Fingerprint module and electronic equipment

Abstract

The embodiment of the utility model provides a fingerprint module and electronic equipment, the fingerprint module is applied to the electronic equipment, and the fingerprint module comprises a cover plate, an ultrasonic sensor, a circuit board and a rear cover; the fingerprint module is electrically connected with a processing unit of the electronic equipment through the circuit board; the ultrasonic sensor is used for transmitting an ultrasonic signal and receiving the reflected ultrasonic signal penetrating through the cover plate, and is also used for converting the received ultrasonic signal into an electric signal and sending the electric signal to the processing unit through the circuit board; the cover plate is used for providing a pressing surface, and a containing space formed by the cover plate and the rear cover is used for containing the ultrasonic sensor. According to the embodiment of the invention, an ultrasonic fingerprint scheme is adopted, and the ultrasonic penetrating power is relatively high, so that compared with a capacitive fingerprint scheme in the prior art, the cover plate can be made of various materials, and a relatively thick cover plate can be arranged, so that the fingerprint module is prevented from being damaged when being impacted by external force.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of fingerprint modules, and in particular to a fingerprint module and an electronic device. Background Art

[0002] With the development of smart devices, fingerprint recognition has become the mainstream security solution for smart devices. The side fingerprint solution is installed in a different position from the traditional front and back fingerprint solution. The traditional front and back fingerprint solution needs to occupy the structural space on the front or back of the smart device, while the side fingerprint solution is set on the side of the middle frame of the smart device, avoiding the fingerprint module occupying the structural space on the front or back, and can meet the space requirements of smart devices.

[0003] At present, the side fingerprint solution mainly adopts the capacitive fingerprint solution.

[0004] However, the penetration performance of the capacitive fingerprint solution is poor, resulting in the fingerprint module cover being designed to be thinner, which can cause damage to the fingerprint module under external force impact. Utility Model Content

[0005] In view of this, embodiments of the present application provide a fingerprint module and an electronic device to at least partially solve the above problems.

[0006] According to a first aspect of an embodiment of the present application, a fingerprint module is provided, which is applied to an electronic device, and the fingerprint module includes: a cover plate, an ultrasonic sensor, a circuit board and a back cover; the fingerprint module is electrically connected to a processing unit of the electronic device through the circuit board; the ultrasonic sensor is used to transmit an ultrasonic signal and receive the ultrasonic signal that is reflected and passes through the cover plate, and is also used to convert the received ultrasonic signal into an electrical signal and send the electrical signal to the processing unit through the circuit board; the cover plate is used to provide a pressing surface, and the accommodation space formed by the cover plate and the back cover is used to accommodate the ultrasonic sensor.

[0007] According to the second aspect of the embodiments of the present application, an electronic device is provided, comprising: a processing unit such as a fingerprint module as described in any one of the first aspect of the embodiments of the present application; the fingerprint module is arranged in an opening of a middle frame of the electronic device; the processing unit is used to receive an electrical signal sent by the fingerprint module and perform fingerprint recognition based on the electrical signal.

[0008] According to the fingerprint module provided in the embodiment of the present application, the fingerprint module includes a cover plate, an ultrasonic sensor, a circuit board and a back cover. The ultrasonic sensor is arranged in the accommodating space between the cover plate and the back cover. The ultrasonic sensor can emit an ultrasonic signal, and convert the ultrasonic signal that is reflected and passes through the cover plate into an electrical signal. The electrical signal is transmitted to the processing unit of the electronic device through the circuit board, thereby enabling fingerprint recognition. The embodiment of the present application adopts an ultrasonic fingerprint solution. Since ultrasonic waves have strong penetrating power, the cover plate can be made of a variety of materials compared with the capacitive fingerprint solution in the prior art, and a thicker cover plate can be set. When subjected to external force impact, the fingerprint module can be protected by the thicker cover plate to prevent damage to the fingerprint module. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0010] Figure 1 is a cross-sectional schematic diagram of a fingerprint module provided in an embodiment of the present application;

[0011] Figure 2 is a top view of a fingerprint module provided in an embodiment of the present application;

[0012] Figure 3 is a schematic diagram of a cover plate provided in an embodiment of the present application;

[0013] Figure 4 is a side view of a back cover provided in an embodiment of the present application;

[0014] Figure 5 is a cross-sectional schematic diagram of a fingerprint module including a padding structure provided in an embodiment of the present application;

[0015] Figure 6 is a cross-sectional schematic diagram of a fingerprint module provided by an embodiment of the present application, wherein a top plate includes a protruding structure;

[0016] Figure 7 is a side view of a fingerprint module having a top plate including a protruding structure provided by an embodiment of the present application;

[0017] Figure 8 This is a schematic diagram of an electrical connection through a binding wire provided in an embodiment of the present application;

[0018] Fig. 9 is a schematic diagram of a fingerprint module including a reinforcement plate provided in an embodiment of the present application;

[0019] Fig.10 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application;

[0020] Fig.11 is a cross-sectional view of the side of a fingerprint module including a reinforcement plate provided in an embodiment of the present application;

[0021] Fig.12 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application;

[0022] Fig.13 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application;

[0023] Fig.14 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application;

[0024] Fig.15 is a cross-sectional schematic diagram of another fingerprint module provided in an embodiment of the present application;

[0025] Fig.16 is a schematic diagram of a fingerprint module including a buffer layer provided in an embodiment of the present application;

[0026] Fig.17 is a schematic diagram of a back cover provided in an embodiment of the present application;

[0027] Fig.18 is a cross-sectional view of the side of a fingerprint module provided in an embodiment of the present application;

[0028] Fig.19 is a cross-sectional schematic diagram of another fingerprint module provided in an embodiment of the present application;

[0029] Fig. 20 is a schematic diagram of an electronic device provided in an embodiment of the present application;

[0030] Fig.21 It is a flow chart of a fingerprint module assembly method provided in an embodiment of the present application. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the embodiments of the present application should fall within the scope of protection of the embodiments of the present application.

[0032] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0033] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0034] The fingerprint module provided by the present application is described below by way of examples.

[0035] Figure 1 is a cross-sectional schematic diagram of a fingerprint module provided in an embodiment of the present application. The fingerprint module 100 is applied to electronic devices, such as Figure 1 As shown, the fingerprint module 100 includes a cover plate 101, an ultrasonic sensor 102, a circuit board 103 and a back cover 104. The fingerprint module 100 is electrically connected to a processing unit of an electronic device through the circuit board 103. The ultrasonic sensor 102 is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and transmitted through the cover plate 101, and is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board 103. The cover plate 101 is used to provide a pressing surface, and the accommodation space formed by the cover plate 101 and the back cover 104 is used to accommodate the ultrasonic sensor 102.

[0036] The fingerprint module 100 includes a cover 101, an ultrasonic sensor 102, a circuit board 103 and a back cover 104. The cover 101 can be made of plastic, metal, glass, ceramic, etc. The surface of the cover 101 can be processed by vacuum plating, vacuum matte, oil spraying, material polishing and other processes. The material of the back cover 104 can be metal.

[0037] The circuit board 103 is electrically connected to the processing unit in the electronic device. The circuit board 103 includes a flexible circuit board 103. The ultrasonic sensor 102 is arranged in the accommodation space formed by the cover plate 101 and the back cover 104. The ultrasonic sensor 102 can emit ultrasonic signals and receive ultrasonic signals that are reflected and passed through the cover plate 101. After receiving the reflected ultrasonic signal, the ultrasonic sensor 102 converts the ultrasonic signal into an electrical signal. The circuit board 103 transmits the electrical signal to the processing unit of the electronic device, and the processing unit performs fingerprint recognition based on the electrical signal.

[0038] In the embodiment of the present application, the fingerprint module 100 includes a cover plate 101, an ultrasonic sensor 102, a circuit board 103 and a back cover 104. The ultrasonic sensor 102 is arranged in the accommodation space between the cover plate 101 and the back cover 104. The ultrasonic sensor 102 can emit an ultrasonic signal, and the ultrasonic signal reflected and transmitted through the cover plate 101 is converted into an electrical signal, and the electrical signal is transmitted to the processing unit of the electronic device through the circuit board 103, thereby enabling fingerprint recognition. The embodiment of the present application adopts an ultrasonic fingerprint solution. Since ultrasonic waves have strong penetrating power, the cover plate 101 can be made of a variety of materials compared with the capacitive fingerprint solution in the prior art, and a thicker cover plate 101 can be set. When subjected to external force impact, the fingerprint module 100 can be protected by the thicker cover plate 101 to prevent the fingerprint module 100 from being damaged.

