Wafer efficient cleaning and drying integrated equipment

Abstract

The utility model discloses efficient wafer cleaning and drying integrated equipment, relates to the technical field of wafer cleaning, and aims to solve the problem that articles are damaged due to different local temperatures caused by different dropping points of cleaning water drops when the existing efficient wafer cleaning equipment is used. The inner cavity is installed in the cleaning and drying equipment body, a drying and heating mechanism is arranged on one side of the interior of the inner cavity, a moving mechanism is arranged on the upper portion of the interior of the inner cavity, a moving groove is formed in the moving mechanism, an open groove is formed in the lower end face of the moving mechanism, and the open groove is communicated with the drying and heating mechanism. Connecting pieces are arranged in the open groove, the number of the connecting pieces is two, one ends of the two connecting pieces are rotationally connected with the interior of the moving groove through rotating pulleys, the number of the rotating pulleys is two, and the other ends of the two connecting pieces are provided with an air blowing mechanism and a cleaning spray head correspondingly; and the cleaning nozzle is connected with the storage device through a hose.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a highly efficient wafer cleaning and drying integrated device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. After high-purity polycrystalline silicon is dissolved, silicon crystal seeds are added, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. Domestic wafer production lines are mainly 8 inches and 12 inches, and the main processing methods of wafers are sheet processing and batch processing, that is, processing one or more wafers at the same time. As the feature size of semiconductors becomes smaller and smaller, and the processing and measurement equipment becomes more and more advanced, new data characteristics have emerged in wafer processing. At the same time, the reduction in feature size increases the impact of the number of particles in the air on the quality and reliability of the wafer after processing during wafer processing, and as the cleanliness improves, the number of particles also has new data characteristics.

[0003] For example, the announcement number is CN114653704B, and the name of the Chinese authorized patent is (A high-efficiency wafer cleaning equipment), which includes: a mounting frame, a pickling component is fixedly installed on the upper end of the mounting frame, a single wafer is placed in an annular clamp, and then passes through a conveyor belt device to undergo a process of pickling, two water washings, and finally drying, thereby realizing a fast and automated cleaning process; the motor drives the lever and the annular ring to rotate continuously, and the intermittent disk causes the separating disk to rotate intermittently, thereby stopping the clamps one by one in an arc for a short time, the motor drives the cam to rotate, so that the L-shaped push rod drives the multi-axis brush to move up and down, and the gear group links the piston shaft to rotate, thereby driving the multi-axis brush to rotate continuously, and then the upper surface of the wafer body can be cleaned.

[0004] However, the existing high-efficiency wafer cleaning equipment may cause damage to objects due to different local temperatures caused by different landing points of cleaning water droplets during use; therefore, it does not meet existing needs. We have proposed an integrated high-efficiency wafer cleaning and drying equipment. Utility Model Content

[0005] The purpose of the utility model is to provide an integrated device for efficient wafer cleaning and drying, so as to solve the existing problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a wafer high-efficiency cleaning and drying integrated device, comprising: a cleaning and drying device body, the upper end surface of the cleaning and drying device body is provided with a storage device, a flip door panel is provided on one side of the front end surface of the cleaning and drying device body, the flip door panel is rotatably connected to the cleaning and drying device body through a rotating shaft, and a handle bar is provided on the front end surface of the flip door panel;

[0007] Also includes:

[0008] An inner cavity is installed inside the main body of the cleaning and drying equipment, a drying and heating mechanism is arranged on one side of the inner cavity, a moving mechanism is arranged above the inner cavity, a moving groove is arranged inside the moving mechanism, a groove is arranged at the lower end face of the moving mechanism, a connecting piece is arranged inside the groove, and there are two connecting pieces, one end of each of the two connecting pieces is rotatably connected to the inside of the moving groove through a rotating pulley, and there are two rotating pulleys, and a blowing mechanism and a cleaning nozzle are respectively arranged at the other ends of the two connecting pieces, the cleaning nozzle is connected to the storage device through a hose, and an output hole is arranged at the lower end face of the blowing mechanism.

[0009] Preferably, a heating tube is provided on one side inside the drying and heating mechanism, a motor is provided at the middle position of the front end surface of the heating tube, and fan blades are provided around a circle of the outer wall of the motor.

[0010] Preferably, a placement plate is provided below the inner cavity, a connecting rod is provided on the lower end surface of the placement plate, and two groups of connecting rods are provided.

