Silicon wafer cleaning device

Abstract

The utility model discloses a silicon wafer cleaning device. The silicon wafer cleaning device comprises a shell, a cleaning device and a driving device, the first cleaning basket is rotatably arranged in the shell; the second cleaning basket is arranged in the shell, and the second cleaning basket is located below the first cleaning basket; and the first driving mechanism is arranged on the shell and is in transmission connection with the first cleaning basket, and the first cleaning basket is suitable for rotating relative to the shell under the driving action of the first driving mechanism, so that the silicon wafers in the first cleaning basket can be conveyed to the second cleaning basket. Therefore, the silicon wafer can be cleaned for multiple times, so that the silicon wafer can be cleaned more cleanly, the cleaning speed can be increased, and the cleaning efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a silicon wafer cleaning device. Background Art

[0002] Silicon is one of the most abundant elements in the earth's crust, providing sufficient raw materials for the production of monocrystalline silicon. 160,000 transistors can be integrated on a silicon wafer the size of a grain of rice, which is an important milestone in the progress of science and technology. Silicon wafers, also known as wafers, are important raw materials for manufacturing chips and various semiconductor devices.

[0003] The silicon wafer cleaning devices in the prior art all clean the silicon wafers, then replace the cleaning agent with a clean one, and then clean the next batch of silicon wafers. This not only causes the problem of incomplete cleaning, but also has the problems of slow cleaning speed and low efficiency. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a silicon wafer cleaning device, which can transport silicon wafers in a first cleaning basket to a second cleaning basket, and can clean the silicon wafers multiple times, so that the silicon wafers can be cleaned more cleanly.

[0005] According to an embodiment of the utility model, the silicon wafer cleaning device includes: a shell; a first cleaning basket, which is rotatably arranged in the shell; a second cleaning basket, which is arranged in the shell and is located below the first cleaning basket; a first driving mechanism, which is arranged in the shell and is transmission-connected to the first cleaning basket, and the first cleaning basket is suitable for rotating relative to the shell under the driving action of the first driving mechanism to transport the silicon wafers in the first cleaning basket to the second cleaning basket.

[0006] Thus, the silicon wafer cleaning device can transport the silicon wafers in the first cleaning basket to the second cleaning basket, and can clean the silicon wafers multiple times, thereby making the silicon wafers cleaned more thoroughly, and can also increase the cleaning speed, thereby improving the cleaning efficiency.

[0007] According to some embodiments of the present invention, the first cleaning basket includes: a first basket body; a first rotating shaft, the first rotating shaft is connected to opposite sides of the first basket body and is rotatably disposed on the shell, and the first driving mechanism is located outside the shell and is transmission-connected to the first rotating shaft located on one side.

[0008] According to some embodiments of the utility model, the silicon wafer cleaning device also includes: a second driving mechanism, the second driving mechanism is arranged on the shell and is transmission-connected to the second cleaning basket, the second cleaning basket is suitable for rotating relative to the shell under the driving action of the second driving mechanism, and the maximum rotation angle of the second cleaning basket is smaller than the maximum rotation angle of the first cleaning basket.

[0009] According to some embodiments of the present invention, the second cleaning basket includes: a second basket body; a second rotating shaft, the second rotating shaft is connected to opposite sides of the second basket body and is rotatably disposed on the shell, and the second driving mechanism is located outside the shell and is transmission-connected to the second rotating shaft located on one side.

[0010] According to some embodiments of the present invention, the silicon wafer cleaning device further includes: a pressure sensor, which is disposed on the first cleaning basket, and is used to detect the pressure of the first cleaning basket, and the pressure sensor is electrically connected to the first driving mechanism.

[0011] According to some embodiments of the utility model, the silicon wafer cleaning device also includes: a liquid spraying mechanism, which is arranged above the first cleaning basket to spray cleaning liquid onto the silicon wafers in the first cleaning basket; a circulation mechanism, one end of which is connected to the liquid spraying mechanism, and the other end of which is connected to the bottom of the shell to draw the cleaning liquid at the bottom of the shell to the liquid spraying mechanism.

[0012] According to some embodiments of the utility model, the liquid spraying mechanism includes: a delivery pipe; a plurality of nozzles, which are arranged on the delivery pipe and are respectively used to spray cleaning liquid onto the silicon wafers in the first cleaning basket; the circulation mechanism includes: a circulation pipe, one end of which is connected to one end of the delivery pipe, and the other end of which is connected to the bottom of the shell; a circulation driving member, which is arranged on the circulation pipe to provide a suction force to draw the cleaning liquid located at the bottom of the shell to the delivery pipe.

