Mounting structure of vibration-resistant SMD (Surface Mount Device) type aluminum electrolytic capacitor

Abstract

The utility model provides a mounting structure of a vibration-resistant surface-mounted aluminum electrolytic capacitor, which comprises a capacitor body and a base, a mounting groove for accommodating the capacitor body is arranged on the base, at least two grooves are arranged on a first surface, adjacent to the bottom of the capacitor body, of the mounting groove, and the first surface of the capacitor body is provided with a plurality of grooves. At least two bosses are arranged on the outer surface of colloidal particles at the bottom of the capacitor body, the inner diameter of the groove is matched with the outer diameter of the bosses, and when the capacitor body is installed in the installation groove, the bosses are embedded in the groove. According to the mounting structure of the vibration-resistant patch type aluminum electrolytic capacitor, the groove is formed in the base and the boss is correspondingly arranged at the bottom of the capacitor, so that the aluminum electrolytic capacitor and the base are effectively prevented from rotating relatively, and the stability of the capacitor is improved. And the grooves and the bosses are correspondingly arranged in different shapes, so that a fool-proof effect is achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a mounting structure of a vibration-resistant patch-type aluminum electrolytic capacitor. Background Art

[0002] A capacitor is a device that holds electric charge. It is one of the electronic components used in large quantities in electronic equipment. It is widely used in circuits for DC isolation, AC passing, coupling, bypassing, filtering, tuning circuits, energy conversion, and control.

[0003] With the rapid development of electronic technology, in electronic products, SMD aluminum electrolytic capacitors are common electrical components today. Surface mount technology (SMT) is generally used to achieve automation to improve production efficiency and save materials, manpower, time, etc. With the continuous expansion of the application fields of electronic products, such as 5G communication base stations, new energy vehicles, industrial robot automation, high-end medical care, etc., the application environment is becoming increasingly harsh, especially in working environments with large vibrations. Aluminum electrolytic capacitors have poor seismic resistance, and the internal structure will become loose, offset, or the pins will break and deform during the vibration process. The vibration-resistant seat plate in the prior art is difficult to ensure the firm contact between the aluminum electrolytic capacitor and the PCB board, especially under working conditions with high vibration frequency and large vibration amplitude, and it is easy to fall off; the matching effect between the aluminum electrolytic capacitor and the vibration-resistant seat plate is difficult to ensure, and the aluminum electrolytic capacitor and the seat plate are prone to relative offset. The performance stability of the aluminum capacitor cannot be guaranteed and cannot meet the market demand.

[0004] Chinese patent CN216902560U discloses a mounting base plate for a chip-type aluminum electrolytic capacitor. The patented technology discloses that four arc-shaped support blocks are arranged on the base body, and the inner side of the arc-shaped support blocks fits the outer surface of the capacitor. The capacitor is fixed in the inner cavity formed by the four arc-shaped support blocks. The capacitor in this patent has no other auxiliary fixing devices except the four arc-shaped support blocks. The capacitor is prone to relative rotation displacement with the mounting base plate, resulting in lead breakage and affecting product quality.

[0005] Chinese patent CN217640997U discloses a capacitor low waist anti-vibration seat plate, which discloses that a pair of through holes for inserting leads are arranged in the middle of the seat plate, and the leads are bent to both sides along the center line after passing through the through holes and accommodated in the lead groove. The contact area between the lead and the base lead groove after bending is limited, which is not conducive to the stable fixation of the lead pin, and the height of the seat plate guard plate and the capacitor contact area are limited, which makes the capacitor still prone to vibration, affecting the stability of the product.

[0006] Chinese patent CN207529815U discloses a vibration-resistant capacitor base. The inner surface of each guard plate of the capacitor base disclosed in the patent technology is in contact with the capacitor shell, and the height of the guard plate is not less than 30% of the height of the capacitor. The contact area between the guard plate and the capacitor in the patent is large, which is not conducive to the heat dissipation of the capacitor.

