Semiconductor laser welding equipment with heat dissipation and dust prevention structure

Abstract

The utility model discloses semiconductor laser welding equipment with a heat dissipation dustproof structure, which comprises a laser welding device main body, a heat dissipation mechanism and an oxygen bottle mounting base, the side surface of the laser welding device main body is connected with the heat dissipation mechanism in an embedded manner, and the upper end of the laser welding device main body is provided with the oxygen bottle mounting base in a penetrating manner; an oxygen bottle is connected to the inner side of the oxygen bottle mounting base in an embedded mode, a guide rail is fixedly mounted on the upper surface of the laser welding device body, a sealing plate is connected to the outer side of the guide rail in an embedded mode, an air nozzle connecting opening is formed in the inner side of the oxygen bottle mounting base, and an air nozzle is arranged at the bottom of the oxygen bottle in a penetrating mode. By arranging a sealing plate and an oxygen bottle mounting base, the interior of the welding chamber is filled with sufficient oxygen when the welding operation is carried out, and by arranging a heat dissipation mechanism and a plasma generator, the device can also achieve a good dust removal effect while carrying out heat dissipation on the welding operation.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor laser welding, in particular to semiconductor laser welding equipment with a heat dissipation and dustproof structure. Background Art

[0002] Semiconductor laser welding is a welding process that uses a high-energy laser beam generated by a semiconductor laser. In this welding process, the laser beam is focused on the welding joint of the workpiece, and the high-energy density beam instantly heats the surface of the workpiece, causing it to melt and form a weld, thereby connecting the workpieces together. In order to prevent dust and impurities in the air from falling on the surface of the semiconductor during the welding process, resulting in impurities being welded inside the semiconductor during the welding operation, the existing device usually has a dustproof structure. The existing dustproof structure usually uses a sealed method to isolate most of the dust and impurities. However, the sealing effect is achieved by isolating the outside air, which leads to the problem of insufficient oxygen content inside the device. During the welding operation, this may cause incomplete combustion of the semiconductor surface, prolong the time required for welding, and insufficient oxygen content may also affect the welding quality.

[0003] The implementation of the utility model aims to provide a semiconductor laser welding equipment with a heat dissipation and dustproof structure to solve the problems raised in the above background technology. Utility Model Content

[0004] The purpose of the utility model is to solve the shortcomings of the prior art mentioned in the background technology and to propose a semiconductor laser welding equipment with a heat dissipation and dustproof structure.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor laser welding equipment with a heat dissipation and dustproof structure comprises a laser welding device body, a heat dissipation mechanism and an oxygen cylinder mounting base, wherein the heat dissipation mechanism is embedded in the side of the laser welding device body, the upper end of the laser welding device body is penetrated by an oxygen cylinder mounting base, the inner side of the oxygen cylinder mounting base is embedded in the oxygen cylinder, a guide rail is fixedly installed on the upper surface of the laser welding device body, and a sealing plate is embedded in the outer side of the guide rail, a gas nozzle connecting port is provided on the inner side of the oxygen cylinder mounting base, a gas nozzle is penetrated by the bottom of the oxygen cylinder, an air duct is provided at the bottom of the oxygen cylinder mounting base, and a nozzle is penetrated at the other end of the air duct, an air duct fixing plate is embedded in the outer side of the air duct, and the air duct fixing plate is fixedly connected to the inner wall of the laser welding device body.

[0007] Preferably, a motor protection cover is provided inside the heat dissipation mechanism, and a fan is embedded and connected to one side of the motor protection cover, and a generator fixing plate is provided at the other end of the fan, and the upper and lower ends of the generator fixing plate are fixedly connected to the plasma generator.

[0008] Preferably, there are two generator fixing plates in total, and the two generator fixing plates are symmetrically arranged inside the heat dissipation mechanism, and the two generator fixing plates are installed on the inner walls on both sides of the heat dissipation mechanism.

[0009] Preferably, a plurality of fans are equidistantly arranged on one side of the motor protective cover, and a plurality of motors are arranged inside the motor protective cover corresponding to the fans.