[0013] According to some embodiments of the present invention, the silicon wafer cleaning device further includes: a one-way valve, which is arranged at the other end of the delivery pipe, and the one-way valve only allows the cleaning liquid to flow from the outer liquid inlet pipe to the delivery pipe.

[0014] According to some embodiments of the utility model, the silicon wafer cleaning device also includes: a cleaning piece, which is arranged in the second cleaning basket; a third driving mechanism, which is arranged in the second cleaning basket, and the third driving mechanism is transmission-connected to the cleaning piece to drive the cleaning piece to translate in the second cleaning basket.

[0015] According to some embodiments of the utility model, the third driving mechanism includes: a translational driving member; a screw rod, which is rotatably arranged on the second cleaning basket, and one end of the screw rod is connected to the translational driving member; a guide rod, which is arranged on the second cleaning basket and parallel to the screw rod; a screw rod mating member, which is threadably matched with the screw rod and is passed through the guide rod, and the cleaning member is arranged on the screw rod mating member.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0018] Figure 1 It is a structural schematic diagram of a silicon wafer cleaning device according to an embodiment of the utility model;

[0019] Figure 2 It is a schematic diagram of the internal structure of a silicon wafer cleaning device according to an embodiment of the utility model;

[0020] Figure 3 It is a schematic structural diagram of a silicon wafer cleaning device including a third driving mechanism according to an embodiment of the utility model;

[0021] Figure 4 yes Figure 3 Magnified view of area A in the middle.

[0022] Reference numerals:

[0023] 100. Silicon wafer cleaning device;

[0024] 10. Shell;

[0025] 20. First cleaning basket; 21. First basket body; 22. First rotating shaft;

[0026] 30. Second cleaning basket; 31. Second basket body; 32. Second rotating shaft;

[0027] 40. A first driving mechanism; 41. A second driving mechanism;

[0028] 50. Pressure sensor;

[0029] 60. Liquid spraying mechanism; 61. Delivery pipe; 62. Spray nozzle;

[0030] 70. Circulation mechanism; 71. Circulation pipe; 72. Circulation drive member;

[0031] 80. One-way valve; 81. Cleaning parts;

[0032] 90. The third driving mechanism; 91. The translation driving member; 92. The screw rod; 93. The guide rod; 94. The screw rod matching member; 95. The feed port; 96. The reminder light; 97. The drain pipe. DETAILED DESCRIPTION

[0033] Embodiments of the present invention are described in detail below, and the embodiments described with reference to the accompanying drawings are exemplary.

[0034] Reference below Figure 1-Figure 4 A silicon wafer cleaning device 100 according to an embodiment of the present invention is described.

[0035] like Figure 1 As shown, a silicon wafer cleaning device 100 according to an embodiment of the utility model includes: a shell 10, a first cleaning basket 20, a second cleaning basket 30 and a first driving mechanism 40. The first cleaning basket 20 can be rotatably arranged in the shell 10, the second cleaning basket 30 is arranged in the shell 10, and the second cleaning basket 30 is located below the first cleaning basket 20. The first driving mechanism 40 is arranged in the shell 10, and the first driving mechanism 40 is transmission-connected with the first cleaning basket 20. The first cleaning basket 20 is suitable for rotating relative to the shell 10 under the driving action of the first driving mechanism 40, so that the silicon wafers in the first cleaning basket 20 can be transported to the second cleaning basket 30.

[0036] Specifically, conventional silicon wafer cleaning devices have the problem of not cleaning the silicon wafers cleanly, and some silicon wafer cleaning devices also have the problem of slow cleaning speed and small amount of silicon wafers cleaned.

[0037] Therefore, the silicon wafer cleaning device 100 is mainly composed of a housing 10, a first cleaning basket 20, a second cleaning basket 30 and a first driving mechanism 40. The first cleaning basket 20 is located inside the housing 10. The first cleaning basket 20 can hold silicon wafers, so that the silicon wafers in the first cleaning basket 20 can be roughly cleaned. Moreover, the first cleaning basket 20 can rotate relative to the housing 10. When the cleaning of the silicon wafers in the first cleaning basket 20 reaches a suitable degree, the first cleaning basket 20 rotates. Since the second cleaning basket 30 is located below the first cleaning basket 20, when the first cleaning basket 20 rotates to a certain angle, the silicon wafers in the first cleaning basket 20 can fall into the second cleaning basket 30. In this way, the silicon wafers can be cleaned, so that the silicon wafers can be cleaned more cleanly.

