Tool for testing semiconductor device

Abstract

The utility model relates to a tool for testing a semiconductor device, which aims at solving the technical problems that the pressing force is inconvenient to control and the contact pressure between a chip and a pin is easy to be overlarge and further the chip is damaged in the current mode of manually pressing a clamping bracket, and comprises a test assembly of which the upper end surface is detachably provided with a test part, a tray assembly is detachably installed at the top of the testing part, the testing part comprises a testing plate, buffer mechanisms are fixedly arranged on the upper end face of the testing plate at equal intervals, positioning holes are formed in the four corners of the upper end face of the testing plate, and the buffer mechanisms are used for achieving the buffer effect when a chip is pressed down for detection. Positioning holes are formed in the upper end face of the tray body, positioning inserting rods which are inserted into the positioning holes in a matched mode to achieve the positioning effect are arranged at the four corners of the lower end face of the tray body, the buffering mechanism comprises V-shaped elastic pieces which are symmetrically arranged in a crossed mode, the V-shaped elastic pieces are connected, and the chip pressing detection device has the advantage of achieving the buffering effect in the chip pressing detection process.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor device testing, in particular to a tool for semiconductor device testing. Background Art

[0002] Semiconductors are materials with electrical conductivity between insulators and conductors. Their electrical conductivity is easily controlled and can be used as a component material for information processing. Semiconductors are very important from the perspective of science and technology or economic development. The core units of many electronic products, such as computers, mobile phones, and digital recorders, use the changes in the electrical conductivity of semiconductors to process information. Common semiconductor materials include silicon, germanium, gallium arsenide, etc.

[0003] Currently, semiconductor devices made of semiconductors, such as semiconductor chips, need to be tested before leaving the factory to eliminate inferior products and retain good products. The traditional testing method is to load the semiconductor device into a bracket, then place the bracket on a semiconductor testing tool, and manually press down to clamp the semiconductor bracket and make the chip contact the pins to achieve batch power-on testing of the chips. However, the manual pressing down to clamp the bracket is not convenient for controlling the pressing force, which can easily cause excessive contact pressure between the chip and the pins, thereby causing damage to the chip. In view of this, we propose a tool for testing semiconductor devices. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art, meet actual needs, and provide a tool for testing semiconductor devices to solve the technical problem that the current method of manually pressing down the clamping bracket is not convenient for controlling the pressing force, which easily causes excessive contact pressure between the chip and the pins, thereby causing damage to the chip.

[0005] In order to achieve the purpose of the utility model, the technical solution adopted by the utility model is: designing a semiconductor device testing tool, including a test assembly with a test component detachably mounted on the upper end surface;

[0006] The top of the test component is detachably mounted with a tray assembly, and the test component includes a test plate with a buffer mechanism fixedly arranged at equal intervals on the upper end surface, and positioning holes are formed at the four corners of the upper end surface of the test plate, and the buffer mechanism is used to play a buffering effect when the chip is pressed down for testing;

[0007] The tray assembly comprises a tray body, and the four corners of the lower end surface of the tray body are all configured with positioning rods adapted to be inserted into positioning holes to achieve a positioning effect.

[0008] Preferably, the buffer mechanism includes V-shaped spring pieces that are symmetrically arranged crosswise with each other, the V-shaped spring pieces are structurally connected, and the middle structure between the V-shaped spring pieces forms an annular portion, notch grooves are symmetrically formed on the outer edge surface of the annular portion, and an arc-shaped rubber strip is fixedly provided on the top of the inner edge surface of the annular portion.

[0009] Preferably, two ends of the V-shaped spring piece located at the top are in contact with the lower end surface of the tray body, and two ends of the V-shaped spring piece located at the bottom are structurally connected to the upper end surface of the test board.

[0010] Preferably, rubber contacts for buffering are bonded and fixed in a rectangular array on the edge of the upper end surface of the tray body, and chip slots for placing chips are equidistantly provided inside the tray body.

[0011] Preferably, the test assembly includes a test bench with a mounting plate fixedly arranged in the center on one side, a lower pressure arm movably arranged on one side of the mounting plate, the lower pressure arm movably connected to a lower pressure rod, and the bottom end of the lower pressure rod is fixedly connected to a lower pressure plate for pressing down and limiting the chip.