[0011] Preferably, a reserved hole is arranged on the lower end surface inside the placement tray, and there are a plurality of the reserved holes, and the plurality of the reserved holes are formed integrally with the placement tray.

[0012] Preferably, a display screen is provided on the other side of the front end surface of the main body of the cleaning and drying device, and a plurality of operation buttons are provided on the lower side of the display screen.

[0013] Preferably, an inspection plate is provided on one side of the main body of the cleaning and drying device, and the inspection plate is threadedly connected to the main body of the cleaning and drying device through hexagonal bolts, and four hexagonal bolts are provided.

[0014] Compared with the prior art, the beneficial effects of the utility model are:

[0015] The utility model is provided with a storage device, a drying and heating mechanism, a blower mechanism, a cleaning nozzle and a moving mechanism. The storage device transports cleaning water to the cleaning nozzle through a hose, and the cleaning nozzle moves on the moving groove, so as to carry out comprehensive and multi-directional cleaning. After the cleaning is completed, the blower mechanism is turned on, and the blower mechanism can also move in the moving groove with the rotating pulley, so that the water droplets on the wafer can be blown away evenly. At the same time, the turned-on drying and heating mechanism can enhance the internal drying effect, and effectively avoid the problem of damage to objects caused by different local temperatures due to different falling points of the cleaning water droplets when the existing high-efficiency wafer cleaning equipment is in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the internal structure of the main body of the cleaning and drying equipment of the utility model;

[0018] Figure 3 This is a schematic diagram of the internal structure of the drying and heating mechanism of the utility model;

[0019] Figure 4 It is a schematic diagram of the bottom end surface structure of the mobile mechanism of the utility model;

[0020] Figure 5 It is a schematic diagram of the local structure of the placement plate of the utility model;

[0021] Figure 6 It is a schematic diagram of the internal structure of A of the utility model;

[0022] In the figure: 100, cleaning and drying equipment body; 101, inspection panel; 102, hexagonal bolt; 103, flip door panel; 104, rotating shaft; 105, handle bar; 106, display screen; 107, operation button; 200, inner cavity; 201, moving mechanism; 20101, slot; 202, drying and heating mechanism; 20201, heating tube; 20202, motor; 20203, fan blade; 203, connecting rod; 204, placement plate; 20401, reserved hole; 205, blower mechanism; 206, output hole; 207, moving slot; 208, rotating pulley; 209, connecting piece; 210, cleaning nozzle; 300, storage device. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0024] See also Figure 1-6 The utility model provides an embodiment: a wafer efficient cleaning and drying integrated device, comprising: a cleaning and drying device body 100, a storage device 300 is arranged on the upper end surface of the cleaning and drying device body 100, a flip door plate 103 is arranged on one side of the front end surface of the cleaning and drying device body 100, the flip door plate 103 is rotatably connected to the cleaning and drying device body 100 through a rotating shaft 104, and a handle bar 105 is arranged on the front end surface of the flip door plate 103;

[0025] Also includes:

[0026] The inner cavity 200 is installed inside the cleaning and drying device body 100. A drying and heating mechanism 202 is arranged on one side of the inner cavity 200. A moving mechanism 201 is arranged above the inner cavity 200. A moving groove 207 is arranged inside the moving mechanism 201. A groove 20101 is arranged on the lower end surface of the moving mechanism 201. A connecting member 209 is arranged inside the groove 20101. There are two connecting members 209. One end of the two connecting members 209 is rotatably connected to the inside of the moving groove 207 through a rotating pulley 208. There are two rotating pulleys 208. The other ends of the two connecting members 209 are respectively provided with a blower mechanism 205 and a cleaning nozzle 210. The cleaning nozzle 210 is connected to the storage device 300 through a hose. The lower end surface of the blower mechanism 205 is provided with an output hole 206.

[0027] See also Figure 3 A heating tube 20201 is arranged on one side inside the drying heating mechanism 202, a motor 20202 is arranged at the middle position of the front end surface of the heating tube 20201, and a fan blade 20203 is arranged around the outer wall of the motor 20202.

[0028] See also Figure 2 A placement plate 204 is disposed below the inner cavity 200 , and a connecting rod 203 is disposed on the lower end surface of the placement plate 204 , and two groups of connecting rods 203 are disposed.

