Mother board, heat dissipation substrate with chip, and power module

Abstract

The utility model discloses a mother board, a heat dissipation substrate with a chip, and a power module. The mother board comprises a ceramic layer; the first metal layer comprises a plurality of first metal parts, and the first metal parts are separated through first groove parts; the second metal layer comprises a plurality of second metal parts, the second metal parts are separated through second groove parts, the second metal parts and the first metal parts are correspondingly arranged, and the second groove parts and the first groove parts are correspondingly arranged; the plurality of groups of chips are correspondingly arranged on the first metal parts; the mother board is configured in the mode that the mother board can be divided into a plurality of heat dissipation substrates with chips along the first groove parts or the second groove parts, and each heat dissipation substrate with the chip comprises a first metal part, a set of chips corresponding to the first metal part and a second metal part corresponding to the first metal part. According to the utility model, the workload of early-stage transfer can be saved, and the production efficiency can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of power module testing, in particular to a motherboard, a heat dissipation substrate with a chip and a power module. Background Art

[0002] The power module needs to use a ceramic heat dissipation substrate to achieve the heat dissipation of the internal chip. In the related technology, the power module manufacturer usually separates the whole board into multiple ceramic heat dissipation substrates, and then the power module manufacturer coats silver paste on the ceramic heat dissipation substrate and mounts the chip. However, this method has the following problems:

[0003] 1. The ceramic heat sink substrate needs to be placed on a special carrier. For example, the power module manufacturer needs to put the ceramic heat sink substrate into a transfer carrier for delivery. The power module manufacturer needs to put the ceramic heat sink substrate into a production carrier for subsequent production. The transfer carrier and the production carrier are usually not directly interchangeable. Therefore, the power module manufacturer also needs to transfer the ceramic heat sink substrate from the transfer carrier to the production carrier, which adds a transfer link.

[0004] 2. Since the accuracy of the transfer carrier is usually lower than that of the production carrier, there is a problem of not being able to accurately place the ceramic heat dissipation substrate into the production carrier. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a motherboard that does not need to be transferred from a transfer carrier to a production carrier, which can reduce the transfer links and help improve production efficiency.

[0006] The utility model also provides a heat dissipation substrate with a chip made of a template, and a power module comprising the heat dissipation substrate with a chip.

[0007] The motherboard according to the first embodiment of the utility model includes:

[0008] Ceramic layer;

[0009] A first metal layer is disposed on a first side of the ceramic layer, the first metal layer includes a plurality of first metal parts, and the first metal parts are separated by first grooves;

[0010] A second metal layer is disposed on a second side of the ceramic layer, the second side is disposed opposite to the first side, the second metal layer includes a plurality of second metal parts, each of the second metal parts is separated by a second groove part, the second metal part is disposed corresponding to the first metal part, and the second groove part is disposed corresponding to the first groove part;

[0011] A plurality of groups of chips are correspondingly arranged on each of the first metal parts;

[0012] Wherein, the motherboard is configured to be capable of being divided into a plurality of heat dissipation substrates with chips along the first groove portion or the second groove portion, each of the heat dissipation substrates with chips comprising a first metal portion, a group of the chips corresponding to the first metal portion, and the second metal portion corresponding to the first metal portion.

[0013] The motherboard according to the first embodiment of the utility model has at least the following beneficial effects:

[0014] 1. This embodiment does not require the whole board to be split first. The manufacturer of the heat dissipation substrate can directly deliver the whole board without using a dedicated transfer carrier. Conventional packaging boxes or packaging bags can be used for packaging. The manufacturer of the power substrate can also directly mount the chip on the whole board without using a dedicated production carrier. Therefore, the workload of the early transfer can be saved, which helps to improve production efficiency. At the same time, it also avoids the problem that the ceramic heat dissipation substrate cannot be placed in the production carrier due to the different precision of the transfer carrier and the production carrier.

[0015] Second, since there is no need to use a transfer carrier for placement, the space occupied by the transfer carrier can be saved. Under the same area, the motherboard of this embodiment has a higher integration level, that is, it can be divided into more heat dissipation substrates.

