FOC drive circuit of three-phase brushless motor and electronic equipment

Abstract

The embodiment of the utility model discloses an FOC drive circuit of a three-phase brushless motor and electronic equipment, and relates to the field of power supply circuits. A plurality of MOS tubes used in an inverter circuit of the three-phase brushless motor are sealed into one driving chip, and reasonable distribution positions of pins on the control chip and the driving chip are set, so that mutual intersection of wires on a PCB of the FOC driving circuit is avoided, the purpose of smooth wire arrangement is achieved, the area of the PCB can be reduced, and the reliability of the FOC driving circuit is improved. Signal crosstalk caused by wiring is reduced, external radiation of the whole machine is reduced, and EMI performance of the whole machine is improved.

Description

Technical Field

[0001] The utility model relates to the field of power supply circuits, in particular to a FOC drive circuit of a three-phase brushless motor and electronic equipment. Background Art

[0002] The driving methods of three-phase brushless motors can be square wave driving, sine wave driving and FOC (Field-Oriented Control) driving. Six MOS tubes are set in the driving circuit. When designers draw the circuit diagram of the driving circuit on a single-sided board, multiple MOS tubes will occupy a lot of space on the PCB board, and it is difficult to avoid the problem of cross-intersection between multiple MOS tubes, making routing more difficult. Utility Model Content

[0003] The FOC drive circuit and electronic device of a three-phase brushless motor provided in the embodiments of the present application can solve the problem that the existing drive circuit occupies a large area of ​​a single-panel board and has complex wiring. The technical solution is as follows:

[0004] In a first aspect, an embodiment of the present application provides a FOC drive circuit for a three-phase brushless motor, comprising:

[0005] A control chip, a drive chip, a first resistor, a second resistor, a third resistor and a capacitor; the control chip is provided with an A-phase upper bridge PWM output pin, an A-phase lower bridge PWM output pin, a B-phase upper bridge PWM output pin, a B-phase lower bridge PWM output pin, a C-phase upper bridge PWM output pin, a C-phase lower bridge PWM output pin, a first current amplification pin, a second current amplification pin, a third current amplification pin and a fourth current amplification pin, a first power supply pin and a first ground pin;

[0006] The driving chip is provided with an A-phase upper bridge PWM input pin, an A-phase lower bridge PWM input pin, a B-phase upper bridge PWM input pin, a B-phase lower bridge PWM input pin, a C-phase upper bridge PWM input pin, a C-phase lower bridge PWM input pin, an A-phase drive pin, a B-phase drive pin, a C-phase drive pin, an A-phase current pin, a B-phase current pin, a C-phase current pin, a second power supply pin and a second ground pin;

[0007] Wherein, the A-phase upper bridge PWM pin is connected to the A-phase upper bridge PWM input pin, the B-phase upper bridge PWM output pin is connected to the B-phase upper bridge PWM input pin, the B-phase lower bridge PWM output pin is connected to the B-phase lower bridge PWM input pin, the C-phase upper bridge PWM output pin is connected to the C-phase upper bridge PWM input pin, and the C-phase lower bridge PWM output pin is connected to the C-phase lower bridge input pin;

[0008] The first current amplifying pin is respectively connected to the A-phase current pin and the first end of the first resistor, the second current amplifying pin is respectively connected to the second end of the first resistor and the first end of the third resistor, the third current amplifying pin is respectively connected to the second end of the second resistor and the B-phase current pin, the fourth current amplifying pin is respectively connected to the second end of the first resistor and the first end of the second resistor, the C-phase current pin is connected to the first end of the second resistor, and the second end of the third resistor is grounded;

[0009] The A-phase driving pin, the B-phase driving pin and the C-phase driving pin are connected to the three-phase brushless motor;

[0010] The first power supply pin is connected to a power source, the first ground pin is grounded, the second ground pin is grounded, the second power supply pin is respectively connected to a positive electrode of the power source and a positive electrode of the capacitor, and a negative electrode of the capacitor is grounded.

[0011] In a second aspect, the present application provides an electronic device, comprising the above-mentioned FOC drive circuit and a three-phase brushless motor.

[0012] The beneficial effects brought about by the technical solutions provided by some embodiments of the present application include at least:

[0013] By sealing multiple MOS tubes used in the inverter circuit of the three-phase brushless motor into one driver chip and setting the reasonable distribution positions of each pin on the control chip and the driver chip, the crossing of various traces on the PCB of the FOC drive circuit is avoided to achieve smooth routing, which can reduce the area of ​​the PCB board, reduce the signal crosstalk caused by the routing, reduce the external radiation of the whole machine, and improve the EMI performance of the whole machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0015] Figure 1 is a structural diagram of a FOC drive circuit of a three-phase brushless motor provided in an embodiment of the present application;

[0016] Figure 2 Schematic diagram of the packaging and pin distribution of the driver chip provided in the embodiment of the present application;

[0017] Figure 3 It is a schematic diagram of the structure of the driver chip provided in the embodiment of the present application. DETAILED DESCRIPTION

[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0019] See also Figure 1 The utility model provides a structural schematic diagram of a FOC drive circuit of a three-phase brushless motor according to an embodiment. The FOC drive circuit of the three-phase brushless motor includes: a control chip U4, a drive chip U2, a first resistor R3, a second resistor R11, a third resistor R58R58 and a capacitor C2.

