Ejector pin mechanism for separating chip from film
By designing a thimble mechanism for separation of chips and membranes, using technical means such as vacuum adsorption parts, compression springs and servo motors, the problem of high adhesion between chips and membranes in semiconductor packaging tests is solved, and a high-precision chip is achieved Push and smaller overall structure.
Patent Information
- Application Number
- CN202420954952.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-06
AI Technical Summary
In semiconductor packaging tests, the adhesion between the chip and the film is too great, resulting in a large overall lateral structure of the thimble module, making it difficult to achieve high-precision chip lifting, affecting product quality.
A thimble mechanism for separation of chips and membranes is designed. By installing a vacuum adsorption member on one side of the vacuum chamber housing and connecting a pressure spring and a pressure spring baffle on the other side, combining servo motor and cam control, the precise extension of the thimble is ensured. Exit and retract to achieve high-precision chip hoisting.
The thimble mechanism can strictly control the extension of the thimble, improve the accuracy of chip elevation, ensure product quality, and have a smaller overall structure and higher integration.
Smart Images
Figure CN222462887U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor packaging, in particular to an ejector pin mechanism for separating a chip from a film. Background Art
[0002] In the field of semiconductor packaging and testing, after the chip is cut into a single chip matrix on the film, the adhesion between the chip and the film is too strong, and the chip cannot be directly sucked off the film using a suction cup. It is necessary to lift the center of the chip and separate the edge of the chip from the film to reduce the adhesion between the film and the chip. Only then can the suction cup suck the chip off the film.
[0003] The centralized arrangement of the existing ejector pin modules results in a large overall lateral structure, which limits the design and use. When the material is demolded from the blue film, the demolding is not thorough, resulting in deviations in the surface recognition of the next product. Therefore, the chip lifting mechanism requires very high lifting and lowering accuracy to ensure the quality of the product. To this end, the technical solution proposes an ejector pin mechanism for separating the chip from the film. Utility Model Content
[0004] The utility model provides a pin mechanism for separating chips from membranes, wherein a vacuum adsorption component is installed on one side of a vacuum chamber shell, and a compression spring and a compression spring baffle are connected to the other side. The pin is tightened and fixed to one end of a lead screw by a lock nut, and two ball linear bearings are arranged inside the vacuum chamber of the lead screw to ensure that the lead screw and the pin move in a straight line. The mechanism adopts a servo motor as power and adopts cam control in the longitudinal direction, which has higher precision and strictly controls the extension amount of the pin, thereby ensuring the quality of the product. In summary, the problems in the background technology are solved.
[0005] In order to solve the above technical problems, the utility model is realized by the following technical solutions:
[0006] The utility model discloses a pin mechanism for separating a chip from a membrane, comprising a vacuum chamber shell, one end of the vacuum chamber shell being provided with a vacuum adsorption component via a first lock nut, and the other end being connected with a compression spring and a compression spring baffle; one side of the compression spring baffle is connected with a lead screw penetrating the vacuum chamber shell, and the other side is provided with a cam to control the lead screw to move upward; the top of the lead screw is provided with a pin via a second lock nut.
[0007] Furthermore, an ultra-thin elastic material is padded in the connection portion between the first lock nut and the vacuum adsorption component.
[0008] Furthermore, two ball linear bearings are installed at the upper and lower parts of the vacuum chamber shell to enable the lead screw and the ejector pin to move in a straight line.
[0009] Furthermore, a sealing ring is provided at the connection between the ball linear bearing and the vacuum chamber housing and the lead screw, and an ultra-thin elastic material is padded at the connection between the vacuum chamber housing and the vacuum adsorption component to prevent air leakage at the connection part and ensure the airtightness of the vacuum chamber.
[0010] Furthermore, a vacuum connector is provided on the side of the vacuum chamber shell, and the membrane is completely adsorbed through the internal vacuum chamber and the first grooves evenly arranged on the top of the vacuum adsorbent. The vacuum chamber is composed of straight holes on the inner side wall of the vacuum chamber shell and the middle hole of the vacuum adsorbent.
