Silicon wafer grinding machine
By designing a silicon wafer grinder including an automatic discharge system, the problem of manual operation of the grinding liquid in the prior art is solved, and automatic lubrication and efficient grinding are achieved.
Patent Information
- Application Number
- CN202421178874.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-28
AI Technical Summary
During the grinding process, existing silicon wafer grinders require staff to manually rotate the adjustment disk to make the grinding liquid fall on the surface of the silicon wafer, which is inconvenient to operate.
A silicon wafer grinder including a base, a workbench, a displacement mechanism, a motor, a grinding module and a liquid discharge mechanism is designed. Through the cooperation of the driving module and the liquid discharge mechanism, the automatic discharge of the grinding liquid is realized and the grinding wheel is lubricated. Improve the polishing effect of silicon wafers.
Automatic discharge of grinding liquid is realized, the operation process is simplified, the grinding effect of silicon wafers is improved, and human error is reduced.
Smart Images
Figure CN222449797U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer grinding, in particular to a silicon wafer grinding machine. Background Art
[0002] Silicon material has become the most widely used semiconductor material because of its good high temperature resistance and radiation resistance, and is particularly suitable for the production of high-power devices. Most integrated circuit semiconductor devices are made of silicon material. After the silicon wafer is produced, it is usually necessary to grind its surface to make it smoother.
[0003] In the patent application with authorization publication number CN218747005U, authorization publication date 2023-03-28, and name "A IGBT silicon wafer grinder", when the IGBT silicon wafer is to be ground, the staff injects an appropriate amount of grinding liquid into the loading frame. When the IGBT silicon wafer is ground, the staff turns the adjusting disk to drive the discharge pipe to rotate, and the first torsion spring is deformed accordingly. When the discharge pipe rotates and aligns with the discharge hole, the grinding liquid in the loading frame can flow to the surface of the IGBT silicon wafer through the discharge hole and the discharge pipe, thereby playing a lubricating role, so that the grinding disk can grind the surface of the IGBT silicon wafer smoother; in the actual use of the above-mentioned device, the staff needs to rotate the adjusting disk by themselves to make the grinding liquid fall on the surface of the silicon wafer for lubrication, which is inconvenient to operate.
[0004] So we proposed a silicon wafer grinder to solve the above problems. Utility Model Content
[0005] 1. Technical problems to be solved by the utility model:
[0006] The purpose of the utility model is to provide a silicon wafer grinding machine to solve the problems in the current market raised by the above background technology.
[0007] 2. Technical solution:
[0008] To achieve the above object, the utility model provides the following technical solution: a silicon wafer grinding machine, comprising a base, a workbench capable of fixing a silicon wafer is installed on the front side of the upper end of the base, a displacement mechanism is installed on the rear side of the upper end of the base, and the output end of the displacement mechanism is connected to a motor, and the output end of the motor is connected to a grinding module, and a water collecting tank is installed on the outer side of the lower end of the workbench;
[0009] A base plate is fixedly connected to the lower part of the motor housing, and a grinding liquid box is fixed to the lower end of the base plate, and a liquid injection port is installed at the front end of the grinding liquid box, and a liquid discharge mechanism is installed at the lower end side of the grinding liquid box, and the liquid discharge mechanism discharges the grinding liquid for use as a lubricant;
[0010] A gear plate is installed on the lower end bearing of the discharge mechanism, a driving module is connected between the gear plate and the grinding module, and the grinding module drives the gear plate to rotate through the driving module.
[0011] Furthermore, the grinding module includes a central shaft connected to the output end of the motor, a telescopic rod is provided at the lower end of the central shaft, the lower end of the central shaft is connected to the fixed end of the telescopic rod, and the movable end of the telescopic rod is connected to the grinding wheel, and a buffer spring is provided on the outer side of the telescopic rod, and a sleeve is fixed to the lower end of the central shaft.
[0012] Through the above technical solution, the impact can be buffered under the cooperation of the buffer spring and the telescopic rod.
[0013] Furthermore, the drainage mechanism includes a drainage pipe connected to the grinding liquid tank, a fixing plate is fixed inside the drainage pipe, and the fixing plate is in contact with the upper end surface of the gear plate, and through holes are correspondingly opened inside the fixing plate and the gear plate.
