Photovoltaic bypass diode module frame

Abstract

The utility model relates to the technical field of diode packaging, in particular to a photovoltaic bypass diode module frame which comprises a diode module, a heat dissipation copper plate is connected in the diode module in a penetrating mode, heat dissipation through grooves are symmetrically formed in the outer wall of the heat dissipation copper plate, and three heat dissipation air channels are formed in the bottom of the heat dissipation copper plate. The heat dissipation air channel is arranged at the bottom of the heat dissipation air channel in a V shape. The heat dissipation copper plate on the diode module can increase the heat dissipation area in the operation process of the diode module, heat resistance is effectively reduced, the heat dissipation straight slot can reduce the heat productivity of the diode module, the heat dissipation air channel further increases the contact surface area of air and the heat dissipation copper plate, air flow is guided, the air flow speed is increased, and the service life of the diode module is prolonged. And the resistance of air flow is reduced, so that air can flow through the heat dissipation copper plate more easily, the heat transfer speed is accelerated, the convection heat exchange efficiency is further improved, and the heat dissipation capability of the diode module is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of diode packaging, in particular to a photovoltaic bypass diode module frame. Background Art

[0002] At present, my country's photovoltaic power generation market has a strong reserve scale. According to incomplete statistics, the total configuration scale of photovoltaic power stations in various provinces this year (including some wind power) is 89.28GW, and the scale of large-scale bases announced has exceeded 60GW. Driven by the huge reserve of photovoltaic power generation projects in China, the installation volume is expected to exceed 75GW in 2022.

[0003] Continuously reducing the cost of photovoltaic electricity is the essence of the photovoltaic module industry. High efficiency and high power are the continuous pursuit in the evolution of photovoltaic module technology, and are also the key factors in reducing the cost of photovoltaic electricity. As the power generation power of photovoltaic solar panels becomes larger and larger, the requirements for bypass diodes are getting higher and higher. The entire industry is developing in the direction of low thermal resistance, low voltage drop, high current, and high anti-static ability. When the hot plate effect occurs, the bypass diode can pass more and more working current at the minimum energy consumption. The existing chips on the market either have a large voltage drop or a large leakage. In high-power components, the heat generation is high, the thermal stability is poor, the failure rate is high, the internal stress in the formed diode module is large, and its stability and reliability are poor. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a photovoltaic bypass diode module frame.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A photovoltaic bypass diode module frame comprises a diode module, wherein a heat dissipation copper plate is connected through the interior of the diode module, heat dissipation grooves are symmetrically provided on the outer wall of the heat dissipation copper plate, three heat dissipation air ducts are provided at the bottom of the heat dissipation copper plate, and the heat dissipation air ducts are arranged in a "V" shape at the bottom of the heat dissipation air ducts, a thickened plate is laid around the heat dissipation copper plate, and a support beam is fixedly connected to the thickened plate.

[0007] Preferably, grooves are symmetrically formed on the outer wall of the heat dissipation copper plate and located on both sides of the diode module.

[0008] Preferably, a protrusion is provided on one side of the heat dissipation copper plate, a card connector is fixedly connected to the protrusion, and the cross-section of the card connector is arranged in a "C" shape.

[0009] Preferably, positioning holes are provided at four corners of the heat dissipation copper plate, and two of the positioning holes are provided with openings on one side close to the side edge of the heat dissipation copper plate.

[0010] The beneficial effects of the utility model are:

[0011] During the operation of the diode module, the heat dissipation copper plate on it can increase its heat dissipation area and effectively reduce thermal resistance. The heat dissipation groove can be used to reduce the heat generation of the diode module itself. The heat dissipation duct further increases the surface area of ​​the air in contact with the heat dissipation copper plate, guides the flow of air, increases the air flow speed, reduces the resistance of air flow, makes it easier for air to flow through the heat dissipation copper plate, speeds up the heat transfer speed, further improves the efficiency of convection heat exchange, and greatly improves the heat dissipation capacity of the diode module.

[0012] By installing a thickened plate around the heat dissipation copper plate, the edge thickness of the heat dissipation copper plate is made higher than the internal thickness. By setting a support beam on the thickened plate, it is beneficial to reduce the local deformation of the edge of the heat dissipation copper plate, improve the strength and stability of the entire structure, reduce stress concentration, and improve the overall bearing capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a schematic diagram of the overall structure of a photovoltaic bypass diode module frame proposed by the utility model;

[0014] Figure 2 This is a schematic diagram of the structure of the enlarged point A of a photovoltaic bypass diode module frame proposed by the utility model;

[0015] Figure 3 This is a schematic diagram of the bottom structure of a photovoltaic bypass diode module frame proposed by the utility model.

