Heat dissipation structure and charger
By setting up anti-spill belts on the substrate of the new energy vehicle vehicle charger, the partition welding surface is formed into a welding area and a coating area, the problem of overflow of the thermal medium is solved, and the welding effect and thermal conductivity are improved.
Patent Information
- Application Number
- CN202420986577.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-08
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-05-08
AI Technical Summary
In existing new energy vehicle vehicle chargers, the glue coating process between the substrate and the heat dissipation plate cannot effectively control the overflow direction and overflow amount of the heat conducting medium, affecting the welding effect.
By providing an anti-spill belt on the welding surface of the substrate, the welding surface is partitioned into a welding area and a coating area to prevent the heat conducting medium from overflowing from the coating area to the welding area.
It effectively avoids overflow of heat-conducting medium, ensures the welding effect between the substrate and the heat-dissipation plate, and improves the coverage quality of the heat-conducting medium, ensuring the heat-dissipation effect of the substrate.
Smart Images
Figure CN222465154U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of new energy vehicles, and in particular to a heat dissipation structure and a charger. Background Art
[0002] As countries continue to put forward higher requirements for energy utilization and environmental protection, new energy vehicles have entered a period of rapid development, and all countries are vigorously carrying out technical research and development of charger products. The gluing process design between the substrate and the heat sink has an important impact on the heat dissipation and fixing method of the substrate, and is crucial to the function and quality of the product assembly.
[0003] In the related technology, the glue coating process between the substrate and the heat sink in the on-board charger of new energy vehicles is as follows: Figure 1 As shown, a heat-conducting medium is filled between the substrate and the heat sink, and then the substrate and the heat sink are fixed together by laser welding to achieve fixation and heat dissipation of the substrate. In order to prevent the overflow of the heat-conducting medium from affecting welding, an overflow groove is left on the lower side of the heat sink, and the coating area and amount of the heat-conducting medium are controlled at the same time.
[0004] The inventors found in their research that the solutions in the related art have at least the following defects:
[0005] The glue overflow groove located under the heat sink cannot effectively control the overflow direction and amount of the thermal conductive medium. Overflow on the upper side and both sides will affect welding. Summary of the invention
[0006] In view of the above shortcomings of the prior art, the purpose of the utility model is to provide a heat dissipation structure and a charger. The heat dissipation structure can separate the welding surface of the substrate into a welding area for welding and a coating area for coating a heat-conducting medium by setting an anti-overflow belt, which can prevent the heat-conducting medium from overflowing from the coating area into the welding area, thereby ensuring the welding effect of the substrate and the heat dissipation plate.
[0007] The utility model embodiment discloses a heat dissipation structure, which includes a substrate, a heat dissipation plate, a heat conducting medium and an anti-overflow belt;
[0008] The anti-overflow belt is arranged on the welding surface of the substrate, and the anti-overflow belt can separate the welding surface into a welding area located outside the anti-overflow belt and a coating area located inside the anti-overflow belt;
[0009] The heat-conducting medium is filled between the substrate and the heat-dissipating plate and is located in the coating area;
[0010] The base plate is welded to the heat sink through the welding area.
[0011] Furthermore, there are a plurality of anti-overflow belts, and a gap for forming an overflow area is provided between two adjacent anti-overflow belts.
[0012] Furthermore, the heat dissipation plate is an "L"-shaped plate structure, and a glue overflow groove is provided at a corner of the heat dissipation plate, and one side of the substrate is close to the glue overflow groove.
[0013] Furthermore, there are multiple glue overflow areas, and the glue overflow direction corresponding to the glue overflow groove is different from the glue overflow direction corresponding to any glue overflow area.
[0014] Furthermore, the sizes of the plurality of anti-overflow tapes are not completely the same.
[0015] Furthermore, the substrate is a square plate-shaped structure, and the number of anti-overflow bands located in the length direction of the substrate is less than the number of anti-overflow bands located in the width direction of the substrate.
[0016] Furthermore, the substrate includes an aluminum substrate or a copper substrate.
[0017] Further, the anti-overflow tape comprises a foam tape.
[0018] Furthermore, the other side of the anti-overflow tape facing away from the base plate is adhered to the heat dissipation plate.
[0019] The embodiment of the utility model also discloses a charger, comprising the above-mentioned heat dissipation structure.
