Position adjusting assembly and laminating device
By designing position adjustment components for semiconductor processes, the mobile platform is used to drive the support structure and center-facing structure to move, so that the to-adjustment part automatically touches the center-facing part, solving the problem of reduced accuracy caused by the position offset of the pallet and achieving high efficiency , precise position adjustment.
Patent Information
- Application Number
- CN202420274334.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-04
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-02-04
AI Technical Summary
In semiconductor technology, the position shift is prone to occur after multiple translations and lifting movements, resulting in a reduction in the center alignment accuracy of the pallet and wafer, which requires manual adjustment operation, which is complex and inefficient.
Design a position adjustment component, including a support structure, a center structure and a mobile platform, and drives the support structure and a center structure to move through the mobile platform, so that the first to be adjusted touches the first center part, and automatically realizes the central position. Adjustment.
The efficiency of center position adjustment of the adjustment parts is improved, the movement mechanism is simplified, the fault tolerance is increased, and the rapid and accurate position adjustment is achieved.
Smart Images

Figure CN222440565U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor preparation, in particular to a position adjustment component and a chip assembly device. Background Art
[0002] In the semiconductor manufacturing process, an automated method (such as the cooperation between a lifting mechanism and a robot) is usually used to pick up and place wafers from a tray. This method of picking and placing places extremely high requirements on the center alignment accuracy of both the tray and the wafer.
[0003] However, in the semiconductor process, the tray is very likely to have positional deviation problems after multiple translation and lifting movements, resulting in reduced center alignment accuracy between the tray and the wafer. In this case, manual adjustment of the tray or wafer is often required, which is complicated and inefficient, affecting the efficiency of wafer placement. Utility Model Content
[0004] The purpose of the utility model is to provide a position adjustment component and a closing device, which can drive the first part to be adjusted to touch the first pair of center parts through a mobile platform, so that the center position of the first part to be adjusted can be automatically adjusted during the collision between the first part to be adjusted and the first pair of center parts, thereby improving the efficiency of the center position adjustment of the first part to be adjusted.
[0005] In order to achieve the above object, the utility model is implemented through the following technical solutions:
[0006] A position adjustment component, used for adjusting the center position of a wafer or a wafer tray, characterized in that the position adjustment component comprises:
[0007] A supporting structure, the supporting structure comprising at least two relatively fixed first supporting parts, the first supporting part comprising a first supporting surface arranged horizontally and a first stopper arranged protruding from the first supporting surface, the first stopper defining a first accommodating part, the first accommodating part comprising an accommodating space for accommodating a first part to be adjusted;
[0008] A centering structure, the centering structure having a first centering portion, an upper surface of the first centering portion at least partially higher than a first supporting surface, and a lower surface of the first centering portion at least partially lower than a height of the first to-be-adjusted member located on the first supporting surface; and
[0009] A mobile platform, wherein the mobile platform comprises at least one moving path, and the mobile platform is capable of driving one of the supporting structure and the centering structure to move along the moving path toward the other of the supporting structure and the centering structure; when the mobile platform is located at the end point of the moving path, the first centering portion is at least partially located within the accommodation space of the first accommodation portion.
[0010] Optionally, when the moving platform is located at the end point of the moving path, the first centering portion and at least one of the first stop portions define a second accommodating portion, and a size of the second accommodating portion matches a size of the first part to be adjusted.
[0011] Optionally, a first accommodating radius is defined as a minimum distance from a center of the first accommodating portion to the first stop portion, and a second accommodating radius is defined as a minimum distance from a center of the second accommodating portion to the first centering portion, and the first accommodating radius is larger than the second accommodating radius.
[0012] Optionally, the first to-be-adjusted member is configured in a disc shape.
[0013] Optionally, the first centering portion and the first stop portion are located at the same horizontal height, and the first centering portion includes a first curved side surface facing the accommodating space of the first accommodating portion, and the radius of the first curved side surface matches the radius of the first part to be adjusted; the first stop portion includes a second curved side surface facing the accommodating space of the first accommodating portion, and the radius of the second curved side surface matches the radius of the first part to be adjusted.