[0016] In other embodiments of the present invention, multiple first metal parts and multiple second metal parts are distributed in a rectangular array, the first groove part and the second groove part both include a transverse groove parallel to the width direction of the motherboard, and the first groove part and the second groove part both include a longitudinal groove parallel to the width direction of the motherboard.

[0017] In other embodiments of the present invention, the motherboard is configured to be split into a plurality of heat dissipation substrates along the first groove portion or the second groove portion, including: being cut into a plurality of heat dissipation substrates by a tool along the first groove portion or the second groove portion.

[0018] In other embodiments of the present invention, the motherboard further includes a first supporting layer, wherein the first supporting layer is disposed on the first side of the ceramic layer and surrounds the outer side of the first metal layer;

[0019] And / or, the motherboard further includes a second supporting layer, wherein the second supporting layer is disposed on the second side of the ceramic layer and surrounds the outer side of the second metal layer.

[0020] In other embodiments of the present invention, the motherboard includes the first supporting layer, and the thickness of the first supporting layer is equal to the thickness of the first metal layer;

[0021] And / or, the motherboard includes the second supporting layer, and the thickness of the second supporting layer is equal to the thickness of the second metal layer.

[0022] In other embodiments of the present invention, the motherboard includes the first supporting layer, the first supporting layer has a third groove portion, and the third groove portion is arranged corresponding to the first groove portion;

[0023] And / or, the motherboard includes the second supporting layer, the second supporting layer has a fourth groove portion, and the fourth groove portion is arranged corresponding to the second groove portion.

[0024] According to the second embodiment of the utility model, the heat dissipation substrate with chips is formed by dividing the motherboard along the first groove portion or the second groove portion.

[0025] In other embodiments of the present invention, the heat dissipation substrate is formed by dividing the motherboard along the first groove portion or the second groove portion, including: the heat dissipation substrate is formed by dividing the motherboard along the first groove portion or the second groove portion by a tool.

[0026] In other embodiments of the present invention, the profile arithmetic mean deviation Ra of the side wall surface of the heat dissipation substrate is 0.5 to 1.0 micrometers.

[0027] A power module according to a third embodiment of the present utility model includes the heat dissipation substrate with the chip.

[0028] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0030] Figure 1 A schematic diagram of a process for preparing a ceramic heat dissipation substrate with a chip in the related art;

[0031] Figure 2 A top view of a production carrier for placing a ceramic heat dissipation substrate in the related art;

[0032] Figure 3 for Figure 2 A cross-sectional view of the production vehicle;

[0033] Figure 4 It is a top view of the motherboard in the first embodiment of the utility model;

[0034] Figure 5 for Figure 4Bottom view of the middle motherboard;

[0035] Figure 6 for Figure 4 Side view of the middle motherboard;

[0036] Figure 7 for Figure 4 A magnified schematic diagram of the middle A area;

[0037] Figure 8 for Figure 5 A magnified schematic diagram of the middle B area;

[0038] Fig. 9 for Figure 6 Enlarged schematic diagram of the middle C area;

[0039] Fig.10 A schematic diagram of the process of preparing a heat dissipation substrate with a chip in the utility model;

[0040] Fig.11 It is a top view of a heat dissipation substrate with a chip in the second embodiment of the utility model.

[0041] Reference numerals:

[0042] Ceramic heat dissipation substrate 10;

[0043] Motherboard 100, first metal layer 110, first metal part 111, first groove part 112, fifth groove part 113, second metal layer 120, second metal part 121, second groove part 122, ceramic layer 130, first support layer 140, third groove part 141, second support layer 150, fourth groove part 151, chip 160, silver paste 170, transverse groove 101, longitudinal groove 102;

[0044] Heat dissipation substrate 200 with chip and ceramic part 210;

[0045] Production of vehicles 300;

[0046] Tool 400. DETAILED DESCRIPTION

[0047] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0048] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0049] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0050] In the description of the present utility model, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present utility model based on the specific content of the technical solution.

[0051] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0052] Reference Figure 1 , shows the general process of preparing a ceramic heat dissipation substrate with a chip in a traditional process, which mainly includes the following steps:

[0053] 1. The manufacturer of the heat dissipation substrate separates the ceramic heat dissipation substrate 10 from the whole plate, places a plurality of ceramic heat dissipation substrates 10 on a transfer carrier and delivers them.

