High-efficiency radiating structure of radiating fins
By setting a heat dissipation tank and partition at the heat dissipation base of the heat dissipation fin and injecting circulating coolant, the heat dissipation parts are directly in contact with the coolant, the problem of low heat conduction efficiency of existing liquid-cooled heat dissipation fins is solved, and the heat dissipation efficiency is significantly improved and service life.
Patent Information
- Application Number
- CN202420856341.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-23
- Publication Date
- 2025-02-07
- Estimated Expiration
- 2034-04-23
AI Technical Summary
The heat dissipation efficiency of existing liquid-cooled heat sinks is restricted by the heat conduction efficiency, especially due to the difference in heat conduction efficiency caused by different materials between the heat dissipation pipe and the heat dissipation base.
A high-efficiency heat dissipation structure of a heat sink is designed, including a heat dissipation base and a heat dissipation member. A heat dissipation groove and a partition are provided at the heat dissipation base. The heat dissipation member is welded in the heat dissipation groove, and a first through hole and The second through hole is injected with circulating coolant, so that the heat dissipation member is directly in contact with the coolant, thereby improving the heat conduction efficiency.
By directly contacting the coolant, the heat conduction efficiency of the heat dissipation parts is significantly improved, which significantly improves the heat dissipation effect of the heat sink and greatly improves the service life of the heat sink.
Smart Images

Figure CN222442103U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of heat dissipation devices, in particular to a heat dissipation fin high-efficiency heat dissipation structure. Background Art
[0002] A heat sink is a heat dissipation device used to dissipate heat from electronic components. It is usually widely used in the field of liquid cooling. Most of the existing liquid cooling heat sinks include a heat sink base and a heat pipe. The heat pipe is arranged at the heat sink base to dissipate heat from the heat pipe, and then the heat is dissipated from the high-temperature liquid in the heat pipe, so as to finally realize liquid cooling circulation heat dissipation and achieve the heat dissipation purpose. However, due to the different contact areas between the heat pipe and the heat sink base, the heat dissipation efficiency of various types of heat sinks varies, but they are ultimately restricted by the heat conduction efficiency. The heat conduction efficiency between the heat pipe and the heat sink base is different between materials, which greatly restricts the heat dissipation effect of the heat sink, so it needs to be improved. Utility Model Content
[0003] The main purpose of the utility model is to provide a heat sink with high efficiency heat dissipation structure, aiming to provide a heat sink that can efficiently perform heat conduction and heat dissipation.
[0004] To achieve the above-mentioned purpose, the utility model proposes a heat sink with high efficiency heat dissipation structure, including a heat dissipation base and a heat dissipation component, the heat dissipation base is provided with a heat dissipation groove, the heat dissipation component is welded in the heat dissipation groove, and the ends of the heat dissipation base are respectively provided with a first through hole and a second through hole, the first through hole and the second through hole are not connected to each other, and the first through hole and the second through hole are both connected to the heat dissipation groove.
[0005] Specifically, a partition is provided in the heat dissipation slot, the first through hole and the second through hole are respectively provided at the same end of the heat dissipation base, and the first through hole and the second through hole are located on both sides of the partition.
[0006] Specifically, the heat sink is provided with a heat conducting surface and a heat dissipating surface, the heat conducting surface is located above the heat dissipating slot, and the heat dissipating surface is arranged toward the heat dissipating slot.
[0007] Specifically, a plurality of heat dissipation fins are provided on the heat dissipation surface, and the heat dissipation fins are located in the heat dissipation slots.
[0008] Specifically, the heat dissipation base and the heat dissipation element are both made of metal material, and the specific heat capacity of the metal materials used for the heat dissipation base and the heat dissipation element is different.
[0009] Specifically, a connecting platform is provided in the heat dissipation slot, and the heat dissipation element is located at the connecting platform and covers the heat dissipation slot.
[0010] The technical solution of the utility model is to set a heat dissipation groove at the heat dissipation base, and then set the heat dissipation element in the heat dissipation groove. By setting a first through hole and a second through hole at the heat dissipation base, circulating coolant is injected into the heat dissipation groove through the first through hole and the second through hole, and the heat dissipation element is in direct contact with the coolant, thereby improving the heat conduction efficiency of the heat dissipation element to improve the heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;
[0012] Figure 2 This is a schematic diagram of the disassembled structure of the utility model;
[0013] Figure 3 It is a structural schematic diagram of the heat dissipation base of the utility model;
[0014] Figure 4 It is a structural schematic diagram of the heat dissipation element of the utility model.