[0010] Preferably, the sealing plate is rectangular as a whole, and the overall size of the sealing plate is consistent with the size of the outlet of the welding chamber of the main body of the laser welding device.

[0011] Preferably, the heat dissipation mechanism is rectangular as a whole, and a honeycomb-shaped air inlet is provided on the outer side of the heat dissipation mechanism.

[0012] Preferably, an air outlet is provided on a surface of a side of the main body of the laser welding device away from the heat dissipation mechanism, and a one-way valve is provided on the inner side of the air outlet.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. In the utility model, a sealing plate and an oxygen cylinder mounting base are provided, so that when the device is in use, the oxygen inside the oxygen cylinder can be transported to the nozzle through the air duct, and the nozzle inputs the oxygen into the welding chamber, thereby ensuring that there is sufficient oxygen inside the welding chamber during the welding operation. At the same time, the sealing of the sealing plate can prevent a large amount of impurities such as dust from entering the welding chamber.

[0015] 2. By setting up a heat dissipation mechanism and a plasma generator, when the fan performs heat dissipation operation on the welding gun and the semiconductor in the welding room, the fan mixes the outside air with the plasma airflow generated by the plasma generator and blows it into the welding room, so that the airflow generated by the mixed plasma wind can take away the static charge inside the device and on the surface of the semiconductor, so that the internal surface of the device remains neutral. When the static charge removed is large, the dust and impurities originally adsorbed on the surface will also be taken away, so that the device can not only dissipate heat for the welding operation, but also have a good dust removal effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of a semiconductor laser welding equipment with a heat dissipation and dustproof structure proposed by the utility model;

[0017] Figure 2 It is a schematic diagram of the cross-sectional structure of the utility model;

[0018] Figure 3 for Figure 2 A is an enlarged structural diagram;

[0019] Figure 4 Schematic diagram of the internal structure of the heat dissipation mechanism.

[0020] In the figure: 1. main body of laser welding device; 2. guide rail; 3. sealing plate; 4. heat dissipation mechanism; 5. oxygen cylinder mounting base; 6. oxygen cylinder; 7. air duct; 8. nozzle; 9. air duct fixing plate; 10. air nozzle; 11. air nozzle connection port; 12. motor protection cover; 13. fan; 14. generator fixing plate; 15. plasma generator. DETAILED DESCRIPTION

[0021] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0022] In the description of the present invention, "plurality" means two or more than two, unless otherwise clearly and specifically defined.

[0023] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Example

[0026] Reference Figure 1-4A semiconductor laser welding equipment with a heat dissipation and dustproof structure includes a laser welding device body 1, a heat dissipation mechanism 4 and an oxygen cylinder mounting base 5. A bottom base is provided at the bottom of the laser welding device body 1, a welding chamber is provided at the upper end of the bottom base, a semiconductor fixture is provided inside the welding chamber, and a laser welding gun is provided at the upper end of the semiconductor fixture.

[0027] A heat dissipation mechanism 4 is embedded and connected to the side of the laser welding device body 1, an oxygen cylinder mounting base 5 is penetrated through the upper end of the laser welding device body 1, and an oxygen cylinder 6 is embedded and connected to the inner side of the oxygen cylinder mounting base 5, a guide rail 2 is fixedly installed on the upper surface of the laser welding device body 1, and a sealing plate 3 is embedded and connected to the outer side of the guide rail 2, a gas nozzle connecting port 11 is provided on the inner side of the oxygen cylinder mounting base 5, a gas nozzle 10 is penetrated through the bottom of the oxygen cylinder 6, an air guide tube 7 is provided at the bottom of the oxygen cylinder mounting base 5, and a nozzle 8 is penetrated at the other end of the air guide tube 7, an air guide tube fixing plate 9 is embedded and connected to the outer side of the air guide tube 7, and the air guide tube fixing plate 9 is fixedly connected to the inner wall of the laser welding device body 1, so that when the device is used for welding and processing semiconductors, the staff can pull the sealing plate 3 to slide the sealing plate 3 on the outer side of the guide rail 2 away from the welding room, and then the staff will need The semiconductor to be welded is placed on the surface of the fixture in the welding chamber for fixation. After the semiconductor is fixed, the staff pushes the sealing plate 3 to the outside of the welding chamber so that the sealing plate 3 is embedded in the outside of the welding chamber. Through this operation, the welding-type sealing and dust-proof work is completed. Then the staff can start the laser welding gun through the external controller to make the welding gun weld the semiconductor. In this process, since the environment in the welding chamber is relatively sealed, the staff can open the oxygen cylinder 6 through the external controller to allow the oxygen inside the oxygen cylinder 6 to be input into the air duct 7 through the gas nozzle 10 and the gas nozzle connecting port 11, and then the oxygen is transported to the nozzle 8 through the gas duct 7, and the nozzle 8 inputs the oxygen into the welding chamber, so as to ensure that there is sufficient oxygen inside the welding chamber when the welding operation is in progress. At the same time, the sealing of the sealing plate 3 can prevent a large amount of dust and other impurities from entering the welding chamber.