[0020] Among them, the control chip U4 is provided with an A-phase upper bridge PWM output pin UH_PWM, an A-phase lower bridge PWM output pin UL_PWM, a B-phase upper bridge PWM output pin VH_PWM, a B-phase lower bridge PWM output pin VL_PWM, a C-phase upper bridge PWM output pin WH_PWM, a C-phase lower bridge PWM output pin WL_PWM, a first current amplification pin OP0_N, a second current amplification pin OP0_P, a third current amplification pin OP1_N and a fourth current amplification pin OP1_P, a first power supply pin VCC and a first ground pin VSS.

[0021] See also Figure 2 As shown, the driving chip U2 is provided with an A-phase upper bridge PWM input pin UH, an A-phase lower bridge PWM input pin UL, a B-phase upper bridge PWM input pin VH, a B-phase lower bridge PWM input pin VL, a C-phase upper bridge PWM input pin WH, a C-phase lower bridge PWM input pin WL, an A-phase drive pin U, a B-phase drive pin V, a C-phase drive pin W, an A-phase current pin UI, a B-phase current pin VI, a C-phase current pin WI, a second power supply pin VCC and a second ground pin GND.

[0022] See also Figure 3 As shown, the driver chip U2 includes a first MOS tube M11, a second MOS tube M12, a third MOS tube M21, a fourth MOS tube M22, a fifth MOS tube M31 and a sixth MOS tube M32. The connection relationship between the MOS tubes can be seen in Figure 3 As shown, no further description is given here.

[0023] Among them, the A-phase upper bridge PWM pin is connected to the A-phase upper bridge PWM input pin UH, the B-phase upper bridge PWM output pin VH_PWM is connected to the B-phase upper bridge PWM input pin VH, the B-phase lower bridge PWM output pin VL_PWM is connected to the B-phase lower bridge PWM input pin VL, the C-phase upper bridge PWM output pin is connected to the C-phase upper bridge PWM input pin WH, and the C-phase lower bridge PWM output pin WL_PWM is connected to the C-phase lower bridge input pin WL.

[0024] The first current amplification pin OP0_N is respectively connected to the A-phase current pin UI and the first end of the first resistor R3, the second current amplification pin OP0_P is respectively connected to the second end of the first resistor R3 and the first end of the third resistor R58, the third current amplification pin OP1_N is respectively connected to the second end of the second resistor R11 and the B-phase current pin VI, the fourth current amplification pin OP1_P is respectively connected to the second end of the first resistor R3 and the first end of the second resistor R11, the C-phase current pin WI is connected to the first end of the second resistor R11, and the second end of the third resistor R58 is grounded.

[0025] A-phase driving pin U, B-phase driving pin V and C-phase driving pin W are connected to the three-phase brushless motor MOTOR.

[0026] The first power supply pin VCC is connected to the power supply, the first ground pin VSS is grounded, the second ground pin GND is grounded, the second power supply pin VCC is respectively connected to the positive electrode of the power supply and the positive electrode of the capacitor C2, and the negative electrode of the capacitor C2 is grounded.

[0027] In the FOC drive circuit of the present application, the control chip U4 plays a control role, which can be a processor chip, a digital processing chip or an FPGA chip, etc. The control chip U4 outputs PWM signals on the A-phase upper bridge PWM output pin UH_PWM and the A-phase lower bridge PWM output pin UL_PWM, the B-phase upper bridge PWM output pin VH_PWM and the B-phase lower bridge PWM output pin VL_PWM, the C-phase upper bridge PWM output pin WH_PWM and the C-phase lower bridge PWM output pin WL_PWM according to a certain sequence, so as to realize the sequential opening of the input PWM signals on the A-phase, B-phase and C-phase, and correspondingly, the MOS tubes of the A-phase, the B-phase and the C-phase in the driving chip U2 are sequentially opened to realize the speed control of the three-phase brushless motor. The first current amplification pin OP0_N, the second current amplification pin OP0_P, the third current amplification pin OP1_N and the fourth current amplification pin OP1_P, the first power supply pin VCC and the first ground pin VSS are used to receive the current output by each MOS tube. The driving chip U8 amplifies the current, and then calculates the actual speed of the three-phase brushless motor MOTOR according to the amplified current. The duty cycle of the PWM signal output by each phase is calculated according to the difference between the actual speed and the target speed through a closed-loop control algorithm.