[0014] Optionally, the first centering portion and the first stop portion are located at the same horizontal height, and the first centering portion includes a plurality of first positioning blocks arranged at intervals along a first arc, and the radius of the first arc matches the radius of the first part to be adjusted.
[0015] Optionally, the supporting structure further includes a second supporting portion, the second supporting portion includes a second supporting surface arranged horizontally and a second stop portion arranged to protrude from the second supporting surface, the second stop portion defines a third accommodating portion for accommodating a second to-be-adjusted member, and the second supporting portion is relatively fixed to the first supporting portion;
[0016] The centering structure further comprises: a second centering portion, which is fixed relative to the first centering portion, and the second centering portion and the second supporting portion are located at the same level;
[0017] When the mobile platform is located at the end point of the moving path, the second centering portion is at least partially located in the accommodating space of the third accommodating portion; the second centering portion and at least part of the second stop portion define a fourth accommodating portion, and the size of the fourth accommodating portion matches the size of the second part to be adjusted.
[0018] Optionally, the first supporting portion and the first centering portion are configured as a first position adjustment combination, and the second supporting portion and the second centering portion are configured as a second position adjustment combination; the second position adjustment combination and the first position adjustment combination are spaced apart in the same vertical direction, and the second position adjustment combination is located above the first position adjustment combination.
[0019] On the other hand, the utility model further provides a wafer assembly device using the position adjustment assembly as described above, which is used to combine a wafer and a wafer tray, wherein the first part to be adjusted in the position adjustment assembly is configured as a wafer tray, and the second part to be adjusted is configured as a wafer; the wafer assembly device further includes:
[0020] a sensor fixed relative to the centering structure for identifying the orientation of the wafer tray and the wafer;
[0021] A driving mechanism, used for driving the supporting structure to rotate along a first axis to adjust the direction of the wafer tray; and
[0022] The lifting mechanism can penetrate the center position of the supporting structure in the vertical direction to perform lifting movement, and is used to drive the wafer and / or a part of the wafer tray to perform ascending or descending movement.
[0023] Compared with the prior art, the utility model has at least one of the following advantages:
[0024] The utility model provides a position adjustment component and a closing device, wherein a moving platform can drive one of a supporting structure and a centering structure to move along a moving path toward the other of the supporting structure and the centering structure, so that a first part to be adjusted located on the supporting structure can touch the first centering portion, thereby automatically realizing the center position adjustment of the first part to be adjusted during the collision between the first part to be adjusted and the first centering portion. Since the adjustment action of the entire position adjustment component is single and does not need to be linked with other parts during the movement process, the movement mechanism is simple to realize and has a high fault tolerance rate, thereby effectively improving the efficiency of the center position adjustment of the first part to be adjusted.
[0025] When the mobile platform in the utility model is located at the end point of the moving path, the first centering portion is at least partially located in the accommodating space of the first accommodating portion. At this time, the first centering portion and the first stop portion define a second accommodating portion, and the size of the second accommodating portion matches the size of the first part to be adjusted, so that the second accommodating portion limits the position of the first part to be adjusted, thereby enabling the center position of the first part to be adjusted to be quickly and accurately adjusted.
[0026] The mobile platform in the utility model can also drive the second part to be adjusted located on the supporting structure to touch the second centering part, so as to automatically adjust the center position of the second part to be adjusted; and when the first part to be adjusted and the second part to be adjusted are driven by the mobile platform to approach the centering structure at the same time, the center positions of the first part to be adjusted and the second part to be adjusted can be adjusted at the same time, thereby effectively improving the adjustment efficiency.