[0014] Through the above technical solution, when the gear plate drives the through hole opened by itself to face the through hole on the fixed plate, the grinding liquid can be discharged.
[0015] Furthermore, a torsion spring is sleeved on the outer side of the drain pipe, and two ends of the torsion spring are respectively connected to the gear plate and the grinding liquid tank.
[0016] Through the above technical solution, the gear plate can be reversely rotated and reset under the action of the torsion spring.
[0017] Furthermore, the driving module includes driving gear blocks distributed at equal angles on the outside of the sleeve, and the driving gear blocks are meshed with the guide gear, and the guide gear bearing is installed at the lower end of the grinding liquid box, and the lower end bearing of the grinding liquid box is installed with an inner gear ring, which meshes with the guide gear.
[0018] Through the above technical solution, after the sleeve rotates, the inner gear ring can be driven to rotate.
[0019] Furthermore, a tooth block group is installed on the outer wall of the inner gear ring, and the tooth block group is meshed with the side of the gear plate.
[0020] Through the above technical solution, the inner gear ring drives the gear plate to rotate under the cooperation of the gear block group.
[0021] 3. Beneficial effects:
[0022] By adopting the technical solution provided by the utility model, compared with the prior art, the silicon wafer grinding machine of the utility model realizes the automatic discharge of the grinding liquid through the cooperation of the driving module and the liquid discharge mechanism, provides lubricant for the grinding wheel, and improves the grinding effect of the silicon wafer. The specific contents are as follows:
[0023] (1) When the motor drives the grinding wheel to grind the silicon wafer through the central shaft, the central shaft drives the sleeve to rotate synchronously, and the sleeve drives the guide gear to rotate by driving the tooth block, and the guide gear drives the inner ring to rotate at a reduced speed by meshing with the inner ring gear. After the inner ring gear rotates, the inner ring gear drives the gear plate to rotate at the lower end of the drain pipe by meshing with the tooth block group and the gear plate. When the gear plate rotates until the through hole opened in itself is opposite to the through hole opened in the fixed plate, the grinding liquid in the grinding liquid box can be discharged from the drain pipe and fall on the silicon wafer, providing lubricant for the grinding wheel and improving the grinding effect of the silicon wafer. Then, when the tooth block group is not meshed with the gear plate, the gear plate is driven to return to its original position under the elastic action of the torsion spring, thereby blocking the outflow of the grinding liquid.
[0024] (2) The displacement mechanism drives the grinding module to move toward the silicon wafer. When the grinding wheel contacts the silicon wafer, the buffer spring and the telescopic rod work together to buffer the impact force. The buffer spring also allows the silicon wafer to adhere closely to the surface of the silicon wafer, thereby improving the grinding effect of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS
[0025] Figure 1 This is a schematic diagram of the overall side-view stereoscopic structure of the utility model;
[0026] Figure 2 This is a schematic diagram of the three-dimensional structure of the substrate of the utility model from a side view;
[0027] Figure 3 This is a schematic diagram of the three-dimensional structure of the grinding module of the utility model from a side view;
[0028] Figure 4 This is a schematic diagram of the structure of the drive module of the utility model when viewed from above;
[0029] Figure 5 It is a side-section stereoscopic structural schematic diagram of the liquid discharge mechanism of the utility model.