[0028] A motor protection cover 12 is provided inside the heat dissipation mechanism 4, and a fan 13 is embedded and connected to one side of the motor protection cover 12, a generator fixing plate 14 is provided at the other end of the fan 13, and the upper and lower ends of the generator fixing plate 14 are fixedly connected with plasma generators 15, and there are two generator fixing plates 14 in total, and the two generator fixing plates 14 are symmetrically arranged inside the heat dissipation mechanism 4, and the two generator fixing plates 14 are installed on the inner walls on both sides of the heat dissipation mechanism 4. Through this design, the middle of the two generator fixing plates 14 is the output end of the plasma wind, and the space reserved in the middle allows the airflow generated by the fan 13 to drive the plasma wind to be transported to the inside of the welding room, and a plurality of fans 13 are equidistantly provided on one side of the motor protection cover 12, and the inside of the motor protection cover 12 is provided with a plurality of fans 13 corresponding to the fans 13. A motor is installed so that when the device is performing welding operations, the staff can start the generator fixing plate 14 and the motor protection cover 12 through an external controller, so that the motor protection cover 12 drives the fan 13 to rotate through the transmission shaft, and at the same time, the generator fixing plate 14 ionizes the air through a high-voltage power supply to form plasma, and then the fan 13 blows the outside air mixed with the plasma airflow into the welding room. While the high-speed airflow has a heat dissipation effect on the semiconductor and the welding gun, the airflow generated by the plasma wind delivered by the fan 13 can take away the static charge inside the device and on the surface of the semiconductor, so that the internal surface of the device remains neutral. When the static charge removed is large, the dust and impurities originally adsorbed on the surface will also be taken away, so that the device can not only dissipate heat for the welding operation, but also have a good dust removal effect.

[0029] The sealing plate 3 is rectangular as a whole, and the overall size of the sealing plate 3 is consistent with the size of the welding chamber outlet of the laser welding device body 1. Through this design, the sealing plate 3 can fit more closely on the inner side of the welding chamber outlet, thereby enhancing the sealing effect of the sealing plate 3.

[0030] The heat dissipation mechanism 4 is rectangular as a whole, and a honeycomb air inlet is provided on the outside of the heat dissipation mechanism 4. An air outlet is provided on the surface of the side of the laser welding device body 1 away from the heat dissipation mechanism 4, and a one-way valve is provided on the inside of the air outlet. A filter plate is provided on the inside of the honeycomb air inlet. The filter plate can prevent excessive impurities in the outside air when the fan 13 rotates to bring in outside air. At the same time, after the airflow output by the fan 13 is blown into the welding room, it can be discharged through the air outlet on the other side of the laser welding device body 1. The one-way valve on the inside of the air outlet can also prevent outside air from entering the welding room through the air outlet.

