Substrate mounting structure of small-size switching power supply
By adopting a multi-layer substrate installation structure and optimizing heat dissipation design in small-sized switching power supplies, the problems of tight substrate layout and design difficulty in the prior art are solved, and higher space utilization and heat dissipation efficiency are achieved.
Patent Information
- Application Number
- CN202420878638.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-25
AI Technical Summary
The existing small-size power modules use PCB as the substrate and adopt a planar layout, which leads to a tight layout of power devices and control circuits, increasing the design difficulty.
A multi-layer substrate installation structure is adopted, including a switching power supply housing, an HTCC substrate and a number of vertically arranged PCB substrates. The double-sided installation of the device is achieved through the connector and extension, increasing space utilization and optimizing heat dissipation.
By optimizing the substrate layout and heat dissipation structure, the space utilization and heat dissipation efficiency are improved, and the design difficulty is reduced.
Smart Images
Figure CN222465011U_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of switching power supplies, and in particular to a substrate mounting structure of a small-size switching power supply. Background Art
[0002] A switching power supply is a power supply that uses modern power electronics technology to control the on-off time ratio of the switch tube to maintain a stable output voltage. A switching power supply is generally composed of a pulse width modulation (PWM) control IC and a MOSFET. With the development and innovation of power electronics technology, switching power supply technology is also constantly innovating. At present, switching power supplies are widely used in almost all electronic devices due to their small size, light weight and high efficiency. They are an indispensable power supply method for the rapid development of today's electronic information industry.
[0003] At present, as the output power of small-size power modules continues to increase, the size of power devices has also increased. However, existing small-size power modules are still implemented in a planar layout using PCB as the substrate, which leads to tight layout of power devices and control circuits and increases the difficulty of design. Summary of the invention
[0004] The present invention provides a substrate mounting structure for a small-sized switching power supply, aiming to solve the problem that the existing small-sized power supply modules in the related art are all implemented in a planar layout manner using a PCB as a substrate, which results in a tight layout of power devices and control circuits and increases the difficulty of design.
[0005] The substrate mounting structure of a small-size switching power supply of the present invention comprises: a switching power supply housing; a fourth substrate, which is arranged in the switching power supply housing; a first substrate and a second substrate, which are both vertically arranged on the fourth substrate; a third substrate, which is arranged between the first substrate and the second substrate, and there is a space between the third substrate and the fourth substrate for mounting devices, and devices can be mounted on both sides of the first substrate, the second substrate and the third substrate.
[0006] Furthermore, the first substrate has a first docking point, and the second substrate has a second docking point.
[0007] Furthermore, the first substrate and the second substrate both have a first connecting member, and the first connecting member includes a first connecting portion and a second connecting portion.
[0008] Furthermore, the second connection parts on the first substrate are fixed on the first substrate in two rows, and the two rows of the second connection parts are respectively arranged on the upper and lower sides of the first docking point.
[0009] Furthermore, both ends of the third substrate have extension parts, and the two extension parts can be inserted into the first docking point and the second docking point respectively.
[0010] Furthermore, second connecting members are installed on both upper and lower sides of the two extending portions, and the second connecting members on the first substrate and the second substrate are respectively soldered to the second connecting members on the two extending portions.
[0011] Furthermore, the fourth substrate is fixed to the inner bottom wall of the switching power supply housing, and the fourth substrate is a HTCC substrate.
[0012] Furthermore, the switching power supply housing is made of aluminum material.
[0013] The beneficial effect is: through the installation method of the first substrate, the second substrate and the third substrate, a larger space is provided between the second substrate and the fourth substrate after installation, and combined with the metal switching power supply housing and the fourth substrate, the heat dissipation efficiency is improved, and the first substrate, the second substrate and the third substrate can all be used to place devices on both sides, thereby improving space utilization. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a schematic diagram of the structure of the switching power supply housing in an embodiment of the present invention.
[0015] Figure 2 Schematic diagram of the structure of the first substrate in an embodiment of the present invention.
[0016] Figure 3 Schematic diagram of the structure of the third substrate in the embodiment of the present invention.
[0017] Reference numerals:
[0018] 10. Switch power supply housing; 11. First substrate; 111. First docking point; 112. First connecting portion; 113. Second connecting portion; 12. Second substrate; 121. Second docking point; 13. Third substrate; 131. Extension portion; 132. Second connecting member; 14. Fourth substrate. DETAILED DESCRIPTION
[0019] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to be used to explain the present invention, but should not be understood as limiting the present invention.