[0054] 2. The power module manufacturer transfers the incoming ceramic heat dissipation substrate 10 from the transfer carrier to the production carrier 300 by means of a mechanism such as a vacuum chuck.

[0055] 3. A two-dimensional code is formed on the ceramic heat dissipation substrate 10 by means of a laser coding device.

[0056] Fourth, apply silver paste 170 on the ceramic heat dissipation substrate 10 .

[0057] 5. Mount the chip 160 onto the silver paste 170 .

[0058] 6. Sinter the silver paste 170 to solidify the chip 160 on the ceramic heat dissipation substrate 10 .

[0059] However, there are some problems in the above process, such as:

[0060] 1. The transfer carrier and the production carrier are different carriers. The two have different shapes and structures and are difficult to be compatible. Therefore, the power module manufacturer needs to transfer the ceramic heat dissipation substrate 10 from the transfer carrier to the production carrier. On the one hand, a large number of transfer operations are added, affecting production efficiency. On the other hand, a large number of production carriers need to be prepared, increasing material costs.

[0061] 2. Usually, the transfer carrier is made of plastic through an injection molding process, and its precision is relatively low, that is, the size variation range of the placement hole for placing the ceramic heat dissipation substrate 10 is relatively large, while the production carrier is made of metal through a machining process, and its precision is relatively high, that is, the size variation range of the placement hole for placing the ceramic heat dissipation substrate 10 is relatively small, and the transfer mechanism used for transfer usually only moves between fixed positions and has no correction function. Therefore, in the process of transferring the ceramic heat dissipation substrate 10 from the transfer carrier to the production carrier, there is a problem that the ceramic heat dissipation substrate 10 deviates from the placement hole of the production carrier and cannot be placed normally, affecting the production rhythm.

[0062] 3. Common production vehicles 300 such as Figure 2 , Figure 3 As shown, it includes a plurality of placement holes 310, and the placement holes 310 include an introduction section 311 and a placement section 312 from top to bottom (for easy identification, the approximate areas of the introduction section 311 and the placement section 312 are marked with two dotted boxes in the figure respectively), wherein the cross-sectional area of ​​the introduction section 311 gradually decreases from top to bottom, that is, the area at its entrance is the largest, so that it is easy to introduce the ceramic heat dissipation substrate 10 into the placement hole 310, and the ceramic heat dissipation substrate 10 is finally placed in the placement section 312. When applying silver paste, it is necessary to lift the ceramic heat dissipation substrate 10 upward through a lifting mechanism so that it enters the introduction section 311 from the placement section 312. Although the lifting mechanism is usually equipped with an adsorption hole for adsorbing the ceramic heat dissipation substrate 10, the adsorption force is relatively small. Therefore, during the lifting process, the ceramic heat dissipation substrate 10 may be offset in the introduction section 311 due to vibration and other reasons, resulting in the silver paste printing offset, thereby affecting the subsequent chip 160 mounting.

[0063] Based on the above, the present invention proposes a motherboard 100, which can print silver paste and mount chips in the form of a whole board, so as to at least improve one of the above-mentioned problems. The following will be described in conjunction with the drawings and specific embodiments.

[0064] Reference Figures 4 to 9 ,in Figures 4 to 6 The schematic diagrams respectively show a top view, a bottom view and a side view of the motherboard 100 in the first embodiment of the present invention. Figures 7 to 9 They are Figures 4 to 6 The enlarged schematic diagram of the A area, B area and C area is shown in FIG. Figure 6 and Fig. 9 As shown, the motherboard 100 includes a whole board and a plurality of chips 160. The whole board includes a first metal layer 110, a second metal layer 120 and a ceramic layer 130. The first metal layer 110 is located on a first side of the ceramic layer 130, and the second metal layer 120 is located on a second side of the ceramic layer 130. Fig. 9 As shown in the figure, the first metal layer 110 is located on the upper side of the ceramic layer 130, and the second metal layer 120 is located on the lower side of the ceramic layer 130. The ceramic layer 130 can be made of materials such as silicon nitride, aluminum nitride, aluminum oxide, etc., and the first metal layer 110 and the second metal layer 120 can be made of metals such as copper.