[0007] From the above, it can be seen that the vibration-resistant seat plate of the prior art SMD aluminum electrolytic capacitor still has shortcomings: in the prior art, the vibration-resistant seat plate only fixes the capacitor through the mounting groove formed by the guard plate and the base, and there is no auxiliary fixing device. The capacitor is prone to relative rotational displacement, resulting in lead pin breakage; the lead pins directly pass through the seat plate, and the two lead pins are led out in the same straight line. The contact area of ​​the lead pins on the seat plate is limited, and the bottom is not firmly fixed, affecting the anti-seismic effect; the contact area between the guard plate and the capacitor is too large, which affects the heat dissipation of the capacitor and causes insufficient heat resistance of the product.

[0008] Therefore, there is an urgent need to provide a new type of vibration-resistant chip-type aluminum electrolytic capacitor installation structure to solve the above shortcomings and deficiencies in the prior art. Utility Model Content

[0009] The utility model aims to provide a mounting structure for a vibration-resistant chip-type aluminum electrolytic capacitor, so as to solve the technical problems in the prior art that the chip-type aluminum electrolytic capacitor is mounted on a vibration-resistant seat plate, the vibration reduction effect is poor, the pins are easily broken, and the heat dissipation is poor.

[0010] To achieve the above-mentioned purpose, the utility model provides a mounting structure of a vibration-resistant SMD aluminum electrolytic capacitor, comprising a capacitor body and a base, wherein the base is provided with a mounting groove for accommodating the capacitor body;

[0011] At least two grooves are arranged on the first surface of the bottom of the capacitor body adjacent to the mounting groove, and at least two bosses are arranged on the outer surface of the rubber particles at the bottom of the capacitor body, and the inner diameter of the groove matches the outer diameter of the boss; so that when the capacitor body is installed in the mounting groove, the boss is embedded in the groove.

[0012] By adopting the above technical solution, the connection between the capacitor and the base is strengthened by utilizing the mutual combination of the groove and the boss, the shock resistance of the capacitor is improved, the phenomenon of relative rotational displacement between the capacitor and the base causing pin breakage or capacitor falling and damage is reduced, and its service life is increased.

[0013] Preferably, the at least two grooves are respectively configured to have different shapes, and the shapes of the at least two bosses correspond to the grooves one by one. In particular, the grooves can be respectively configured to be circular grooves and square grooves, and the at least two bosses are respectively configured to be circular bosses and square bosses.

[0014] By adopting the above technical solution, the positive and negative poles can be identified accordingly, so as to avoid damage to the chip-type aluminum electrolytic capacitor due to reverse connection of the positive and negative poles due to misoperation during installation, thereby having a fool-proof effect.

[0015] Preferably, the height of the boss is 1 / 4 to 1 / 3 of the thickness of the rubber particles, and the depth of the groove is 1 / 5 to 1 / 4 of the thickness of the base bottom plate.

[0016] Preferably, the height of the boss is greater than the depth of the groove.

[0017] By adopting the above technical solution, when the capacitor is installed in the installation groove, a gap is formed between the bottom of the capacitor and the upper surface of the base, and part of the heat of the capacitor can be dissipated through the gap between the bottom of the capacitor and the base, thereby improving the heat dissipation performance of the capacitor and increasing stability.

[0018] Preferably, the bottom of the capacitor body has two lead pins, the base includes a bottom plate and multiple guard plates, the multiple guard plates are vertically arranged on the bottom plate, the bottom plate and the multiple guard plates constitute the mounting groove, the bottom plate has a first surface for mounting the capacitor body and a second surface for welding and fixing, the groove is opened on the first surface of the bottom plate, the bottom plate of the base is opened with two lead sockets corresponding to the lead pins of the capacitor body one by one, and the second surface of the base is opened with two lead grooves matching the lead sockets one by one.

[0019] Preferably, the mounting groove is a circular mounting groove, the two lead grooves are not located on the same straight line, and the lead grooves extend from the middle of the base plate to the edge of the base plate, and the length of the lead groove is not less than the radius of the mounting groove.

