Uniform-heating heating disc structure and thin film deposition device
By designing a heating disk structure with uniform heating, the problem of uneven heat receiving of wafers during film deposition is solved, and the film uniformity and deposition quality of wafer surface are improved.
Patent Information
- Application Number
- CN202420941778.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-30
AI Technical Summary
In the prior art, the wafer is heated unevenly during the thin film deposition process, resulting in uneven film on the wafer surface, affecting the quality of the wafer film deposition.
A heating disk structure with uniform heating is designed, including a first heating disk, a second heating disk and an air intake pipe. By providing a heating element on the first heating plate for heating, and providing an air outlet on the second heating plate for communication with the intake passage of the first heating plate, gas is transported into the intake pipe by using the driving member to ensure that the temperature in the chamber is uniform. .
Through this heating disk structure, heat energy can be distributed effectively and uniformly, local overheating problems can be reduced, temperature in the chamber is uniform, uniformity of wafers during film deposition, and quality of wafer film deposition is ensured.
Smart Images
Figure CN222455214U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of thin film deposition, in particular to a heating disc structure with uniform heating and a thin film deposition device. Background Art
[0002] Thin film deposition is an important part of wafer processing and manufacturing, which forms a thin film on the surface of the wafer through thin film deposition equipment. Chemical vapor thin film deposition equipment is one of them. It places the wafer in the reaction chamber, and the reaction gas enters the reaction chamber through the gas distribution plate, and uses a radio frequency device to plasmatize the reaction gas. The heating plate in the reaction chamber provides the temperature required for the wafer reaction, so that a thin film is deposited on the wafer.
[0003] In the prior art, when depositing a thin film, the wafer is placed on the upper surface of a heating plate, and the heating plate is heated by a heating element inside the heating plate. During the heating process, since the heating element directly heats the heating plate, the temperature on the upper surface of the heating plate or the temperature in the chamber may be uneven, resulting in uneven heating of the wafer, and further causing uneven film on the surface of the wafer, affecting the quality of wafer film deposition. Utility Model Content
[0004] In view of this, the utility model provides a heating plate structure with uniform heating and a thin film deposition device to solve the problem of uneven heating of the wafer, which causes uneven film on the surface of the wafer.
[0005] In a first aspect, the utility model provides a heating plate structure for uniform heating, comprising:
[0006] The first heating plate is provided with a first air inlet passage;
[0007] A heating element, disposed on the first heating plate, for heating the first heating plate;
[0008] a second heating plate, disposed on an upper surface of the first heating plate, the upper surface of the second heating plate being suitable for placing wafers, the second heating plate being provided with at least one air outlet hole penetrating the upper surface and the lower surface of the second heating plate, the air outlet hole being communicated with the first air inlet channel;
[0009] An air intake pipe has one end connected to the first air intake passage and the other end suitable for being connected to a driving member, and the driving member is used to transport gas to the air intake pipe.
[0010] Beneficial effects: This uniformly heated heating plate structure sets the heating element on the first heating plate, and directly heats the first heating plate through the heating element. Since the second heating plate is set on the upper surface of the first heating plate, the first heating plate transfers heat evenly to the second heating plate after heating, which can effectively and evenly distribute heat energy and help reduce the problem of local overheating caused by direct heating. At the same time, the driving member is connected to the air inlet pipe, and the first air inlet channel on the first heating plate is connected to the air outlet on the second heating plate. The gas is transported into the air inlet pipe through the driving member. When the gas passes through the first air inlet channel of the first heating plate, it will pass through the first heating plate and be heated to the same temperature as the first heating plate, and the heated gas will be discharged from the air outlet, ensuring the uniform temperature in the chamber, improving the heating efficiency and temperature uniformity, thereby improving the uniformity of the wafer during thin film deposition and ensuring the quality of wafer thin film deposition.
[0011] In an optional embodiment, the air outlet is inclined, and in a direction from the lower surface of the second heating plate to the upper surface of the second heating plate, the air outlet is inclined from a central area close to the second heating plate to a direction away from the central area of the second heating plate.
[0012] Beneficial effect: The air outlet is tilted so that it can be set at the edge of the second heating plate, avoiding the placement of the wafer and preventing the wafer from blocking the air outlet. At the same time, the tilted air outlet can promote the rapid discharge of hot air inside the heating plate structure, speed up the heat dissipation process, and help maintain the thermal stability of the heating plate.
