Wafer stage device

Abstract

The utility model discloses a wafer carrying table device. The wafer carrying table device comprises a carrying table body which is provided with a placing part for placing a wafer; the magnetofluid structure is arranged below the carrying table body and comprises a magnetofluid fixed shaft and a magnetofluid rotating shaft, the magnetofluid rotating shaft is rotationally arranged in a center hole of the magnetofluid fixed shaft, and the end, close to the carrying table body, of the magnetofluid rotating shaft is connected with the carrying table body; the lifting bottom tray is arranged below the carrying table body, ejector pins are arranged on the lifting bottom tray, and the ejector pins can be in contact with the back face of the wafer after penetrating through the carrying table body; a lifting driving assembly; wherein the lifting driving assembly is used for driving the lifting bottom tray to do lifting motion, and the ejector pin is installed on the lifting bottom tray in a threaded connection mode. According to the wafer carrying platform device, the adjustment of the wafer suspension height is realized from two aspects, and the adjustment range of the wafer suspension height is widened.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer carriers, in particular to a wafer carrier device. Background Art

[0002] Ion beam etching (IBE) and ion beam deposition (IBD) technologies play a powerful role in the fields of optical fiber, computer, communication, nanotechnology, new materials and integrated optics. The ideal film should have the characteristics of stable optical properties, no scattering and absorption, strong mechanical properties and stable chemical properties. Ion beam etching (IBE) and ion beam deposition (IBD) provide a technical platform that can meet these requirements. At present, the application field of ion beam etching and deposition technology is constantly being broadened, especially with the improvement of chip integration, the reduction of key dimensions, high selectivity and precise pattern transfer. The process requirements have increased, which further highlights the advantages of ion beam etching and ion beam deposition.

[0003] During the ion beam etching process, the wafer is tightly attached to the wafer stage and needs to be cooled by the wafer stage. However, during the transmission process, the wafer needs to be detached from the wafer stage and suspended above the wafer stage. The wafer is then placed by the robot arm of the transmission platform. The wafer stage needs to satisfy the functions of both wafer tightness and suspension.

[0004] Existing wafer carriers generally use ejector pins to lift the wafer so that the wafer is separated from the wafer carrier plane by a certain distance to achieve the wafer suspension function; however, this suspension method has a small adjustment range for the wafer suspension height.

[0005] Therefore, how to provide a wafer carrier device that can broaden the adjustment range of the wafer suspension height is a technical problem that technical personnel in this field currently need to solve. Utility Model Content

[0006] In view of this, an object of the present invention is to provide a wafer stage device to broaden the adjustment range of the wafer suspension height.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] Optionally, in the above wafer stage device, it includes:

[0009] The stage body is provided with a placement portion for placing the wafer;

[0010] A magnetic fluid structure is arranged below the stage body, the magnetic fluid structure comprises a magnetic fluid fixed axis and a magnetic fluid rotating axis, the magnetic fluid rotating axis is rotatably arranged in the center hole of the magnetic fluid fixed axis, and one end of the magnetic fluid rotating axis close to the stage body is connected to the stage body;

[0011] A lifting bottom tray is arranged below the stage body, and an ejector pin is arranged on the lifting bottom tray, and the ejector pin can contact the back side of the wafer after passing through the stage body;

[0012] Lifting drive assembly;

[0013] Wherein, the lifting drive assembly is used to drive the lifting bottom tray to perform lifting movement, and the ejector pin is installed on the lifting bottom tray by means of a threaded connection.

[0014] Optionally, in the above-mentioned wafer stage device, the lifting drive assembly includes a cylinder body and a sealing bellows cooperating with the cylinder body, and a bottom air inlet and a top air inlet are respectively arranged at the bottom and the top of the cylinder body.

[0015] Optionally, in the above-mentioned wafer stage device, the number of the cylinder bodies and the sealing bellows is at least two, a plurality of the cylinder bodies are evenly distributed in the outer circumferential direction of the magnetic fluid shaft, and the tops of a plurality of the sealing bellows are connected by a top ring.

[0016] Optionally, in the above-mentioned wafer carrier device, the lifting drive assembly also includes a lifting rod connected to the lifting end of the sealing bellows, a magnet is arranged at the bottom of the lifting rod, and the carrier body is provided with a magnetic induction switch cooperating with the magnet.