[0030] In the figure: 1. base; 2. workbench; 3. water collecting tank; 4. displacement mechanism; 5. motor; 6. substrate; 7. grinding module; 71. central axis; 72. telescopic rod; 73. grinding wheel; 74. buffer spring; 75. sleeve; 8. grinding liquid tank; 81. liquid filling port; 82. liquid discharge mechanism; 821. liquid discharge pipe; 822. fixing plate; 823. gear plate; 824. torsion spring; 825. through hole; 9. driving module; 91. driving gear block; 92. guide gear; 93. inner gear ring; 94. gear block group. DETAILED DESCRIPTION
[0031] In order to facilitate the understanding of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0032] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "page", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed", "provided with", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. Example
[0035] See also Figure 1-5A silicon wafer grinding machine comprises a base 1, a workbench 2 for fixing silicon wafers is installed on the front side of the upper end of the base 1, and a displacement mechanism 4 is installed on the rear side of the upper end of the base 1, and the output end of the displacement mechanism 4 is connected to a motor 5, and the output end of the motor 5 is connected to a grinding module 7, and a water collecting tank 3 is installed on the outer side of the lower end of the workbench 2; a base plate 6 is fixedly connected to the lower part of the shell of the motor 5, and a grinding liquid box 8 is fixed to the lower end of the base plate 6, and a liquid injection port 81 is installed at the front end of the grinding liquid box 8, and a drainage mechanism 82 is installed on the lower end side of the grinding liquid box 8, and the drainage mechanism 82 discharges the grinding liquid for use as a lubricant; a gear plate 823 is installed on the lower end bearing of the drainage mechanism 82, and a driving module 9 is connected between the gear plate 823 and the grinding module 7, and the grinding module 7 drives the gear plate 823 to rotate through the driving module 9; the drainage mechanism 82 includes a drain pipe 821 connected to the grinding liquid box 8, a fixed plate 822 is fixed inside the drain pipe 821, and the fixed plate 822 is in contact with the upper end surface of the gear plate 823, and through holes 825 are correspondingly opened inside the fixed plate 822 and the gear plate 823; a torsion spring 824 is sleeved on the outer side of the drain pipe 821, and the two ends of the torsion spring 824 are respectively connected to the gear plate 823 and the grinding liquid box 8; the driving module 9 includes a driving tooth block 91 distributed at an equal angle on the outer side of the sleeve 75, and the driving tooth block 91 is meshed with the guide gear 92, and the guide gear 92 is mounted on the lower end of the grinding liquid box 8, and the lower end bearing of the grinding liquid box 8 is mounted with an inner gear ring 93, and the inner gear ring 93 is meshed with the guide gear 92; a tooth block group 94 is mounted on the outer wall of the inner gear ring 93, and the tooth block group 94 is meshed with the side of the gear plate 823;
[0036] Combination Figure 1-5 As shown, the motor 5 is started, and the motor 5 drives the grinding wheel 73 to grind the silicon wafer through the central shaft 71. The central shaft 71 drives the sleeve 75 to rotate synchronously. The sleeve 75 drives the guide gear 92 to rotate by driving the gear block 91. The guide gear 92 drives the inner gear ring 93 to rotate at a reduced speed by meshing with the inner gear ring 93. When the inner gear ring 93 rotates, the inner gear ring 93 drives the gear plate 823 to rotate in the discharge pipe 821 by meshing with the gear block group 94 and the gear plate 823. When the gear plate 823 rotates to the position where the through hole 825 provided in the gear plate 823 is opposite to the through hole 825 provided in the fixed plate 822, the grinding liquid in the grinding liquid box 8 can be discharged from the drain pipe 821 and fall on the silicon wafer, providing lubricant for the grinding wheel 73, thereby improving the grinding effect on the silicon wafer. Then, when the tooth block group 94 is not engaged with the gear plate 823, the gear plate 823 is driven to return to its original position under the elastic action of the torsion spring 824, thereby blocking the outflow of the grinding liquid.
[0037] The grinding module 7 includes a central shaft 71 connected to the output end of the motor 5, a telescopic rod 72 is provided at the lower end of the central shaft 71, the lower end of the central shaft 71 is connected to the fixed end of the telescopic rod 72, and a grinding wheel 73 is connected to the movable end of the telescopic rod 72, and a buffer spring 74 is sleeved on the outer side of the telescopic rod 72, and a sleeve 75 is fixed to the lower end of the central shaft 71;
[0038] Combination Figure 2-3 As shown, the grinding module 7 is driven to move toward the silicon wafer under the action of the displacement mechanism 4. When the grinding wheel 73 contacts the silicon wafer, the impact force can be buffered under the cooperation of the buffer spring 74 and the telescopic rod 72. In addition, the buffer spring 74 can cause the silicon wafer to be tightly attached to the surface of the silicon wafer, thereby improving the grinding effect of the silicon wafer.