[0038] In addition, the first driving mechanism 40 is arranged on the outside of the housing 10, and the first driving mechanism 40 is in transmission connection with the first cleaning basket 20, so that the first driving mechanism 40 can provide the first cleaning basket 20 with rotational power, and the first driving mechanism 40 can be arranged as a servo motor, so that the first driving mechanism 40 can control the first cleaning basket 20 to swing, so that the silicon wafers in the first cleaning basket 20 can be cleaned multiple times. Moreover, the first driving mechanism 40 can also control the rotation angle of the first cleaning basket 20, and the silicon wafers in the first cleaning basket 20 can be transported to the second cleaning basket 30, so that the silicon wafers in the second cleaning basket 30 can be cleaned again.

[0039] Thus, the silicon wafer cleaning device 100 can transport the silicon wafers in the first cleaning basket 20 to the second cleaning basket 30, and can clean the silicon wafers multiple times, so that the silicon wafers can be cleaned more thoroughly, and the cleaning speed can be increased, thereby improving the cleaning efficiency.

[0040] According to some embodiments of the present invention, Figure 2 and Figure 3 As shown, the first cleaning basket 20 includes: a first basket body 21 and a first rotating shaft 22, the first rotating shaft 22 is connected to the opposite sides of the first basket body 21, and the first rotating shaft 22 can be rotatably disposed on the shell 10, the first driving mechanism 40 is located outside the shell 10, and the first driving mechanism 40 is transmission-connected to the first rotating shaft 22 located on one side.

[0041] Among them, the first cleaning basket 20 is mainly composed of a first frame body 21 and a first rotating shaft 22. The first rotating shaft 22 passes through the first frame body 21, and the first rotating shaft 22 is located on opposite sides of the first frame body 21, so that the first rotating shaft 22 can be subjected to more uniform force during rotation, thereby making the first cleaning basket 20 more stable during rotation, and the first rotating shaft 22 can be rotatably set on the shell 10, so that the first cleaning basket 20 can be rotated relative to the shell 10.

[0042] In addition, the first driving mechanism 40 is in driving connection with the first rotating shaft 22 , so that the first driving mechanism 40 can provide the first rotating shaft 22 with rotational power and can also control the rotation angle of the first rotating shaft 22 .

[0043] According to some embodiments of the present invention, Figure 2 As shown, the silicon wafer cleaning device 100 also includes: a second driving mechanism 41, which is arranged on the shell 10, and the second driving mechanism 41 is transmission-connected to the second cleaning basket 30, and the second cleaning basket 30 is suitable for rotating relative to the shell 10 under the driving action of the second driving mechanism 41, and the maximum rotation angle of the second cleaning basket 30 is smaller than the maximum rotation angle of the first cleaning basket 20.

[0044] Among them, the second driving mechanism 41 can be set as a servo motor. When the silicon wafers in the first cleaning basket 20 are cleaned, the first cleaning basket 20 is driven by the first driving mechanism 40 to rotate, so that the first cleaning basket 20 can be flipped over, so that all the silicon wafers in the first cleaning basket 20 can fall into the second cleaning basket 30.

[0045] Furthermore, the second driving mechanism 41 can provide rotational power to the second cleaning basket 30, so that the second cleaning basket 30 can be rotated. The maximum rotation angle of the second cleaning basket 30 is smaller than the maximum rotation angle of the first cleaning basket 20. For example, the maximum rotation angle of the first cleaning basket 20 is set to 90°, and the maximum rotation angle of the second cleaning basket 30 can be set to 60°. In this way, the silicon wafers in the second cleaning basket 30 can be prevented from tipping over.

[0046] According to some embodiments of the present invention, Figure 3 As shown, the second cleaning basket 30 includes: a second basket body 31 and a second rotating shaft 32, the second rotating shaft 32 is connected to the opposite sides of the second basket body 31, and the second rotating shaft 32 can be rotatably arranged on the shell 10, the second driving mechanism 41 is located outside the shell 10, and the second driving mechanism 41 is transmission-connected to the second rotating shaft 32 located on one side.