[0017] Optionally, in the above-mentioned wafer carrier device, a transition connection seat is provided at one end of the magnetic fluid rotating shaft close to the carrier body, the carrier body is provided on the transition connection seat, and an elastic element is provided between the transition connection seat and the lifting bottom tray.

[0018] Optionally, in the above-mentioned wafer carrier device, a clamping piece for clamping the wafer is provided on the carrier body, and a clamping connecting rod is also provided on the lifting bottom tray, and the clamping connecting rod passes through the transition connecting seat and the carrier body and is connected to the clamping piece.

[0019] Optionally, in the above-mentioned wafer stage device, the magnetic fluid fixed axis separates the internal structure of the wafer stage device into a vacuum environment side and an atmospheric environment side, and the vacuum environment side is provided with a pressing position detection device;

[0020] Wherein, the clamping position detection device includes a signal sensor and a signal transmitter, the number of the signal sensors is at least two, and the plurality of signal sensors are distributed up and down, and the signal transmitter is arranged on the side of the lifting bottom tray.

[0021] Optionally, in the above-mentioned wafer stage device, the stage body includes a gas disk, the placement portion is located on the gas disk, and the placement portion is provided with a gas through hole, and a cooling gas path is provided inside the magnetic fluid structure, the cooling gas path can be connected to a cooling gas source, and the cooling gas path extends to the gas through hole;

[0022] And / or, the carrier body includes a cooling disk, a cooling water path is provided inside the magnetic fluid structure, the cooling water path can be communicated with a coolant, and the cooling water path extends into the cooling disk.

[0023] Optionally, in the above-mentioned wafer stage device, the wafer stage device further includes a stage support member and a flip driving member;

[0024] The stage support is used to support the entire wafer stage device, the output shaft of the flip driving component is connected to the stage support, and the axis of the output shaft of the flip driving component is perpendicular to the rotation axis of the magnetic fluid shaft.

[0025] Optionally, in the above-mentioned wafer stage device, the wafer stage device further includes a rotation driving member, a first rotating member, a second rotating member and a synchronous belt;

[0026] Wherein, the first rotating member is connected to the output shaft of the rotary driving member, the second rotating member is arranged on the magnetic fluid rotating shaft, and the synchronous belt connects the first rotating member and the second rotating member.

[0027] Optionally, in the above-mentioned wafer stage device, an encoder is provided on the magnetic fluid rotating shaft.

[0028] When the wafer carrier device provided by the utility model is used, since the magnetic fluid structure is arranged below the carrier body, the magnetic fluid structure includes a magnetic fluid fixed axis and a magnetic fluid rotating axis, the magnetic fluid rotating axis is rotatably arranged in the center hole of the magnetic fluid fixed axis, and the end of the magnetic fluid rotating axis close to the carrier body is connected to the carrier body, therefore, the carrier body can be driven to rotate by the magnetic fluid rotating axis, and the wafer placed on the placement part of the carrier body also rotates accordingly, ensuring that the number of bombarded atoms on the wafer surface reaches a certain proportion, ensuring the performance and quality of the wafer; since the ejector pin is arranged on the lifting tray, the ejector pin can contact the back side of the wafer after passing through the carrier body, and the lifting drive component is used to drive the lifting bottom tray to perform lifting movement, therefore, the lifting bottom tray can be lifted and lowered by the lifting drive component, so that the ejector pin arranged on the lifting bottom tray is lifted and lowered, so as to realize the adjustment of the floating height of the wafer; in addition, since the ejector pin is installed on the lifting bottom tray by a threaded connection, the ejector pin height can be adjusted by adjusting the thread tightening depth of the ejector pin on the lifting bottom tray, so as to realize the adjustment of the floating height of the wafer.

[0029] It can be seen that the wafer carrier device provided by the utility model, on the one hand, adjusts the height of the lifting bottom tray through the lifting drive assembly to achieve adjustment of the height of the ejector pin, thereby adjusting the floating height of the wafer; on the other hand, the inherent height of the ejector pin is adjusted by the threaded connection between the ejector pin and the lifting bottom tray to achieve adjustment of the wafer floating height; the wafer carrier device achieves adjustment of the wafer floating height from two aspects, thereby broadening the adjustment range of the wafer floating height. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0031] Figure 1 A schematic diagram of the internal structure of a wafer stage device provided in an embodiment of the utility model.