[0012] Preferably, a U-shaped block is symmetrically constructed on one side of the mounting plate facing the test assembly, a positioning rod is constructed on the lower end surface of the U-shaped block, and positioning grooves adapted for movable positioning of the positioning rod are symmetrically provided inside the lower pressure plate.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. By equidistantly arranging buffer mechanisms on the upper end surface of the test board, when the tray body is pressed down under pressure and drives the chip to contact the pins, the buffer mechanism can buffer the downward pressure of the tray body, thereby increasing the downward pressure resistance of the tray body. The increase in downward pressure resistance is conducive to the operator to better control the hand strength, thereby controlling the downward pressure and reducing the situation where the chip is damaged due to excessive contact pressure between the chip and the pins.

[0015] 2. By designing the buffer mechanism as V-shaped spring pieces that are symmetrically arranged crosswise, it is beneficial to evenly bear the pressure, thereby improving the buffering effect, and the annular portion formed between the V-shaped spring pieces is beneficial to absorbing the pressure when the end of the V-shaped spring piece is under pressure, and absorbing the pressure through the expansion and contraction of the notch groove, and the pressure is evenly transmitted in the annular portion through the arc-shaped rubber strip, so that the downward pressure is evenly distributed inside the buffer mechanism, thereby improving the buffering effect of the downward pressure on the tray body. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is a schematic diagram of the structure of the test assembly of the utility model;

[0018] Figure 3 This is a schematic diagram of the structure of the tray assembly of the utility model when it is in contact with the test component;

[0019] Figure 4 It is a schematic diagram of the disassembly of the tray assembly and the test component of the utility model;

[0020] Figure 5 It is a structural schematic diagram of the buffer mechanism of the utility model;

[0021] Figure 6 For this utility model Figure 5 A magnified schematic diagram of the structure in the middle.

[0022] In the figure: 1. test assembly; 101. test bench; 102. mounting plate; 103. U-shaped block; 104. positioning rod; 105. lower pressure arm; 106. lower pressure rod; 107. lower pressure plate; 2. test component; 201. test plate; 202. positioning hole; 3. tray assembly; 301. tray body; 302. rubber contact; 303. chip slot; 304. positioning rod; 4. buffer mechanism; 401. V-shaped spring piece; 402. annular portion; 403. notch groove; 404. arc-shaped rubber strip. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0024] Embodiment 1: A semiconductor device testing tool, see Figure 1 , Figure 3 and Figure 4 , including a test assembly 1 with a test component 2 detachably mounted on the upper end surface, a tray assembly 3 detachably mounted on the top of the test component 2, and the test component 2 includes a test board 201 with a buffer mechanism 4 fixedly arranged at equal intervals on the upper end surface, and positioning holes 202 are formed at the four corners of the upper end surface of the test board 201, and the buffer mechanism 4 is used for buffering effect when the chip is pressed down for detection, and the tray assembly 3 includes a tray body 301, and the four corners of the lower end surface of the tray body 301 are constructed with positioning rods 304 adapted to be inserted into the positioning holes 202 to achieve a positioning effect.

[0025] See also Figure 5 and Figure 6The buffer mechanism 4 includes V-shaped spring pieces 401 that are symmetrically arranged crosswise with each other. The V-shaped spring pieces 401 are structurally connected, and the middle structure between the V-shaped spring pieces 401 forms an annular portion 402. Notch grooves 403 are symmetrically formed on the outer edge surface of the annular portion 402. An arc-shaped rubber strip 404 is fixedly provided on the top of the inner edge surface of the annular portion 402. The two ends of a V-shaped spring piece 401 located at the top are abutted against the lower end surface of the tray body 301, and the two ends of a V-shaped spring piece 401 located at the bottom are structurally connected to the upper end surface of the test board 201.

[0026] See also Figure 4 The upper edge of the tray body 301 is bonded and fixed with rubber contacts 302 for buffering in a rectangular array, and the inside of the tray body 301 is provided with chip slots 303 for placing chips at equal intervals.

[0027] See also Figure 1 and Figure 2 The test assembly 1 includes a test bench 101 with a mounting plate 102 fixedly arranged in the center on one side, a pressing arm 105 movably arranged on one side of the mounting plate 102, a pressing rod 106 movably connected to the pressing arm 105, a pressing plate 107 for pressing down and limiting the chip is fixedly connected to the bottom end of the pressing rod 106, a U-shaped block 103 is symmetrically constructed on one side of the mounting plate 102 facing the test assembly 1, a positioning rod 104 is constructed on the lower end surface of the U-shaped block 103, and a positioning groove adapted for the movable positioning of the positioning rod 104 is symmetrically opened inside the pressing plate 107. The utility model solves the technical problem that the current manual pressing and clamping bracket method is not convenient for controlling the pressing force, which easily causes excessive contact pressure between the chip and the pins, thereby causing damage to the chip by setting a buffer mechanism 4.