[0039] In one possible implementation, Figure 1 As shown, the back cover 104 is a box-like structure with one end open, the ultrasonic sensor 102 is arranged in the box-like structure, the back cover 104 abuts against the edge of the cover plate 101 to form a receiving space, and the edge of the back cover 104 does not exceed the edge of the cover plate 101.

[0040] One end of the back cover 104 is open to form a box structure. In one example, the back cover 104 can be obtained by CNC lathe processing or stamping, stretching forming. The cover plate 101 covers one side of the opening on the back cover 104 and abuts against the edge of the back cover 104. A storage space for accommodating the ultrasonic sensor 102 is formed between the cover plate 101 and the back cover 104. The ultrasonic sensor 102 is arranged in the storage space. Figure 2 is a top view of a fingerprint module provided in an embodiment of the present application, such as Figure 2 As shown, the back cover 104 and the top plate 1011 can be an oblong structure, and the edge of the back cover 104 does not exceed the edge of the cover plate 101 in the abutment area between the back cover 104 and the cover plate 101, that is, the cover plate 101 covers the entire opening of the back cover 104, and the size of the cover plate 101 is larger than the size of the opening in the back cover 104.

[0041] In the embodiment of the present application, the back cover 104 is a box-shaped structure with an opening at one end. The back cover 104 abuts against the edge of the cover plate 101 to form a accommodating space. The ultrasonic sensor 102 is arranged in the accommodating space formed by the cover plate 101 and the back cover 104. The ultrasonic sensor 102 can be protected by the cover plate 101 and the back cover 104 to improve the overall strength of the module. The cover plate 101 abuts against the back cover 104, and the cover plate 101 covers the entire opening of the back cover 104, which can enhance the waterproof and dustproof effect of the fingerprint module 100.

[0042] Figure 3 is a schematic diagram of a cover plate provided in an embodiment of the present application, such as Figure 3 As shown, the cover plate 101 includes a top plate 1011 and a support member 1012 that are vertically connected. The cover plate 101 includes a top plate 1011 and a support member 1012 that are vertically connected. The top plate 1011, the support member 1012 and the back cover 104 form a receiving space, and the end of the support member 1012 is bonded to the bottom wall of the back cover 104, and the back cover 104 abuts against the edge of the top plate 1011.

[0043] The cover plate 101 includes a top plate 1011 and a support member 1012, the top plate 1011 and the support member 1012 are vertically arranged, the top plate 1011, the support member 1012 and the back cover 104 form a receiving space, and the end of the support member 1012 can be bonded to the bottom wall of the back cover 104. In one example, Figure 3 As shown, the support member 1012 can be bonded to the bottom wall of the back cover 104 through the first adhesive layer 201, and the first adhesive layer 201 can be an adhesive film or glue, preferably glue. One side of the opening of the back cover 104 abuts against the top plate 1011, that is, the top plate 1011 covers the entire opening of the back cover 104, and the size of the top plate 1011 is larger than the size of the opening in the back cover 104.

[0044] It should be understood that the support member 1012 is located on the side of the ultrasonic sensor 102 where the circuit board 103 is not set, and forms a accommodating space with the top plate 1011 and the back cover 104. The ultrasonic sensor 102 is located in the accommodating space, so the support member 1012 does not contact the ultrasonic sensor 102, that is, in a direction perpendicular to the bottom wall of the back cover 104, the projection of the support member 1012 on the bottom wall of the back cover 104 does not intersect with the projection of the ultrasonic sensor 102 on the bottom wall of the back cover 104.

[0045] Optionally, the support member 1012 may be a cubic structure or a columnar structure, which is not limited in the embodiment of the present application.

[0046] In the embodiment of the present application, the cover plate 101 includes a top plate 1011 and a support member 1012 which are vertically connected. The top plate 1011, the support member 1012 and the back cover 104 form a accommodating space and the end of the support member 1012 is bonded to the bottom wall of the back cover 104. The back cover 104 abuts against the top plate 1011. Therefore, the top plate 1011 can be supported by the support member 1012 to prevent the top plate 1011 from being deformed under the action of external force, which would damage the ultrasonic sensor 102 arranged between the cover plate 101 and the back cover 104. The top plate 1011 can be fixed to the back cover 104 by bonding the end of the support member 1012 to the bottom wall of the back cover 104, thereby improving the reliability of the fingerprint module 100.

[0047] Figure 4 is a side view of a back cover provided in an embodiment of the present application, such as Figure 4 As shown, a groove structure 1041 is provided on the side of the back cover 104. After the back cover 104 abuts against the edge of the top plate 1011, the circuit board 103 passes through the groove structure 1041, so that one end of the circuit board 103 is located in the accommodating space, and the other end of the circuit board 103 is located outside the accommodating space. There is a gap for glue injection between the circuit board 103 and the top plate 1011 in the groove structure 1041.

[0048] The side of the rear cover 104 is provided with a groove structure 1041. Figure 1 In the structure shown in the cross-sectional view, after the back cover 104 abuts against the edge of the top plate 1011, one end of the circuit board 103 is located in the accommodating space, and the other end of the circuit board 103 passes through the groove structure 1041 and is located outside the accommodating space. There is a gap between the circuit board 103 and the top plate 1011 for glue injection.

[0049] In the embodiment of the present application, a groove structure 1041 is provided on the side of the back cover 104. After the back cover 104 abuts against the edge of the top plate 1011, the circuit board 103 passes through the groove structure 1041 and is electrically connected to the processing unit of the electronic device, thereby enabling the ultrasonic sensor 102 to be electrically connected to the processing unit in the electronic device through the circuit board 103. Since the groove structure 1041 is provided on the back cover 104, there are side walls on the side of the back cover 104, which ensures that the circuit board 103 extends out of the accommodation space while ensuring the dustproofness of the entire fingerprint module 100.

[0050] Figure 5 is a cross-sectional schematic diagram of a fingerprint module including a padding structure provided in an embodiment of the present application, such as Figure 5 As shown, a cushioning structure 105 is arranged between the circuit board 103 and the bottom wall of the back cover 104, the first surface of the cushioning structure 105 is in contact with the circuit board 103, the second surface of the cushioning structure 105 is directly or indirectly connected to the bottom wall of the back cover 104, and the first surface of the cushioning structure 105 is opposite to the second surface.

[0051] Since the thickness of the circuit board 103 is less than that of the ultrasonic sensor 102, there is a height difference between the ultrasonic sensor 102 and the circuit board 103 in the accommodation space. Therefore, in order to keep the circuit board 103 flat, the recessed height of the groove structure 1041 needs to be relatively high, so that the bottom surfaces of the circuit board 103 and the ultrasonic sensor 102 are close to being on the same horizontal plane, but this will result in a larger gap between the circuit board 103 and the top plate 1011. At this time, a padding structure 105 may be provided between the circuit board 103 and the bottom wall of the back cover 104, the first surface of the padding structure 105 contacts the circuit board 103, the second surface of the padding structure 105 is directly or indirectly connected to the bottom wall of the back cover 104, and the second surface of the padding structure 105 is directly connected to the bottom wall of the back cover 104, including: the first surface of the padding structure 105 is bonded to the circuit board 103, and the second surface of the padding structure 105 is bonded to the bottom wall of the back cover 104.

[0052] The second surface of the raising structure 105 is indirectly connected to the bottom wall of the back cover 104, including: the first surface of the raising structure 105 is bonded to the circuit board 103, the second surface of the raising structure 105 is bonded to the first surface of the reinforcement plate, and the second surface of the reinforcement plate is bonded to the bottom wall of the back cover 104, that is, the circuit board 103 is bonded to the reinforcement plate through the raising structure 105, and the reinforcement plate is bonded to the bottom wall of the back cover 104, thereby realizing the indirect connection between the second surface of the raising structure 105 and the bottom wall of the back cover 104.