[0065] Reference Figure 4 and Figure 7 , the first metal layer 110 includes a plurality of first metal portions 111. For ease of understanding, Figure 4 and Figure 7 The approximate range of a first metal portion 111 is marked by a dotted frame. As shown in the figure, the first metal portion 111 is approximately rectangular. In some embodiments, the first metal portion 111 includes a single metal structure. In other embodiments, the first metal portion 111 includes multiple metal structures. The metal structures of the same first metal portion 111 are separated by the fifth groove portion 113. Figure 7 As shown, the first metal part 111 includes two metal structures, wherein the metal structure with a relatively larger area is used to connect the chip 160. The first metal parts 111 are separated by the first groove parts 112. According to the arrangement of the first metal parts 111, the first groove parts 112 may include a plurality of transverse grooves, a plurality of longitudinal grooves, or a combination of a plurality of transverse grooves and a plurality of longitudinal grooves.

[0066] Reference Figure 5 and Figure 8 , the second metal layer 120 includes a plurality of second metal portions 121. For ease of understanding, Figure 5 and Figure 8 The dotted line frame in the figure marks the approximate range of a second metal part 121. As shown in the figure, the second metal part 121 is roughly rectangular. The second metal parts 121 are separated by second grooves 122. According to the arrangement of the second metal parts 121, the second grooves 122 may include a plurality of transverse grooves, a plurality of longitudinal grooves, or a combination of a plurality of transverse grooves and a plurality of longitudinal grooves.

[0067] It should be noted that the first metal part 111 and the second metal part 121 are arranged correspondingly. Specifically, the correspondingly arranged first metal part 111 and the second metal part 121 are referred to as the same group of metal parts. A reference plane parallel to the motherboard 100 is established, and the projections of the same group of metal parts in the reference plane at least partially overlap, and the projections of different groups of metal parts in the reference plane do not overlap. More specifically, the projections of the same group of metal parts in the reference plane completely overlap; the first groove part 112 and the second groove part 122 are arranged correspondingly. Specifically, the opposite side of any part of the first groove part 112 has the corresponding part of the second groove part 122, and the opposite side of any part of the second groove part 122 has the corresponding part of the first groove part 112. More specifically, a reference plane parallel to the motherboard 100 is established, and the projection of the first groove part 112 in the reference plane completely overlaps with the projection of the second groove part 122 in the reference plane.

[0068] The motherboard 100 further includes a plurality of groups of chips 160, which are correspondingly disposed on each of the first metal parts 111. A group of chips 160 may include one chip 160 or may include a plurality of chips 160. Figure 7 As shown, a group of chips 160 includes two chips, and the chips in the same group are disposed on the same first metal portion 111 .

[0069] In this embodiment, the motherboard 100 can be divided into multiple heat dissipation substrates 200 with chips along the first groove portion 112 or the second groove portion 122, and each heat dissipation substrate 200 with chips includes a first metal portion 111, a group of chips 160 corresponding to the first metal portion 111, and a second metal portion 121 corresponding to the first metal portion 111.

[0070] Reference Fig.10 , shows the preparation process of the heat dissipation substrate 200 with a chip in this embodiment, which mainly includes the following steps:

[0071] 1. Prepare a whole board having the first metal layer 110, the second metal layer 120 and the ceramic layer 130, and form a barcode on the whole board.

[0072] 2. Printing the silver paste 170 directly on the first metal portion 111 of the first metal layer 110;

[0073] 3. Mount the chip 160 onto the silver paste 170;

[0074] 4. Sintering the entire board carrying the chip 160 to solidify the chip 160 on the first metal part 111, thereby forming the aforementioned motherboard 100;

[0075] 5. Separate a plurality of heat dissipation substrates 200 with chips 160 from the motherboard 100 .

[0076] Based on the above, this embodiment has the following advantages compared with the traditional process:

[0077] 1. In this embodiment, there is no need to split the whole board first. The manufacturer of the heat dissipation substrate can directly deliver the whole board without using a special transfer carrier, and can be packed in a conventional packaging box or packaging bag. The manufacturer of the power substrate can also directly print silver paste and mount the chip on the whole board without using a special production carrier. Therefore, the workload of the early transfer can be saved, which helps to improve production efficiency. At the same time, it also avoids the problem that the ceramic heat dissipation substrate cannot be placed in the production carrier due to the different precision of the transfer carrier and the production carrier.