[0028] Working principle: When in use, first place the chip in the chip slot 303, then place the tray body 301 on the test board 201, and insert the positioning rod 304 into the positioning hole 202 for positioning, and at the same time make the two ends of a V-shaped spring piece 401 located at the top abut against the lower end surface of the tray body 301, then manually press down the lower pressure arm 105, so that the lower pressure rod 106 moves downward and drives the lower pressure plate 107 to apply pressure to the tray body 301, and the downward pressure on the tray body 301 is transmitted to the buffer mechanism 4. By designing the buffer mechanism 4 as V-shaped spring pieces 401 that are symmetrically arranged crosswise, it is beneficial to press The force is evenly carried, thereby improving the buffering effect. When the buffer mechanism 4 is under pressure for buffering, the two ends of the V-shaped spring piece 401 expand outward and drive the notch groove 403 at the top of the annular portion 402 to expand, and at the same time, the notch groove 403 at the bottom of the annular portion 402 contracts, and drives the arc-shaped rubber strip 404 to produce tensile deformation, so that the pressure is evenly distributed in the buffer mechanism 4 until the chip and the pin are abutted and the detection work begins. When the lower pressure plate 107 applies pressure to the tray body 301, it first abuts against the rubber contact 302, and the elastic deformation of the rubber contact 302 is conducive to further buffering effect.

[0029] The embodiments of the present invention disclose preferred embodiments, but are not limited thereto. A person skilled in the art can easily understand the spirit of the present invention based on the above embodiments and make different extensions and changes. However, as long as they do not deviate from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A semiconductor device testing tool, characterized in that: It comprises a test assembly (1) having a test component (2) detachably mounted on its upper end surface; A tray assembly (3) is detachably mounted on the top of the test component (2), and the test component (2) comprises a test plate (201) on which a buffer mechanism (4) is fixedly arranged at equal intervals on the upper end surface, and positioning holes (202) are formed at four corners of the upper end surface of the test plate (201), and the buffer mechanism (4) is used to provide a buffering effect when the chip is pressed down for testing; The tray assembly (3) comprises a tray body (301), and the four corners of the lower end surface of the tray body (301) are each provided with a positioning rod (304) adapted to be inserted into a positioning hole (202) to achieve a positioning effect.

2. A semiconductor device testing tool as claimed in claim 1, characterized in that: The buffer mechanism (4) comprises V-shaped spring sheets (401) arranged symmetrically and crosswise with each other, the V-shaped spring sheets (401) are structurally connected, and a ring portion (402) is formed in the middle structure between the V-shaped spring sheets (401), notch grooves (403) are symmetrically formed on the outer edge surface of the ring portion (402), and an arc-shaped rubber strip (404) is fixedly arranged on the top of the inner edge surface of the ring portion (402).

3. A semiconductor device testing tool as claimed in claim 2, characterized in that: Two ends of the V-shaped spring piece (401) located at the top are in contact with the lower end surface of the tray body (301), and two ends of the V-shaped spring piece (401) located at the bottom are structurally connected to the upper end surface of the test board (201).

4. A semiconductor device testing tool as claimed in claim 1, characterized in that: Rubber contacts (302) for achieving a buffering effect are bonded and fixed to the edge of the upper end surface of the tray body (301) in a rectangular array, and chip slots (303) for placing chips are equidistantly provided inside the tray body (301).

5. A semiconductor device testing tool as claimed in claim 4, characterized in that: The test assembly (1) comprises a test bench (101) with a mounting plate (102) fixedly arranged in the center on one side, a lower pressure arm (105) movably arranged on one side of the mounting plate (102), the lower pressure arm (105) being movably connected to a lower pressure rod (106), and the bottom end of the lower pressure rod (106) being fixedly connected to a lower pressure plate (107) for pressing down and limiting the chip.

6. A semiconductor device testing tool as claimed in claim 5, characterized in that: A U-shaped block (103) is symmetrically constructed on one side of the mounting plate (102) facing the test assembly (1), a positioning rod (104) is arranged on the lower end surface of the U-shaped block (103), and a positioning groove adapted for movable positioning of the positioning rod (104) is symmetrically provided inside the lower pressing plate (107).

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