[0053] In another example, the circuit board 103 and the upper surface of the ultrasonic sensor 102 in the accommodating space can be nearly on the same level through the padding structure 105. The specific height of the padding structure 105 and the specific height of the circuit board 103 after being raised are not limited here.

[0054] In the embodiment of the present application, a cushioning structure 105 may be further provided in the fingerprint module 100, and the cushioning structure 105 may raise the height of the circuit board 103. Since the cushioning structure 105 is provided, the height of the circuit board 103 inside the fingerprint module 100 can be higher. Therefore, a groove structure 1041 with a smaller recessed height may be provided on the side of the back cover 104, so that the gap between the circuit board 103 and the top plate 1011 is smaller, thereby further ensuring the dustproofness of the entire fingerprint module 100 while realizing the circuit board 103 extending out of the accommodation space.

[0055] Figure 6 is a cross-sectional schematic diagram of a fingerprint module with a top plate including a protruding structure provided in an embodiment of the present application, such as Figure 6As shown, the top plate 1011 is provided with a protruding structure 1013. After the back cover 104 abuts against the edge of the top plate 1011, the protruding structure 1013 is located in the groove structure 1041. A gap for glue injection exists between the circuit board 103 and the protruding structure 1013 in the groove structure 1041.

[0056] The top plate 1011 includes a protruding structure 1013. Figure 7 is a side view of a fingerprint module with a top plate including a protruding structure provided in an embodiment of the present application, such as Figure 7 As shown, a protruding structure 1013 is disposed on the top plate 1011 of the fingerprint module 100. When the rear cover 104 abuts against the edge of the top plate 1011, the protruding structure 1013 is located in the groove structure 1041. Figure 6 As shown, when the back cover 104 abuts against the edge of the top plate 1011 , one end of the circuit board 103 is located in the accommodating space, and the other end of the circuit board 103 passes through the groove structure 1041 , and a gap for glue injection exists between the circuit board 103 and the protruding structure 1013 .

[0057] In the embodiment of the present application, the top plate 1011 is provided with a protruding structure 1013. After the back cover 104 abuts against the edge of the top plate 1011, the protruding structure 1013 is located in the groove structure 1041. There is a gap for injecting glue between the circuit board 103 and the protruding structure 1013. The circuit board 103 passes through the groove structure 1041 and is electrically connected to the processing unit of the electronic device. Thus, the ultrasonic sensor 102 and the processing unit in the electronic device can be electrically connected through the circuit board 103. A protruding structure 1013 is provided on 011, and the protruding structure 1013 is located in the groove structure 1041 after the back cover 104 abuts against the top plate 1011. Compared with the aforementioned embodiment in which the protruding structure 1013 is not provided, the gap between the circuit board 103 and the protruding structure 1013 is much smaller than the gap between the circuit board 103 and the top plate 1011 when the protruding structure 1013 is not provided on the top plate 1011. Therefore, the protruding structure 1013 provided on the top plate 1011 can further enhance the dustproofness of the fingerprint module 100.

[0058] In one possible implementation, Figure 1 As shown, the ultrasonic sensor 102 includes a substrate 1021 and an acoustic layer 1022, the acoustic layer 1022 is arranged on the substrate 1021, a first electrical connection area 1023 is arranged on the substrate 1021, a second electrical connection area 1031 is arranged on the circuit board 103, and the first electrical connection area 1023 and the second electrical connection area 1031 are electrically connected through a binding wire.

[0059] The ultrasonic sensor 102 is provided with a substrate 1021 and an acoustic layer 1022. The ultrasonic sensor 102 can transmit ultrasonic signals through the acoustic layer 1022, and receive ultrasonic signals reflected by external structures, such as fingers, and passing through the cover 101. In one example, the acoustic layer 1022 can be a piezoelectric sound-emitting material. When the cover 101 is pressed, for example, when the cover 101 is touched by a finger, the ultrasonic sensor 102 transmits ultrasonic signals and receives ultrasonic signals reflected by the finger. The reflected ultrasonic signals are converted into electrical signals by the ultrasonic sensor 102, and the electrical signals are transmitted to the processing unit through the circuit board 103. The processing unit processes the electrical signals to realize fingerprint recognition.

[0060] The ultrasonic sensor 102 and the circuit board 103 are electrically connected via a binding wire. In one example, Figure 8 is a schematic diagram of an electrical connection through a binding wire provided in an embodiment of the present application, such as Figure 8 As shown, the ultrasonic sensor 102 and the circuit board 103 may be electrically connected via a single-row binding wire and a double-row binding wire, which is not limited in the embodiment of the present application.

[0061] In the embodiment of the present application, the ultrasonic sensor 102 includes a substrate 1021 and an acoustic layer 1022, a first electrical connection area 1023 is provided on the substrate 1021, and a second electrical connection area 1031 is provided on the circuit board 103, the first electrical connection area 1023 and the second electrical connection area 1031 are electrically connected through a binding wire, and the ultrasonic sensor 102 can emit an ultrasonic signal, and convert the ultrasonic signal reflected back and passing through the cover plate 101 into an electrical signal, and transmit the electrical signal to the processing unit of the electronic device through the circuit board 103, thereby enabling fingerprint recognition. The embodiment of the present application adopts an ultrasonic fingerprint solution. Since ultrasonic waves have strong penetrating power, the cover plate 101 can be made of a variety of materials compared with the capacitive fingerprint solution in the prior art, and a thicker cover plate 101 can be provided. When impacted by external force, the fingerprint module 100 can be protected by the thicker cover plate 101 to prevent damage to the fingerprint module 100.

[0062] Fig. 9 is a schematic diagram of a fingerprint module including a reinforcement plate provided in an embodiment of the present application, such as Fig. 9 As shown, the fingerprint module 100 also includes a reinforcement plate 107, a substrate 1021 bonded to the first surface of the reinforcement plate 107, a circuit board 103 bonded to the first surface of the reinforcement plate 107, an acoustic layer 1022 bonded to the top plate 1011, so that the acoustic layer 1022 is located between the substrate 1021 and the top plate 1011, and the substrate 1021 is located between the reinforcement plate 107 and the acoustic layer 1022, and at least a portion of the second surface of the reinforcement plate 107 is bonded to the bottom wall of the back cover 104, wherein the first surface of the reinforcement plate 107 is opposite to the second surface.

[0063] The fingerprint module 100 further includes a reinforcing plate 107, which can be made of a variety of materials, preferably a metal material. The reinforcing plate 107 is disposed on a side of the substrate 1021 in the ultrasonic sensor 102 away from the acoustic layer 1022, the substrate 1021 and a portion of the circuit board 103 are bonded to a first surface of the reinforcing plate 107, and at least a portion of the second surface of the reinforcing plate 107 is bonded to the bottom wall of the rear cover 104. In one example, Figure 8 As shown, the reinforcing plate 107 can be bonded to the substrate 1021 and part of the circuit board 103 through the second adhesive layer 202, and can be bonded to the bottom wall of the back cover 104 through the third adhesive layer 203. The second adhesive layer 202 and the third adhesive layer 203 can be adhesive films or glue, preferably glue.

[0064] like Fig. 9 As shown, the acoustic layer 1022 is bonded to the top plate 1011 except the support 1012, the acoustic layer 1022 is located between the substrate 1021 and the top plate 1011, the substrate 1021 is located between the acoustic layer 1022 and the reinforcing plate 107, and the acoustic layer 1022 can be bonded to the top plate 1011 through the fourth adhesive layer 204, and the fourth adhesive layer 204 can be an adhesive film or glue. When the acoustic layer 1022 is bonded to the top plate 1011 except the support 1012, the first electrical connection area 1023 is arranged on the side of the substrate 1021 close to the top plate 1011, the first surface of the circuit board 103 close to the side of the top plate 1011 is provided with a second electrical connection area 1031, the second surface of the circuit board 103 is bonded to the reinforcing plate 107, and the first surface of the circuit board 103 is opposite to the second surface.