[0020] The heat dissipation structure provided by the utility model has the following beneficial effects, including but not limited to:
[0021] 1) The heat dissipation structure can separate the welding surface of the substrate into a welding area for welding and a coating area for coating the heat-conducting medium by setting the anti-overflow belt, which can prevent the heat-conducting medium from overflowing from the coating area into the welding area, thereby ensuring the welding effect between the substrate and the heat dissipation plate;
[0022] 2) In the heat dissipation structure, the glue overflow area formed between two adjacent anti-overflow belts is convenient for controlling the generation of glue overflow parts. At the same time, it can avoid mutual interference with the welding area, accurately preventing glue overflow while ensuring the welding effect;
[0023] 3) In this heat dissipation structure, the coating area and the welding area are divided by the anti-overflow belt, which can avoid excessive control of the coating position and coating amount of the thermal conductive medium, thereby avoiding the occurrence of too little coating amount, and then the thermal conductive medium can be effectively covered in the coating area to ensure the heat dissipation effect of the substrate. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] This specification will be further described in the form of exemplary embodiments, which will be described in detail by the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:
[0025] Figure 1 A schematic diagram of a heat dissipation structure provided for related technologies;
[0026] Figure 2 A schematic diagram of the heat dissipation structure provided by an embodiment of the utility model;
[0027] Figure 3 A schematic diagram of the structure of a substrate provided in an embodiment of the utility model;
[0028] Figure 4 This is a front view of the welding surface of the substrate provided in an embodiment of the utility model.
[0029] Icon: 100-heat dissipation structure;
[0030] 10-substrate; 101-welding surface; 1011-welding area; 1012-coating area; 1013-glue overflow area;
[0031] 11- heat sink; 111- glue overflow groove;
[0032] 12- Spill prevention tape. DETAILED DESCRIPTION
[0033] The following describes the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.
[0034] It should be noted that the illustrations provided in the following embodiments are only used to schematically illustrate the basic concept of the present invention, and thus the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0035] like Figure 1 As shown, in the related technology, a heat-conducting medium is filled between the substrate and the heat sink, and then the substrate and the heat sink are fixed together by laser welding to achieve fixation and heat dissipation of the substrate. In order to prevent the overflow of the heat-conducting medium from affecting welding, an overflow groove is left on the lower side of the heat sink, and the coating area and amount of the heat-conducting medium are controlled at the same time.
[0036] It is understandable that the related art has at least the following defects:
[0037] 1) The overflow groove on the lower side cannot effectively control the overflow direction and amount of the thermal conductive medium. Overflow on the upper side (the side away from the overflow groove in the figure) and both sides (the left and right sides of the overflow groove in the figure) will affect welding;
[0038] 2) Controlling the thermal conductive medium coating area cannot accurately prevent glue overflow, and the glue overflow area will still appear randomly;
[0039] 3) Controlling the coating amount will result in the thermal conductive medium being unable to effectively cover the heat dissipation area of the aluminum substrate, while the small amount of glue will affect the heat dissipation effect.
[0040] Please refer to Figure 2-Figure 4 . The utility model provides a heat dissipation structure 100, which includes a substrate 10, a heat sink 11, a heat-conducting medium (not shown in the figure) and an anti-overflow belt 12; the anti-overflow belt 12 is arranged on the welding surface 101 of the substrate 10, and the anti-overflow belt 12 can separate the welding surface 101 to form a welding area 1011 located on the outside of the anti-overflow belt 12 (the side away from the center point of the substrate 10) and a coating area 1012 located on the inside of the anti-overflow belt 12 (the side close to the center point of the substrate 10); the heat-conducting medium is filled between the substrate 10 and the heat sink 11, and is located in the coating area 1012; the substrate 10 is welded to the heat sink 11 through the welding area 1011. It can be understood that the welding surface 101 of the substrate 10, that is, the side of the substrate 10 close to the heat sink 11, can be connected to each other by welding to the heat sink 11.
[0041] It is worth noting that the heat dissipation structure 100 can separate the welding surface 101 of the substrate 10 to form a welding area 1011 for welding and a coating area 1012 for coating a heat-conducting medium through the setting of the overflow prevention belt 12, which can prevent the heat-conducting medium from overflowing from the coating area 1012 into the welding area 1011, thereby ensuring the welding effect of the substrate 10 and the heat dissipation plate 11. At the same time, the heat dissipation structure 100 can avoid excessive control of the coating position and coating amount of the heat-conducting medium by dividing the coating area 1012 and the welding area 1011 through the overflow prevention belt 12, thereby avoiding the occurrence of too little coating, so that the heat-conducting medium can effectively cover the coating area 1012, thereby ensuring the heat dissipation effect of the substrate 10.
[0042] It is also worth noting that the heat conducting medium in this embodiment may be a heat conducting adhesive.
[0043] Please refer again Figure 3 There are a plurality of anti-overflow belts 12 , and a gap for forming an overflow glue area 1013 is provided between two adjacent anti-overflow belts 12 .