[0047] Among them, the second cleaning basket 30 is mainly composed of a second frame body 31 and a second rotating shaft 32. The second rotating shaft 32 passes through the opposite sides of the second frame body 31, so that the second frame body 31 can rotate relative to the second rotating shaft 32. Moreover, the second rotating shaft 32 is located on the opposite sides of the second frame body 31, so that the second rotating shaft 32 can be subjected to more uniform force during the rotation process, thereby making the second cleaning basket 30 more stable during the rotation process, and the second rotating shaft 32 can be rotatably set on the shell 10, so that the second cleaning basket 30 can be rotated relative to the shell 10.

[0048] In addition, the second driving mechanism 41 is in driving connection with the second rotating shaft 32 , so that the second driving mechanism 41 can provide the second rotating shaft 32 with rotational power and can also control the rotation angle of the second rotating shaft 32 .

[0049] According to some embodiments of the present invention, Figure 2 As shown, the silicon wafer cleaning device 100 further includes: a pressure sensor 50 , which is disposed on the first cleaning basket 20 , and is used to detect the pressure of the first cleaning basket 20 , and the pressure sensor 50 is electrically connected to the first driving mechanism 40 .

[0050] Among them, a pressure sensor 50 is attached to the bottom of the first cleaning basket 20. When the weight of the first cleaning basket 20 reaches the set weight, the first driving mechanism 40 drives the first cleaning basket 20 to rotate, so that the silicon wafers fall into the second cleaning basket 30. The second driving mechanism 41 drives the second cleaning basket 30 to swing, so that the silicon wafers can be cleaned again. Multiple cleanings can make the silicon wafers cleaner.

[0051] In addition, the pressure sensor 50 is connected to the first driving mechanism 40 by electrical signals. When the pressure sensor 50 senses the set pressure value, it sends a signal to the first driving mechanism 40, so that the first driving mechanism 40 is turned on, driving the first rotating shaft 22 to rotate, thereby allowing the first cleaning basket 20 to rotate, so that the silicon wafers in the first cleaning basket 20 are poured into the second cleaning basket 30. At the same time, the first rotating shaft 22 is connected to the external control end by electrical signals, and the staff rotates the first cleaning basket 20 back to normal through the external control end.

[0052] According to some embodiments of the present invention, Figure 2 As shown, the silicon wafer cleaning device 100 also includes: a liquid spraying mechanism 60 and a circulation mechanism 70. The liquid spraying mechanism 60 is arranged above the first cleaning basket 20, so that it can be used to spray cleaning liquid to the silicon wafers in the first cleaning basket 20. One end of the circulation mechanism 70 is connected to the liquid spraying mechanism 60, and the other end of the circulation mechanism 70 is connected to the bottom of the shell 10, so that the cleaning liquid located at the bottom of the shell 10 can be sucked into the liquid spraying mechanism 60.

[0053] Among them, the liquid spraying mechanism 60 is located above the first cleaning basket 20, which can facilitate the liquid spraying mechanism 60 to spray cleaning liquid onto the first cleaning basket 20. Furthermore, since the first cleaning basket 20 can be rotated, the silicon wafers in the first cleaning basket 20 can be cleaned at various angles, thereby avoiding partial incomplete cleaning of the silicon wafers in the first cleaning basket 20.

[0054] In addition, one end of the circulation mechanism 70 is connected to the liquid spraying mechanism 60, and the other end of the circulation mechanism 70 is connected to the bottom of the shell 10. During the cleaning process of the silicon wafer, the cleaning liquid will fall into the bottom of the shell 10. The setting of the circulation mechanism 70 can make the cleaning liquid at the bottom of the shell 10 flow to the first cleaning basket 20 or the second cleaning basket 30 through the circulation mechanism 70, thereby realizing the recycling of the cleaning liquid and reducing costs.

[0055] According to a specific embodiment of the utility model, the liquid spraying mechanism 60 includes: a delivery pipe 61 and a plurality of nozzles 62, the plurality of nozzles 62 are arranged on the delivery pipe 61, and the plurality of nozzles 62 are respectively used to spray cleaning liquid onto the silicon wafers in the first cleaning basket 20, and the circulation mechanism 70 includes: a circulation pipe 71 and a circulation driving member 72, one end of the circulation pipe 71 is connected to one end of the delivery pipe 61, and the other end of the circulation pipe 71 is connected to the bottom of the shell 10, and the circulation driving member 72 is arranged on the circulation pipe 71, so as to provide a suction force to draw the cleaning liquid located at the bottom of the shell 10 to the delivery pipe 61.