[0065] Optionally, the unbonded portion between the reinforcing plate 107 and the bottom wall of the back cover 104 may be filled with cushioning foam to cushion the reinforcing plate 107 and the ultrasonic sensor 102 . Optionally, the unbonded portion between the reinforcing plate 107 and the bottom wall of the back cover 104 may be an air layer.

[0066] In the embodiment of the present application, the fingerprint module 100 also includes a reinforcement plate 107, the substrate 1021 is bonded to the first surface of the reinforcement plate 107, and the circuit board 103 is bonded to the first surface of the reinforcement plate 107, thereby fixing the relative position between the ultrasonic sensor 102 and the circuit board 103 to prevent the relative position between the ultrasonic sensor 102 and the circuit board 103 from changing, causing the first electrical connection area 1023 and the second electrical connection area 1031 to be out of electrical connection. The ultrasonic sensor 102 is arranged between the reinforcement plate 107 and the top plate 1011, so that the ultrasonic sensor 102 can be reinforced to prevent the ultrasonic sensor 102 from breaking under the action of external force, thereby improving the strength of the fingerprint module 100.

[0067] In one possible implementation, Fig. 9 As shown, there is a first gap between the substrate 1021 and the circuit board 103, and the first gap and the first electrical connection area 1023 and the second electrical connection area 1031 and the cover plate 101 are filled with a first protective glue 106. The circuit board 103 is bonded to the top plate 1011 through the first protective glue 106. The first protective glue 106 covers the first electrical connection area 1023 and the second electrical connection area 1031, and the binding wire is located in the first protective glue 106.

[0068] The substrate 1021 and the circuit board 103 include a first gap, the first gap is filled with a first protective glue 106, and the first protective glue 106 fills the gap between the ultrasonic sensor 102 and the circuit board 103 and between the first electrical connection area 1023 and the second electrical connection area 1031 and the top plate 1011. Fig. 9 As shown, the first protective glue 106 covers the binding wires, and covers the first electrical connection area 1023 and the second electrical connection area 1031. It should be understood that part of the first protective glue 106 is in contact with the acoustic layer 1022, and part of the ultrasonic sensor 102 and part of the circuit board 103 are bonded to the top plate 1011 through the first protective glue 106. It should also be understood that since the first surface of the reinforcing plate 107 is bonded to the substrate 1021 and the circuit board 103 at the same time, the protective glue is in contact with part of the reinforcing plate 107.

[0069] It should be noted that if Fig. 9 In the structure shown, after the fingerprint module 100 is bonded to the top plate 1011 , the first protective glue 106 can be filled into the first gap through the gap for glue injection formed between the top plate 1011 and the circuit board 103 . The specific filling method is not limited in the embodiment of the present application.

[0070] In the embodiment of the present application, a first gap is included between the substrate 1021 and the circuit board 103, and the first gap is filled with a first protective glue 106, and the first protective glue 106 covers the binding wire and the first electrical connection area 1023 and the second electrical connection area 1031. Therefore, the binding wire can be protected by the first protective glue 106 to prevent the first electrical connection area 1023 and the second electrical connection area 1031 from being out of the electrical connection state. Moreover, since the first protective glue 106 fills the first gap and the space between the first electrical connection area 1023, the second electrical connection area 1031 and the top plate 1011, dust can be prevented from entering the interior of the fingerprint module 100 through the gap between the circuit board 103 and the top plate 1011 for glue injection, thereby improving the dustproof and waterproof capabilities of the fingerprint module 100.

[0071] In one possible implementation, Figure 6 and Fig. 9As shown, a recessed space is provided on the top plate 1011 at a position corresponding to the projection of the first gap on the top plate 1011 , and the recessed space is used to prevent the binding wire from contacting the top plate, and a portion of the first protective glue 106 is filled in the recessed space.

[0072] It should be understood that Figure 6 and Fig. 9 The recessed space in is only an example, and the recessed space may be a recessed space of various shapes, including but not limited to a cylindrical recessed space, a rectangular recessed space, a truncated cone-shaped recessed space, etc. The specific shape is not limited in the embodiments of the present application.

[0073] In an embodiment of the present application, a recessed space is provided on the top plate 1011 at a position corresponding to the projection of the first gap on the top plate 1011. The recessed space can be used to prevent the binding wire from contacting the top plate, thereby allowing the binding wire to be in a naturally bent state, preventing the top plate 1011 from compressing the binding wire during assembly and causing deformation of the binding wire, thereby increasing the service life of the binding wire.

[0074] Fig.10 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application, such as Fig.10 As shown, a first through hole 1071 is provided on the reinforcing plate 107 , the first through hole 1071 is connected to the first gap, and the axis of the first through hole 1071 coincides with the center line of the first gap, and the first protective glue 106 is also used to fill the first through hole 1071 .

[0075] A first through hole 1071 may be provided on the reinforcement plate 107. When manufacturing the fingerprint module 100, the ultrasonic sensor 102 and the circuit board 103 electrically connected by the binding wire may be bonded to the reinforcement plate 107, and then the acoustic layer 1022 in the ultrasonic sensor 102 may be bonded to the top plate 1011. Then, the first protective glue 106 may be filled into the first gap between the substrate 1021 and the circuit board 103 through the first through hole 1071 on the reinforcement plate 107. At this time, the first protective glue 106 may also fill the first through hole 1071.

[0076] It should be understood that Fig.10 As shown, the axis of the first through hole 1071 coincides with the center line of the first gap, and the center line of the first gap is the center line formed by the center points of the horizontal line between the substrate 1021 and the circuit board 103, that is, the first through hole 1071 is located directly below the first gap.

[0077] In the embodiment of the present application, a first through hole 1071 is provided on the reinforcement plate 107, and the first through hole 1071 is connected to the first gap. Therefore, when manufacturing the fingerprint module 100, the first protective glue 106 can be filled into the first gap between the ultrasonic sensor 102 and the circuit board 103 through the first through hole 1071. Since the glue is not injected through the gap between the circuit board 103 and the top plate 1011, the gap can be set smaller, thereby improving the dustproof and waterproof capabilities. The first protective glue 106 covers the binding wire, so that the relative position of the binding wire, the top plate 1011 and the back cover 104 will not move, which can improve the protection effect of the binding wire.

[0078] Fig.11 is a cross-sectional view of a fingerprint module including a reinforcement plate provided in an embodiment of the present application, such as Fig.11 As shown, the fingerprint module 100 includes, from top to bottom, a top plate 1011 , a fourth adhesive layer 204 , an acoustic layer 1022 , a substrate 1021 , a second adhesive layer 202 , a reinforcement plate 107 , an air layer and a back cover 104 .

[0079] Fig.12 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application, such as Fig.12 As shown, the first through hole 1071 may be a truncated cone-shaped through hole, and the opening radius of the first through hole 1071 on the first surface of the reinforcing plate 107 is smaller than the opening radius of the first through hole 1071 on the second surface of the reinforcing plate 107 .

[0080] The first through hole 1071 may be a truncated cone-shaped through hole. Fig.12 is a cross-sectional view of the fingerprint module 100. Fig.12 The cross-section corresponding to the middle truncated cone through hole is a trapezoid, and the opening radius of the truncated cone through hole on the first surface of the reinforcing plate 107 is smaller than the opening radius on the second surface of the reinforcing plate 107. Thus, the first through hole 1071 forms a truncated cone through hole similar to a funnel shape, which can accommodate more first protective glue 106.

[0081] In the embodiment of the present application, the first through hole 1071 can be a truncated cone-shaped through hole, and the opening radius of the first through hole 1071 on the first surface of the reinforcement plate 107 is smaller than the opening radius of the first through hole 1071 on the second surface of the reinforcement plate 107, so that the first protective glue 106 can be injected into the first gap through the first through hole 1071. Since the first through hole 1071 is a truncated cone-shaped through hole, the truncated cone-shaped through hole can accommodate more first protective glue 106 when the opening radius is the same as that of the cylindrical through hole in the above embodiment on the first surface of the reinforcement plate 107, and more first protective glue 106 can be injected at one time, thereby reducing the number of injections of the first protective glue 106 and improving the efficiency of injecting glue into the first gap in the fingerprint module 100.