[0044] It is worth mentioning that in the heat dissipation structure 100, the glue overflow area 1013 formed between two adjacent anti-overflow belts 12 is convenient for controlling the generation of glue overflow parts. At the same time, it can avoid mutual interference with the welding area 1011, thereby accurately preventing glue overflow and ensuring the welding effect.
[0045] Please follow again Figure 2 The heat dissipation plate 11 is an “L”-shaped plate structure, and a glue overflow groove 111 is provided at a corner of the heat dissipation plate 11 , and one side of the substrate 10 is close to the glue overflow groove 111 .
[0046] It is worth noting that the structural setting of the heat sink 11 does not require any structural changes to the existing heat sink 11, which can reasonably save production costs and avoid excessive adjustments to the production line. In addition, compared with the overflow area 1013 only set on the welding surface 101, the overflow amount of the overflow groove 111 is determined by the length and depth of the overflow groove 111, and thus it can provide more overflow space to further ensure the final welding effect.
[0047] In this embodiment, there are multiple glue overflow areas 1013, and the glue overflow direction corresponding to the glue overflow groove 111 is different from the glue overflow direction corresponding to any glue overflow area 1013.
[0048] It is worth noting that by setting the overflowing glue grooves 111 and overflowing glue areas 1013 in different directions, the overflowing glue can be evenly processed. At the same time, different overflowing glue directions can cover more different directions, which can process overflowing glue in multiple areas at the same time, improve production efficiency, and make the process smoother.
[0049] Please refer again Figure 4 , the sizes of the multiple anti-overflow belts 12 are not exactly the same.
[0050] It is worth noting that the anti-overflow belts 12 of different sizes can be designed and arranged for different parts or different requirements, so that the arrangement of the overflow area 1013 is more flexible and adaptable to different structures and requirements. In addition, the anti-overflow belts 12 of different sizes can be further optimized in the division of the welding area 1011 and the coating area 1012, so that the boundary between the welding area 1011 and the coating area 1012 is clearer and more precise.
[0051] In this embodiment, the substrate 10 is a square plate-shaped structure, and the number of the anti-overflow bands 12 located in the length direction of the substrate 10 is less than the number of the anti-overflow bands 12 located in the width direction of the substrate 10 .
[0052] It is worth noting that different numbers of overflow prevention bands 12 can provide flexible welding layout options. According to different needs and design requirements, more free adjustments can be made in the width and length directions to meet different heat dissipation and connection requirements. In this embodiment, the number of overflow prevention bands 12 located in the length direction of the substrate 10 is less than the number of overflow prevention bands 12 located in the width direction of the substrate 10. Figure 4 It can be seen that the length of the anti-overflow belt 12 in the length direction is longer, and the number of the overflow glue areas 1013 formed therein is less than that in the width direction, so that it can further reduce the influence of the overflow glue areas 1013 on welding while ensuring the anti-overflow glue effect.
[0053] It is also worth noting that in one implementation of this embodiment, the number of anti-overflow tapes 12 located in the length direction of the substrate 10 is 1, and the number of anti-overflow tapes 12 located in the width direction of the substrate 10 is 4 (two on each side). Depending on the specific implementation environment, the number of anti-overflow tapes 12 in the length direction of the substrate 10 may also be 2 or other numbers, and the number of anti-overflow tapes 12 in the width direction of the substrate 10 may also be 6, 8, or other numbers. This embodiment does not constitute a limitation on the specific number, but is only an example of the relationship between the numbers.
[0054] In this embodiment, the substrate 10 includes an aluminum substrate 10 or a copper substrate 10. It is understood that the metal substrate 10 has good thermal conductivity and mechanical strength, and is suitable for chargers that require higher power and heat dissipation performance. Depending on the specific implementation environment, the substrate 10 may also be made of nickel or other materials, and this embodiment does not constitute a limitation on its specific material.
[0055] In this embodiment, the anti-overflow tape 12 comprises a foam tape.
[0056] It is worth noting that the foam tape has good stability and durability, and has viscoelasticity, and can achieve good adhesion with the metal surface, making it convenient to paste with the substrate 10 and ensure that it will not fall off during the pressing process. Depending on the specific implementation, double-sided tape or other thinner materials can also be used for paste anti-overflow glue.
[0057] In this embodiment, the other side of the anti-overflow tape 12 facing away from the substrate 10 is adhered to the heat dissipation plate 11 .
[0058] It is worth mentioning that the foam tape has good compressibility. A foam tape of appropriate thickness can be compressed by a pressing tool to meet the welding gap requirements. At the same time, it can contact the substrate 10 and the heat sink 11 on both sides, thereby effectively blocking the overflow of the heat-conducting medium, achieving a better anti-overflow glue effect, and ensuring the welding quality.
