Cutting device for semiconductor material processing

Abstract

The utility model discloses a cutting device for semiconductor material processing, and belongs to the technical field of cutting. A cutting device for semiconductor material processing is used for cutting semiconductor materials and comprises a rack; the first guide plate is fixedly connected with the rack; the second guide plate is fixedly connected with the rack; the first sliding block is vertically and slidably connected with the first guide plate; the two ends of the first spring are fixedly connected with the first sliding block and the first guide plate respectively; the second sliding block is vertically and slidably connected with the second guide plate; the two ends of the second spring are fixedly connected with the second sliding block and the second guide plate respectively; the two ends of the pressing plate are fixedly connected with the first sliding block and the second sliding block respectively; two ends of the first rotating shaft are rotationally connected with the first guide plate and the second guide plate respectively; and the cam is fixedly connected with the first rotating shaft. The cutting device for semiconductor material processing has the beneficial effect that the cutting device for semiconductor material processing is convenient to fix.

Description

Technical Field

[0001] The present application relates to the field of cutting technology, and in particular to a cutting device for semiconductor material processing. Background Art

[0002] Semiconductor materials are a type of electronic material that has semiconductor properties and conductivity between conductors and insulators. They can be used to make semiconductor devices and integrated circuits. They have stable structures, excellent electrical properties, and low costs, and can be used to manufacture field effect transistors that are widely used in modern electronic devices.

[0003] The cutting device for semiconductor material processing is a device specially used for cutting semiconductor materials. The current cutting device for semiconductor material processing needs to manually drive the cutting wheel when cutting semiconductor materials, which has low work efficiency, low safety, and is not convenient for use. When cutting semiconductor materials, a fixing device is needed to fix the semiconductor materials, and multiple screws are needed. After cutting, the screws need to be loosened, and the process is very troublesome.

[0004] Therefore, a cutting device for semiconductor material processing which is easy to fix is ​​provided. Utility Model Content

[0005] The content of this application is used to introduce concepts in a brief form, which will be described in detail in the detailed implementation section below. The content of this application is not intended to identify the key features or essential features of the technical solution claimed for protection, nor is it intended to limit the scope of the technical solution claimed for protection.

[0006] In order to solve the technical problems mentioned in the above background technology part, some embodiments of the present application provide a cutting device for semiconductor material processing, a cutting device for semiconductor material processing, used for cutting semiconductor materials, including: a frame; a first guide plate, fixedly connected to the frame; a second guide plate, fixedly connected to the frame; a first slider, vertically slidingly connected to the first guide plate; a first spring, whose two ends are respectively fixedly connected to the first slider and the first guide plate; the second slider, vertically slidingly connected to the second guide plate; the second spring, whose two ends are respectively fixedly connected to the second slider and the second guide plate; a pressure plate, whose two ends are respectively fixedly connected to the first slider and the second slider; a first rotating shaft, whose two ends are respectively rotatably connected to the first guide plate and the second guide plate; a cam, fixedly connected to the first rotating shaft; a first motor, fixedly connected to the first guide plate, and its drive shaft is fixed to the first rotating shaft; a cutting assembly, used for cutting semiconductor materials; a driving assembly, used to drive the cutting assembly; wherein the cam abuts against the pressure plate.

[0007] The first motor drives the first rotating shaft to rotate, and the rotation of the first rotating shaft drives the cam to rotate, thereby driving the pressure plate to move. The movement of the pressure plate will fix the semiconductor material, so it is easier to fix.

[0008] Furthermore, the first guide plate is provided with a first sliding groove extending along the height direction of the first guide plate; and the first sliding block moves along the first sliding groove.

[0009] Furthermore, the second guide plate is provided with a second slide groove extending along the height direction of the second guide plate; the second sliding block moves along the second slide groove.