[0020] By adopting the above technical solution, the wire body length of the lead pin of the capacitor can be installed in the lead groove to the maximum extent, increasing the contact area between the lead pin and the base, thereby improving the firmness of the bottom fixation of the capacitor, and then improving the anti-seismic effect of the capacitor.

[0021] Preferably, the two lead grooves are arranged in parallel or in reverse parallel. The overall structure is more beautiful.

[0022] Preferably, the inner surfaces of the plurality of guard plates are all in contact with the capacitor housing, and the inner surfaces of the guard plates are arc-shaped with an arc of π / 8 to π / 4. The height of the plurality of guard plates is 1 / 3 to 1 / 4 of the height of the waist of the capacitor body. Since the diameter of the waist of the capacitor is often smaller than the diameter of the capacitor housing, by adopting the above technical solution, the guard plates can be clamped on the waist of the capacitor, thereby making the connection between the capacitor and the base more stable.

[0023] Preferably, a buckle for clamping the waist part of the capacitor body is provided on the inner side of the guard plate, the buckle is set with rounded corners on the arc surface and is strip-shaped as a whole. The buckle is made of anti-slip material, and the diameter of the circle surrounded by the strip buckles on the multiple guard plates is slightly smaller than the diameter of the place where the capacitor body and the buckle are in contact.

[0024] By adopting the above technical solution, the circular diameter formed by the buckle is smaller than the waist diameter of the capacitor, so that the buckle can further clamp the capacitor, and the anti-slip material has good elasticity and great friction, which reinforces the capacitor and protects the capacitor shell.

[0025] Preferably, through holes are arranged on the guard plate, and the area of ​​the through holes is 30%-50% of the area of ​​the guard plate, so as to increase the heat dissipation surface and improve the heat dissipation performance.

[0026] Preferably, an elastic support pad is provided on the second surface of the base plate for welding and fixing, the thickness of the elastic support pad is 0.04-0.08 mm, and there may be a plurality of elastic support pads.

[0027] By adopting the above technical solution, the support points between the base and the PCB board are increased to form a gap support, which effectively reduces vibration and improves the overall stability of the chip aluminum electrolytic capacitor and the PCB board after installation.

[0028] In summary, compared with the prior art, the utility model further improves the anti-seismic performance and has a better heat dissipation effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the specific implementation modes of the present invention, the drawings required for use in the description of the specific implementation modes will be briefly introduced below. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0030] Figure 1 A three-dimensional diagram of the installation structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to a specific embodiment;

[0031] Figure 2 is a structural schematic diagram of a base in a specific embodiment;

[0032] Figure 3 is a bottom schematic diagram of a base of a specific embodiment;

[0033] Figure 4 is a cross-sectional view of a base of a specific embodiment;

[0034] Figure 5 is a three-dimensional diagram of a surface-mount aluminum electrolytic capacitor of a specific embodiment;

[0035] Figure 6 A bottom view of a chip-type aluminum electrolytic capacitor of a specific embodiment;

[0036] Figure 7 A top view of the mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to a specific embodiment;

[0037] Figure 8 A cross-sectional view of a mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to a specific embodiment;

[0038] Fig. 9 The bottom schematic diagram of the mounting structure of the vibration-resistant chip-type aluminum electrolytic capacitor according to a specific embodiment.

[0039] In the figure: 1. capacitor body; 101. colloid; 2. base; 201. bottom plate; 202. guard plate; 3. mounting groove; 301. first surface of mounting groove (first surface of bottom plate); 302. second surface of bottom plate; 4. cylindrical groove; 5. rectangular groove; 6. cylindrical boss; 7. rectangular boss; 8. positive lead pin; 9. negative lead pin; 10. positive lead socket; 11. negative lead socket; 12. positive lead slot; 13. negative lead slot; 14. buckle; 15. through hole; 16. elastic support pad. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0041] In the description of the present utility model, it should be understood that the terms "center", "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In the description of the present utility model, unless otherwise specified, "plurality" means two or more. In addition, the term "include" and any variation thereof all mean "at least include".