[0056] Specifically, the liquid spraying mechanism 60 is mainly composed of a delivery pipe 61 and a plurality of nozzles 62. The delivery pipe 61 is located above the first cleaning basket 20, and the delivery pipe 61 is extended along the length direction of the first cleaning basket 20. The plurality of nozzles 62 are spaced apart along the length direction of the delivery pipe 61, so that the cleaning liquid can be evenly sprayed on the silicon wafers in the first cleaning basket 20, thereby further improving the cleaning speed and cleaning efficiency of the silicon wafers.

[0057] Furthermore, the circulation mechanism 70 is mainly composed of a circulation pipe 71 and a circulation driving member 72. The circulation driving member 72 can provide power to the cleaning liquid transported upward from the bottom of the shell 10, thereby facilitating the transportation of the cleaning liquid at the bottom of the shell 10 to the delivery pipe 61.

[0058] According to some embodiments of the present invention, Figure 3 As shown, the silicon wafer cleaning device 100 further includes: a one-way valve 80 , which is disposed at the other end of the delivery pipe 61 , and the one-way valve 80 only allows the cleaning liquid to flow from the outer liquid inlet pipe to the delivery pipe 61 .

[0059] The one-way valve 80 is connected to the delivery pipe 61 , so that the cleaning liquid can flow in one direction, that is, from the outer liquid inlet pipe to the delivery pipe 61 , thereby avoiding the backflow phenomenon.

[0060] In addition, a drain pipe 97 is provided at the bottom of the housing 10, and the drain pipe 97 passes through the outside of the housing 10, so that the staff can easily drain the dirty liquid in the bottom of the housing 10. At the same time, the first rotating shaft 22 is electrically connected to the solenoid valve provided at the drain pipe 97. When the first rotating shaft 22 rotates once, an electrical signal is sent to the solenoid valve. When the solenoid valve receives the electrical signal twice, the drain pipe 97 is automatically opened to discharge the dirty liquid. After the dirty liquid is discharged, the staff injects liquid into the silicon wafer cleaning device 100 through the liquid inlet pipe, so that the silicon wafer can be cleaned.

[0061] According to some embodiments of the present invention, Figure 3As shown, the silicon wafer cleaning device 100 also includes: a cleaning member 81 and a third driving mechanism 90. The cleaning member 81 is arranged in the second cleaning basket 30. The third driving mechanism 90 is arranged in the second cleaning basket 30. The third driving mechanism 90 is transmission-connected with the cleaning member 81, so as to drive the cleaning member 81 to translate in the second cleaning basket 30.

[0062] Among them, the third driving mechanism 90 can provide power for the movement of the cleaning member 81, so that the cleaning member 81 can act on the silicon wafers in the second cleaning basket 30. When the third driving mechanism 90 drives the cleaning member 81 to move, the cleaning member 81 can achieve contact cleaning of the silicon wafers in the second cleaning basket 30, thereby making the silicon wafers in the second cleaning basket 30 cleaned more thoroughly.

[0063] According to the specific embodiment of the utility model, Figure 3 As shown, the third driving mechanism 90 includes: a translation driving member 91, a screw rod 92, a guide rod 93 and a screw rod fitting member 94. The screw rod 92 can be rotatably set on the second cleaning basket 30. One end of the screw rod 92 is connected to the translation driving member 91. The guide rod 93 is set on the second cleaning basket 30, and the guide rod 93 is set parallel to the screw rod 92. The screw rod fitting member 94 is threadedly matched with the screw rod 92, and the screw rod fitting member 94 is passed through the guide rod 93. The cleaning member 81 is set on the screw rod fitting member 94.

[0064] Specifically, the third driving mechanism 90 is mainly composed of a translational driving member 91, a screw rod 92, a guide rod 93 and a screw rod matching member 94, wherein the translational driving member 91 can be set as a servo motor, and the cleaning member 81 can be set as a sponge brush. The translational driving member 91 can provide driving force to the screw rod 92, and the screw rod 92 is converted from spiral rotation to linear motion under the action of the translational driving member 91, thereby realizing the translational motion of the cleaning member 81.

[0065] Furthermore, the second cleaning basket 30 is also provided with a guide rod 93, which is located directly below the screw rod 92, and the guide rod 93 is arranged parallel to the screw rod 92, thereby ensuring that the moving direction of the cleaning member 81 remains unchanged during the translation process, and can also make the cleaning member 81 more stable during the movement process, and can also prevent the cleaning member 81 from fluctuating during the cleaning process, so that the silicon wafer can be better cleaned.