[0078] Second, the silver paste can be directly printed on the entire board, which can save the step of lifting the heat dissipation substrate from the production carrier, thereby avoiding the problem of the ceramic heat dissipation substrate being offset during the lifting process.

[0079] Third, since there is no need to use a transfer carrier for placement, the space occupied by the transfer carrier can be saved. Under the same area, the motherboard of this embodiment has a higher integration level, that is, it can be divided into more heat dissipation substrates.

[0080] Based on the first embodiment, refer to Figures 4 to 8 In some embodiments of the present invention, the plurality of first metal parts 111 and the plurality of second metal parts 121 are distributed in a rectangular array. Specifically, along the width direction of the motherboard 100, that is, the left-right direction in the figure, the plurality of first metal parts 111 and the plurality of second metal parts 121 are evenly divided into a plurality of columns, and along the length direction of the motherboard 100, that is, the up-down direction in the figure, the plurality of first metal parts 111 and the plurality of second metal parts 121 are evenly divided into a plurality of rows.

[0081] Adapting to the arrangement of the first metal portion 111 and the second metal portion 121 in this embodiment, the first groove portion 112 and the second groove portion 122 both include a transverse groove 101 parallel to the width direction of the motherboard 100, and both include a longitudinal groove 102 parallel to the width direction of the motherboard 100, referring to Figure 4 , Figure 5 The plurality of transverse grooves 101 and the plurality of longitudinal grooves 102 together form a mesh-like separation groove, thereby separating each first metal part 111 from each second metal part 121. Specifically, the distances between adjacent transverse grooves 101 are equal, and the distances between adjacent longitudinal grooves 102 are equal.

[0082] Based on the first embodiment, refer to Fig. 9In some embodiments of the present invention, the first groove 112 passes through the first metal layer 110. For example, the first groove 112 is formed by etching the first metal layer 110. In other embodiments of the present invention, the second groove 122 passes through the second metal layer 120. For example, the second groove 122 is formed by etching the second metal layer 120.

[0083] Based on the first embodiment, refer to Fig.10 In some embodiments of the present invention, the aforementioned “the motherboard 100 is configured to be segmented into a plurality of heat dissipation substrates 200 with chips along the first groove portion 112 or the second groove portion 122” specifically means that the motherboard 100 can be cut into a plurality of ceramic heat dissipation substrates 200 along the first groove portion 112 or the second groove portion 122 by a tool. In the related art, the method of dividing the whole board into multiple ceramic heat dissipation substrates 10 is: first, a series of non-through holes are formed on the whole board by laser, and then the whole board is broken along these holes manually or mechanically to form multiple ceramic heat dissipation substrates 10. However, misalignment is prone to occur during the breaking process, resulting in the size of the ceramic heat dissipation substrate 10 exceeding the standard acceptable range, thereby resulting in a decrease in the yield rate. In addition, the side edges of the ceramic heat dissipation substrate 10 formed in this way are rough and irregular in shape, which is not conducive to the subsequent use of the corners of the ceramic heat dissipation substrate 10 as identification points for chip mounting. In this embodiment, a tool 400 is used to cut the motherboard 100, so that the side edges of the heat dissipation substrate 200 with the chip are smoother, thereby improving the yield rate, and also facilitating the use of the identification point as an auxiliary chip mounting.

[0084] It should be noted that the tool 400 may also be Fig.10 The circular cutter head shown in the figure cuts the mother board 100 by rotating around a horizontal axis. The thickness of the cutter 400 is less than the thickness of the first groove portion 112 or the second groove portion 122, and moves along the center line of the first groove portion 112 or the second groove portion 122 during cutting, thereby avoiding cutting the first metal layer 110 or the second metal layer 120.