[0082] Fig.13 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application, Fig.14 is a schematic diagram of another fingerprint module including a reinforcement plate provided in an embodiment of the present application, such as Fig.13 and Fig.14 As shown, a truncated cone-shaped recessed structure 1072 is provided on the second surface of the reinforcing plate 107. The opening radius of the recessed structure 1072 on the second surface of the reinforcing plate 107 is greater than the radius of the end surface of the recessed structure 1072 in the reinforcing plate 107. The first through hole 1071 is connected to the recessed structure 1072. The radius of the end surface of the recessed structure 1072 in the reinforcing plate 107 is greater than or equal to the radius of the first through hole 1071. Specifically, Fig.13 The figure shows the case where the radius of the end surface of the recessed structure 1072 in the reinforcing plate 107 is equal to the radius of the first through hole 1071. Fig.14 The diagram shows a case where the radius of the end surface of the recessed structure 1072 in the reinforcing plate 107 is greater than the radius of the first through hole 1071 .

[0083] The second surface of the reinforcing plate 107 may be provided with a truncated cone-shaped recessed structure 1072. It should be understood that due to Fig.13 and Fig.14 is a cross-sectional view of the fingerprint module 100. Fig.13 and Fig.14 The cross section corresponding to the middle recessed structure 1072 is a trapezoid, and the recessed structure 1072 is connected to the first through hole 1071. Optionally, the axis of the first through hole 1071 can coincide with the axis of the recessed structure 1072. The opening radius of the recessed structure 1072 on the second surface of the reinforcing plate 107 is greater than the radius of the end surface of the recessed structure 1072 in the reinforcing plate 107, thereby forming a funnel-shaped truncated cone-shaped recessed structure 1072, which can accommodate more first protective glue 106.

[0084] In the embodiment of the present application, a truncated cone-shaped recessed structure 1072 is provided on the second surface of the reinforcing plate 107, and the first through hole 1071 is connected to the recessed structure 1072. The first protective glue 106 can be injected into the first through hole 1071 through the recessed structure 1072, so that the first protective glue 106 can be injected into the first gap through the first through hole 1071. Since the recessed structure 1072 is truncated cone-shaped, compared with the above embodiment in which only the cylindrical first through hole 1071 is provided, the recessed structure 1072 can accommodate more first protective glue 106, and the first protective glue 106 can be injected at one time. More first protective glue 106 reduces the number of injections of the first protective glue 106, thereby improving the efficiency of injecting glue into the first gap in the fingerprint module 100. Compared with the truncated cone-shaped first through hole 1071 in the above embodiment, since the end face of the recessed structure 1072 is in the reinforcement plate 107, when the end face of the recessed structure 1072 and the truncated cone-shaped first through hole 1071 have the same opening area on the first surface of the reinforcement plate 107, the reinforcement plate 107 with the recessed structure 1072 has a smaller opening, so the strength of the reinforcement plate 107 is higher, thereby improving the reliability of the fingerprint module 100.

[0085] Fig.15 is a cross-sectional schematic diagram of another fingerprint module provided in an embodiment of the present application, such as Fig.15 As shown, the substrate 1021 and the circuit board 103 are bonded to the top plate 1011, and a second gap is included between the substrate 1021 and the circuit board 103. The second gap and the first electrical connection area 1023, the second electrical connection area 1031 and the bottom wall are filled with a second protective glue 108. The substrate 1021 and the circuit board 103 are bonded to the bottom wall of the back cover 104 through the second protective glue 108. The second protective glue 108 covers the first electrical connection area 1023 and the second electrical connection area 1031, and the binding wire is located in the second protective glue 108.

[0086] The substrate 1021 and the circuit board 103 are bonded to the top plate 1011, the substrate 1021 is located between the top plate 1011 and the acoustic layer 1022, the acoustic layer 1022 is located between the substrate 1021 and the bottom wall of the back cover 104, and a second gap is included between the substrate 1021 and the circuit board 103. The second gap and the first electrical connection area 1023 and the second electrical connection area 1031 and the bottom wall are filled with a second protective glue 108, and the second protective glue 108 fills the gap between the substrate 1021 and the circuit board 103. Fig.13 As shown, the second protective glue 108 covers the binding wires, and covers the first electrical connection area 1023 and the second electrical connection area 1031. It should be understood that part of the second protective glue 108 is in contact with the acoustic layer 1022, and part of the ultrasonic sensor 102 and part of the circuit board 103 are bonded to the bottom wall of the back cover 104 through the second protective glue 108.

[0087] The substrate 1021 and the circuit board 103 may be bonded to the top plate 1011 via a fifth adhesive layer 205 . The fifth adhesive layer 205 may be an adhesive film or glue, which is not limited in the embodiment of the present application.

[0088] When the substrate 1021 is bonded to the top plate 1011, the first electrical connection area 1023 is arranged on the side of the substrate 1021 away from the top plate 1011, the first surface portion of the circuit board 103 close to the top plate 1011 is bonded to the top plate 1011, and the second surface of the circuit board 103 is provided with a second electrical connection area 1031, and the first surface of the circuit board 103 is opposite to the second surface.

[0089] In the embodiment of the present application, the substrate 1021 and the circuit board 103 are bonded to the top plate 1011. Since the substrate 1021 is relatively flat relative to the acoustic layer 1022, compared with the solution in the above embodiment, the ultrasonic sensor 102 can be more simply set between the cover plate 101 and the back cover 104. Since the substrate 1021 and the circuit board 103 are bonded to the top plate 1011, there is no need to set the reinforcement plate 107, and the second gap included between the substrate 1021 and the circuit board 103 is filled with the second protective glue 108, and the second protective glue 108 covers the binding line and the first electrical connection area 1023 and the second electrical connection area 1031. Therefore, the binding line can be protected by the second protective glue 108 to prevent the first electrical connection area 1023 and the second electrical connection area 1031 from being out of the electrical connection state, and part of the ultrasonic sensor 102 and part of the circuit board 103 can be bonded to the bottom wall of the back cover 104 through the second protective glue 108, thereby improving the reliability of the fingerprint module 100.

[0090] Fig.16 is a schematic diagram of a fingerprint module including a buffer layer provided in an embodiment of the present application, such as Fig.16 As shown, in Fig.15 Based on the structure of the fingerprint module 100 shown, the fingerprint module 100 may further include a buffer layer 109, wherein a first surface of the buffer layer 109 contacts the acoustic layer 1022, and a second surface of the buffer layer 109 contacts the bottom wall of the back cover 104, wherein the first surface and the second surface of the buffer layer 109 are opposite to each other.

[0091] The fingerprint module 100 also includes a buffer layer 109, which can be a porous foam such as a buffer foam. The first surface of the buffer layer 109 is in contact with the acoustic layer 1022, and the second surface of the buffer layer 109 is in contact with the bottom wall of the back cover 104, that is, the buffer layer 109 is arranged between the acoustic layer 1022 and the bottom wall of the back cover 104, and is in contact with the acoustic layer 1022 and the bottom wall of the back cover 104 at the same time.

[0092] In the embodiment of the present application, the fingerprint module 100 also includes a buffer layer 109, a first surface of the buffer layer 109 is in contact with the acoustic layer 1022, and a second surface of the buffer layer 109 is in contact with the bottom wall of the back cover 104, so that the acoustic layer 1022 in the ultrasonic sensor 102 can be buffered by the buffer layer 109 to prevent the acoustic layer 1022 from being damaged by external force, and the buffer layer 109 can prevent the second protective glue 108 from overflowing between the acoustic layer 1022 and the bottom wall of the back cover 104, thereby preventing the performance of the acoustic layer 1022 in sending and receiving ultrasonic signals from being affected.

[0093] Fig.17 is a schematic diagram of a back cover provided in an embodiment of the present application, such as Fig.17 As shown, the back cover 104 may further include a second through hole 1042 , and the second protective glue 108 is further used to fill the second through hole 1042 . The second through hole 1042 is connected to the second gap, and the axis of the second through hole 1042 coincides with the center line of the second gap.