[0013] In an optional embodiment, a plurality of the air outlet holes are arranged at intervals, and the plurality of the air outlet holes are arranged in a ring-shaped distribution.
[0014] Beneficial effect: The multiple air outlet holes distributed in a ring shape can ensure that the gas on the upper surface of the second heating plate is discharged more evenly. Each air outlet hole serves as an independent exhaust channel, which can effectively avoid gas accumulation in local areas, thereby forming a more uniform temperature field on the surface of the heating plate and in the chamber, thereby improving the uniformity of heating.
[0015] In an optional embodiment, an annular groove is formed on the upper surface of the first heating plate, and the annular groove is respectively connected to the first air inlet channel and the plurality of air outlet holes.
[0016] Beneficial effect: By setting an annular groove on the upper surface of the first heating plate, since the annular groove is connected to the first air inlet channel, when installing the second heating plate, it is only necessary to connect multiple air outlets at different positions to the annular groove, so that multiple air outlets can be connected to the first air inlet channel. At the same time, the annular groove is set on the first heating plate, and the gas enters the annular groove from the first air inlet channel. Since the contact area between the annular groove and the first heating plate is large, the gas in the annular groove can be quickly heated to the required temperature and then discharged from the air outlet, thereby ensuring that the temperature of the discharged gas reaches a constant value.
[0017] In an optional embodiment, a plurality of guide grooves are formed on the upper surface of the first heating plate, and one end of each of the guide grooves is connected to the first air inlet channel, and the other end of each of the guide grooves is connected to the annular groove.
[0018] Beneficial effect: By setting up multiple guide grooves to connect the first air inlet channel and the annular groove, the gas in the first air inlet channel can be more efficiently introduced into the annular groove, ensuring sufficient and rapid gas supply, providing a continuous and stable heat source for the heating process.
[0019] In an optional embodiment, the first air inlet passage and the plurality of guide grooves are both arranged in an inner ring covering area of the annular groove.
[0020] Beneficial effect: By arranging the first air inlet channel and the guide groove in the inner circle area of the annular groove, it can be ensured that the gas is evenly distributed starting from the central area, and then guided to various areas of the annular groove through multiple guide grooves, so that the gas can quickly enter the annular groove from the first air inlet channel.
[0021] In an optional embodiment, a mounting groove is formed on the lower surface of the first heating plate, and the heating element is disposed in the mounting groove.
[0022] Beneficial effects: By building the heating element into the mounting groove of the first heating plate, the overall structure can be made more compact and the space occupied by the device can be reduced. The heating element is installed in the first heating plate, which helps to improve the heating efficiency. At the same time, by reasonably designing the structure of the mounting groove, the heat can be evenly distributed on the surface of the first heating plate, reducing hot spots and ensuring uniform heating.
[0023] In an optional embodiment, a third heating plate is further included, wherein the third heating plate is disposed on the lower surface of the first heating plate, and a second air intake passage connected to the air intake pipe is opened on the third heating plate, and the second air intake passage is connected to the first air intake passage.
[0024] Beneficial effect: The third heating plate is arranged on the lower surface of the first heating plate, which can reduce the heat loss of the heating element and improve the overall heating efficiency and response speed. A second air inlet channel is opened on the third heating plate corresponding to the first air inlet channel, and the air inlet pipe can be arranged at the bottom of the third heating plate to communicate with the second air inlet channel, thereby reducing the chamber space occupied by the heating plate structure.
[0025] In an optional embodiment, the connection between the first heating plate, the second heating plate and the third heating plate is sealed.
[0026] Beneficial effect: Sealing the joints between the first heating plate, the second heating plate and the third heating plate can effectively improve the air tightness of the heating plate structure and reduce heat loss.
[0027] In a second aspect, the utility model further provides a thin film deposition device, comprising:
[0028] Chamber;
[0029] A heating plate structure with uniform heating, wherein the first heating plate and the second heating plate are arranged in the chamber.