[0028] The resistance value of the first resistor R3 is 100 milliohms, the resistance value of the second resistor R11 is 100 milliohms, and the resistance value of the third resistor R58 is 50 milliohms, forming a resistor network.

[0029] In some embodiments of the present application, a heat sink EPAD is provided on the driver chip U2. The heat sink EPAD is in close contact with the bodies of the six built-in MOS tubes, and the contact gaps are filled with thermal paste to dissipate the heat generated by each MOS tube into the air.

[0030] In some embodiments of the present application, in order to improve the compactness of the PCB board, the driving chip U2 and the control chip U4 are both SOP packages.

[0031] The FOC drive circuit of the three-phase brushless motor provided in the embodiment of the present application seals multiple MOS tubes used in the inverter circuit of the three-phase brushless motor into one drive chip, and sets reasonable distribution positions of each pin on the control chip and the drive chip, so as to avoid the crossing of various traces on the PCB of the FOC drive circuit to achieve the purpose of smooth routing, reduce the area of ​​the PCB board, reduce the signal crosstalk caused by the routing, reduce the external radiation of the whole machine, and improve the EMI performance of the whole machine.

[0032] The electronic device provided in the embodiment of the present application includes the above-mentioned FOC drive single path of the three-phase brushless motor and the three-phase brushless motor. The electronic device can be a communication device, a terminal device, a computer device, etc. In addition to the above-mentioned components, the electronic device can also include: a housing for accommodating various components, a display screen and an input device (for example: a keyboard, a mouse or a touch screen), etc.

[0033] The above-described implementation methods do not constitute a limitation on the protection scope of the technical solution. Any modification, equivalent replacement and improvement made within the spirit and principle of the above-described implementation methods shall be included in the protection scope of the technical solution.

Claims

1. A FOC drive circuit for a three-phase brushless motor, characterized in that: include: A control chip, a drive chip, a first resistor, a second resistor, a third resistor and a capacitor; the control chip is provided with an A-phase upper bridge PWM output pin, an A-phase lower bridge PWM output pin, a B-phase upper bridge PWM output pin, a B-phase lower bridge PWM output pin, a C-phase upper bridge PWM output pin, a C-phase lower bridge PWM output pin, a first current amplification pin, a second current amplification pin, a third current amplification pin and a fourth current amplification pin, a first power supply pin and a first ground pin; The driving chip is provided with an A-phase upper bridge PWM input pin, an A-phase lower bridge PWM input pin, a B-phase upper bridge PWM input pin, a B-phase lower bridge PWM input pin, a C-phase upper bridge PWM input pin, a C-phase lower bridge PWM input pin, an A-phase drive pin, a B-phase drive pin, a C-phase drive pin, an A-phase current pin, a B-phase current pin, a C-phase current pin, a second power supply pin and a second ground pin; Wherein, the A-phase upper bridge PWM pin is connected to the A-phase upper bridge PWM input pin, the B-phase upper bridge PWM output pin is connected to the B-phase upper bridge PWM input pin, the B-phase lower bridge PWM output pin is connected to the B-phase lower bridge PWM input pin, the C-phase upper bridge PWM output pin is connected to the C-phase upper bridge PWM input pin, and the C-phase lower bridge PWM output pin is connected to the C-phase lower bridge input pin; The first current amplifying pin is respectively connected to the A-phase current pin and the first end of the first resistor, the second current amplifying pin is respectively connected to the second end of the first resistor and the first end of the third resistor, the third current amplifying pin is respectively connected to the second end of the second resistor and the B-phase current pin, the fourth current amplifying pin is respectively connected to the second end of the first resistor and the first end of the second resistor, the C-phase current pin is connected to the first end of the second resistor, and the second end of the third resistor is grounded; The A-phase driving pin, the B-phase driving pin and the C-phase driving pin are connected to the three-phase brushless motor; The first power supply pin is connected to a power source, the first ground pin is grounded, the second ground pin is grounded, the second power supply pin is respectively connected to a positive electrode of the power source and a positive electrode of the capacitor, and a negative electrode of the capacitor is grounded.

2. The circuit according to claim 1, characterized in that The driver chip is provided with a heat sink, which is in close contact with the tube body of each MOS tube, and the contact gap is filled with heat dissipation paste.

3. The circuit according to claim 1 or 2, characterized in that: The resistance value of the first resistor is 100 milliohms, the resistance value of the second resistor is 100 milliohms, and the resistance value of the third resistor is 50 milliohms.

4. The circuit according to claim 3, characterized in that The control chip and the driving chip are packaged in SOP form.

5. An electronic device, characterized in that: It comprises the FOC drive circuit and the three-phase brushless motor as described in any one of claims 1 to 4.

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