[0011] Furthermore, one end of the vacuum connector is connected to negative pressure, which passes through the straight air hole in the vacuum chamber shell and then through the connection between the vacuum chamber shell and the vacuum adsorption component, and is evenly distributed at the straight hole inside the vacuum adsorption component, and then acts evenly on the adsorption workpiece on the top through four small holes.
[0012] Furthermore, a second groove in the shape of a vertical notch for inserting the ejector pin is provided at the upper end of the lead screw, and is used for screwing in a second lock nut to fix the ejector pin.
[0013] Compared with the prior art, the utility model has the following beneficial effects:
[0014] The ejector mechanism of the utility model has the advantages of delicate structure, capable of strictly controlling the extension amount of the ejector, being replaceable, having a smaller overall structure and being more integrated.
[0015] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0017] Figure 1 This is a schematic structural diagram of a pin mechanism for separating a chip from a membrane according to the utility model;
[0018] Figure 2 for Figure 1 Structural cross-sectional view of
[0019] Figure 3 Schematic diagram of the structure inside the vacuum chamber;
[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows:
[0021] 1-vacuum chamber housing, 14-vacuum connector, 15-first groove, 2-vacuum adsorption piece, 3-first lock nut, 4-ultra-thin elastic material, 5-compression spring, 6-compression spring baffle, 7-cam, 8-screw, 9-thimble, 10-second groove, 11-second lock nut, 12-ball linear bearing, 13-sealing ring, 14-vacuum connector, 15-groove. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] In the description of the present invention, it should be understood that terms such as "one end", "one side", "the other side", "upper and lower ends", "side", and "vertical" indicating orientation or positional relationship are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the components or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0024] In view of the deficiencies in the prior art, the utility model provides a novel ejector pin mechanism, which has the advantages of strictly controlling the extension amount of the ejector pin, the ejector pin being replaceable, having a smaller overall structure, and having higher integration, thereby solving the above technical problems.
[0025] See also Figure 1-3 As shown, the utility model is a pin mechanism for separating chips from membranes, comprising a vacuum chamber housing 1, one end of the vacuum chamber housing 1 is equipped with a vacuum adsorption component 2 through a first lock nut 3, and the other end is connected with a compression spring 5 and a compression spring baffle 6; one side of the compression spring baffle 6 is connected with a lead screw 8 that passes through the vacuum chamber housing 1, and the other side uses a cam 7 to control the lead screw 8 to move upward; a pin 9 is installed on the top of the lead screw 8 through a second lock nut 11.
[0026] The connection portion between the first lock nut 3 and the vacuum adsorption component 2 is padded with an ultra-thin elastic material 4 .
[0027] Two ball linear bearings 12 are installed at the upper and lower parts of the vacuum chamber housing 1 to enable the lead screw 8 and the ejector pin 9 to move along a straight line.
[0028] Among them, a sealing ring 13 is provided at the connection between the ball linear bearing 12 and the vacuum chamber housing 1 and the lead screw 8, and an ultra-thin elastic material 4 is padded at the connection between the vacuum chamber housing 1 and the vacuum adsorption component 2 to prevent air leakage at the connection part and ensure the airtightness of the vacuum chamber.
[0029] Among them, a vacuum connector 14 is arranged on the side of the vacuum chamber shell 1, and the membrane is completely adsorbed through the first grooves 15 evenly arranged on the top of the internal vacuum chamber and the vacuum adsorption component 2. The first groove 15 is a shallow groove for allowing the vacuum adsorption gas path to flow. The vacuum chamber shell 1 and the vacuum adsorption component 2 are connected and fixed by a first lock nut 3, and the middle connection part is padded with ultra-thin elastic material 4 to ensure that the workpiece is relatively easy to process and the connection part has good air tightness. The vacuum chamber is composed of straight holes on the inner side wall of the vacuum chamber shell 1 and the middle hole of the vacuum adsorption component 2.
[0030] Among them, one end of the vacuum connector 14 is connected to negative pressure, passes through the straight air hole in the vacuum chamber shell 1, and then passes through the connection between the vacuum chamber shell 1 and the vacuum adsorption component 2, and is evenly distributed at the straight hole inside the vacuum adsorption component 2, and then acts evenly on the adsorption workpiece on the top through four small holes.