[0030] Beneficial effects: This thin film deposition device arranges the first heating plate and the second heating plate in the chamber, and directly heats the first heating plate through the heating element. After the first heating plate is heated, the heat is evenly transferred to the second heating plate, which can effectively and evenly distribute the heat energy. The gas is transported into the air inlet pipe through the driving element. When the gas passes through the first air inlet channel of the first heating plate, it will be heated to the same temperature as the first heating plate through the first heating plate, and the heated gas will be discharged from the air outlet, ensuring the uniform temperature in the chamber, improving the heating efficiency and temperature uniformity, thereby improving the uniformity of the wafer during thin film deposition, and ensuring the quality of wafer thin film deposition. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0032] Figure 1 This is a schematic structural diagram of a heating plate structure with uniform heating according to an embodiment of the utility model;
[0033] Figure 2 for Figure 1 The internal schematic diagram of the second heating plate in the heating plate structure with uniform heating is shown;
[0034] Figure 3 for Figure 1 A top view of the second heating plate in the heating plate structure for uniform heating is shown;
[0035] Figure 4 for Figure 1 A bottom view of the second heating plate in the heating plate structure for uniform heating is shown;
[0036] Figure 5 for Figure 1 A schematic structural diagram of a first heating plate in the heating plate structure for uniform heating shown;
[0037] Figure 6 for Figure 1 A top view of the first heating plate in the heating plate structure for uniform heating is shown;
[0038] Figure 7 for Figure 1 A bottom view of the first heating plate in the heating plate structure for uniform heating is shown.
[0039] Description of reference numerals:
[0040] 1. First heating plate; 101. First air inlet channel; 102. Annular groove; 103. Guide groove; 104. Mounting groove; 2. Second heating plate; 201. Air outlet hole; 202. Air exhaust hole; 3. Air inlet pipe; 4. Third heating plate; 5. Air exhaust pipe. DETAILED DESCRIPTION
[0041] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0042] In the related art, when depositing a thin film, the wafer is placed on the upper surface of a heating plate, and the heating plate is heated by a heating element inside the heating plate. During the heating process, since the heating element directly heats the heating plate, the temperature on the upper surface of the heating plate or the temperature in the chamber may be uneven, resulting in uneven heating of the wafer, and further causing uneven film on the surface of the wafer, affecting the quality of wafer film deposition.
[0043] In order to solve the above technical problems, the following Figures 1 to 7 , describing an embodiment of the utility model.
[0044] According to an embodiment of the present utility model, on the one hand, combined with Figures 1 to 7As shown, a heating plate structure with uniform heating is provided, comprising a first heating plate 1, a heating element, a second heating plate 2 and an air inlet pipe 3.
[0045] Specifically, combined Figure 1 , Figure 5 and Figure 6 As shown, a first air inlet channel 101 is provided on the first heating plate 1 .
[0046] Specifically, a heating element (not shown in the figure) is disposed on the first heating plate 1 , and the heating element is used to heat the first heating plate 1 .
[0047] Specifically, combined Figures 1 to 3 As shown, the second heating plate 2 is arranged on the upper surface of the first heating plate 1, the upper surface of the second heating plate 2 is suitable for placing wafers, and at least one air outlet 201 is opened on the second heating plate 2, and the air outlet 201 runs through the upper surface and the lower surface of the second heating plate 2. The air outlet 201 is connected to the first air inlet channel 101.
[0048] Specifically, Figure 1 As shown, one end of the air intake pipe 3 is communicated with the first air intake channel 101 , and the other end is suitable for being connected with a driving member, and the driving member is used to deliver gas to the air intake pipe 3 .
[0049] In this uniformly heated heating plate structure, the heating element is arranged on the first heating plate 1, and the first heating plate 1 is directly heated by the heating element. Since the second heating plate 2 is arranged on the upper surface of the first heating plate 1, the first heating plate 1 transfers heat uniformly to the second heating plate 2 after being heated, which can effectively and evenly distribute heat energy and help reduce the problem of local overheating caused by direct heating. At the same time, the driving element is connected to the air inlet pipe 3, and the first air inlet channel 101 on the first heating plate 1 is connected to the air outlet 201 on the second heating plate 2. The driving element transports gas into the air inlet pipe 3. When the gas passes through the first air inlet channel 101 of the first heating plate 1, it will pass through the first heating plate 1 and be heated to the same temperature as the first heating plate 1, and the heated gas will be discharged from the air outlet 201, ensuring the uniform temperature in the chamber, improving the heating efficiency and temperature uniformity, thereby improving the uniformity of the wafer during thin film deposition and ensuring the quality of wafer thin film deposition.