[0027] The utility model has the characteristics of simple structure, strong versatility, convenient operation and low manufacturing cost. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 It is a cross-sectional schematic diagram of a position adjustment assembly provided in the first embodiment of the utility model;
[0029] Figure 2 It is a top view of a position adjustment assembly provided in the first embodiment of the utility model;
[0030] Figure 3 It is a cross-sectional schematic diagram of a position adjustment component provided in the first embodiment of the utility model at the end point of the moving path;
[0031] Figure 4 It is a top view of a position adjustment component provided in the first embodiment of the utility model at the end point of the moving path;
[0032] Figure 5 It is a cross-sectional schematic diagram of a position adjustment component provided in the second embodiment of the present utility model. DETAILED DESCRIPTION
[0033] The following is a further detailed description of a position adjustment component and a closing device proposed in the utility model in combination with the accompanying drawings and specific implementation methods. According to the following description, the advantages and features of the utility model will be clearer. It should be noted that the accompanying drawings are in a very simplified form and use non-precise proportions, which are only used to conveniently and clearly assist in explaining the purpose of the implementation method of the utility model. In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, please refer to the accompanying drawings. It should be noted that the structure, proportion, size, etc. illustrated in the drawings of this specification are only used to match the content disclosed in the specification for people familiar with this technology to understand and read, and are not used to limit the limiting conditions for the implementation of the utility model, so it has no technical substantive significance. Any modification of the structure, change of the proportional relationship or adjustment of the size, without affecting the effect that the utility model can produce and the purpose that can be achieved, should still fall within the scope of the technical content disclosed by the utility model.
[0034] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
[0035] Embodiment 1
[0036] Combined with Figures 1 to 4 As shown, this embodiment provides a position adjustment component for adjusting the center position of a wafer or a wafer tray; the position adjustment component includes: a supporting structure 20, the supporting structure 20 includes a first supporting portion 210, the first supporting portion 210 includes a first supporting surface 2101 arranged horizontally and a first stop portion 2102 protruding from the first supporting surface 2101 and located at the edge of the first supporting surface 2101, the first stop portion 2102 defines a first accommodating portion, the first accommodating portion includes a first The accommodating space of the part to be adjusted 101; the centering structure 30, the centering structure 30 having a first centering portion 310, the upper surface 3101 of the first centering portion 310 at least partially higher than the first supporting surface 2101, the lower surface 3102 of the first centering portion 310 at least partially lower than the height of the first part to be adjusted 101 located on the first supporting surface 2101, so that the first centering portion 310 can touch the first part to be adjusted 101; and a moving platform 40, the moving platform 40 having at least one moving path. In this embodiment, the moving platform 40 can drive the supporting structure 20 to move toward the centering structure 30 along the moving path. Specifically, in this embodiment, at least one of the first stopper 2102 and the first centering portion 310 are respectively located on opposite sides of the first accommodating portion on the moving path. In other optional embodiments, the moving platform 40 can also be configured to drive the centering structure 30 to move toward the supporting structure 20 (not shown).
[0037] Specifically, in one embodiment, the supporting structure 20 can be mounted on the mobile platform 40 via a mounting base 50, that is, the supporting structure 20 is fixed on the mounting base 50, and the mounting base 50 is mounted on the mobile platform 40. Optionally, the mounting base 50 can be rotatably connected to the mobile platform 40 via a bearing 51, so as to facilitate the subsequent wafer and wafer tray assembly operation in the assembly device using the position adjustment assembly, but the present invention is not limited thereto.
[0038] Specifically, in one embodiment, the centering structure 30 can be fixed at the end position of the moving path; the moving platform 40 can reciprocate between the starting point and the end point of the moving path to drive the supporting structure 20 and the first part to be adjusted 101 located in the first accommodating portion to approach or move away from the first centering portion 310; and when the first part to be adjusted 101 approaches the first centering portion 310, the edge of the first part to be adjusted 101 touches the first centering portion 310, thereby automatically realizing the center position adjustment of the first part to be adjusted 101 in the process of collision between the edge of the first part to be adjusted 101 and the first centering portion 310, and then realizing the center position adjustment of the first part to be adjusted 101 through a single movement action, thereby improving the efficiency and fault tolerance of the center position adjustment of the first part to be adjusted 101. Optionally, the first part to be adjusted 101 is in the shape of a disk, and the size of the accommodation space of the first accommodation portion is larger than the size of the first part to be adjusted 101, that is, the minimum distance from the center of the first accommodation portion to the first stop portion 2012 is larger than the radius of the first part to be adjusted 101, so that even if the position of the first part to be adjusted 101 has a large deviation during the transportation process, the first part to be adjusted 101 can be smoothly placed in the first accommodation portion. Preferably, the first part to be adjusted 101 is configured as a wafer or wafer tray in a disk shape, but the utility model is not limited thereto.