[0085] Based on the first embodiment, refer to Figures 4 to 9In some embodiments of the present invention, the motherboard 100 further includes a first support layer 140, which is disposed on a first side of the ceramic layer 130, such as the upper side of the ceramic layer 130, and is disposed around the outer side of the first metal layer 110. In other embodiments, the motherboard 100 further includes a second support layer 150, which is disposed on a second side of the ceramic layer 130, such as the lower side of the ceramic layer 130, and is disposed around the outer side of the second metal layer 120. When printing the silver paste 170 on the whole board, mounting the chip 160, or dividing the motherboard 100, the whole board or the motherboard 100 can be in contact with other mechanisms through the first support layer 140 or the second support layer 150, for example, the whole board or the motherboard 100 is placed on the fixing seat through the second support layer 150, and the pressing structure is pressed against the upper surface of the first support layer 140, so as to achieve the fixing of the whole board or the motherboard 100.

[0086] When the motherboard 100 further includes the first supporting layer 140, Fig. 9 In some embodiments of the present invention, the thickness of the first support layer 140 is equal to the thickness of the first metal layer 110. For example, the first support layer 140 and the first metal layer 110 can be formed from the same metal sheet through an etching process.

[0087] When the motherboard 100 further includes a second supporting layer 150, refer to Fig. 9 In some embodiments of the present invention, the thickness of the second supporting layer 150 is equal to the thickness of the second metal layer 120. For example, the second supporting layer 150 and the second metal layer 120 can be formed from the same metal sheet through an etching process.

[0088] When the motherboard 100 further includes the first supporting layer 140, Fig. 9 In some embodiments of the present invention, the first supporting layer 140 has a third groove portion 141, and the third groove portion 141 is arranged corresponding to the first groove portion 112. For example, the third groove portion 141 is also provided with a plurality of transverse grooves and longitudinal grooves corresponding to the first groove portion 112, and the transverse grooves of the third groove portion 141 are arranged opposite to the transverse grooves of the first groove portion 112, and the longitudinal grooves of the third groove portion 141 are arranged opposite to the longitudinal grooves of the first groove portion 112.

[0089] When the motherboard 100 further includes a second supporting layer 150, refer to Fig. 9 In some embodiments of the present invention, the second supporting layer 150 has a fourth groove portion 151, and the fourth groove portion 151 is arranged corresponding to the second groove portion 122. For example, the fourth groove portion 151 is also provided with a plurality of transverse grooves and longitudinal grooves corresponding to the second groove portion 122, and the transverse grooves of the fourth groove portion 151 are arranged opposite to the transverse grooves of the second groove portion 122, and the longitudinal grooves of the fourth groove portion 151 are arranged opposite to the longitudinal grooves of the second groove portion 122.

[0090] Based on the above, when using a tool to cut the motherboard 100, the tool 400 can first cut from the third groove 141 or the fourth groove 151, and then enter the corresponding first groove 112 or the second groove 122, thereby avoiding the tool 400 from cutting into the first support layer 140 or the second support layer 150, and reducing the loss of the tool 400.

[0091] The second embodiment of the present invention also provides a heat dissipation substrate 200 with a chip, which is formed by dividing the motherboard in the above embodiments along the first groove portion 112 or the second groove portion 122. Fig.11 The heat dissipation substrate 200 with chip includes a first metal part 111, a second metal part 121 and a ceramic part 210 located between the first metal part 111 and the second metal part 121, wherein the ceramic part 210 is formed by dividing the ceramic layer 130 on the motherboard 100. The chip 160 is disposed on the first metal part 111.

[0092] Based on the second embodiment, refer to Fig.10 In some embodiments of the present invention, the aforementioned “the motherboard 100 is configured to be divided into a plurality of heat dissipation substrates 200 with chips along the first groove 112 or the second groove 122” specifically means that the motherboard 100 can be cut into a plurality of ceramic heat dissipation substrates 200 along the first groove 112 or the second groove 122 by a cutter. In this embodiment, the cutter 400 is used to cut the motherboard 100, so that the side of the heat dissipation substrate 200 with chips is smoother, so as to facilitate the chip mounting as an identification point.