[0050] Specifically, the driving component can be any existing driving component such as a vacuum pump, a blower, a compressor, etc. In the embodiment of the present application, there is no specific limitation on the type of the driving component.
[0051] Specifically, the intake pipe 3 can be connected to the first intake channel 101 by fixing the intake pipe 3 on the first intake channel 101 and connecting the two, or the intake pipe 3 can be detachably set on the first intake channel 101 and connect the two. In the embodiment of the present application, there is no specific restriction on the connection method between the intake pipe 3 and the first intake channel 101.
[0052] Specifically, when the wafer is placed on the upper surface of the second heating plate 2, the wafer should avoid covering the air outlet 201 to ensure that the air outlet 201 can discharge the gas normally. In the embodiment of the present application, the position of the air outlet 201 is not specifically restricted.
[0053] Specifically, the air outlet 201 can be arranged on the second heating plate 2 at an angle, or can be arranged on the second heating plate 2 vertically. In the embodiment of the present application, the arrangement of the air outlet 201 is not specifically limited.
[0054] Specifically, the heating element can be selected from existing heating wires, heating discs, heating plates, etc. according to needs. In the embodiments of the present application, there is no specific restriction on the type of the heating element.
[0055] In one embodiment, Figure 2 As shown, the air outlet 201 is inclined, and in the direction from the lower surface of the second heating plate 2 to the upper surface of the second heating plate 2, the air outlet 201 is inclined from the central area close to the second heating plate 2 to the direction away from the central area of the second heating plate 2.
[0056] The air outlet 201 is tilted so that the air outlet 201 can be set at the edge area of the second heating plate 2, which can avoid the placement of the wafer and prevent the wafer from blocking the air outlet 201. At the same time, the tilted air outlet 201 can promote the rapid discharge of hot air inside the heating plate structure, speed up the heat dissipation process, and help maintain the thermal stability of the heating plate.
[0057] Specifically, the inclination angle of the air outlet 201 relative to the horizontal plane can be 45°, 30°, 20°, etc. In the embodiment of the present application, the inclination angle of the air outlet 201 is not specifically limited.
[0058] In one embodiment, in combination Figure 2 and Figure 3 As shown, a plurality of air outlet holes 201 are arranged at intervals, and the plurality of air outlet holes 201 are arranged in a circular distribution.
[0059] The multiple air outlet holes 201 distributed in an annular pattern can ensure that the gas on the upper surface of the second heating plate 2 is discharged more evenly. Each air outlet hole 201 serves as an independent exhaust channel, which can effectively avoid gas accumulation in a local area, thereby forming a more uniform temperature field on the surface of the heating plate and in the chamber, thereby improving the uniformity of heating.
[0060] Specifically, the plurality of air outlet holes 201 may be arranged at uniform intervals or at non-uniform intervals. In the embodiment of the present application, no specific limitation is imposed on the arrangement of the plurality of air outlet holes 201 .
[0061] In one embodiment, Figure 5 and Figure 6 As shown, an annular groove 102 is formed on the upper surface of the first heating plate 1 , and the annular groove 102 is connected to the first air inlet channel 101 , and the annular groove 102 is also connected to the plurality of air outlet holes 201 .
[0062] By providing the annular groove 102 on the upper surface of the first heating plate 1, since the annular groove 102 is connected to the first air inlet channel 101, when installing the second heating plate 2, it is only necessary to connect the multiple air outlet holes 201 at different positions to the annular groove 102, so that multiple air outlet holes 201 can be connected to the first air inlet channel 101. At the same time, the annular groove 102 is provided on the first heating plate 1, and the gas enters the annular groove 102 from the first air inlet channel 101. Since the contact area between the annular groove 102 and the first heating plate 1 is large, the gas in the annular groove 102 can be quickly heated to the required temperature and then discharged from the air outlet 201, thereby ensuring that the temperature of the discharged gas reaches a constant value.
[0063] Specifically, the annular groove 102 may be disposed concentrically with the first heating plate 1 , or may be disposed non-concentrically. In the embodiment of the present application, the position of the annular groove 102 is not specifically limited.
[0064] In one embodiment, a plurality of guide grooves 103 are formed on the upper surface of the first heating plate 1 , and one end of the plurality of guide grooves 103 are connected to the first air inlet channel 101 , and the other end of the plurality of guide grooves 103 are connected to the annular groove 102 .