[0010] Furthermore, the driving assembly includes: a fixed plate, fixedly connected to the frame; a lead screw, rotatably connected to the fixed plate; a second motor, fixedly connected to the fixed plate, and its drive shaft is fixed to the lead screw; a third slider, horizontally slidably connected to the frame, and internally threadedly connected to the lead screw.

[0011] Furthermore, the frame is provided with a guide groove extending along the width direction of the frame; the third sliding block is partially located in the guide groove and moves along the guide groove.

[0012] Furthermore, the cutting assembly includes: a connecting frame fixedly connected to the third slider; a second rotating shaft rotatably connected to the connecting frame; a third motor fixedly connected to the connecting frame, and its drive shaft is fixed to the second rotating shaft; and a cutting blade fixedly connected to the second rotating shaft.

[0013] Furthermore, the frame is provided with a first avoidance groove; the first avoidance groove is for the cutting blade to pass through.

[0014] Furthermore, the first guide plate is located at one end of the first rotating shaft; and the second guide plate is located at the other end of the first rotating shaft.

[0015] The beneficial effect of the present application is that it provides a cutting device for semiconductor material processing that is specific and easy to fix. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings constituting a part of this application are used to provide a further understanding of this application, so that other features, purposes and advantages of this application become more obvious. The illustrative embodiment drawings and their descriptions of this application are used to explain this application and do not constitute an improper limitation on this application.

[0017] In addition, throughout the drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and that the components and elements are not necessarily drawn to scale.

[0018] In the attached picture:

[0019] Figure 1 is an overall schematic diagram according to an embodiment of the present application;

[0020] Figure 2 It is a schematic structural diagram of a part of the embodiment, mainly showing the structure of the convex surface and the arc surface;

[0021] Figure 3 It is an exploded view of a part of the embodiment, mainly showing the structure of the second sliding block and the second sliding groove;

[0022] Figure 4 It is an exploded view of a part of the embodiment, mainly showing the structure of the first sliding block and the first sliding groove.

[0023] Reference numerals:

[0024] 100. Cutting device for semiconductor material processing; 101. semiconductor material; 102. frame; 102a. guide groove;

[0025] 103, first guide plate; 103a, first slide groove; 104, second guide plate; 104a, second slide groove; 105, first slider; 106, first spring; 107, second slider; 108, second spring; 109, pressure plate; 110, first rotating shaft;

[0026] 112, cam; 112a, convex surface; 112b, arc surface; 113, first motor; 114, fixing plate; 115, lead screw;

[0027] 116, second motor; 117, third slider; 118, connecting frame; 119, second rotating shaft; 120, third motor; 121, cutting blade. DETAILED DESCRIPTION

[0028] Embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms, and it should not be interpreted as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided to provide a more thorough and complete understanding of the present disclosure. It should be understood that the drawings and embodiments of the present disclosure are only for exemplary purposes and are not intended to limit the scope of protection of the present disclosure.

[0029] It should also be noted that, for ease of description, only the parts related to the invention are shown in the drawings. In the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0030] It should be noted that the concepts such as "first" and "second" mentioned in the present disclosure are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0031] It should be noted that the modifications of "one" and "plurality" mentioned in the present disclosure are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0032] The present disclosure will be described in detail below with reference to the accompanying drawings and in conjunction with embodiments.

[0033] Reference Figure 1-4 A semiconductor material processing cutting device 100 is used for cutting semiconductor material 101, comprising: a frame 102, a first guide plate 103, a second guide plate 104, a fixing assembly for fixing the semiconductor material 101, a cutting assembly for cutting the semiconductor material 101, and a driving assembly for driving the cutting assembly to move. The first guide plate 103 is fixedly connected to the frame 102. The second guide plate 104 is fixedly connected to the frame 102.