[0039] Specifically, in one embodiment, at least one of the first stop portions 2102 and the first centering portion 310 are arranged relative to each other on the above-mentioned moving path to limit the moving distance of the first part to be adjusted 101 on the first supporting surface 2101 when the center position of the first part to be adjusted 101 is adjusted, thereby preventing the first part to be adjusted 101 from being forced to fall from the first supporting surface 2101 during the collision between the first part to be adjusted 101 and the first centering portion 310.
[0040] Please continue to refer to Figures 1 to 4 , the mobile platform 40 includes a first position located at the starting point of the mobile path and a second position located at the end point of the mobile path; Figure 3 and Figure 4As shown, when the mobile platform 40 is at the second position, that is, at the end of the moving path, the first centering portion 310 is at least partially located in the accommodation space of the first accommodation portion, and the first centering portion 310 and at least one of the first stop portions 2102 define a second accommodation portion, and the size of the second accommodation portion matches the size of the first part to be adjusted 101. Specifically, it is useful to define the first accommodation radius as the minimum distance from the center of the first accommodation portion to the first stop portion, and define the second accommodation radius as the minimum distance from the center of the second accommodation portion to the first centering portion, and the first accommodation radius is greater than the second accommodation radius, so that when the mobile platform 40 is located at the end of the moving path, the first centering portion 310 can constrict the accommodation space of the first accommodation portion, and the first part to be adjusted 101 can be accurately limited to the preset position.
[0041] Specifically, in one embodiment, Figure 3 and Figure 4 As shown, in the process of the mobile platform 40 moving to the end point of the moving path, the first centering portion 310 touches the first part to be adjusted 101 in the first accommodating portion and pushes the first part to be adjusted 101 to move on the first supporting surface 2101, so that the edge of the other side of the first part to be adjusted 101 abuts against the first stop portion 2102. At this time, the first centering portion 310 cooperates with the first stop portion 2102 on the other side of the first part to be adjusted 101 to form the second accommodating portion, and the second accommodating portion can just limit the position of the first part to be adjusted 101, that is, the size of the second accommodating portion matches the size of the first part to be adjusted 101, so that the center position of the first part to be adjusted 101 can be quickly and accurately adjusted.
[0042] Please continue to refer to Figure 3 and Figure 4 In this embodiment, the first centering portion 310 and the first stop portion 2102 are located at the same horizontal height, and the first centering portion 310 includes a first arc-shaped side surface facing the accommodating space of the first accommodating portion, and the radius of the first arc-shaped side surface matches the radius of the first part to be adjusted 101; the first stop portion 2102 includes a second arc-shaped side surface facing the accommodating space of the first accommodating portion, and the radius of the second arc-shaped side surface matches the radius of the first part to be adjusted 101, so that the radius of the second accommodating portion formed by the first centering portion 310 and the first stop portion 2102 matches the radius of the first part to be adjusted 101, so that the second accommodating portion can adjust the position of the first part to be adjusted 101 at multiple angles, and thus the center position of the first part to be adjusted 101 can be quickly and accurately adjusted.
[0043] In other embodiments, the first centering portion 310 and the first stop portion 2102 are located at the same horizontal height, and the first centering portion 310 includes a plurality of first positioning blocks arranged at intervals along a first arc, and the radius of the first arc matches the radius of the first part to be adjusted 101; further, the first stop portion 2102 can be arranged at intervals along a second arc, and the radius of the second arc matches the radius of the first part to be adjusted 101; in this case, the radius of the second accommodating portion formed by the first centering portion 310 and the first stop portion 2102 can also be made to match the radius of the first part to be adjusted 101.