[0094] It should be understood that Fig.17 As shown, the axis of the second through hole 1042 coincides with the center line of the second gap, and the center line of the second gap is the center line formed by the center points of the horizontal line between the substrate 1021 and the circuit board 103, that is, the second through hole 1042 is located directly below the second gap.

[0095] When manufacturing the fingerprint module 100, the ultrasonic sensor 102 can be set in the accommodation space between the cover plate 101 and the back cover 104, and then the acoustic layer 1022 compacts the buffer layer 109, and then the second protective glue 108 is filled into the second gap between the substrate 1021 and the circuit board 103 through the second through hole 1042 on the back cover 104 to achieve filling of the second protective glue 108.

[0096] It should be understood that the second through hole 1042 is a through hole, so the second protective glue 108 fills the second through hole 1042 and adheres to the inner side wall of the second through hole 1042 on the back cover 104 .

[0097] It should be noted that the rear cover 104 may be a non-porous structure. Fig.15 and Fig.16 The rear cover 104 may also be a porous structure, such as Fig.17 The structure shown.

[0098] Fig.18 is a cross-sectional view of a fingerprint module provided in an embodiment of the present application, such as Fig.18 As shown, for Fig.16 and Fig.17The structure of the fingerprint module 100 shown in the figure comprises, from top to bottom, a top plate 1011 , a fifth adhesive layer 205 , a substrate 1021 , an acoustic layer 1022 , a buffer layer 109 and a back cover 104 .

[0099] In the embodiment of the present application, the back cover 104 includes a second through hole 1042, so that when the fingerprint module 100 is manufactured, the second protective glue 108 can be filled into the second gap between the substrate 1021 and the circuit board 103 through the second through hole 1042 on the back cover 104. Compared with the fingerprint module 100 in the above embodiment, there is no need to inject the second protective glue 108 before abutting the back cover 104 against the top plate 1011. Since the second protective glue 108 is injected after the back cover 104 is abutted against the top plate 1011, it can be ensured that the second protective glue 108 completely fills the second gap, the first electrical connection area 1023, and the space between the second electrical connection area 1031 and the top plate 1011, thereby improving the efficiency and yield of manufacturing the fingerprint module 100.

[0100] In a possible implementation, the thickness of the ultrasonic sensor 102 is in the range of [0.1 mm, 0.5 mm].

[0101] In the embodiment of the present application, the thickness range of the ultrasonic sensor 102 is [0.1mm, 0.5mm], thereby reducing the overall thickness of the fingerprint module 100, making the fingerprint module 100 occupy a smaller volume, and being suitable for electronic devices with compact space, with high applicability.

[0102] In a possible implementation, the thickness range of the cover plate 101 is [0.5 mm, 2 mm].

[0103] In the embodiment of the present application, the thickness range of the cover plate 101 is [0.5mm, 2mm], thereby balancing the performance of the ultrasonic sensor 102 in sending and receiving ultrasonic signals while protecting the ultrasonic sensor 102 to prevent damage to the ultrasonic sensor 102 due to external forces, thereby improving the reliability of the fingerprint module 100.

[0104] Fig.19 is a cross-sectional schematic diagram of another fingerprint module provided in an embodiment of the present application, such as Fig.19 As shown, the fingerprint module 100 further includes a conductive base 110 , which is bonded to a side of the back cover 104 away from the cover plate 101 . The conductive base 110 can move driven by the back cover 104 to trigger the physical button.

[0105] Optionally, the conductive base 110 is preferably made of thermoplastic polyurethane (TPU) material, and the specific conductive base 110 material is not limited in the present embodiment. In one example, the conductive base 110 can be bonded to the back cover 104 through the sixth adhesive layer 206, and the sixth adhesive layer 206 can be an adhesive film or glue, preferably glue.

[0106] In the embodiment of the present application, the fingerprint module 100 further includes a conductive base 110, thereby combining the fingerprint module 100 with a physical button, thereby reducing the space occupied by the fingerprint module 100 in the electronic device.

[0107] Fig. 20 is a schematic diagram of an electronic device provided in an embodiment of the present application, such as Fig. 20 As shown, the electronic device 300 includes a processing unit 301 and a fingerprint module 100 of any of the above embodiments. The fingerprint module 100 is arranged in an opening of a middle frame of the electronic device 300. The processing unit 301 can receive an electrical signal sent by the fingerprint module 100 and perform fingerprint recognition based on the electrical signal.

[0108] In the embodiment of the present application, the electronic device 300 includes a processing unit 301 and a fingerprint module 100. The processing unit 301 is electrically connected to the circuit board in the fingerprint module 100. The processing unit 301 can receive the electrical signal sent by the fingerprint module 100 and perform fingerprint recognition based on the electrical signal, thereby realizing the fingerprint recognition function. Since the embodiment of the present application adopts an ultrasonic fingerprint solution, the ultrasonic wave has strong penetrating power. Therefore, compared with the capacitive fingerprint solution in the prior art, the cover plate can be made of a variety of materials, and the thickness of the cover plate can be thicker. When the electronic device 300 is impacted by external force, the fingerprint module 100 can be protected to prevent the fingerprint module 100 from being damaged.

[0109] In a possible implementation, the cover plate in the fingerprint module 100 is flush with the outer surface of the middle frame.

[0110] In one example, the middle frame of the electronic device 300 is a planar structure, and the cover plate can be set to be a planar structure flush with the outer edge of the middle frame. In another example, the middle frame of the electronic device 300 is a curved structure, and the cover plate can be set to be a curved structure flush with the outer edge of the middle frame.

[0111] In the embodiment of the present application, the cover plate in the fingerprint module 100 is flush with the outer surface of the middle frame, which can enhance the aesthetics of the electronic device 300. Moreover, since the cover plate in the fingerprint module 100 is flush with the outer surface of the middle frame, part of the impact force can be dispersed through the middle frame when receiving an external impact, thereby preventing the fingerprint module 100 from being damaged.

[0112] Fig.21is a flow chart of an assembly method of a fingerprint module provided in an embodiment of the present application, wherein the fingerprint module includes a cover plate, an ultrasonic sensor, a circuit board and a back cover. Fig. 20 As shown, the fingerprint module assembly method includes the following steps 2101 to 2102:

[0113] Step 2101: Bond the ultrasonic sensor to the back of the cover.

[0114] The ultrasonic sensor is bonded to the cover. In one example, the ultrasonic sensor can be bonded to the back of the cover through an adhesive layer. The specific bonding method can refer to the description of the fingerprint module embodiment above, which will not be repeated here.

[0115] Step 2102: abut the back cover against the back side of the cover plate.

[0116] The back cover is abutted against the edge of the back side of the cover plate, so that the ultrasonic sensor is located in the accommodation space formed by the cover plate and the back cover, and one end of the circuit board is located in the accommodation space and electrically connected to the ultrasonic sensor, and the other end of the circuit board is located outside the accommodation space, and the other end of the circuit board is used to be electrically connected to the processing unit of the electronic device, and the front side of the cover plate provides a pressing surface.

[0117] In the embodiment of the present application, after the ultrasonic sensor is bonded to the back side of the cover plate, the back cover is abutted against the cover plate, so that the ultrasonic sensor can be set in the accommodation space between the cover plate and the back cover, thereby realizing the assembly of the fingerprint module of the ultrasonic side fingerprint solution. Since the assembled fingerprint module is set in the accommodation space between the cover plate and the back cover, the fingerprint module can be protected by the cover plate and the back cover, and since the assembled fingerprint module is an ultrasonic fingerprint module, the cover plate can be made of a variety of materials, and the cover plate can be thicker. When impacted by external force, the fingerprint module can be protected by the thicker cover plate to prevent damage to the fingerprint module.