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integrally formed connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0044] Example 1

[0045] Reference Figure 1-Figure 8 The mounting structure of a vibration-resistant SMD aluminum electrolytic capacitor shown comprises a SMD aluminum electrolytic capacitor body 1 and a base 2, wherein a mounting groove 3 for accommodating the capacitor body is provided on the base.

[0046] Two cylindrical grooves 4 and a rectangular groove 5 located on the same straight line are arranged on the first surface 301 at the bottom of the adjacent capacitor body 1 in the mounting groove 3, and a cylindrical boss 6 and a rectangular boss 7 are arranged on the outer surface of the gel particle 101 at the bottom of the capacitor body 1. The bosses and grooves of two different shapes correspond to identify the positive and negative poles, so that the chip-type aluminum electrolytic capacitor will not be damaged due to errors caused by reverse connection of the pins during installation, and has a fool-proof effect.

[0047] like Figure 8 As shown, during installation, the capacitor body 1 is placed in the installation groove 3, and the cylindrical boss 6 and the rectangular boss 7 on the outer surface of the bottom glue particle 101 of the capacitor body 1 are respectively embedded in the cylindrical groove 4 and the rectangular groove 5 of the installation groove 3, thereby strengthening the connection between the capacitor body 1 and the base 2, effectively avoiding the pin breakage or capacitor falling damage caused by relative rotational displacement between the capacitor body 1 and the base 2, and improving stability.

[0048] It is understandable that the height of the boss and the depth of the groove are set within a suitable range, which is conducive to the mutual cooperation between the groove and the boss. If the boss is embedded in the groove too shallowly, the boss will easily come out of the groove in the case of excessive vibration, and the fixing effect cannot be achieved. If the height of the boss and the depth of the groove are set too large, the processing cost will be increased. In this embodiment, the height of the cylindrical boss 6 and the rectangular boss 7 is 1 / 3 of the thickness of the rubber particle 101, and the depth of the cylindrical groove 4 and the rectangular groove 5 is 1 / 4 of the thickness of the bottom plate 201 of the base 2. At this time, the boss and the groove can cooperate with each other and are not easy to come out when the vibration is too large.

[0049] In this embodiment, the height of the cylindrical boss 6 and the rectangular boss 7 is greater than the depth of the cylindrical groove 4 and the rectangular groove 5, so that a gap is formed between the bottom of the capacitor 1 and the base 2. A portion of the heat generated by the capacitor 1 during operation is conducted through the air convection formed in the gap, which helps to quickly dissipate heat and improve the heat resistance of the capacitor.

[0050] Reference Figure 2-Figure 5 The bottom of the chip-type aluminum electrolytic capacitor body 1 has a positive lead pin 8 and a negative lead pin 9, the base 2 includes a bottom plate 201 and four protective plates 202, the four protective plates 202 are perpendicular to the upper surface of the bottom plate 201, the bottom plate 201 and the four protective plates 202 together constitute the mounting groove 3, the capacitor 1 is radially fixed in the mounting groove 3, the bottom plate 201 of the base 2 has a first surface 301 for mounting the capacitor body 1 and a second surface 302 for welding and fixing, the cylindrical groove 4 and the rectangular groove 5 are opened on the first surface 301 of the bottom plate 201, the bottom plate 201 is provided with a positive lead jack 10 and a negative lead jack 11, and the second surface 302 of the base 201 is provided with a positive lead groove 12 and a negative lead groove 13. In this embodiment, the distance between the two adjacent lead plug holes is equal to the distance between the two lead pins of the capacitor, so as to avoid excess lead pins remaining between the capacitor and the base bottom plate so that they are easily broken by force during vibration, thus affecting their stability.

[0051] Reference Figure 2 The mounting groove is a circular mounting groove. Since the cross section of the chip-type aluminum electrolytic capacitor is generally circular, the mounting groove is set to be circular.