[0059] In one implementation of this embodiment, the heat dissipation structure 100 may be connected and fixed by using the following steps:
[0060] A foam tape is pasted on the welding surface 101 of the substrate 10 coated with the heat-conducting medium, and a glue overflow area 1013 is left; a heat-conducting medium is coated on the coating area of the substrate 10; Figure 2 As shown, the substrate 10 and the heat sink 11 are pressed together by a pressing tool, and then the welding area 1011 is welded by laser welding to achieve connection and fixation of the substrate 10 and the heat sink 11.
[0061] This embodiment also provides a charger, including the above-mentioned heat dissipation structure 100, having all its beneficial effects.
[0062] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.
[0063] In the description herein, many specific details, such as examples of components and / or methods, are provided to provide a complete understanding of the embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more specific details or by other devices, systems, components, methods, components, materials, parts, etc. In other cases, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of the embodiments of the present invention.
[0064] References throughout the specification to "one embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention, and not necessarily in all embodiments. Thus, various appearances of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. In addition, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments of the present invention described herein and shown may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.
[0065] It should also be understood that one or more of the elements shown in the figures may also be implemented in a more separate or more integrated manner, or even removed because they are inoperable in certain circumstances or provided because they may be useful depending on the application.
[0066] In addition, unless otherwise explicitly indicated, any marking arrows in the drawings should be regarded as exemplary only and not limiting. In addition, unless otherwise indicated, the term "or" used herein is generally intended to mean "and / or". In the case where the term is not clear because it is anticipated that the ability to separate or combine is provided, the combination of components or steps will also be regarded as indicated.
[0067] As used in the description herein and throughout the claims that follow, "a", "an", and "the" include plural references unless otherwise indicated. Likewise, as used in the description herein and throughout the claims that follow, the meaning of "in" includes "in" and "on" unless otherwise indicated.
[0068] The above description of the illustrated embodiments of the present invention (including the contents in the abstract of the specification) is not intended to be an exhaustive list or to limit the present invention to the precise form disclosed herein. Although specific embodiments of the present invention and examples of the present invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention as will be recognized and understood by those skilled in the art. As noted, these modifications may be made to the present invention in accordance with the above description of the embodiments of the present invention, and these modifications will be within the spirit and scope of the present invention.
[0069] Systems and methods have been generally described herein as details that are helpful for understanding the present invention. In addition, various specific details have been given to provide an overall understanding of the embodiments of the present invention. However, those skilled in the relevant art will recognize that the embodiments of the present invention can be practiced without one or more specific details, or practiced using other devices, systems, accessories, methods, components, materials, parts, etc. In other cases, well-known structures, materials, and / or operations are not specifically shown or described in detail to avoid confusion with various aspects of the embodiments of the present invention.
Claims
1. A heat dissipation structure, characterized in that: Including substrate, heat sink, heat conducting medium and anti-overflow tape; The anti-overflow belt is arranged on the welding surface of the substrate, and the anti-overflow belt can separate the welding surface into a welding area located outside the anti-overflow belt and a coating area located inside the anti-overflow belt; The heat-conducting medium is filled between the substrate and the heat dissipation plate and is located in the coating area; The substrate is welded to the heat sink through the welding area.
2. The heat dissipation structure according to claim 1, characterized in that: There are a plurality of anti-overflow belts, and a gap for forming an overflowing glue area is provided between two adjacent anti-overflow belts.
3. The heat dissipation structure according to claim 2, characterized in that: The heat dissipation plate is an "L"-shaped plate structure, and a glue overflow groove is provided at a corner of the heat dissipation plate, and one side of the substrate is close to the glue overflow groove.
4. The heat dissipation structure according to claim 3, characterized in that: There are multiple glue overflow areas, and the glue overflow direction corresponding to the glue overflow groove is different from the glue overflow direction corresponding to any of the glue overflow areas.
5. The heat dissipation structure according to claim 2, characterized in that: The sizes of the plurality of anti-overflow tapes are not completely the same.
6. The heat dissipation structure according to claim 5, characterized in that: The substrate is a square plate-shaped structure, and the number of the anti-overflow bands located in the length direction of the substrate is less than the number of the anti-overflow bands located in the width direction of the substrate.
7. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The substrate includes an aluminum substrate or a copper substrate.
8. The heat dissipation structure according to any one of claims 1 to 6, characterized in that: The anti-overflow tape comprises a foam tape.
9. The heat dissipation structure according to claim 8, characterized in that: The other side of the anti-overflow tape facing away from the substrate is adhered to the heat dissipation plate.
10. A charger, characterized in that: It comprises the heat dissipation structure as described in any one of claims 1 to 9.