[0029] See also Figure 5 A reserved hole 20401 is provided on the lower end surface of the placement tray 204 , and a plurality of the reserved holes 20401 are provided, and the plurality of reserved holes 20401 are integrally formed with the placement tray 204 .

[0030] The provision of the reserved hole 20401 facilitates the water from the placement tray 204 to flow out.

[0031] See also Figure 1A display screen 106 is provided on the other side of the front end surface of the cleaning and drying equipment body 100, and an operation button 107 is provided on the lower side of the display screen 106, and a plurality of operation buttons 107 are provided. An inspection plate 101 is provided on one side of the cleaning and drying equipment body 100, and the inspection plate 101 is threadedly connected to the cleaning and drying equipment body 100 through hexagonal bolts 102, and four hexagonal bolts 102 are provided.

[0032] The bolting method of the hexagonal bolt 102 can make the connection and disassembly convenient.

[0033] Working principle: When in use, the inspection plate 101 is opened by rotating the shaft 104, and then the wafer object is placed inside the placement tray 204, and the cleaning and drying equipment body 100 is turned on by operating the button 107, and the storage device 300 transports its cleaning water to the cleaning nozzle 210 through a hose, and then the cleaning nozzle 210 moves on the movable groove 207, so as to carry out comprehensive and multi-directional cleaning. After the cleaning is completed, the blower mechanism 205 is turned on, and the blower mechanism 205 can also move in the movable groove 207 with the rotating pulley 208, so that the water droplets on the wafer can be blown away evenly, and the drying and heating mechanism 202 turned on at the same time can enhance the internal drying effect.

[0034] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A wafer high-efficiency integrated cleaning and drying device, comprising a cleaning and drying device body (100), wherein the upper end surface of the cleaning and drying device body (100) is provided with a storage device (300), a flip door plate (103) is provided on one side of the front end surface of the cleaning and drying device body (100), the flip door plate (103) is rotatably connected to the cleaning and drying device body (100) via a rotating shaft (104), and a handle bar (105) is provided on the front end surface of the flip door plate (103); Features: Also includes: An inner cavity (200) is installed inside the cleaning and drying device body (100); a drying and heating mechanism (202) is arranged on one side inside the inner cavity (200); a moving mechanism (201) is arranged above the inner cavity (200); a moving groove (207) is arranged inside the moving mechanism (201); a groove (20101) is arranged on the lower end surface of the moving mechanism (201); a connecting piece (209) is arranged inside the groove (20101); Two connecting members (209) are provided, one end of each of the two connecting members (209) is rotatably connected to the inside of the movable groove (207) via a rotating pulley (208), and two rotating pulleys (208) are provided, and the other ends of the two connecting members (209) are respectively provided with a blower mechanism (205) and a cleaning nozzle (210), the cleaning nozzle (210) is connected to the storage device (300) via a hose, and the lower end surface of the blower mechanism (205) is provided with an output hole (206).

2. The wafer efficient cleaning and drying integrated equipment according to claim 1, characterized in that: A heating tube (20201) is provided on one side inside the drying heating mechanism (202), a motor (20202) is provided at the middle position of the front end surface of the heating tube (20201), and fan blades (20203) are provided around the outer wall of the motor (20202).

3. The wafer efficient cleaning and drying integrated equipment according to claim 1, characterized in that: A placement plate (204) is provided below the interior of the inner cavity (200), and a connecting rod (203) is provided on the lower end surface of the placement plate (204), and two groups of connecting rods (203) are provided.

4. The wafer efficient cleaning and drying integrated equipment according to claim 3, characterized in that: A reserved hole (20401) is provided on the lower end surface inside the placement plate (204), and a plurality of the reserved holes (20401) are provided, and the plurality of the reserved holes (20401) are formed integrally with the placement plate (204).

5. The wafer efficient cleaning and drying integrated equipment according to claim 1, characterized in that: A display screen (106) is provided on the other side of the front end surface of the cleaning and drying device body (100), and operation buttons (107) are provided on the lower side of the display screen (106), and a plurality of operation buttons (107) are provided.

6. The wafer efficient cleaning and drying integrated equipment according to claim 1, characterized in that: An inspection plate (101) is provided on one side of the cleaning and drying device body (100); the inspection plate (101) is threadedly connected to the cleaning and drying device body (100) via hexagonal bolts (102), and four hexagonal bolts (102) are provided.

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