[0052] Reference Figure 3-Figure 9 , the positive electrode lead groove 12 and the negative electrode lead groove 13 on the second surface 302 of the bottom plate 201 of the base 2 are not located on the same straight line, so that the lead groove can be extended to the maximum extent on the bottom plate of the base without being affected by other lead grooves to reduce the length. Fig. 9As shown, after the capacitor 1 is installed in the installation groove 3, the positive lead pin 8 and the negative lead pin 9 of the capacitor body 1 can be respectively passed through the positive lead plug hole 10 and the negative lead plug hole 11 and then installed in the corresponding positive lead slot 12 and negative lead slot 13 by bending and / or flattening. The lead pins of the capacitor 1 can be accommodated in the lead slot to the maximum extent, increasing the force-bearing area of ​​the lead pins in the lead slot, greatly improving the stability of the lead pin connection. The positive lead slot 12 and the negative lead slot 13 extend from the middle of the bottom plate 201 to the edge of the bottom plate 201, respectively, to facilitate the subsequent welding after the positive lead pin 8 and the negative lead pin 9 pass through the bottom plate 201.

[0053] In this embodiment, the length of the positive lead groove 12 and the negative lead groove 13 is not less than the radius of the installation groove 3. Since the lead pin is generally arranged in the middle of the capacitor, when the length of the positive and negative lead grooves is not less than the radius of the circular installation groove, on the one hand, it can ensure that the lead groove is long enough to increase the force-bearing area of ​​the lead pin in the lead groove, and on the other hand, it is also convenient for the lead pin to be smoothly inserted into the lead groove through the lead plug hole.

[0054] In this embodiment, if Figure 3 As shown, the positive lead slot 12 and the negative lead slot 13 are arranged in parallel and extend in a back-to-back manner to the edge of the bottom plate 201. Since the positive and negative lead slots are not on the same straight line, the accommodation of the positive and negative lead slots on the bottom plate does not need to be shortened due to the influence of other lead slots, that is, the positive and negative lead slots can be extended on the bottom plate to the maximum extent, increasing the force-bearing area of ​​the lead pins in the lead slots.

[0055] In actual applications, the positive lead groove 12 and the negative lead groove 13 can also be arranged in parallel (not shown in the figure). In this case, the positive lead groove 12 and the negative lead groove 13 extend to the same side edge of the bottom plate 201, and the spacing between the positive lead groove 12 and the negative lead groove 13 is equal to the spacing between the positive lead pin 8 and the negative lead pin 9, so that the lead pin can be smoothly inserted into the lead groove through the lead plug hole.

[0056] Reference Figure 2 In this embodiment, the inner surfaces of the four protective plates 202 are arc-shaped and fit with the outer shell of the capacitor 1. Preferably, the inner surface curvature of each protective plate 202 is π / 4. The height of the four protective plates 202 is located at one-third of the height of the waist of the capacitor body 1. Since the diameter of the waist is often smaller than the diameter of the overall outer shell of the capacitor during the manufacturing process of the capacitor, in the present utility model, setting the height of the protective plate at the waist of the capacitor can make the connection between the capacitor and the base more stable.

[0057] Reference Figure 2In this embodiment, a buckle 14 is provided at the place where the inner side of the guard plate 202 fits with the waist of the capacitor 1. The buckle 14 is clamped at the position of the waist of the capacitor 1, and can firmly fix the chip-type aluminum electrolytic capacitor body 1. The buckle 14 has a rounded corner on the arc surface, and the diameter of the circle surrounded by the buckles 14 on the four guard plates 202 is slightly smaller than the diameter of the one-third of the waist of the capacitor body 1. The circular diameter formed by the buckle 14 is smaller than the diameter of the waist of the capacitor 1, so that the buckle 14 can further clamp the capacitor body 1, which can improve the firmness of the connection between the capacitor body 1 and the mounting groove 3, so that during the vibration process, the chip-type aluminum electrolytic capacitor body 1 vibrates together with the base 2, thereby reducing the force on the capacitor lead pins and avoiding the situation where the pins are easily broken when the vibration is relatively severe.