[0031] The upper end of the lead screw 8 is provided with a second groove 10 in the shape of a vertical notch for the ejector pin 9 to be inserted into, and is used to screw in a second lock nut 11 to fix the ejector pin 9;
[0032] The lead screw 8 passes through the entire vacuum chamber housing 1, and an ejector pin 9 is inserted into the upper end. The clearance between the ejector pin 9 and the end of the lead screw 8 ensures easy replacement. A vertical notch and an external thread are processed at the insertion position of the ejector pin 9 on the lead screw 8, and a second lock nut 11 is used to fix the ejector pin.
[0033] During operation, negative pressure is first connected through the vacuum connector 14 to evacuate the vacuum chamber to adsorb the workpiece, and then the cam is used to control the lead screw 8 and the ejector pin 9 to move to the desired position to eject the mold on the other side 7 of the compression spring baffle 6. After that, the compression spring is released to return the lead screw 8 and the ejector pin 9 to their original positions, the air circuit is depressurized, and the work is completed.
[0034] like Figure 3 In the vacuum air path shown, the A end of the vacuum connector 14 is connected to negative pressure, which passes through the straight air path hole B in the vacuum chamber shell 1 and then passes through the connection point C between the vacuum chamber shell and the vacuum adsorbent, and is evenly distributed at the straight hole D inside the vacuum adsorbent, and then acts evenly at E through four small holes to adsorb the workpiece.
[0035] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.
Claims
1. A pin mechanism for separating a chip from a film, comprising a vacuum chamber housing (1), characterized in that: One end of the vacuum chamber housing (1) is mounted with a vacuum adsorption component (2) via a first lock nut (3), and the other end is connected with a compression spring (5) and a compression spring baffle (6); one side of the compression spring baffle (6) is connected with a lead screw (8) that passes through the vacuum chamber housing (1), and the other side uses a cam (7) to control the lead screw (8) to move upward; the top of the lead screw (8) is mounted with a thimble (9) via a second lock nut (11).
2. The ejector pin mechanism for separating a chip from a film according to claim 1, characterized in that: An ultra-thin elastic material (4) is padded in the connection portion between the first lock nut (3) and the vacuum adsorption component (2).
3. The ejector pin mechanism for separating a chip from a film according to claim 1, characterized in that: Two ball linear bearings (12) are installed at the upper and lower parts of the vacuum chamber housing (1) to enable the lead screw (8) and the ejector pin (9) to move along a straight line.
4. The ejector pin mechanism for separating a chip from a film according to claim 3, characterized in that: A sealing ring (13) is provided at the connection between the ball linear bearing (12) and the vacuum chamber housing (1) and the lead screw (8), and an ultra-thin elastic material (4) is inserted into the connection between the vacuum chamber housing (1) and the vacuum adsorption component (2) to prevent air leakage at the connection part and ensure the airtightness of the vacuum chamber.
5. The ejector pin mechanism for separating a chip from a film according to claim 1, characterized in that: A vacuum connector (14) is provided on the side of the vacuum chamber shell (1), and the film is completely adsorbed through the internal vacuum chamber and the first grooves (15) evenly arranged at the top of the vacuum adsorbent (2). The vacuum chamber is composed of the straight holes on the inner side wall of the vacuum chamber shell (1) and the middle hole of the vacuum adsorbent (2).
6. The ejector pin mechanism for separating a chip from a film according to claim 5, characterized in that: One end of the vacuum connector (14) is connected to negative pressure, passes through the straight air path hole in the vacuum chamber housing (1), passes through the connection between the vacuum chamber housing (1) and the vacuum adsorption component (2), is evenly distributed at the straight hole inside the vacuum adsorption component (2), and then acts evenly on the adsorption workpiece at the top through the four small holes.
7. The ejector pin mechanism for separating a chip from a film according to claim 1, characterized in that: The upper end of the lead screw (8) is provided with a second groove (10) in the shape of a vertical notch for inserting the ejector pin (9), and is used for screwing in a second lock nut (11) to fix the ejector pin (9).