[0032] Among them, 10 is the carrier body, 11 is the air disk, 12 is the cooling disk, 20 is the magnetic fluid structure, 30 is the lifting bottom tray, 31 is the ejector pin, 41 is the cylinder body, 42 is the sealing bellows, 43 is the ejector ring, 44 is the magnet, 50 is the transition connection seat, 51 is the elastic element, 61 is the clamping part, 62 is the clamping connecting rod, 71 is the signal sensor, 80 is the carrier support part, 91 is the rotating drive part, 92 is the first rotating part, 93 is the second rotating part, 94 is the synchronous belt, and 95 is the encoder. DETAILED DESCRIPTION

[0033] In view of this, the core of the present invention is to provide a wafer stage device to broaden the adjustment range of the wafer suspension height.

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] like Figure 1 As shown, an embodiment of the utility model discloses a wafer stage device, including a stage body 10, a magnetic fluid structure 20, a lifting bottom tray 30 and a lifting drive assembly.

[0036] Among them, the carrier body 10 is provided with a placement portion for placing wafers; the magnetic fluid structure 20 is arranged below the carrier body 10, and the magnetic fluid structure 20 includes a magnetic fluid fixed axis and a magnetic fluid rotating axis, the magnetic fluid rotating axis is rotatably arranged in the center hole of the magnetic fluid fixed axis, and the end of the magnetic fluid rotating axis close to the carrier body 10 is connected to the carrier body 10; the lifting bottom tray 30 is arranged below the carrier body 10, and the lifting bottom tray 30 is provided with a pin 31, and the pin 31 can contact the back of the wafer after passing through the carrier body 10; the lifting drive assembly is used to drive the lifting bottom tray 30 to perform lifting and lowering movements, and the pin 31 is installed on the lifting bottom tray 30 by a threaded connection.

[0037] When using the wafer carrier device provided by the utility model, since the magnetic fluid structure 20 is arranged below the carrier body 10, the magnetic fluid structure 20 includes a magnetic fluid fixed axis and a magnetic fluid rotating axis, the magnetic fluid rotating axis is rotatably arranged in the center hole of the magnetic fluid fixed axis, and the end of the magnetic fluid rotating axis close to the carrier body 10 is connected to the carrier body 10. Therefore, the carrier body 10 can be driven to rotate by the magnetic fluid rotating axis, and the wafer placed on the placement part of the carrier body 10 also rotates accordingly, ensuring that the number of atoms bombarded on the wafer surface reaches a certain proportion, thereby ensuring the performance and quality of the wafer; An ejector pin 31 is provided on the lifting tray. The ejector pin 31 can contact the back side of the wafer after passing through the carrier body 10. The lifting drive assembly is used to drive the lifting bottom tray 30 to perform lifting movement. Therefore, the lifting bottom tray 30 can be lifted and lowered by the lifting drive assembly, so that the ejector pin 31 provided on the lifting bottom tray 30 is lifted and lowered, thereby realizing the floating height adjustment of the wafer. In addition, since the ejector pin 31 is installed on the lifting bottom tray 30 by a threaded connection, the height of the ejector pin 31 can be adjusted by adjusting the thread tightening depth of the ejector pin 31 on the lifting bottom tray 30, thereby realizing the floating height adjustment of the wafer.

[0038] It can be seen that the wafer carrier device provided by the utility model, on the one hand, adjusts the height of the lifting bottom tray 30 through the lifting drive assembly, thereby adjusting the height of the ejector pin 31, thereby adjusting the floating height of the wafer; on the other hand, the inherent height of the ejector pin 31 is adjusted by the threaded connection between the ejector pin 31 and the lifting bottom tray 30, thereby adjusting the floating height of the wafer; the wafer carrier device realizes the adjustment of the wafer floating height from two aspects, thereby widening the adjustment range of the wafer floating height.

[0039] It should be noted that the above-mentioned lifting drive component can realize the lifting drive of the lifting bottom tray 30 through gear rack transmission, screw nut transmission or telescopic cylinder and other types of transmission methods. As long as the lifting drive method can meet the use requirements, it belongs to the protection scope of the present utility model; optionally, the embodiment of the present utility model provides a lifting drive component.