[0044] Embodiment 2
[0045] Combined with Figure 5 As shown, the difference between this embodiment and the first embodiment is that the supporting structure 20 further includes a second supporting portion 220, the second supporting portion 220 includes a second supporting surface 2201 arranged horizontally and a second stop portion 2202 arranged protruding from the second supporting surface 2201 and located at the edge of the second supporting surface 2201, the second stop portion 2202 defines a third accommodating portion for accommodating the second to-be-adjusted member 102, and the second supporting portion 220 is relatively fixed to the first supporting portion 210. The centering structure 30 further includes: a second centering portion 320, which is fixed relative to the first centering portion 310, the second centering portion 320 and the second supporting portion 220 are located at the same horizontal height; and the upper surface of the second centering portion 320 is at least partially higher than the second supporting surface 2201, and the lower surface of the second centering portion 320 is at least partially lower than the height of the second to-be-adjusted member 102 located on the second supporting surface 2201. When the moving platform 40 is located at the end point of the moving path, the second centering portion 320 is at least partially located in the accommodating space of the third accommodating portion, and the second centering portion 320 and at least part of the second stop portion 2202 define a fourth accommodating portion, and the size of the fourth accommodating portion matches the size of the second adjustable member 102.
[0046] Specifically, in one embodiment, the mobile platform 40 reciprocates between the starting point and the end point of the moving path, and can also drive the second to-be-adjusted part 102 located in the third accommodating portion to approach or move away from the second centering portion 320; and when the second to-be-adjusted part 102 approaches the second centering portion 320, the edge of the second to-be-adjusted part 102 touches the second centering portion 320, so that the center position of the second to-be-adjusted part 102 is automatically adjusted during the collision between the edge of the second to-be-adjusted part 102 and the second centering portion 320, thereby improving the efficiency of adjusting the center position of the second to-be-adjusted part 102. Furthermore, the mobile platform 40 can simultaneously drive the first to-be-adjusted part 101 and the second to-be-adjusted part 102 to approach the centering structure 30, so that the center positions of the first to-be-adjusted part 101 and the second to-be-adjusted part 102 can be adjusted simultaneously, thereby effectively improving the adjustment efficiency.
[0047] Specifically, in one embodiment, the second part to be adjusted 102 is disc-shaped, and the size of the third accommodating portion is larger than the size of the second part to be adjusted 102, that is, the minimum distance from the center of the third accommodating portion to the second stop portion 2202 is larger than the radius of the second part to be adjusted 102, so that even if the position of the second part to be adjusted 102 has a large deviation during the transportation process, the second part to be adjusted 102 can be smoothly placed in the third accommodating portion, thereby increasing the tolerance for adjusting the center position of the second part to be adjusted 102.
[0048] Specifically, in one embodiment, at least one of the second stopper portions 2202 and the second centering portion 320 are arranged opposite to each other on the moving path, that is, at least one of the second stopper portions 2202 and the second centering portion 320 are respectively located on opposite sides of the third accommodating portion on the moving path. The second stopper portion 2202 can limit the moving stroke of the second to-be-adjusted member 102 when the center position of the second to-be-adjusted member 102 is adjusted, thereby preventing the second to-be-adjusted member 102 from being forced to fall off the second supporting surface 2201 during the collision between the second to-be-adjusted member 102 and the second centering portion 320.
[0049] More specifically, in the process of the mobile platform 40 moving to the end point of the moving path, the second centering portion 320 touches the second part to be adjusted 102 in the third accommodating portion and pushes the second part to be adjusted 102 to move on the second supporting surface 2201, so that the edge of the other side of the second part to be adjusted 102 abuts against the second stop portion 2202. At this time, the second centering portion 320 cooperates with the second stop portion 2202 on the other side of the second part to be adjusted 102 to form the fourth accommodating portion, and the fourth accommodating portion can just limit the position of the second part to be adjusted 102, that is, the size of the fourth accommodating portion matches the size of the second part to be adjusted 102, so that the center position of the second part to be adjusted 102 can be quickly and accurately adjusted.