[0020] like Figures 1 to 3 As shown, the substrate mounting structure of the small-size switching power supply of the present invention comprises
[0021] like Figure 1As shown, the switch power supply housing 10 (a cover plate is also provided in the switch power supply housing 10, which is not shown in the figure) and the first substrate 11, the second substrate 12, the third substrate 13 and the fourth substrate 14 provided in the switch power supply housing 10, wherein the first substrate 11, the second substrate 12 and the third substrate 13 are provided on the fourth substrate 14, and the installation structure of the first substrate 11, the second substrate 12, the third substrate 13 and the fourth substrate 14 is optimized, the layout rationality is reasonably planned, and the space utilization rate of the power module is improved. At the same time, the heat dissipation of the electrical components is optimized and improved.
[0022] In one embodiment, the fourth substrate 14 is fixed to the inner bottom wall of the switching power supply housing 10 , and the fourth substrate 14 is fixed to the switching power supply housing 10 by welding.
[0023] In one embodiment, the fourth substrate 14 is a HTCC substrate or a DPC substrate, and the HTCC substrate refers to a high temperature co-fired ceramic substrate. The HTCC substrate is a special type of circuit board, which is usually used in applications under high temperature environments and has excellent thermal stability and high temperature resistance. The HTCC substrate is usually composed of multiple layers of ceramic sheets, each layer having conductive paths and electronic components. These ceramic layers are co-fired into one body under high temperature conditions to form a strong and stable structure. Between each layer of ceramic, the wires of each layer can be connected through holes or metallized through holes to achieve circuit connection. The HTCC substrate can work in a high temperature environment and can usually withstand temperatures of hundreds of degrees Celsius, so it is very suitable for high temperature application scenarios. Ceramic materials have good thermal conductivity, can effectively dissipate heat, and help maintain a stable operating temperature of circuit components. And the use of ceramic materials has good corrosion resistance, which can resist the erosion of chemicals and humidity to the circuit, and improve the reliability and stability of the circuit.
[0024] In one embodiment, DPC, also known as direct copper plated ceramic substrate, consists of two parts: ceramic substrate and wiring metal layer. The packaging substrate plays a key role in connecting the upper and lower parts and connecting the internal and external heat dissipation channels, while also having functions such as electrical interconnection and mechanical support. Ceramics have high thermal conductivity, good heat resistance, high mechanical strength, and low thermal expansion coefficient, and are commonly used substrate materials for power semiconductor device packaging.
[0025] In one embodiment, the switch power supply housing 10 is made of metal material, such as a steel housing or an aluminum housing. The steel housing or the aluminum housing can make the switch power supply housing 10 have a better heat dissipation effect on the internal heat. The HTCC substrate and the metallic switch power supply housing 10 are matched to improve the heat dissipation effect on the electrical components.
[0026] In one embodiment, the first substrate 11, the second substrate 12, and the third substrate 13 are all disposed on the fourth substrate 14. Specifically, the first substrate 11 and the second substrate 12 are vertically mounted on the fourth substrate 14 along the vertical direction. The first substrate 11 and the second substrate 12 are of the same size, and the first substrate 11 and the second substrate 12 are disposed in parallel, and the second substrate 12 is located directly to the right of the first substrate 11.
[0027] In one embodiment, the first substrate 11, the second substrate 12, and the third substrate 13 are all PCB double substrates. The PCB substrate is a basic component for supporting and connecting electronic components, usually made of insulating material, covered with a conductive layer, and used for arranging and connecting electronic components. The PCB double-sided board has two sides covered with a conductive layer, usually copper foil. Circuit connections and layouts are formed on each side. The electronic components on the double-sided board can be installed on both sides at the same time, and the circuits are connected through through holes or by surface assembly technology. Double-sided boards are usually used for electronic devices of medium complexity, can provide higher circuit density and performance, and are suitable for more complex circuit designs.
[0028] like Figure 2 and Figure 3 As shown, in one embodiment, a first docking point 111 and a second docking point 121 are respectively provided on the first substrate 11 and the second substrate 12, which are used to mount the third substrate 13 and interconnect the circuits among the first substrate 11, the second substrate 12 and the third substrate 13. It should be noted that the first docking point 111 and the second docking point 121 are at the same height from the fourth substrate 14, and the first docking point 111 and the second docking point 121 are the same in size.
