Wafer feeding mechanism and demolding jacking device

Abstract

The utility model relates to the technical field of chip die bonding, and specifically discloses a wafer feeding mechanism and a demoulding jacking device, the wafer feeding mechanism comprises a wafer platform, the middle position of the wafer platform is provided with a wafer positioning groove used for placing a wafer; and the material pulling manipulator is installed on the wafer platform and is used for pulling the wafer from the outside of the wafer platform to the wafer positioning groove and taking the wafer out of the wafer positioning groove to the outside of the wafer platform. The wafer feeding mechanism and the demolding jacking device provided by the utility model can effectively meet the demolding operation requirement of chip mechanization, thereby improving the production efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of chip solid crystal, in particular to a wafer feeding mechanism and a film stripping and lifting device. Background Art

[0002] When the wafer is incoming, it includes a crystal ring, a film stretched tightly on the crystal ring, and a number of chips attached to the film. Before the chip is bonded to the bracket, the chip needs to be removed from the film. The utility model is dedicated to the development of a wafer loading mechanism and a film stripping lifting device to meet the requirements of mechanized chip stripping operations, thereby improving production efficiency.

[0003] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Utility Model Content

[0004] One purpose of the utility model is to provide a wafer loading mechanism and a film stripping lifting device, which can effectively meet the requirements of mechanized chip stripping operations, thereby improving production efficiency.

[0005] In order to achieve the above purpose, the utility model provides a wafer loading mechanism and a film stripping lifting device, including:

[0006] A wafer platform, wherein a wafer positioning groove for placing a wafer is provided in the middle of the wafer platform;

[0007] A material pulling robot is installed on the wafer platform and is used to pull the wafer from the outside of the wafer platform to the wafer positioning groove, and is used to take the wafer out of the wafer positioning groove to the outside of the wafer platform.

[0008] Optionally, also include:

[0009] A limiting top plate, wherein the limiting top plate is fixedly arranged above the wafer platform, and the material pulling robot is located in the interval space between the limiting top plate and the wafer platform;

[0010] Wherein, the position of the limiting top plate corresponding to the wafer positioning groove is provided with a top plate avoidance groove for the chip to pass through.

[0011] Optionally, the material pulling robot includes a clamping claw assembly for clamping the wafer, and a robot linear drive mechanism for driving the clamping claw assembly to enter and exit the spacing space.

[0012] Optionally, the material pulling manipulator further includes:

[0013] A connecting plate, the clamping jaw assembly is installed on one end of the connecting plate, and the other end of the connecting plate is connected to the driving end of the linear driving mechanism of the manipulator.

[0014] Optionally, the wafer platform includes a platform bottom plate, a first sliding frame slidably disposed above the platform bottom plate, and a first platform linear driving mechanism driving the first sliding frame to slide back and forth relative to the platform bottom plate along a first direction.

[0015] Optionally, the wafer platform further includes a second slide frame slidably disposed above the first slide frame and provided with the wafer positioning groove, and a second platform linear drive mechanism driving the second slide frame to slide back and forth relative to the first slide frame along a second direction.

[0016] Optionally, the first direction is perpendicular to the second direction, and the first direction is parallel to the driving direction of the manipulator linear drive mechanism.

[0017] On the other hand, a film stripping and lifting device is provided, comprising:

[0018] Any wafer loading mechanism described above;

[0019] The lifting mechanism is located below the wafer positioning groove of the wafer loading mechanism and is used to lift the chip on the wafer upward to separate from the film on the wafer.

[0020] Optionally, the lifting mechanism includes an ejector assembly and an ejector linear drive mechanism for driving the ejector assembly to move up and down.

[0021] The beneficial effect of the utility model is that it provides a wafer loading mechanism and a film stripping and lifting device. After the pulling robot pulls the wafer from the outside of the wafer platform to the wafer positioning groove of the wafer platform, the lifting mechanism can push the chip on the film upward to separate from the film, so that the solid crystal robot can take away the chip.

[0022] Therefore, the wafer loading mechanism and the film stripping lifting device provided by the utility model can effectively meet the requirements of the mechanized film stripping operation of the chip, thereby improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0024] Figure 1 A schematic structural diagram of the film stripping and lifting device provided in an embodiment.