[0016] In the figure:

[0017] 1. Diode module; 2. Heat dissipation copper plate; 3. Heat dissipation groove; 4. Heat dissipation air duct; 5. Thickened plate; 6. Support beam; 7. Groove; 8. Card connector; 9. Positioning hole. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0019] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0020] The standard parts used in the utility model can all be purchased from the market, and special-shaped parts can be customized according to the instructions and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the existing technology. The machinery, parts and equipment all adopt the conventional models in the existing technology, and the circuit connection adopts the conventional connection method in the existing technology, which will not be described in detail here.

[0021] Example:

[0022] Reference Figure 1-3 A photovoltaic bypass diode module frame comprises a diode module 1, a heat dissipation copper plate 2 is connected through the inside of the diode module 1, heat dissipation grooves 3 are symmetrically opened on the outer wall of the heat dissipation copper plate 2, three heat dissipation air ducts 4 are opened at the bottom of the heat dissipation copper plate 2, and the heat dissipation air duct 4 is arranged in a "V" shape at the bottom of the heat dissipation air duct 4. A thickened plate 5 is laid around the heat dissipation copper plate 2, and a support beam 6 is fixedly connected to the thickened plate 5.

[0023] Grooves 7 are symmetrically formed on the outer wall of the heat dissipation copper plate 2 and on both sides of the diode module 1 .

[0024] A protrusion is provided on one side of the heat dissipation copper plate 2, and a clamping connector 8 is fixedly connected to the protrusion. The cross section of the clamping connector 8 is arranged in a "C" shape.

[0025] Positioning holes 9 are formed at four corners of the heat dissipation copper plate 2 , and two of the positioning holes 9 are formed with openings on one side close to the side edge of the heat dissipation copper plate 2 .

[0026] In this embodiment, during the use and operation of the diode module 1, the heat dissipation area is increased by the heat dissipation copper plate 2 thereon, thereby effectively reducing the thermal resistance. The heat dissipation groove 3 can reduce the heat generation of the diode module 1 itself. The heat dissipation duct 4 at the bottom of the diode module 1 further increases the surface area of ​​the air in contact with the heat dissipation copper plate 2, guides the flow of air, increases the air flow speed, reduces the resistance of air flow, makes it easier for air to flow through the heat dissipation copper plate 2, speeds up the heat transfer speed, further improves the efficiency of convection heat exchange, and greatly improves the heat dissipation capacity of the diode module 1.

[0027] The diode module 1 can be installed on the external installation panel by using the positioning hole 9 through the card joint 8. By installing the thickened plate 5 around the heat dissipation copper plate 2, the edge thickness of the heat dissipation copper plate 2 is made higher than the internal thickness. By arranging the support beam 6 on the thickened plate 5, the local deformation of the edge of the heat dissipation copper plate 2 can be reduced, thereby improving the strength and stability of the entire structure, reducing stress concentration, and improving the overall bearing capacity.

[0028] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0029] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0030] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A photovoltaic bypass diode module frame, comprising a diode module (1), characterized in that: A heat dissipation copper plate (2) is connected through the interior of the diode module (1); heat dissipation grooves (3) are symmetrically provided on the outer wall of the heat dissipation copper plate (2); three heat dissipation air ducts (4) are provided at the bottom of the heat dissipation copper plate (2); the heat dissipation air ducts (4) are arranged in a "V" shape at the bottom of the heat dissipation air ducts (4); a thickened plate (5) is laid around the periphery of the heat dissipation copper plate (2); and a support beam (6) is fixedly connected to the thickened plate (5).

2. A photovoltaic bypass diode module frame according to claim 1, characterized in that: Grooves (7) are symmetrically provided on the outer wall of the heat dissipation copper plate (2) and located on both sides of the diode module (1).

3. A photovoltaic bypass diode module frame according to claim 1, characterized in that: A protrusion is provided on one side of the heat dissipation copper plate (2), and a clamping joint (8) is fixedly connected to the protrusion, and the cross section of the clamping joint (8) is arranged in a "C" shape.

4. A photovoltaic bypass diode module frame according to claim 1, characterized in that: Positioning holes (9) are provided at the four corners of the heat dissipation copper plate (2), and two of the positioning holes (9) are provided with openings on one side close to the side edge of the heat dissipation copper plate (2).

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