[0031] Working principle: When the device is used for welding semiconductors, the staff can pull the sealing plate 3 to make the sealing plate 3 slide on the outside of the guide rail 2 away from the welding chamber, and then the staff puts the semiconductor to be welded into the fixture surface in the welding chamber for fixing. After the semiconductor is fixed, the staff pushes the sealing plate 3 to the outside of the welding chamber so that the sealing plate 3 is embedded in the outside of the welding chamber. Through this operation, the welding-type sealing and dust-proof work is completed. Then the staff can start the laser welding gun through the external controller to make the welding gun weld the semiconductor. In this process, since the environment in the welding room is relatively sealed, the staff can open the oxygen cylinder 6 through the external controller, so that the oxygen inside the oxygen cylinder 6 is input into the air duct 7 through the gas nozzle 10 and the gas nozzle connecting port 11, and then the oxygen is transported to the nozzle 8 through the air duct 7, and the nozzle 8 inputs the oxygen into the welding chamber, so as to ensure that there is sufficient oxygen inside the welding chamber when the welding operation is in progress. At the same time, the sealing of the sealing plate 3 can prevent a large amount of dust and other impurities from entering the welding chamber.

[0032] The above embodiments are preferred implementation modes of the present invention, but the implementation modes of the present invention are not limited by the above embodiments. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principle of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

[0033] In the description of the present invention, it is necessary to understand that the terms indicating orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

Claims

1. A semiconductor laser welding device with a heat dissipation and dustproof structure, comprising a laser welding device body (1), a heat dissipation mechanism (4) and an oxygen cylinder mounting base (5), characterized in that: A heat dissipation mechanism (4) is connected to the side of the laser welding device body (1); an oxygen cylinder mounting base (5) is penetrated through the upper end of the laser welding device body (1); an oxygen cylinder (6) is embedded and connected to the inner side of the oxygen cylinder mounting base (5); a guide rail (2) is fixedly mounted on the upper surface of the laser welding device body (1); and a sealing plate (3) is embedded and connected to the outer side of the guide rail (2); a gas nozzle connection port (11) is provided on the inner side of the oxygen cylinder mounting base (5); a gas nozzle (10) is penetrated through the bottom of the oxygen cylinder (6); an air guide tube (7) is provided at the bottom of the oxygen cylinder mounting base (5); and a nozzle (8) is penetrated through the other end of the air guide tube (7); an air guide tube fixing plate (9) is embedded and connected to the outer side of the air guide tube (7); and the air guide tube fixing plate (9) is fixedly connected to the inner wall of the laser welding device body (1).

2. The semiconductor laser welding equipment with heat dissipation and dust prevention structure according to claim 1, characterized in that: A motor protection cover (12) is provided inside the heat dissipation mechanism (4), and a fan (13) is embedded and connected to one side of the motor protection cover (12), a generator fixing plate (14) is provided at the other end of the fan (13), and a plasma generator (15) is fixedly connected to both upper and lower ends of the generator fixing plate (14).

3. The semiconductor laser welding equipment with heat dissipation and dust prevention structure according to claim 2, characterized in that: A total of two generator fixing plates (14) are provided, and the two generator fixing plates (14) are symmetrically arranged inside the heat dissipation mechanism (4), and the two generator fixing plates (14) are both installed on the inner walls on both sides of the heat dissipation mechanism (4).

4. The semiconductor laser welding equipment with heat dissipation and dust prevention structure according to claim 2, characterized in that: A plurality of fans (13) are equidistantly arranged on one side of the motor protection cover (12), and a plurality of motors are arranged inside the motor protection cover (12) corresponding to the fans (13).

5. The semiconductor laser welding equipment with heat dissipation and dust prevention structure according to claim 1, characterized in that: The sealing plate (3) is rectangular as a whole, and the overall size of the sealing plate (3) is consistent with the size of the welding chamber outlet of the laser welding device body (1).

6. The semiconductor laser welding equipment with heat dissipation and dust prevention structure according to claim 1, characterized in that: The heat dissipation mechanism (4) is rectangular as a whole, and a honeycomb-shaped air inlet is provided on the outer side of the heat dissipation mechanism (4).

7. The semiconductor laser welding equipment with heat dissipation and dust prevention structure according to claim 1, characterized in that: An air outlet is provided on a surface of a side of the laser welding device body (1) away from the heat dissipation mechanism (4), and a one-way valve is provided on the inner side of the air outlet.

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