[0066] Moreover, the cleaning member 81 is connected to the screw rod 92 via the screw rod fitting 94, which can facilitate the replacement of the cleaning member 81 and avoid wear when the cleaning member 81 and the screw rod 92 are connected and fitted, thereby protecting the cleaning member 81.

[0067] Also, if Figure 1As shown, a feed port 95 is provided above the silicon wafer cleaning device 100, and the feed port 95 extends to the interior of the shell 10. By providing the feed port 95, it is convenient for the staff to feed the silicon wafers into the first cleaning basket 20 through the feed port 95. A reminder light 96 is also fixedly installed above the silicon wafer cleaning device 100. When the silicon wafer cleaning is completed, the reminder light 96 will flash to remind the staff to take out the silicon wafers in time, thereby facilitating the cleaning of the next batch of silicon wafers.

[0068] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0069] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0070] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A silicon wafer cleaning device, characterized in that: include: case; a first cleaning basket rotatably disposed in the housing; a second cleaning basket, the second cleaning basket being disposed in the housing and being located below the first cleaning basket; The first driving mechanism is arranged on the shell and is drivingly connected to the first cleaning basket. The first cleaning basket is suitable for rotating relative to the shell under the driving action of the first driving mechanism to transport the silicon wafers in the first cleaning basket to the second cleaning basket.

2. The silicon wafer cleaning device according to claim 1, characterized in that: The first cleaning basket comprises: The first basket; The first rotating shaft is connected to opposite sides of the first housing and is rotatably disposed on the shell. The first driving mechanism is located outside the shell and is drivingly connected to the first rotating shaft located on one side.

3. The silicon wafer cleaning device according to claim 1, characterized in that: Also includes: A second driving mechanism is disposed on the shell and is transmission-connected to the second cleaning basket. The second cleaning basket is adapted to rotate relative to the shell under the driving action of the second driving mechanism. The maximum rotation angle of the second cleaning basket is smaller than the maximum rotation angle of the first cleaning basket.

4. The silicon wafer cleaning device according to claim 3, characterized in that: The second cleaning basket comprises: second basket; The second rotating shaft is connected to opposite sides of the second housing and is rotatably disposed on the shell. The second driving mechanism is located outside the shell and is drivingly connected to the second rotating shaft located on one side.

5. The silicon wafer cleaning device according to claim 1, characterized in that: Also includes: A pressure sensor is provided on the first cleaning basket, and is used to detect the pressure of the first cleaning basket. The pressure sensor is electrically connected to the first driving mechanism.

6. The silicon wafer cleaning device according to claim 1, characterized in that: Also includes: a liquid spraying mechanism, the liquid spraying mechanism being disposed above the first cleaning basket and being used for spraying cleaning liquid onto the silicon wafers in the first cleaning basket; A circulation mechanism, one end of which is connected to the liquid spraying mechanism, and the other end of which is connected to the bottom of the shell, so as to draw the cleaning liquid at the bottom of the shell to the liquid spraying mechanism.

7. The silicon wafer cleaning device according to claim 6, characterized in that: The liquid spraying mechanism comprises: Delivery pipe; A plurality of nozzles, the plurality of nozzles are arranged on the conveying pipe and are respectively used to spray cleaning liquid onto the silicon wafers in the first cleaning basket; The circulation mechanism comprises: A circulation pipe, one end of which is connected to one end of the delivery pipe, and the other end of which is connected to the bottom of the shell; A circulation drive member is arranged on the circulation pipe to provide a suction force for sucking the cleaning liquid at the bottom of the shell to the delivery pipe.

8. The silicon wafer cleaning device according to claim 7, characterized in that: Also includes: A one-way valve is arranged at the other end of the delivery pipe, and the one-way valve only allows the cleaning liquid to flow from the outer liquid inlet pipe to the delivery pipe.

9. The silicon wafer cleaning device according to claim 1, characterized in that: Also includes: a cleaning member, the cleaning member being disposed in the second cleaning basket; A third driving mechanism is provided on the second cleaning basket and is in driving connection with the cleaning member to drive the cleaning member to translate in the second cleaning basket.

10. The silicon wafer cleaning device according to claim 9, characterized in that: The third driving mechanism comprises: Translation drive member; A screw rod, the screw rod is rotatably disposed on the second cleaning basket, and one end of the screw rod is connected to the translation driving member; A guide rod, the guide rod is arranged on the second cleaning basket and is arranged parallel to the screw rod; A screw rod matching piece is matched with the screw rod thread and is passed through the guide rod, and the cleaning piece is arranged on the screw rod matching piece.

Images