[0050] In addition, when the second part to be adjusted 102 is in the shape of a disk, the second centering portion 320 may include a third curved side surface facing the accommodating space of the third accommodating portion, and the radius of the third curved side surface matches the radius of the second part to be adjusted 102; the second stop portion 2202 includes a fourth curved side surface facing the accommodating space of the third accommodating portion, and the radius of the fourth curved side surface matches the radius of the second part to be adjusted 102, so that the radius of the fourth accommodating portion formed by the second centering portion 320 and the second stop portion 2202 matches the radius of the second part to be adjusted 102, so that the fourth accommodating portion can adjust the position of the second part to be adjusted 102 at multiple angles, thereby improving the efficiency and accuracy of adjusting the center position of the second part to be adjusted 102.
[0051] In other embodiments, when the second part to be adjusted 102 is in the shape of a disk, the second centering portion 320 may include a plurality of second positioning blocks arranged at intervals along a third arc, and the radius of the third arc matches the radius of the second part to be adjusted 102; further, the second stop portion 2202 may be arranged at intervals along a fourth arc, and the radius of the fourth arc matches the radius of the second part to be adjusted 102; in this case, the radius of the fourth accommodating portion formed by the second centering portion 320 and the second stop portion 2202 may also be made to match the radius of the second part to be adjusted 102.
[0052] Specifically, in one embodiment, the first supporting portion 210 and the first centering portion 310 are configured as a first position adjustment assembly, and the second supporting portion 220 and the second centering portion 320 are configured as a second position adjustment assembly; the second position adjustment assembly and the first position adjustment assembly are arranged in the same vertical direction, and the second position adjustment assembly is located above the first position adjustment assembly. Optionally, the first to-be-adjusted part 101 is configured as a wafer tray, and the second to-be-adjusted part 102 is configured as a wafer, but the present invention is not limited thereto.
[0053] On the other hand, combined with Figure 5 As shown, the utility model also provides a piece-closing device using a position adjustment component as described in Example 2, wherein the first part to be adjusted 101 in the position adjustment component is configured as a wafer tray, and the second part to be adjusted 102 is configured as a wafer; the piece-closing device also includes: a sensor 60, which is fixed relative to the centering structure 30, and is used to identify the directions of the wafer tray and the wafer; a driving mechanism 70, which is used to drive the supporting structure 20 to rotate along the first axis AA to adjust the direction of the wafer tray; and a lifting mechanism 80, which can penetrate the center position of the supporting structure 20 in the vertical direction to perform lifting and lowering movements, and is used to drive the wafer and / or a part of the wafer tray to perform rising or falling movements.
[0054] Specifically, the wafer tray can be placed in the first accommodating portion as the first part to be adjusted, and the wafer can be placed in the third accommodating portion as the second part to be adjusted; and a first mark is provided on the wafer tray, and a second mark is provided on the wafer, and the sensor 60 determines the direction of the wafer tray based on the detected first mark and determines the direction of the wafer based on the detected second mark; optionally, the sensor 60 uses the polar angle of the first mark or the second mark in the preset polar coordinate system as the corresponding direction of the wafer tray or the wafer. More specifically, the sensor 60 is electrically connected to the drive mechanism 70, and when the sensor 60 detects that the first mark or the second mark is located at a set position, it generates a first drive mechanism stop signal to adjust the direction of the wafer tray to be consistent with the direction of the wafer. Optionally, the wafer tray is configured as a split tray with an inner tray and an outer tray, or the wafer tray is configured as a ring tray, but the utility model is not limited thereto.
[0055] In one embodiment, the second supporting portion 220 is further provided with a retracting mechanism (not shown in the figure), which can drive the second supporting portion 220 to switch between a retracted position and a carrying position; wherein, in the carrying position, the horizontal distance between the second supporting portion 220 and the first axis AA is smaller than the radius of the wafer, so that the second supporting surface 2201 can carry the wafer; in the retracted position, the horizontal distance between the second supporting portion 220 and the first axis AA is larger than the radius of the wafer, so as to provide an avoidance space for the lifting and lowering of the wafer.