[0029] In one embodiment, both the first substrate 11 and the second substrate 12 have a first connector, the first connector includes a first connector 112 and a second connector 113, the second connector 113 on the first substrate 11 is divided into two rows and fixed on the first substrate 11, and the two rows of second connectors 113 are respectively arranged on the upper and lower sides of the first docking point 111, the first connector 112 is arranged below one side of the first substrate 11, and the sides of the two rows of second connectors 113 that want to be close are respectively flush with the upper bottom wall and the lower bottom wall of the first docking point 111. At the same time, the first connector on the second substrate 12 is arranged in the same position. And the first connector 112 and the HTCC substrate are soldered together.
[0030] In one embodiment, both ends of the third substrate 13 have extensions 131, and the two extensions 131 can be inserted into the first docking point 111 and the second docking point 121 respectively. The upper and lower sides of the two extensions 131 are installed with second connectors 132, so that the upper and lower extensions 131 can be respectively attached to the upper bottom wall and the lower bottom wall of the first docking point 111, so that the third substrate 13 can be installed between the first substrate 11 and the second substrate 12, and then the second connectors 113 on the first substrate 11 and the second substrate 12 are respectively soldered to the second connectors 132 on the two extensions 131 to complete the installation of the first substrate 11, the second substrate 12 and the third substrate 13. After installation, there is a large space between the second substrate 12 and the fourth substrate 14, and the first substrate 11, the second substrate 12 and the third substrate 13 can all be placed on both sides of the device, thereby improving the space utilization rate.
[0031] In one embodiment, a plurality of third substrates 13 may be arranged between the first substrate 11 and the second substrate 12 according to the upper step, and the plurality of third substrates 13 may be arranged in sequence from top to bottom. The third substrate 13 may be added later according to demand and actual conditions to reasonably utilize the space.
[0032] It should be noted that the remaining free space on the fourth substrate 14 is used to install other large-volume components (such as Figure 1 The remaining space of the fourth substrate 14 shown in the figure) is used for the transformer and the magnetic core. Therefore, the present invention can install more components with a smaller remaining occupied area, thereby improving the space utilization.
[0033] In the description of the present invention, it is to be understood that the terms “center”, “longitudinal”, “lateral”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.
[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0035] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.
Claims
1. A substrate mounting structure for a small-size switching power supply, characterized in that: Switching power supply housing (10); A fourth substrate (14) is arranged in the switching power supply housing (10); The first substrate (11) and the second substrate (12) are both vertically arranged on the fourth substrate (14); The third substrate (13) is arranged between the first substrate (11) and the second substrate (12); a space for mounting devices is provided between the third substrate (13) and the fourth substrate (14); devices can be mounted on both sides of the first substrate (11), the second substrate (12) and the third substrate (13).
2. The substrate mounting structure of a small-size switching power supply according to claim 1, characterized in that: The first substrate (11) has a first docking point (111), and the second substrate (12) has a second docking point (121).
3. The substrate mounting structure of a small-size switching power supply according to claim 2, characterized in that: The first substrate (11) and the second substrate (12) both have a first connecting member, wherein the first connecting member comprises a first connecting portion (112) and a second connecting portion (113).
4. The substrate mounting structure of a small-size switching power supply according to claim 3, characterized in that: The second connection parts (113) on the first substrate (11) are divided into two rows and fixed on the first substrate (11), and the two rows of the second connection parts (113) are respectively arranged on the upper and lower sides of the first docking point (111).
5. The substrate mounting structure of a small-size switching power supply according to claim 3, characterized in that: Both ends of the third substrate (13) have extension parts (131), and the two extension parts (131) can be inserted into the first docking point (111) and the second docking point (121) respectively.
6. The substrate mounting structure of a small-size switching power supply according to claim 5, characterized in that: Second connecting parts (132) are installed on both upper and lower sides of the two extension parts (131), and the second connecting parts (113) on the first substrate (11) and the second substrate (12) are respectively soldered to the second connecting parts (132) on the two extension parts (131) by tinning.
7. The substrate mounting structure of a small-size switching power supply according to claim 1, characterized in that: The fourth substrate (14) is fixed to the inner bottom wall of the switching power supply housing (10), and the fourth substrate (14) is a HTCC substrate.
8. The substrate mounting structure of a small-size switching power supply according to any one of claims 1 to 7, characterized in that: The switch power supply housing (10) is made of aluminum material.