[0034] The fixing assembly fixes the semiconductor material 101, and includes: a first slider 105, a first spring 106, a second slider 107, a second spring 108, a pressure plate 109, a first rotating shaft 110, a cam 112, and a first motor 113. The first slider 105 is vertically slidably connected to the first guide plate 103. Specifically, the first guide plate 103 is provided with a first slide groove 103a extending along the height direction of the first guide plate 103, and the first slider 105 moves along the first slide groove 103a. The two ends of the first spring 106 are respectively fixedly connected to the first slider 105 and the first guide plate 103. The second slider 107 is vertically slidably connected to the second guide plate 104. Specifically, the second guide plate 104 is provided with a second slide groove 104a extending along the height direction of the second guide plate 104, and the second slider 107 moves along the second slide groove 104a. The two ends of the second spring 108 are respectively fixedly connected to the second slider 107 and the second guide plate 104.

[0035] The two ends of the pressing plate 109 are fixedly connected to the first slider 105 and the second slider 107 respectively. The two ends of the first rotating shaft 110 are rotatably connected to the first guide plate 103 and the second guide plate respectively. The first guide plate 103 is located at one end of the first rotating shaft 110, and the second guide plate 104 is located at the other end of the first rotating shaft 110. The cam 112 is fixedly connected to the first rotating shaft 110. The first motor 113 is fixedly connected to the first guide plate 103, and the driving shaft of the first motor 113 is fixed to the first rotating shaft 110. Among them, the cam 112 is in contact with the pressing plate 109. The first motor 113 drives the first rotating shaft 110 to rotate, and the rotation of the first rotating shaft 110 drives the cam 112 to rotate, thereby driving the pressing plate 109 to move. The movement of the pressing plate 109 will fix the semiconductor material 101, and the fixation of the semiconductor material 101 is more convenient.

[0036] The driving assembly drives the movement of the cutting assembly, and includes: a fixed plate 114, a lead screw 115, a second motor 116, and a third slider 117. The fixed plate 114 is fixedly connected to the frame 102. The lead screw 115 is rotatably connected to the fixed plate 114. Two fixed plates 114 are provided, which are respectively located at the two ends of the lead screw 115. The second motor 116 is fixedly connected to the fixed plate 114, and the driving shaft of the second motor 116 is fixed to the lead screw 115. The third slider 117 is horizontally slidably connected to the frame 102, and the inside is threadedly connected to the lead screw 115. Specifically, the frame 102 is provided with a guide groove 102a extending along the width direction of the frame 102, and the third slider 117 is partially located in the guide groove 102a, and moves along the guide groove 102a. The second motor 116 drives the lead screw 115 to rotate, and the third slider 117 moves along the guide groove 102a, so the lead screw 115 drives the third slider 117 to move, and the movement of the third slider 117 drives the cutting assembly to move.

[0037] The cutting assembly is used for cutting the semiconductor material 101, and includes: a connecting frame 118, a second rotating shaft 119, a third motor 120, and a cutting blade 121. The connecting frame 118 is fixedly connected to the third slider 117. The second rotating shaft 119 is rotatably connected to the connecting frame 118. The third motor 120 is fixedly connected to the connecting frame 118, and the driving shaft of the third motor 120 is fixed to the second rotating shaft 119. The cutting blade 121 is fixedly connected to the second rotating shaft 119.

[0038] Working process: the first motor 113 drives the first rotating shaft 110 to rotate, and the rotation of the first rotating shaft 110 drives the cam 112 to rotate. The cam 112 includes a convex surface 112a and an arc surface 112b. The convex surface 112a of the cam 112 will drive the pressure plate 109 to move. The movement of the pressure plate 109 will fix the semiconductor material 101, and the fixation of the semiconductor material 101 is more convenient. Then the third motor 120 drives the second rotating shaft 119 to rotate, and the rotation of the second rotating shaft 119 drives the cutting blade 121 to rotate, and then the second motor 116 drives the lead screw 115 to rotate, and the third slider 117 moves along the guide groove 102a, so the lead screw 115 will drive the third slider 117 to move, and the movement of the third slider 117 drives the connecting block to move, and the movement of the connecting block drives the cutting blade 121 to move, thereby completing the cutting of the semiconductor material 101. After the cutting is completed, the first motor 113 drives the first rotating shaft 110 to rotate, and the rotation of the first rotating shaft 110 drives the cam 112 to rotate, and the arc surface 112b of the cam 112 will rotate to the position of the pressing plate 109. Under the action of the first spring 106 and the second spring 108, the first slider 105 and the second slider 107 will be reset, thereby driving the pressing plate 109 away from the semiconductor material 101, and the semiconductor material 101 can be taken out, which is convenient to operate.