[0058] In this embodiment, the buckle 14 is provided with an anti-skid material, which can be rubber or silicone, etc. The anti-skid material has good flexibility and friction. The capacitor body 1 is installed in the installation groove 3. Since the diameter formed at the buckle 14 of the guard plate 202 is slightly smaller than the diameter of the third part of the waist of the capacitor body 1, the anti-skid material will be squeezed and deformed, and the capacitor body 1 is fixed by the elastic force of the anti-skid material. At the same time, due to the buffering of the anti-skid material, the wear and damage to the capacitor housing during the installation process can be avoided. The anti-skid material also has insulation, which is safe to use and avoids faults such as short circuits.

[0059] Reference Figure 2-Figure 4 In this embodiment, through holes 15 are respectively provided on the four shields 202, and the area of ​​the through holes 15 is 50% of the area of ​​the shield 202. The through holes provided on the shield are conducive to timely dissipation of the heat of the capacitor from the through holes of the shield, so as to achieve the purpose of rapid heat dissipation. Furthermore, since the through holes provided on the shield can effectively dissipate heat, the shield can be appropriately raised to achieve the purpose of improving the anti-seismic effect.

[0060] In this embodiment, if Figure 3 As shown, four elastic support pads with a thickness of 0.04 mm are arranged on the second surface 302 of the bottom plate 201 for welding and fixing, and two are arranged on the positive side and the negative side of the capacitor, respectively. The elastic support pads can form a buffer zone between the base and the PCB board to prevent the welding surface of the base and the PCB board from loosening and falling off due to the rigid contact between the two during vibration. Two elastic support pads can also be arranged, one on the positive side and the negative side of the capacitor, and the material can be damping rubber, which has excellent shock absorption and insulation properties.

[0061] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A mounting structure for a vibration-resistant chip-type aluminum electrolytic capacitor, characterized in that: It comprises a capacitor body and a base, wherein the base is provided with a mounting groove for accommodating the capacitor body; The mounting groove is adjacent to the first surface of the bottom of the capacitor body and is provided with at least two grooves. The outer surface of the rubber particles at the bottom of the capacitor body is provided with at least two bosses. The inner diameter of the groove matches the outer diameter of the boss. When the capacitor body is installed in the installation groove, the boss is embedded in the groove.

2. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 1, characterized in that: The at least two grooves are respectively configured to have different shapes, and the shapes of the at least two bosses correspond one-to-one to the grooves.

3. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 1, characterized in that: The height of the boss is greater than the depth of the groove.

4. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 1, characterized in that: The bottom of the capacitor body has two lead pins, the base includes a bottom plate and multiple guard plates, the multiple guard plates are vertically arranged on the bottom plate, the bottom plate and the multiple guard plates constitute the mounting groove, the bottom plate has a first surface for mounting the capacitor body and a second surface for welding and fixing, the groove is opened on the first surface of the bottom plate, the bottom plate of the base is opened with two lead sockets corresponding to the lead pins of the capacitor body one by one, and the second surface of the bottom plate is opened with two lead grooves matching the lead sockets one by one.

5. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 4, characterized in that: The mounting groove is a circular mounting groove, the two lead grooves are not located on the same straight line, and the lead grooves extend from the middle of the bottom plate to the edge of the bottom plate, and the length of the lead groove is not less than the radius of the mounting groove.

6. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 5, characterized in that: The two lead grooves are arranged in parallel or in reverse parallel.

7. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 4, characterized in that: The inner surfaces of the plurality of guard plates are all in contact with the capacitor shell, and the heights of the plurality of guard plates are all located at the waist of the capacitor body.

8. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 4, characterized in that: A buckle is provided on the inner side of the guard plate to clamp the waist part of the capacitor body. The buckle has rounded corners on an arc surface and is made of non-slip material. The diameter of the circle formed by the buckles on the multiple guard plates is slightly smaller than the diameter of the capacitor body and the buckle at the joint.

9. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 4, characterized in that: The guard plate is provided with a through hole.

10. The mounting structure of a vibration-resistant chip-type aluminum electrolytic capacitor according to claim 4, characterized in that: An elastic support pad is arranged on the second surface of the bottom plate for welding and fixing.

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