[0040] Specifically, the lifting drive assembly includes a cylinder body 41 and a sealing bellows 42 matched with the cylinder body 41. The bottom and top of the cylinder body 41 are respectively provided with a bottom air inlet and a top air inlet. When it is necessary to lift the ejector pin 31, compressed air is introduced into the bottom air inlet of the cylinder body 41, and the bottom air inlet is connected with the sealing bellows 42. Under the impetus of the airflow, the top of the sealing bellows 42 is lifted, driving the ejector pin 31 to lift. When the ejector pin 31 is lifted to the highest limit position, it is a certain distance from the placement groove of the carrier body 10. The distance is convenient for the wafer robot finger to transfer and place the wafer on the ejector pin 31; when the ejector pin 31 needs to be lowered, compressed air is introduced into the top air inlet of the cylinder body 41, and the top of the sealing bellows 42 is pushed back by the airflow. When the ejector pin 31 falls back to the lowest limit position, the top of the sealing bellows 42 is separated from the lifting bottom tray 30 with a certain gap to prevent the lifting bottom tray 30 from interfering with or rubbing against the sealing bellows 42 during rotation, thereby affecting the normal use of the wafer carrier device.

[0041] Furthermore, the number of cylinder bodies 41 and sealing bellows 42 is at least two, and the multiple cylinder bodies 41 are evenly distributed in the outer circumferential direction of the magnetic fluid shaft so that the lifting force of the lifting tray is uniform at all locations, thereby improving the lifting stability, and the tops of the multiple sealing bellows 42 are connected by a top ring 43 to ensure that the telescopic ends of the multiple cylinders are lifted and lowered synchronously, thereby further improving the lifting stability.

[0042] It should be understood that the utility model does not specifically limit the number of the above-mentioned cylinder bodies 41 and the sealing bellows 42, as long as the number can meet the use requirements, it belongs to the protection scope of the utility model; optionally, the number of cylinder bodies 41 and sealing bellows 42 provided in the embodiment of the utility model is two, and the two cylinder bodies 41 are symmetrically arranged on both sides of the magnetic fluid shaft to balance the force on both sides of the lifting bottom tray 30 and improve stability.

[0043] A magnetic fluid flange is also provided on the above-mentioned magnetic fluid fixed axis. When the top of the sealing bellows 42 falls back to contact with the upper surface of the magnetic fluid flange, it is the limit position of the fall. At this time, the top ring 43 and the lifting bottom tray 30 are separated, and there is a certain gap to prevent the lifting bottom tray 30 from interfering or rubbing with the top ring 43 during rotation, thereby affecting the normal use of the wafer carrier device.

[0044] In addition, the above-mentioned lifting drive assembly also includes a lifting rod connected to the lifting end of the sealing bellows 42, and a magnet 44 is arranged at the bottom of the lifting rod. The platform body 10 is provided with a magnetic induction switch cooperating with the magnet 44, so as to judge the lifting position of the telescopic rod through the cooperation between the magnet 44 and the magnetic induction switch, thereby judging the lifting position of the sealing bellows 42 to detect whether the cylinder is operating normally.

[0045] like Figure 1As shown, a transition seat 50 is provided at one end of the magnetic fluid shaft close to the carrier body 10, the carrier body 10 is provided on the transition seat 50, and an elastic element 51 is provided between the transition seat 50 and the lifting bottom tray 30, so that based on the compression deformation force of the elastic element 51, the lifting bottom tray 30 is in a falling state, so that the ejector pin 31 provided on the lifting bottom tray 30 is in a falling state, so as to prevent the ejector pin 31 from applying an ejection force to the wafer and causing damage to the wafer.

[0046] A clamping member 61 for clamping the wafer is provided on the above-mentioned carrier body 10, and a clamping connecting rod 62 is also provided on the lifting bottom tray 30. The clamping connecting rod 62 passes through the transition connecting seat 50 and the carrier body 10 and is connected to the clamping member 61, so as to drive the clamping connecting rod 62 to rise and fall through the lifting bottom tray 30, so that the clamping member 61 can clamp the wafer when it is lifted to a preset clamping position, and can release the wafer when it is lifted to a preset release position.