[0118] In a possible implementation, the ultrasonic sensor includes a substrate and an acoustic layer, the acoustic layer is arranged on the substrate, a first electrical connection area is arranged on the substrate, a second electrical connection area is arranged on the circuit board, the first electrical connection area and the second electrical connection area are electrically connected through a binding wire, the back cover is a box-like structure with one end open, the ultrasonic sensor is arranged in the box-like structure, the cover plate includes a top plate and a support member vertically connected, the top plate, the support member and the back cover form the accommodating space, and the end of the support member is bonded to the bottom wall of the back cover, the back cover abuts against the edge of the top plate, a first gap is included between the substrate and the circuit board, a groove structure is provided on the side of the back cover, after the back cover abuts against the edge of the top plate, the circuit board passes through the groove structure, so that one end of the circuit board is located in the accommodating space, and the other end of the circuit board is located outside the accommodating space, and there is a gap for glue injection between the circuit board and the top plate in the groove structure, and the method also includes:

[0119] A first protective glue is injected into the gap between the circuit board and the top plate for glue injection, so that the first gap and the first electrical connection area, the second electrical connection area and the cover plate are filled with the first protective glue, the circuit board is bonded to the top plate through the first protective glue, the first protective glue covers the first electrical connection area and the second electrical connection area, and the binding wire is located in the first protective glue.

[0120] In the embodiment of the present application, by injecting the first protective glue into the gap between the circuit board and the top plate for glue injection, the first gap and the first electrical connection area and the space between the second electrical connection area and the cover plate can be filled with the first protective glue, thereby filling the fingerprint module with the first protective glue. As a result, the first protective glue can fix the binding line to prevent the circuit board and the ultrasonic module from being out of the electrical connection state, and the first protective glue can improve the dustproof function of the fingerprint module.

[0121] In a possible implementation, the top plate is provided with a protruding structure, and after the back cover abuts against an edge of the top plate, the protruding structure is located in the groove structure, and a gap for glue injection is provided between the circuit board and the protruding structure in the groove structure, and the method further includes:

[0122] A first protective glue is injected into the gap between the circuit board and the raised structure for glue injection, so that the first gap and the first electrical connection area, the second electrical connection area and the cover plate are filled with the first protective glue, the circuit board is bonded to the top plate through the first protective glue, the first protective glue covers the first electrical connection area and the second electrical connection area, and the binding wire is located in the first protective glue.

[0123] In the embodiment of the present application, by injecting the first protective glue into the gap between the circuit board and the raised structure for glue injection, the first gap and the first electrical connection area and the space between the second electrical connection area and the cover plate can be filled with the first protective glue, thereby filling the fingerprint module with the first protective glue. As a result, the first protective glue can fix the binding line to prevent the circuit board and the ultrasonic module from being out of the electrical connection state, and the first protective glue can improve the dustproof function of the fingerprint module.

[0124] In a possible implementation, the ultrasonic sensor includes a substrate and an acoustic layer, the acoustic layer is arranged on the substrate, a first electrical connection area is arranged on the substrate, a second electrical connection area is arranged on the circuit board, the first electrical connection area and the second electrical connection area are electrically connected through a binding wire, the cover plate includes a top plate and a support member connected vertically, and the fingerprint module further includes: a reinforcement plate; the substrate is bonded to the first surface of the reinforcement plate, the circuit board is bonded to the first surface of the reinforcement plate, a first through hole is arranged on the reinforcement plate, the first through hole is connected to the first gap, and the axis of the first through hole coincides with the center line of the first gap;

[0125] The step of bonding the ultrasonic sensor to the back side of the cover plate comprises:

[0126] Bonding the acoustic layer to the top plate so that the acoustic layer is located between the substrate and the top plate, and the substrate is located between the reinforcing plate and the acoustic layer;

[0127] The step of abutting the rear cover against the back surface of the cover plate comprises:

[0128] Injecting a first protective glue into the first through hole, so that the first gap and the first electrical connection area, the second electrical connection area and the cover plate are filled with the first protective glue, the circuit board is bonded to the top plate through the first protective glue, the first protective glue covers the first electrical connection area and the second electrical connection area, and the binding wire is located in the first protective glue;

[0129] After coating the end of the support member and at least a portion of the second surface of the reinforcement plate with glue, the back cover is abutted against the edge of the top plate, wherein the top plate, the support member and the back cover form the accommodating space, the end of the support member is bonded to the bottom wall of the back cover, at least a portion of the second surface of the reinforcement plate is bonded to the bottom wall of the back cover, and the first surface of the reinforcement plate is opposite to the second surface.

[0130] In the embodiment of the present application, the first protective glue is injected through the first through hole, so that the first gap and the first electrical connection area and the space between the second electrical connection area and the cover plate are filled with the first protective glue, thereby filling the fingerprint module with the first protective glue. As a result, the first protective glue can fix the binding wire to prevent the circuit board and the ultrasonic module from being out of the electrical connection state, and the first protective glue can improve the dustproof function of the fingerprint module. After coating glue on the end of the support member, the back cover and the top plate are abutted, and the end of the support member can be bonded to the bottom wall of the back cover to prevent the top plate and the back cover from being out of the abutment state, thereby improving the reliability of the fingerprint module.

[0131] In a possible implementation, a truncated cone-shaped recessed structure is provided on the second surface of the reinforcing plate, an opening radius of the recessed structure on the second surface of the reinforcing plate is greater than a radius of an end surface of the recessed structure in the reinforcing plate, the first through hole is connected to the recessed structure, and a radius of an end surface of the recessed structure in the reinforcing plate is greater than or equal to a radius of the first through hole;

[0132] The step of injecting a first protective glue into the first through hole comprises:

[0133] The first protective glue is injected into the recessed structure to inject the first protective glue into the first through hole.

[0134] In the embodiment of the present application, glue is injected into the recessed structure on the reinforcement plate, so that the first protective glue is injected into the fingerprint module through the first through hole, so that the first gap and the first electrical connection area and the second electrical connection area and the cover plate are filled with the first protective glue, thereby realizing the filling of the fingerprint module with the first protective glue. Moreover, since the glue is injected into the recessed structure, compared with directly injecting glue into the first through hole, more first protective glue can be injected at one time due to the larger accommodating space of the recessed structure, thereby reducing the number of injections and simplifying the process flow.

[0135] In a possible implementation, the ultrasonic sensor includes a substrate and an acoustic layer, the acoustic layer is disposed on the substrate, a first electrical connection area is disposed on the substrate, a second electrical connection area is disposed on the circuit board, the first electrical connection area is electrically connected to the second electrical connection area through a binding wire, and the cover plate includes a top plate and a support member vertically connected;

[0136] The step of bonding the ultrasonic sensor to the back side of the cover plate comprises:

[0137] bonding the substrate and the circuit board to the top plate;

[0138] The step of abutting the rear cover against the back surface of the cover plate comprises:

[0139] Filling a second protective glue into a second gap between the substrate and the circuit board, so that the second gap and the first electrical connection area, the second electrical connection area and the bottom wall are filled with the second protective glue, the substrate and the circuit board are bonded to the bottom wall through the second protective glue, the second protective glue covers the first electrical connection area and the second electrical connection area, and the binding wire is located in the second protective glue;

[0140] After glue is coated on the end of the support member, the back cover of the box-shaped structure with one end open is brought into contact with the edge of the top plate, wherein the top plate, the support member and the back cover form the accommodating space, and the end of the support member is bonded to the bottom wall of the back cover.

[0141] In the embodiment of the present application, after the substrate and circuit board of the ultrasonic sensor are bonded to the top plate, the second protective glue is filled into the second gap between the circuit board and the substrate, and after glue is coated on the end of the support member, the back cover is abutted against the edge of the cover plate, thereby realizing the assembly of the fingerprint module, and the second gap and the first electrical connection area and the second electrical connection area and the bottom wall are filled with the second protective glue, thereby realizing the filling of the second protective glue into the fingerprint module, thereby enabling the second protective glue to fix the binding wire and prevent the circuit board and the ultrasonic module from being out of the electrical connection state.

[0142] In a possible implementation, the ultrasonic sensor includes a substrate and an acoustic layer, the acoustic layer is arranged on the substrate, a first electrical connection area is arranged on the substrate, a second electrical connection area is arranged on the circuit board, the first electrical connection area and the second electrical connection area are electrically connected through a binding wire, the back cover is a box-like structure with one end open, the ultrasonic sensor is arranged in the box-like structure, the cover plate includes a top plate and a support member vertically connected, the top plate, the support member and the back cover form the accommodating space, and the end of the support member is bonded to the bottom wall of the back cover, the substrate and the circuit board are bonded to the top plate, a second gap is included between the substrate and the circuit board, the back cover includes a second through hole, and the second through hole is connected to the second gap, and the method also includes:

[0143] The second protective glue is injected through the second through hole so that the second gap and the first electrical connection area, the second electrical connection area and the bottom wall are filled with the second protective glue, the substrate and the circuit board are bonded to the bottom wall through the second protective glue, the second protective glue covers the first electrical connection area and the second electrical connection area, and the binding wire is located in the second protective glue.