[0039] The above descriptions are only some preferred embodiments of the present disclosure and an explanation of the technical principles used. Those skilled in the art should understand that the scope of the invention involved in the embodiments of the present disclosure is not limited to the technical solutions formed by a specific combination of the above-mentioned technical features, but should also cover other technical solutions formed by any combination of the above-mentioned technical features or their equivalent features without departing from the above-mentioned inventive concept. For example, the above-mentioned features are replaced with the technical features with similar functions disclosed in the embodiments of the present disclosure (but not limited to) and the technical solutions formed.

Claims

1. A cutting device for semiconductor material processing, used for cutting semiconductor materials, comprising: frame; Features: The semiconductor material processing cutting device also includes: A first guide plate, fixedly connected to the frame; A second guide plate, fixedly connected to the frame; A first sliding block is vertically slidably connected to the first guide plate; A first spring, two ends of which are respectively fixedly connected to the first slider and the first guide plate; A second sliding block is vertically slidably connected to the second guide plate; A second spring, both ends of which are fixedly connected to the second slider and the second guide plate respectively; A pressing plate, both ends of which are fixedly connected to the first slider and the second slider respectively; A first rotating shaft, two ends of which are rotatably connected to the first guide plate and the second guide plate respectively; A cam fixedly connected to the first rotating shaft; A first motor is fixedly connected to the first guide plate, and a drive shaft thereof is fixed to the first rotating shaft; Cutting components for cutting semiconductor materials; A driving assembly, used for driving the cutting assembly; Wherein, the cam abuts against the pressure plate.

2. The semiconductor material processing cutting device according to claim 1, characterized in that: The first guide plate is provided with a first slide groove extending along the height direction of the first guide plate; The first sliding block moves along the first sliding groove.

3. The semiconductor material processing cutting device according to claim 2, characterized in that: The second guide plate is provided with a second slide groove extending along the height direction of the second guide plate; The second sliding block moves along the second sliding groove.

4. The semiconductor material processing cutting device according to claim 3, characterized in that: The drive assembly comprises: A fixing plate, fixedly connected to the frame; A lead screw, rotatably connected to the fixed plate; A second motor is fixedly connected to the fixed plate, and a drive shaft thereof is fixed to the lead screw; The third sliding block is horizontally slidably connected with the frame and is internally threadedly connected with the lead screw.

5. The semiconductor material processing cutting device according to claim 4, characterized in that: The frame is provided with a guide groove extending along the width direction of the frame; The third sliding block is partially located in the guide groove and moves along the guide groove.

6. The semiconductor material processing cutting device according to claim 5, characterized in that: The cutting assembly comprises: A connecting frame, fixedly connected to the third sliding block; A second rotating shaft is rotatably connected to the connecting frame; A third motor is fixedly connected to the connecting frame, and a driving shaft thereof is fixed to the second rotating shaft; The cutting blade is fixedly connected to the second rotating shaft.

7. The semiconductor material processing cutting device according to claim 6, characterized in that: The frame is provided with a first avoidance groove; The first avoidance groove is for the cutting blade to pass through.

8. The semiconductor material processing cutting device according to claim 7, characterized in that: The first guide plate is located at one end of the first rotating shaft; The second guide plate is located at the other end of the first rotating shaft.

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