second synchronous belt. A third gear is provided on the output shaft of the second driving motor 5. A fourth gear is provided on the second transmission screw 6. The two ends of the second synchronous belt are respectively sleeved on the third gear and the fourth gear, so that the second driving motor 5 drives the second transmission screw 6 to rotate. During the rotation of the second transmission screw 6, the second nut drives the corresponding nozzle support plate 2 to move on the second transmission screw 6. Since the multiple vertical driving mechanisms are synchronous driving structures, the multiple vertical driving mechanisms can drive the multiple nozzle support plates 2 to move up and down synchronously.

[0030] Further, the horizontal guide mechanism includes at least two first guide rails 11 arranged front to back, the vertical guide mechanism includes at least two second guide rails 12 arranged vertically, and a connecting frame is provided on the nozzle support plate 2, each connecting frame is slidably arranged on a first guide rail 11 front to back, and each first guide rail 11 is slidably arranged on a second guide rail 12 up and down. The first guide rail 11 and the second guide rail 12 can guide the movement of the nozzle support plate 2, so that the nozzle support plate 2 can move more quickly.

[0031] Furthermore, there are two nozzle support plates 2 and two vertical drive mechanisms. The two vertical drive mechanisms are respectively arranged at the left and right ends of the support frame 1, and the two nozzle support plates 2 are arranged side by side.

[0032] Furthermore, two nozzle trays 21 are provided on each nozzle support plate 2, and a plurality of nozzles 211 arranged in an array are provided on the bottom wall of each nozzle tray 21. In a specific embodiment, eight nozzles 211 are provided on each nozzle tray 21, and are evenly arranged in eight rows and two columns. The chip test transmission module of the present application can simultaneously absorb thirty-two chips, greatly improving the transportation efficiency of the chips, thereby improving the testing efficiency of the chips.

[0033] Furthermore, a vacuum adsorption hole 212 is provided on the bottom wall of the suction nozzle 211. Specifically, a chip positioning groove is provided on the bottom wall of the suction nozzle 211, and the vacuum adsorption hole 212 is arranged at the center of the chip positioning groove. When the chip is loaded into the chip positioning groove, vacuum is drawn through the vacuum adsorption hole 212 to form a negative pressure adsorption force to fix the chip and prevent the chip from falling off during the movement of the suction nozzle support plate 2.

[0034] Furthermore, the suction nozzle 211 is a flexible suction nozzle, which is made of a flexible material, such as silicone, rubber or FPC material.

[0035] The utility model also provides a testing device, comprising the above chip testing transmission module.

[0036] The above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit the protection scope of the utility model.

Claims

1. A chip test transmission module, characterized in that: The invention comprises a support frame (1), a horizontal driving mechanism, at least two vertical driving mechanisms and at least two nozzle support plates (2); the support frame (1) is provided with a horizontal guiding mechanism and a vertical guiding mechanism; the horizontal driving mechanism and the vertical driving mechanism are both arranged on the support frame (1); each nozzle support plate (2) is drivingly connected to the horizontal driving mechanism; the horizontal guiding mechanism is drivingly connected to the vertical driving mechanism; the nozzle support plate (2) is slidably arranged on the horizontal guiding mechanism; and the horizontal guiding mechanism is slidably arranged on the vertical guiding mechanism.

2. The chip test transmission module according to claim 1, characterized in that: The horizontal driving mechanism comprises a first driving motor (3), a first transmission screw (4) and a first nut, wherein the first driving motor (3) is arranged on the support frame (1), the first transmission screw (4) is horizontally rotatably arranged on the support frame (1), the first transmission screw (4) is connected to the output end of the first driving motor (3), the first nut is movably sleeved on the first transmission screw (4), and the nozzle support plate (2) is connected to the first nut to realize the movement of the nozzle support plate (2) in the horizontal direction.

3. The chip test transmission module according to claim 2, characterized in that: The vertical driving mechanism comprises a second driving motor (5), a second transmission screw (6) and a second nut, wherein the second driving motor (5) is arranged on the support frame (1), the second transmission screw (6) is arranged on the support frame (1) for vertical rotation, the second transmission screw (6) is connected to the output end of the second driving motor (5), the second nut is movably sleeved on the second transmission screw (6), and the horizontal guiding mechanism is connected to the second nut to realize the movement of the nozzle support plate (2) in the vertical direction.

4. The chip test transmission module according to claim 3, characterized in that: The horizontal guide mechanism comprises at least two first guide rails (11) arranged front to back, the vertical guide mechanism comprises at least two second guide rails (12) arranged vertically, a connecting frame is provided on the nozzle support plate (2), each of the connecting frames is slidably arranged on one of the first guide rails (11) front to back, and each of the first guide rails (11) is slidably arranged on one of the second guide rails (12) up and down.

5. The chip test transmission module according to claim 1, characterized in that: The number of the nozzle support plates (2) is two, and the number of the vertical drive mechanisms is also two. The two vertical drive mechanisms are respectively arranged at the left and right ends of the support frame (1), and the two nozzle support plates (2) are arranged side by side on the left and right sides.

6. The chip test transmission module according to claim 5, characterized in that: Two suction nozzle plates (21) are provided on each suction nozzle support plate (2), and a bottom wall of each suction nozzle plate (21) is provided with a plurality of suction nozzles (211) arranged in an array.

7. The chip test transmission module according to claim 6, characterized in that: A vacuum adsorption hole (212) is provided on the bottom wall of the suction nozzle (211).

8. The chip test transmission module according to claim 7, characterized in that: The suction nozzle (211) is a flexible suction nozzle.

9. The chip test transmission module according to claim 2, characterized in that: The first transmission screw rod (4) is arranged on the support frame (1) in a front-to-back transverse direction.

10. A testing device, characterized in that: It comprises a chip test transmission module as described in any one of claims 1-9.

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