[0056] Further, in this embodiment, the wafer joining method using the wafer joining device includes: step S11, placing the wafer tray and the wafer in the first accommodating portion and the third accommodating portion respectively. Step S12, driving the wafer tray to touch the first centering portion 310 and driving the wafer to touch the second centering portion 320 through the mobile platform 40 to adjust the center position of the wafer tray and the wafer; optionally, after completing the adjustment of the center position of the wafer tray and the wafer, the center axis of the wafer tray and the wafer coincides with the first axis AA, and the first axis AA can be set to coincide with the center axis of the mobile platform 40. Step S13, identifying the directions of the wafer and the wafer tray through the sensor 60, and adjusting the direction of the wafer tray to be consistent with the direction of the wafer; wherein, when the driving mechanism 70 only drives one of the first supporting part 210 and the second supporting part 220 to rotate, the driving mechanism 70 drives the first supporting part 210 or the second supporting part 220 to rotate, and stops after the sensor 60 identifies that the directions of the wafer and the wafer tray are consistent; or, when the driving mechanism 70 drives the first supporting part 210 and the second supporting part 220 to rotate at the same time, after the wafer is indirectly lifted upward by the lifting mechanism 80 against the inner tray or the wafer is directly lifted upward by the inner space of the annular tray, the driving mechanism 70 drives the first supporting part 210 and the second supporting part 220 to rotate, and stops after the sensor 60 identifies that the directions of the wafer and the wafer tray are consistent. Step S14: After the wafer is directly or indirectly pushed off the second supporting surface 2201 by the lifting mechanism 80, the second supporting portion 120 is located in the retracted position. Step S15: The wafer or the combination of the wafer and the inner tray is driven downward by the lifting mechanism 80 to place the wafer on the wafer tray, thereby achieving the wafer and the wafer tray being joined.
[0057] In summary, the utility model provides a position adjustment component and a closing device, wherein the mobile platform can drive one of the supporting structure and the centering structure to move toward the other of the supporting structure and the centering structure along the moving path, so that the first part to be adjusted located on the supporting structure touches the first centering portion, thereby automatically realizing the adjustment of the center position of the first part to be adjusted during the collision between the first part to be adjusted and the first centering portion. Since the adjustment action of the entire position component is single, it does not need to be linked with other components during the movement process, and the movement mechanism is simple to realize and has a high fault tolerance rate, thereby improving the efficiency of the adjustment of the center position of the first part to be adjusted. When the mobile platform is located at the end point of the moving path, the first centering portion is at least partially located in the accommodating space of the first accommodating portion. At this time, the first centering portion and the first stop portion define a second accommodating portion, and the size of the second accommodating portion matches the size of the first part to be adjusted, so that the second accommodating portion defines the position of the first part to be adjusted, thereby enabling the center position of the first part to be adjusted to be adjusted quickly and accurately. In addition, the mobile platform can also drive the second part to be adjusted located on the supporting structure to touch the second centering part, so as to automatically adjust the center position of the second part to be adjusted; and when the first part to be adjusted and the second part to be adjusted are simultaneously driven by the mobile platform to approach the centering structure, the center positions of the first part to be adjusted and the second part to be adjusted can be adjusted at the same time, thereby effectively improving the adjustment efficiency.
[0058] Although the content of the utility model has been described in detail through the above preferred embodiments, it should be recognized that the above description should not be considered as a limitation of the utility model. After reading the above content, various modifications and substitutions of the utility model will be obvious to those skilled in the art. Therefore, the protection scope of the utility model should be limited by the attached claims.