[0047] It should be understood that based on the compressive deformation force of the elastic element 51, the clamping member 61 is also in a falling state, and the clamping member 61 applies a clamping force to the edge of the wafer placed on the carrier body 10, thereby fixing the wafer and preventing it from falling off.

[0048] Furthermore, the magnetic fluid fixed axis separates the internal structure of the wafer carrier device into a vacuum environment side and an atmospheric environment side, and a clamping position detection device is arranged on the vacuum environment side; wherein, the clamping position detection device includes a signal sensor 71 and a signal transmitter, and the number of the signal sensors 71 is at least two, and the plurality of signal sensors 71 are distributed up and down, and the signal transmitter is arranged on the side of the lifting bottom tray 30, so as to judge the lifting condition of the lifting bottom tray 30 through the induction cooperation of the signal transmitter and the signal sensor 71, and thus determine whether the ejector pin 31 has fallen back into place.

[0049] The number of the above-mentioned signal sensors 71 can be two or three, etc. The present invention does not specifically limit the number of the above-mentioned signal sensors 71 and the spacing between adjacent signal sensors 71. As long as the setting method can meet the use requirements, it belongs to the protection scope of the present invention; optionally, the present invention provides two signal sensors 71, and the two signal sensors 71 are fixed on the carrier support 80 described below, distributed up and down, and close to the lifting bottom tray 30, so that the lifting condition of the lifting bottom tray 30 can be judged by the induction cooperation of the signal transmitter and the two signal sensors 71, so as to determine whether the ejector 31 has fallen back into place.

[0050] The carrier body 10 provided by the utility model includes an air disk 11, a placement portion is located on the air disk 11, and the placement portion is provided with a gas through hole, a cooling air path is provided inside the magnetic fluid structure 20, the cooling air path can be connected with a cooling air source, and the cooling air path extends to the gas through hole, so as to facilitate the introduction of a cooling air source into the cooling air path, so that the cooling air source flows through the cooling air path and the magnetic fluid structure 20 in turn, and finally flows to the back side of the wafer, and the heat on the wafer can be conducted out by the airflow flowing through the back side of the wafer, so as to provide cooling for the wafer.

[0051] It should be understood that the cooling gas source may be helium, argon or nitrogen, etc. As long as the gas type can meet the cooling requirements, it falls within the protection scope of the present invention; optionally, the gas source provided in the embodiment of the present invention is helium.

[0052] In addition, the above-mentioned carrier body 10 also includes a cooling plate 12. A cooling water path is provided inside the magnetic fluid structure 20. The cooling water path can be connected to the coolant, and the cooling water path extends into the cooling plate 12 to make the cooling water path and the coolant communicate. The coolant circulates through the cooling water path to the cooling plate 12 to provide cooling for the entire wafer carrier.

[0053] The wafer stage device provided by the present invention also includes a stage support 80 and a flip drive member; wherein, the stage support 80 is used to carry the entire wafer stage device, the output shaft of the flip drive member is connected to the stage support 80, and the output shaft axis of the flip drive member is perpendicular to the rotation axis of the magnetic fluid shaft. On the one hand, the wafer stage device drives the stage body 10 to rotate through the magnetic fluid shaft, so that the wafer can rotate and the coating uniformity is improved. On the other hand, the flip drive member flips the stage support 80, so that the entire wafer stage device can be flipped at different angles, thereby improving the coating uniformity and deposition rate. The wafer stage device occupies a small space, has a high degree of integration, rotates smoothly and with high precision, and can be used for etching and ion beam deposition equipment at the same time.

[0054] The above-mentioned wafer carrier device also includes a rotating drive member 91, a first rotating member 92, a second rotating member 93 and a synchronous belt 94; wherein the first rotating member 92 is connected to the output shaft of the rotating drive member 91, the second rotating member 93 is arranged on the magnetic fluid shaft, and the synchronous belt 94 connects the first rotating member 92 and the second rotating member 93, so as to drive the first rotating member 92 to rotate through the rotating drive member 91, and drive the second rotating member 93 to rotate through the synchronous belt 94, so that the magnetic fluid shaft rotates, and the carrier body 10 arranged on the magnetic fluid shaft realizes self-rotation, thereby improving the uniformity of coating.