[0144] In the embodiment of the present application, the second protective glue is filled into the interior of the fingerprint module through the second through hole, so that the second gap and the space between the first electrical connection area, the second electrical connection area and the bottom wall are filled with the second protective glue. Compared with the scheme in the aforementioned embodiment in which the back cover is abutted after the second protective glue is filled, since the amount of the second protective glue cannot be determined after the second protective glue is injected and then the back cover is assembled, it may result in the second protective glue not being able to be completely filled or the second protective glue being excessively filled. In this embodiment, since the second protective glue is injected through the second through hole after the back cover is abutted against the top plate, it can be ensured that the second gap and the space between the first electrical connection area, the second electrical connection area and the bottom wall are completely filled with the second protective glue, thereby improving the yield rate of the fingerprint module.

[0145] The fingerprint module assembled by the fingerprint module assembly method in any of the above embodiments may refer to the description in the above fingerprint module corresponding embodiment, which will not be repeated here.

[0146] Those of ordinary skill in the art will appreciate that the units and method steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of the embodiments of the present application.

[0147] The above implementation methods are only used to illustrate the embodiments of the present application, and are not limitations on the embodiments of the present application. Ordinary technicians in the relevant technical field can make various changes and modifications without departing from the spirit and scope of the embodiments of the present application. Therefore, all equivalent technical solutions also belong to the scope of the embodiments of the present application. The scope of patent protection of the embodiments of the present application should be limited by the claims.

Claims

1. A fingerprint module, applied to electronic equipment, characterized in that: The fingerprint module includes: a cover plate, an ultrasonic sensor, a circuit board and a back cover; The fingerprint module is electrically connected to the processing unit of the electronic device through the circuit board; The ultrasonic sensor is used to transmit ultrasonic signals and receive ultrasonic signals that are reflected and then pass through the cover plate, and is also used to convert the received ultrasonic signals into electrical signals and send the electrical signals to the processing unit through the circuit board; The cover plate is used to provide a pressing surface, and the accommodation space formed by the cover plate and the back cover is used to accommodate the ultrasonic sensor.

2. The fingerprint module according to claim 1, characterized in that: The back cover is a box-like structure with one end open, the ultrasonic sensor is arranged in the box-like structure, the back cover abuts against the edge of the cover plate to form the accommodating space, and the edge of the back cover does not exceed the edge of the cover plate.

3. The fingerprint module according to claim 2, characterized in that: The cover plate includes a top plate and a support member which are vertically connected. The top plate, the support member and the back cover form the accommodating space. The end of the support member is bonded to the bottom wall of the back cover, and the back cover abuts against the edge of the top plate.

4. The fingerprint module according to claim 3, characterized in that: A groove structure is provided on the side of the back cover. After the back cover abuts against the edge of the top plate, the circuit board passes through the groove structure so that one end of the circuit board is located in the accommodating space and the other end of the circuit board is located outside the accommodating space. A gap for glue injection is provided between the circuit board and the top plate in the groove structure.

5. The fingerprint module according to claim 4, characterized in that: A padding structure is provided between the circuit board and the bottom wall of the rear cover, wherein a first surface of the padding structure contacts the circuit board, a second surface of the padding structure is directly or indirectly connected to the bottom wall of the rear cover, and the first surface of the padding structure is opposite to the second surface; Alternatively, the top plate is provided with a protruding structure, and after the back cover abuts against the edge of the top plate, the protruding structure is located in the groove structure, and a gap for glue injection is provided between the circuit board and the protruding structure in the groove structure.

6. The fingerprint module according to claim 3, characterized in that: The ultrasonic sensor comprises: a substrate and an acoustic layer; The acoustic layer is arranged on the substrate, a first electrical connection area is arranged on the substrate, a second electrical connection area is arranged on the circuit board, and the first electrical connection area is electrically connected to the second electrical connection area through a binding wire.

7. The fingerprint module according to claim 6, characterized in that: The fingerprint module further includes: a reinforcement plate; The substrate is bonded to the first surface of the reinforcing plate, the circuit board is bonded to the first surface of the reinforcing plate, and the acoustic layer is bonded to the top plate, so that the acoustic layer is located between the substrate and the top plate, and the substrate is located between the reinforcing plate and the acoustic layer; At least a portion of the second surface of the reinforcing plate is bonded to the bottom wall of the rear cover, wherein the first surface and the second surface of the reinforcing plate are opposite to each other.

8. The fingerprint module according to claim 7, characterized in that: A first gap is included between the substrate and the circuit board. The first gap and the first electrical connection area, the second electrical connection area and the cover plate are filled with a first protective glue. The circuit board is bonded to the top plate through the first protective glue. The first protective glue covers the first electrical connection area and the second electrical connection area. The binding wire is located in the first protective glue.

9. The fingerprint module according to claim 8, characterized in that: A recessed space is provided on the top plate at a position corresponding to the projection of the first gap on the top plate, the recessed space is used to prevent the binding line from contacting the top plate, and a portion of the first protective glue is filled in the recessed space.

10. The fingerprint module according to claim 8, characterized in that: The reinforcing plate is provided with a first through hole; The first through hole is communicated with the first gap, and the axis of the first through hole coincides with the center line of the first gap. The first protective glue is also used to fill the first through hole.

11. The fingerprint module according to claim 10, characterized in that: The first through hole is a truncated cone-shaped through hole, and an opening radius of the first through hole on the first surface of the reinforcing plate is smaller than an opening radius of the first through hole on the second surface of the reinforcing plate; or The second surface of the reinforcing plate is provided with a truncated cone-shaped recessed structure, the opening radius of the recessed structure on the second surface of the reinforcing plate is greater than the radius of the end surface of the recessed structure in the reinforcing plate, the first through hole is connected to the recessed structure, and the radius of the end surface of the recessed structure in the reinforcing plate is greater than or equal to the radius of the first through hole.

12. The fingerprint module according to claim 6, characterized in that: The substrate and the circuit board are bonded to the top plate, and a second gap is included between the substrate and the circuit board. The second gap and the first electrical connection area, the second electrical connection area and the bottom wall are filled with a second protective glue. The substrate and the circuit board are bonded to the bottom wall through the second protective glue, and the second protective glue covers the first electrical connection area and the second electrical connection area. The binding wire is located in the second protective glue.

13. The fingerprint module according to claim 12, characterized in that: The fingerprint module further includes: a buffer layer; The first surface of the buffer layer contacts the acoustic layer, and the second surface of the buffer layer contacts the bottom wall of the rear cover, wherein the first surface and the second surface of the buffer layer are opposite to each other.

14. The fingerprint module according to claim 12, characterized in that: The back cover is a non-porous structure, or the back cover includes a second through hole, the second protective glue is also used to fill the second through hole, the second through hole is connected to the second gap, and the axis of the second through hole coincides with the center line of the second gap.

15. The fingerprint module according to any one of claims 1 to 14, characterized in that: The thickness range of the ultrasonic sensor is [0.1mm, 0.5mm], and the thickness range of the cover plate is [0.5mm, 2mm].

16. The fingerprint module according to any one of claims 1 to 14, characterized in that: Also included is a conductive base; The conductive base is bonded to a side of the back cover away from the cover plate; The conductive base is used to move driven by the back cover to trigger the physical button.

17. An electronic device, characterized in that: include: The processing unit is a fingerprint module as described in any one of claims 1 to 16; The fingerprint module is arranged in the middle frame opening of the electronic device; The processing unit is used to receive the electrical signal sent by the fingerprint module and perform fingerprint recognition based on the electrical signal.

18. The electronic device according to claim 17, characterized in that: The cover plate in the fingerprint module is flush with the outer surface of the middle frame.

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