[0093] Based on the second embodiment, refer to Fig.10 In some embodiments of the utility model, the arithmetic mean deviation Ra of the contour of the side wall surface of the heat dissipation substrate 200 with the chip is 0.5 to 1.0 microns, while for the ceramic heat dissipation substrate formed by laser drilling combined with breaking, the arithmetic mean deviation Ra of the contour of the side wall surface is 2.3 to 2.8 microns. It can be seen that the surface roughness of the side wall surface of the heat dissipation substrate 200 in this embodiment is lower, that is, the side wall surface is smoother, so that it is convenient to use the corners as identification points to assist in the mounting of the chip 160.

[0094] The third embodiment of the utility model further proposes a power module, which includes a molded body and a heat dissipation substrate 200 with a chip in the aforementioned embodiments, wherein the molded body is coated on the outside of the heat dissipation substrate 200, specifically, the chip 160, the first metal part 111 and the ceramic part 210 are all completely coated in the molded body, and the surface of the second metal part 121 away from the ceramic part 210 is exposed on the outside of the molded body, so that the heat generated by the chip 160 can be transferred to the outside through the first metal part 111, the ceramic part 210 and the second metal part 121, thereby realizing the heat dissipation of the chip 160.

[0095] The embodiments of the utility model are described in detail above in conjunction with the accompanying drawings, but the utility model is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the utility model. In addition, the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A motherboard, characterized in that: include: Ceramic layer; A first metal layer is disposed on a first side of the ceramic layer, the first metal layer includes a plurality of first metal parts, and the first metal parts are separated by first grooves; A second metal layer is disposed on a second side of the ceramic layer, the second side is disposed opposite to the first side, the second metal layer includes a plurality of second metal parts, each of the second metal parts is separated by a second groove part, the second metal part is disposed corresponding to the first metal part, and the second groove part is disposed corresponding to the first groove part; A plurality of groups of chips are correspondingly arranged on each of the first metal parts; Wherein, the motherboard is configured to be capable of being divided into a plurality of heat dissipation substrates with chips along the first groove portion or the second groove portion, each of the heat dissipation substrates with chips comprising a first metal portion, a group of the chips corresponding to the first metal portion, and the second metal portion corresponding to the first metal portion.

2. The motherboard according to claim 1, characterized in that: The first metal parts and the second metal parts are distributed in a rectangular array, the first groove part and the second groove part both include a transverse groove parallel to the width direction of the motherboard, and the first groove part and the second groove part both include a longitudinal groove parallel to the width direction of the motherboard.

3. The motherboard according to claim 1, characterized in that: The motherboard is configured to be split into a plurality of heat dissipation substrates along the first groove portion or the second groove portion, including being able to be cut into the plurality of heat dissipation substrates by a cutter along the first groove portion or the second groove portion.

4. The motherboard according to claim 1, characterized in that: The motherboard further includes a first supporting layer, which is disposed on the first side of the ceramic layer and surrounds the outer side of the first metal layer; And / or, the motherboard further includes a second supporting layer, wherein the second supporting layer is disposed on the second side of the ceramic layer and surrounds the outer side of the second metal layer.

5. The motherboard according to claim 4, characterized in that: The motherboard includes the first supporting layer, and the thickness of the first supporting layer is equal to the thickness of the first metal layer; And / or, the motherboard includes the second supporting layer, and the thickness of the second supporting layer is equal to the thickness of the second metal layer.

6. The motherboard according to claim 4, characterized in that: The motherboard includes the first supporting layer, the first supporting layer has a third groove portion, and the third groove portion is arranged corresponding to the first groove portion; And / or, the motherboard includes the second supporting layer, the second supporting layer has a fourth groove portion, and the fourth groove portion is arranged corresponding to the second groove portion.

7. A heat dissipation substrate with a chip, characterized in that: The motherboard according to any one of claims 1 to 6 is divided along the first groove portion or the second groove portion.

8. The heat dissipation substrate with chip according to claim 7, characterized in that: The heat dissipation substrate is formed by dividing the motherboard along the first groove portion or the second groove portion, comprising: the heat dissipation substrate is formed by dividing the motherboard along the first groove portion or the second groove portion by a cutter.

9. The heat dissipation substrate with chip according to claim 7, characterized in that: The profile arithmetic mean deviation Ra of the side wall surface of the heat dissipation substrate is 0.5 to 1.0 micrometers.

10. A power module, characterized in that: A heat dissipation substrate with a chip comprising any one of claims 7 to 9.

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