[0039] Working principle: When using this silicon wafer grinder, Figure 1-5 As shown, first, the silicon wafer is placed on the workbench 2 for fixing, and then the grinding wheel 73 is driven to move in the direction of the silicon wafer by the displacement mechanism 4, and then the motor 5 is started, and the motor 5 drives the grinding wheel 73 to grind the silicon wafer. While the sleeve 75 rotates, the driving module 9 is used to drive the gear plate 823 to rotate. When the gear plate 823 rotates to the point where the through hole 825 opened in the gear plate 823 is opposite to the through hole 825 opened in the fixed plate 822, the grinding liquid in the grinding liquid box 8 can be discharged from the drain pipe 821 and fall on the silicon wafer, providing lubricant for the grinding wheel 73 and improving the grinding effect on the silicon wafer. Then, when the tooth block group 94 is not engaged with the gear plate 823, the gear plate 823 is driven to return to its original position under the elastic action of the torsion spring 824, thereby blocking the outflow of the grinding liquid. The grinding liquid finally falls into the sump 3 for centralized treatment.
[0040] The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.
[0041] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.
Claims
1. A silicon wafer grinding machine, characterized in that: It comprises a base (1), a workbench (2) capable of fixing a silicon wafer is installed on the front side of the upper end of the base (1), a displacement mechanism (4) is installed on the rear side of the upper end of the base (1), the output end of the displacement mechanism (4) is connected to a motor (5), the output end of the motor (5) is connected to a grinding module (7), and a water collecting tank (3) is installed on the outer side of the lower end of the workbench (2); A base plate (6) is fixedly connected to the lower part of the housing of the motor (5), a grinding liquid box (8) is fixed to the lower end of the base plate (6), a liquid injection port (81) is installed at the front end of the grinding liquid box (8), and a liquid discharge mechanism (82) is installed at the lower end side of the grinding liquid box (8), and the liquid discharge mechanism (82) discharges the grinding liquid for use as a lubricant; A gear plate (823) is installed on the bearing at the lower end of the liquid discharge mechanism (82); a driving module (9) is connected between the gear plate (823) and the grinding module (7); the grinding module (7) drives the gear plate (823) to rotate via the driving module (9).
2. A silicon wafer grinding machine according to claim 1, characterized in that: The grinding module (7) comprises a central shaft (71) connected to the output end of the motor (5); a telescopic rod (72) is provided at the lower end of the central shaft (71); the lower end of the central shaft (71) is connected to the fixed end of the telescopic rod (72); the movable end of the telescopic rod (72) is connected to a grinding wheel (73); a buffer spring (74) is sleeved on the outer side of the telescopic rod (72); and a sleeve (75) is fixed to the lower end of the central shaft (71).
3. A silicon wafer grinding machine according to claim 1, characterized in that: The drainage mechanism (82) comprises a drainage pipe (821) connected to the grinding liquid tank (8); a fixing plate (822) is fixed inside the drainage pipe (821); the fixing plate (822) is in contact with the upper end surface of the gear plate (823); and through holes (825) are correspondingly provided inside the fixing plate (822) and the gear plate (823).
4. A silicon wafer grinding machine according to claim 3, characterized in that: The outer side of the liquid discharge pipe (821) is sleeved with a torsion spring (824), and the two ends of the torsion spring (824) are respectively connected to the gear plate (823) and the grinding liquid tank (8).
5. A silicon wafer grinding machine according to claim 1, characterized in that: The driving module (9) comprises driving tooth blocks (91) which are distributed at equal angles on the outside of the sleeve (75), and the driving tooth blocks (91) are meshingly connected with the guide gear (92), and the guide gear (92) is mounted on a bearing at the lower end of the grinding liquid box (8), and an inner gear ring (93) is mounted on the lower end bearing of the grinding liquid box (8), and the inner gear ring (93) is meshing with the guide gear (92).
6. A silicon wafer grinding machine according to claim 5, characterized in that: A tooth block set (94) is installed on the outer wall of the inner tooth ring (93), and the tooth block set (94) is meshed with the side of the gear plate (823).