Claims
1. A position adjustment component for adjusting the center position of a wafer or a wafer tray, characterized in that: The position adjustment component comprises: A supporting structure, the supporting structure comprising at least two relatively fixed first supporting parts, the first supporting part comprising a first supporting surface arranged horizontally and a first stopper arranged protruding from the first supporting surface, the first stopper defining a first accommodating part, the first accommodating part comprising an accommodating space for accommodating a first part to be adjusted; A centering structure, the centering structure having a first centering portion, an upper surface of the first centering portion at least partially higher than a first supporting surface, and a lower surface of the first centering portion at least partially lower than a height of the first to-be-adjusted member located on the first supporting surface; and A mobile platform, wherein the mobile platform comprises at least one moving path, and the mobile platform is capable of driving one of the supporting structure and the centering structure to move along the moving path toward the other of the supporting structure and the centering structure; when the mobile platform is located at the end point of the moving path, the first centering portion is at least partially located within the accommodation space of the first accommodation portion.
2. The position adjustment assembly according to claim 1, characterized in that: When the moving platform is located at the end point of the moving path, the first centering portion and at least one of the first stop portions define a second accommodating portion, and the size of the second accommodating portion matches the size of the first part to be adjusted.
3. The position adjustment assembly according to claim 2, characterized in that: The first accommodating radius is defined as the minimum distance from the center of the first accommodating portion to the first stop portion, and the second accommodating radius is defined as the minimum distance from the center of the second accommodating portion to the first centering portion. The first accommodating radius is greater than the second accommodating radius.
4. The position adjustment assembly according to claim 1, characterized in that: The first to-be-adjusted member is configured in a disc shape.
5. The position adjustment assembly according to claim 4, characterized in that: The first centering portion and the first stop portion are located at the same horizontal height, and the first centering portion includes a first curved side surface facing the accommodating space of the first accommodating portion, and the radius of the first curved side surface matches the radius of the first part to be adjusted; the first stop portion includes a second curved side surface facing the accommodating space of the first accommodating portion, and the radius of the second curved side surface matches the radius of the first part to be adjusted.
6. The position adjustment assembly according to claim 4, characterized in that: The first centering portion and the first stop portion are located at the same horizontal height, and the first centering portion includes a plurality of first positioning blocks arranged at intervals along a first circular arc, and the radius of the first circular arc matches the radius of the first part to be adjusted.
7. The position adjustment assembly according to claim 1, characterized in that: The supporting structure further includes a second supporting portion, the second supporting portion includes a second supporting surface arranged horizontally and a second stop portion arranged protruding from the second supporting surface, the second stop portion defines a third accommodating portion for accommodating a second to-be-adjusted member, and the second supporting portion is relatively fixed to the first supporting portion; The centering structure further comprises: a second centering portion, which is fixed relative to the first centering portion, and the second centering portion and the second supporting portion are located at the same level; When the mobile platform is located at the end point of the moving path, the second centering portion is at least partially located in the accommodating space of the third accommodating portion; the second centering portion and at least part of the second stop portion define a fourth accommodating portion, and the size of the fourth accommodating portion matches the size of the second part to be adjusted.
8. The position adjustment assembly according to claim 7, characterized in that: The first supporting portion and the first centering portion are configured as a first position adjustment combination, and the second supporting portion and the second centering portion are configured as a second position adjustment combination; the second position adjustment combination and the first position adjustment combination are spaced apart in the same vertical direction, and the second position adjustment combination is located above the first position adjustment combination.
9. A wafer assembly device using the position adjustment assembly as claimed in any one of claims 7 to 8, used for assembling a wafer and a wafer tray, characterized in that: The first to-be-adjusted part in the position adjustment assembly is configured as a wafer tray, and the second to-be-adjusted part is configured as a wafer; the wafer assembly device further includes: a sensor fixed relative to the centering structure for identifying the orientation of the wafer tray and the wafer; A driving mechanism, used for driving the supporting structure to rotate along a first axis to adjust the direction of the wafer tray; and The lifting mechanism can penetrate the center position of the supporting structure in the vertical direction to perform lifting movement, and is used to drive the wafer and / or a part of the wafer tray to perform ascending or descending movement.