[0055] In addition, the wafer stage device provided by the present invention further includes an encoder 95 disposed on the magnetic fluid shaft, so as to determine the rotation position of the magnetic fluid shaft through the encoder 95, thereby accurately determining the rotation position of the stage body 10 on which the wafer is placed.

[0056] The terms "first" and "second" in the specification and claims of the utility model and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may include steps or units that are not listed.

[0057] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer stage device, characterized in that: include: The stage body is provided with a placement portion for placing the wafer; A magnetic fluid structure is arranged below the stage body, the magnetic fluid structure comprises a magnetic fluid fixed axis and a magnetic fluid rotating axis, the magnetic fluid rotating axis is rotatably arranged in the center hole of the magnetic fluid fixed axis, and one end of the magnetic fluid rotating axis close to the stage body is connected to the stage body; A lifting bottom tray is arranged below the stage body, and an ejector pin is arranged on the lifting bottom tray, and the ejector pin can contact the back side of the wafer after passing through the stage body; Lifting drive assembly; Wherein, the lifting drive assembly is used to drive the lifting bottom tray to perform lifting movement, and the ejector pin is installed on the lifting bottom tray by means of a threaded connection.

2. The wafer stage device according to claim 1, characterized in that: The lifting drive assembly comprises a cylinder body and a sealing bellows matched with the cylinder body, and a bottom air inlet and a top air inlet are respectively arranged at the bottom and the top of the cylinder body.

3. The wafer stage device according to claim 2, characterized in that: The number of the cylinder bodies and the sealing bellows is at least two, the plurality of cylinder bodies are evenly distributed in the outer circumferential direction of the magnetic fluid shaft, and the tops of the plurality of sealing bellows are connected via a top ring.

4. The wafer stage device according to claim 2, characterized in that: The lifting drive assembly also includes a lifting rod connected to the lifting end of the sealing bellows, a magnet is arranged at the bottom of the lifting rod, and the platform body is provided with a magnetic induction switch cooperating with the magnet.

5. The wafer stage device according to claim 1, characterized in that: A transition connection seat is arranged at one end of the magnetic fluid rotating shaft close to the carrier body, the carrier body is arranged on the transition connection seat, and an elastic element is arranged between the transition connection seat and the lifting bottom tray.

6. The wafer stage device according to claim 5, characterized in that: The carrier body is provided with a clamping piece for clamping the wafer, and the lifting bottom tray is also provided with a clamping connecting rod, which passes through the transition connecting seat and the carrier body and is connected to the clamping piece.

7. The wafer stage device according to claim 5, characterized in that: The magnetic fluid axis fixing separates the internal structure of the wafer stage device into a vacuum environment side and an atmospheric environment side, and the vacuum environment side is provided with a pressing position detection device; Wherein, the clamping position detection device includes a signal sensor and a signal transmitter, the number of the signal sensors is at least two, and the plurality of signal sensors are distributed up and down, and the signal transmitter is arranged on the side of the lifting bottom tray.

8. The wafer stage device according to claim 1, characterized in that: The stage body includes a gas disk, the placement portion is located on the gas disk, and the placement portion is provided with a gas through hole, and a cooling gas path is provided inside the magnetic fluid structure, the cooling gas path can be connected to a cooling gas source, and the cooling gas path extends to the gas through hole; And / or, the carrier body includes a cooling disk, a cooling water path is provided inside the magnetic fluid structure, the cooling water path can be communicated with a coolant, and the cooling water path extends into the cooling disk.

9. The wafer stage device according to claim 1, characterized in that: The wafer stage device also includes a stage support component and a flip driving component; The stage support is used to support the entire wafer stage device, the output shaft of the flip driving component is connected to the stage support, and the axis of the output shaft of the flip driving component is perpendicular to the rotation axis of the magnetic fluid shaft.

10. The wafer stage device according to claim 1, characterized in that: The wafer stage device also includes a rotation driving member, a first rotating member, a second rotating member and a synchronous belt; Wherein, the first rotating member is connected to the output shaft of the rotary driving member, the second rotating member is arranged on the magnetic fluid rotating shaft, and the synchronous belt connects the first rotating member and the second rotating member.

11. The wafer stage device according to claim 1, characterized in that: An encoder is arranged on the magnetic fluid rotating shaft.

Images