[0065] By providing a plurality of guide grooves 103 to connect the first air inlet channel 101 and the annular groove 102, the gas in the first air inlet channel 101 can be more efficiently introduced into the annular groove 102, ensuring sufficient and rapid gas supply, thereby providing a continuous and stable heat source for the heating process.
[0066] Specifically, the guide groove 103 can be set to any existing shape such as a straight line, an arc, etc. In the embodiment of the present application, the shape of the guide groove 103 is not specifically limited.
[0067] In one embodiment, Figure 5 and Figure 6 As shown, the first air inlet channel 101 and the plurality of guide grooves 103 are both arranged in the inner ring covering area of the annular groove 102 .
[0068] By arranging the first air inlet channel 101 and the guide groove 103 in the inner circle area of the annular groove 102, it can be ensured that the gas is evenly distributed starting from the central area, and then guided to various areas of the annular groove 102 through multiple guide grooves 103, so that the gas can quickly enter the annular groove 102 from the first air inlet channel 101.
[0069] In one embodiment, a mounting groove 104 is formed on the lower surface of the first heating plate 1 , and the heating element is disposed in the mounting groove 104 .
[0070] By building the heating element into the mounting groove 104 of the first heating plate 1, the overall structure can be made more compact and the space occupied by the device can be reduced. The heating element is installed in the first heating plate 1, which helps to improve the heating efficiency. At the same time, by reasonably designing the structure of the mounting groove 104, the heat can be evenly distributed on the surface of the first heating plate 1, reducing hot spots and ensuring the uniformity of heating.
[0071] Specifically, the mounting groove 104 can be set to any existing shape such as arc, straight line, mesh, etc. In the embodiment of the present application, the shape of the mounting groove 104 is not specifically limited.
[0072] In one embodiment, Figure 1 As shown, it also includes a third heating plate 4, which is arranged on the lower surface of the first heating plate 1. The third heating plate 4 is provided with a second air intake passage (not shown in the figure) connected to the air intake pipe 3, and the second air intake passage is connected to the first air intake passage 101.
[0073] The third heating plate 4 is arranged on the lower surface of the first heating plate 1, which can reduce the heat loss of the heating element and improve the overall heating efficiency and response speed. A second air inlet channel is opened on the third heating plate 4 corresponding to the first air inlet channel 101, and the air inlet pipe 3 can be arranged at the bottom of the third heating plate 4 to communicate with the second air inlet channel, thereby reducing the chamber space occupied by the heating plate structure.
[0074] In one embodiment, the joints among the first heating plate 1 , the second heating plate 2 and the third heating plate 4 are sealed.
[0075] Sealing the joints between the first heating plate 1 , the second heating plate 2 and the third heating plate 4 can effectively improve the air tightness of the heating plate structure and reduce heat loss.
[0076] Specifically, the first heating plate 1, the second heating plate 2 and the third heating plate 4 can be sealed by welding so that there are no gaps between the parts, thereby effectively improving the air tightness of the heating plate structure. In the embodiment of the present application, no specific restrictions are imposed on the connection method of the first heating plate 1, the second heating plate 2 and the third heating plate 4.
[0077] Specifically, an exhaust hole 202 is also opened on the upper surface of the second heating plate 2, and the exhaust hole 202 is connected to the exhaust pipe 5. The wafer is placed on the upper surface of the second heating plate 2, and the exhaust pipe 5 is evacuated by external equipment to form a negative pressure area on the contact surface between the exhaust hole 202 and the wafer, so that the wafer is adsorbed on the upper surface of the second heating plate 2 to avoid the wafer from shifting during the thin film deposition process.
[0078] The working principle of the heating plate structure for uniform heating in this embodiment is described as follows:
[0079] The wafer is placed on the upper surface of the second heating plate 2 , and the vacuum pipe 5 is evacuated by external equipment to form a negative pressure area between the vacuum hole 202 and the contact surface of the wafer, so that the wafer is firmly adsorbed on the upper surface of the second heating plate 2 .
[0080] The first heating plate 1 is directly heated by the heating element, and the first heating plate 1 transfers heat evenly to the second heating plate 2, so that the second heating plate 2 is evenly heated.