[0025] In the figure:

[0026] 1. Wafer loading mechanism;

[0027] 101, wafer platform; 1011, platform bottom plate; 1012, first slide frame; 1013, second slide frame; 1013a, wafer positioning groove;

[0028] 102. Material pulling manipulator; 1021. Clamping claw assembly; 1022. Manipulator linear drive mechanism; 1023. Connecting plate;

[0029] 103, limit top plate; 1031, top plate avoidance groove;

[0030] 2. Lifting mechanism; 201. Ejector assembly; 202. Ejector linear drive mechanism. DETAILED DESCRIPTION

[0031] In order to make the purpose, features and advantages of the utility model more obvious and easy to understand, the technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the embodiment described below is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0032] In the description of the present utility model, it is to be understood that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time. When a component is considered to be "set on" another component, it may be directly set on the other component or there may be a centrally arranged component at the same time.

[0033] In addition, terms such as "long", "short", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are only used to facilitate the description of the present invention. They do not indicate or imply that the device or component referred to must have this specific direction or operate with a specific direction structure, and should not be understood as a limitation of the present invention.

[0034] The present invention will be described in detail below in conjunction with the specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, methodological, or functional changes made by a person skilled in the art based on these embodiments are all within the scope of protection of the present invention.

[0035] The utility model provides a wafer loading mechanism and a film stripping lifting device, which are suitable for lifting the chip on the wafer upward to separate from the film so that a crystal bonding robot can take the crystal. It can effectively meet the requirements of mechanized chip stripping operations, thereby improving production efficiency.

[0036] See also Figure 1 The film stripping and lifting device provided in this embodiment includes a wafer loading mechanism 1 and a lifting mechanism 2.

[0037] The wafer loading mechanism 1 includes a wafer platform 101 , a material pulling robot 102 , and a limiting top plate 103 .

[0038] A wafer positioning groove 1013a for placing a wafer is provided in the middle of the wafer platform 101. The lifting mechanism 2 is located below the wafer positioning groove 1013a of the wafer loading mechanism 1, and is used to lift the chip on the wafer upward to separate from the film on the wafer. Specifically, the lifting mechanism 2 includes a pin assembly 201 and a pin linear driving mechanism 202 for driving the pin assembly 201 to move up and down.

[0039] The pulling robot 102 is installed on the wafer platform 101 , and is used to pull the wafer from the outside of the wafer platform 101 to the wafer positioning groove 1013 a , and is used to take the wafer out of the wafer positioning groove 1013 a to the outside of the wafer platform 101 .

[0040] The limiting top plate 103 is fixed above the wafer platform 101, and the pulling robot 102 is located in the interval space between the limiting top plate 103 and the wafer platform 101; wherein, the limiting top plate 103 is provided with a top plate avoidance groove 1031 for the chip to pass through at a position corresponding to the wafer positioning groove 1013a.

[0041] It should be noted that the diameter of the top plate avoidance groove 1031 is smaller than the outer diameter of the crystal ring and larger than the inner diameter of the crystal ring, thereby limiting the crystal ring from passing through the top plate avoidance groove 1031 upward.

[0042] Optionally, the material pulling robot 102 includes a clamping claw assembly 1021 for clamping the wafer, and a robot linear driving mechanism 1022 for driving the clamping claw assembly 1021 to enter and exit the spacing space.

[0043] Furthermore, the material pulling robot 102 also includes a connecting plate 1023 , the clamping jaw assembly 1021 is installed on one end of the connecting plate 1023 , and the other end of the connecting plate 1023 is connected to the driving end of the robot linear driving mechanism 1022 .

[0044] In this embodiment, the wafer platform 101 includes a platform base plate 1011, a first slide frame 1012 slidably disposed above the platform base plate 1011, a first platform linear drive mechanism that drives the first slide frame 1012 to slide back and forth relative to the platform base plate 1011 along a first direction (parallel to the X-axis), a second slide frame 1013 slidably disposed above the first slide frame 1012 and provided with the wafer positioning groove 1013a, and a second platform linear drive mechanism that drives the second slide frame 1013 to slide back and forth relative to the first slide frame 1012 along a second direction (parallel to the Y-axis).

[0045] Optionally, the first direction is perpendicular to the second direction, and the first direction is parallel to the driving direction of the manipulator linear driving mechanism 1022 .

[0046] The first platform linear drive mechanism and the second platform linear drive mechanism cooperate to adjust the position of the wafer positioning groove 1013a frontward, backward, leftward and rightward, so that the lifting mechanism 2 can push the chips at different positions upward.

[0047] When demoulding is required, the steps are as follows:

[0048] S10: The pulling robot 102 pulls the wafer from the outside of the wafer platform 101 to above the wafer positioning groove 1013a;

[0049] S20: The ejector linear drive mechanism 202 drives the ejector assembly 201 to lift the chip upward to detach it from the film so that the die bonding robot can take away the chip;

[0050] S30: The first platform linear drive mechanism and the second platform linear drive mechanism cooperate to adjust the position of the wafer in the front, back, left, and right directions, so that the lifting mechanism 2 can lift the chips at different positions upwards;

[0051] S40 : After all chips are ejected, the pulling robot 102 moves the wafer ring to the outside of the wafer platform 101 .