[0015] The reference numerals include: 10. heat dissipation base; 11. heat dissipation element; 12. heat dissipation slot; 13. first through hole; 14. second through hole; 15. partition; 16. connecting platform; 17. heat dissipation fin. DETAILED DESCRIPTION
[0016] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0017] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...), then the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0018] In addition, if there are descriptions involving "first" or "second" etc. in the embodiments of the utility model, the descriptions of "first" or "second" etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0019] like Figures 1 to 4 As shown, a heat sink high-efficiency heat dissipation structure includes a heat dissipation base 10 and a heat dissipation element 11. A heat dissipation groove 12 is provided at the heat dissipation base 10. The heat dissipation element 11 is welded in the heat dissipation groove 12. The ends of the heat dissipation base 10 are respectively provided with a first through hole 13 and a second through hole 14. The first through hole 13 and the second through hole 14 are not communicated with each other, and the first through hole 13 and the second through hole 14 are both communicated with the heat dissipation groove 12. By providing the heat dissipation groove 12 at the heat dissipation base 10, and then providing the heat dissipation element 11 in the heat dissipation groove 12, by providing the first through hole 13 and the second through hole 14 at the heat dissipation base 10, circulating coolant is injected into the heat dissipation groove 12 through the first through hole 13 and the second through hole 14, the heat dissipation element 11 is directly in contact with the coolant, and then the heat conduction efficiency of the heat dissipation element 11 is improved to improve the heat dissipation effect.
[0020] A partition 15 is provided in the heat dissipation slot 12, and the first through hole 13 and the second through hole 14 are respectively provided at the same end of the heat dissipation base 10, and the first through hole 13 and the second through hole 14 are located on both sides of the partition 15; the heat dissipation element 11 is provided with a heat conduction surface and a heat dissipation surface, the heat conduction surface is located above the heat dissipation slot 12, and the heat dissipation surface is arranged toward the heat dissipation slot 12; a plurality of heat dissipation fins 17 are provided at the heat dissipation surface, and the heat dissipation fins 17 are located in the heat dissipation slot 12. In this embodiment, a partition 15 is provided in the heat dissipation slot 12, and the first through hole 13 and the second through hole 14 are separated by the partition 15, and a heat dissipation channel is formed in the heat dissipation slot 12. When the heat dissipation fins 17 of the heat dissipation element 11 are located in the heat dissipation slot 12, when the coolant flows from the first through hole 13 to the second through hole 14, the coolant flows along the heat dissipation channel and contacts the heat dissipation fins 17, thereby quickly taking out the heat of the heat dissipation element 11 to achieve a heat dissipation effect, and at the same time, the direct contact between the coolant and the heat dissipation element 11 effectively improves the heat conduction efficiency, and greatly improves the heat dissipation effect.
[0021] The heat dissipation base 10 and the heat dissipation element 11 are both made of metal materials, and the specific heat capacities of the metal materials used in the heat dissipation base 10 and the heat dissipation element 11 are different. In this embodiment, the heat dissipation base 10 and the heat dissipation element 11 are respectively made of metal materials with different specific heat capacities, so as to improve the heat conduction efficiency and the service life of the heat sink.
[0022] A connection platform 16 is provided in the heat dissipation groove 12, and the heat dissipation element 11 is located at the connection platform 16 and covers the heat dissipation groove 12. In this embodiment, a connection platform 16 is provided in the heat dissipation groove 12, and the heat dissipation element 11 is placed at the connection platform 16, and then the heat dissipation element 11 and the heat dissipation base 10 are welded by a friction stir welding process, thereby improving the connection stability between the heat dissipation element 11 and the heat dissipation base 10, and at the same time, the heat dissipation element 11 and the heat dissipation base 10 can withstand a pressure of three megapascals after welding, so as to improve the service life of the heat sink.
[0023] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.
Claims
1. A heat sink with high efficiency heat dissipation structure, characterized by: It includes a heat dissipation base and a heat dissipation element. The heat dissipation base is provided with a heat dissipation groove. The heat dissipation element is welded in the heat dissipation groove. The ends of the heat dissipation base are respectively provided with a first through hole and a second through hole. The first through hole and the second through hole are not connected to each other, and both of the first through hole and the second through hole are connected to the heat dissipation groove.
2. The heat sink high-efficiency heat dissipation structure according to claim 1, characterized in that: A partition is arranged in the heat dissipation slot, the first through hole and the second through hole are respectively arranged at the same end of the heat dissipation base, and the first through hole and the second through hole are located at two sides of the partition.
3. The heat sink high-efficiency heat dissipation structure according to claim 1, characterized in that: The heat sink is provided with a heat conducting surface and a heat dissipating surface. The heat conducting surface is located above the heat dissipating slot, and the heat dissipating surface is arranged toward the heat dissipating slot.
4. A heat sink high-efficiency heat dissipation structure as claimed in claim 3, characterized in that: A plurality of heat dissipation fins are arranged on the heat dissipation surface, and the heat dissipation fins are located in the heat dissipation slots.
5. The heat sink high-efficiency heat dissipation structure according to claim 1, characterized in that: The heat dissipation base and the heat dissipation element are both made of metal material, and the specific heat capacity of the metal materials used in the heat dissipation base and the heat dissipation element is different.
6. The heat sink high-efficiency heat dissipation structure according to claim 1, characterized in that: A connecting platform is arranged in the heat dissipation slot, and the heat dissipation element is located at the connecting platform and covers the heat dissipation slot.