[0081] The gas is transported into the air inlet pipe 3 through the driving member, and the gas enters the guide groove 103 through the second air inlet channel and the first air inlet channel 101 in turn, and then enters the annular groove 102 from the guide groove 103. When the gas passes through the second air inlet channel, the first air inlet channel 101, the guide groove 103 and the annular groove 102, it will be heated to the same temperature as the first heating plate 1 by the first heating plate 1, and the heated gas will be discharged from the air outlet 201, ensuring the uniform temperature in the chamber, improving the heating efficiency and temperature uniformity, and thereby improving the uniformity of the wafer during thin film deposition.
[0082] According to an embodiment of the present invention, on the other hand, a thin film deposition device is provided, including a chamber and a heating plate structure.
[0083] Specifically, the first heating plate 1 and the second heating plate 2 are arranged in a chamber (not shown in the figure).
[0084] This thin film deposition device arranges a first heating plate 1 and a second heating plate 2 in a chamber, and directly heats the first heating plate 1 through a heating element. After being heated, the first heating plate 1 transfers heat evenly to the second heating plate 2, which can effectively and evenly distribute heat energy. Gas is transported into an air inlet pipe 3 through a driving element. When the gas passes through a first air inlet channel 101 of the first heating plate 1, it is heated to the same temperature as the first heating plate 1 through the first heating plate 1, and the heated gas is discharged from an air outlet 201, thereby ensuring uniform temperature in the chamber, improving heating efficiency and temperature uniformity, and thereby improving uniformity of wafers during thin film deposition, thereby ensuring the quality of wafer thin film deposition.
[0085] Although the embodiments of the present invention are described in conjunction with the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations are all within the scope defined by the appended claims.
Claims
1. A heating plate structure with uniform heating, characterized in that: include: The first heating plate (1) is provided with a first air inlet passage (101); A heating element, disposed on the first heating plate (1), and used for heating the first heating plate (1); a second heating plate (2) disposed on the upper surface of the first heating plate (1), the upper surface of the second heating plate (2) being suitable for placing wafers, the second heating plate (2) being provided with at least one air outlet hole (201) penetrating the upper surface and the lower surface of the second heating plate (2), the air outlet hole (201) being in communication with the first air inlet channel (101); An air intake pipe (3) has one end in communication with the first air intake channel (101) and the other end suitable for being connected to a driving member, the driving member being used to deliver gas to the air intake pipe (3).
2. The uniform heating plate structure according to claim 1, characterized in that: The air outlet holes (201) are arranged obliquely, and in the direction from the lower surface of the second heating plate (2) to the upper surface of the second heating plate (2), the air outlet holes (201) are inclined from a central area close to the second heating plate (2) to a direction away from the central area of the second heating plate (2).
3. The uniform heating plate structure according to claim 2, characterized in that: A plurality of the air outlet holes (201) are arranged at intervals, and the plurality of air outlet holes (201) are arranged in an annular distribution.
4. The uniform heating plate structure according to claim 3, characterized in that: An annular groove (102) is provided on the upper surface of the first heating plate (1), and the annular groove (102) is respectively connected to the first air inlet channel (101) and the plurality of air outlet holes (201).
5. The uniform heating plate structure according to claim 4, characterized in that: A plurality of guide grooves (103) are provided on the upper surface of the first heating plate (1), one end of each of the guide grooves (103) is connected to the first air inlet channel (101), and the other end of each of the guide grooves (103) is connected to the annular groove (102).
6. The uniform heating plate structure according to claim 5, characterized in that: The first air inlet channel (101) and the plurality of guide grooves (103) are both arranged in the inner ring covering area of the annular groove (102).
7. The uniformly heated heating plate structure according to any one of claims 1 to 6, characterized in that: The lower surface of the first heating plate (1) is provided with a mounting groove (104), and the heating element is arranged in the mounting groove (104).
8. The uniformly heated heating plate structure according to any one of claims 1 to 6, characterized in that: It also comprises a third heating plate (4), the third heating plate (4) being arranged on the lower surface of the first heating plate (1), the third heating plate (4) being provided with a second air intake passage connected to the air intake pipe (3), the second air intake passage being connected to the first air intake passage (101).
9. The uniform heating plate structure according to claim 8, characterized in that: The connection between the first heating plate (1), the second heating plate (2) and the third heating plate (4) is sealed.
10. A thin film deposition device, characterized in that: include: Chamber; The uniformly heated heating plate structure according to any one of claims 1 to 9, wherein the first heating plate (1) and the second heating plate (2) are arranged in the chamber.