[0052] The wafer loading mechanism 1 and the film stripping and lifting device provided in this embodiment have the following advantages:

[0053] ① After the pulling robot 102 pulls the wafer from the outside of the wafer platform 101 to the wafer positioning groove 1013a of the wafer platform 101, the lifting mechanism 2 can push the chip on the film upward to separate from the film so that the die bonding robot can take away the chip, thereby effectively meeting the requirements of the mechanized chip demolding operation and improving production efficiency;

[0054] ② The material pulling robot 102 is arranged in the space between the limiting top plate 103 and the wafer platform 101, which is beneficial to reducing the overall volume of the equipment and improving the compactness of the structure.

[0055] It should be noted that the linear drive mechanism mentioned in the present invention can be a cylinder, a hydraulic cylinder, an electric cylinder or a motor screw linear module, etc., and the rotary drive mechanism mentioned can be a brushed motor, a brushless motor, or a rotary cylinder, etc. The present invention does not limit the specific structural forms of the linear drive mechanism and the rotary drive mechanism.

[0056] It should be understood that although this specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each implementation mode may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

[0057] The series of detailed descriptions listed above are only specific descriptions of feasible implementation methods of the utility model. They are not intended to limit the protection scope of the utility model. Any equivalent implementation methods or changes that do not deviate from the technical spirit of the utility model should be included in the protection scope of the utility model.

Claims

1. A wafer loading mechanism, characterized in that: include: A wafer platform (101), wherein a wafer positioning groove (1013a) for placing a wafer is provided in the middle of the wafer platform (101); A material pulling robot (102), the material pulling robot (102) is installed on the wafer platform (101), and is used to pull the wafer from the outside of the wafer platform (101) into the wafer positioning groove (1013a), and is used to take the wafer out of the wafer positioning groove (1013a) to the outside of the wafer platform (101).

2. The wafer loading mechanism according to claim 1, characterized in that: Also includes: A limiting top plate (103), the limiting top plate (103) is fixedly arranged above the wafer platform (101), and the material pulling robot (102) is located in the interval space between the limiting top plate (103) and the wafer platform (101); Wherein, the position of the limiting top plate (103) corresponding to the wafer positioning groove (1013a) is provided with a top plate avoidance groove (1031) for the chip to pass through.

3. The wafer loading mechanism according to claim 2, characterized in that: The material pulling robot (102) comprises a clamping claw assembly (1021) for clamping a wafer, and a robot linear driving mechanism (1022) for driving the clamping claw assembly (1021) to enter and exit the spacing space.

4. The wafer loading mechanism according to claim 3, characterized in that: The material pulling robot (102) further comprises: A connecting plate (1023), the clamping jaw assembly (1021) is mounted on one end of the connecting plate (1023), and the other end of the connecting plate (1023) is connected to the driving end of the manipulator linear drive mechanism (1022).

5. The wafer loading mechanism according to claim 3, characterized in that: The wafer platform (101) comprises a platform base plate (1011), a first sliding frame (1012) slidably arranged above the platform base plate (1011), and a first platform linear driving mechanism for driving the first sliding frame (1012) to slide back and forth relative to the platform base plate (1011) along a first direction.

6. The wafer loading mechanism according to claim 5, characterized in that: The wafer platform (101) further comprises a second slide frame (1013) which is slidably arranged above the first slide frame (1012) and is provided with the wafer positioning groove (1013a), and a second platform linear drive mechanism which drives the second slide frame (1013) to slide back and forth relative to the first slide frame (1012) along a second direction.

7. The wafer loading mechanism according to claim 6, characterized in that: The first direction is perpendicular to the second direction, and the first direction is parallel to the driving direction of the robot linear driving mechanism (1022).

8. A film stripping and lifting device, characterized in that: include: The wafer loading mechanism (1) according to any one of claims 1 to 7; A lifting mechanism (2), the lifting mechanism (2) is located below the wafer positioning groove (1013a) of the wafer loading mechanism (1), and is used to lift the chip on the wafer upward to separate from the film on the wafer.

9. The film stripping and lifting device according to claim 8, characterized in that: The lifting mechanism (2) comprises an ejector assembly (201) and an ejector linear drive mechanism (202) for driving the ejector assembly (201) to move up and down.

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