Groove type drying structure
By using the first flow balancing plate and flow balancing hole in the tank type drying structure, the air flow is evenly distributed to the drying chamber, and the problem of low drying efficiency caused by uneven hot air in the prior art is solved, and further Highly efficient silicon wafer drying effect.
Patent Information
- Application Number
- CN202420680607.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-02-11
- Estimated Expiration
- 2034-04-02
AI Technical Summary
In the existing tank drying structure, the hot air inlet can only blow to a fixed position, resulting in uneven effect of hot air on the silicon wafer drying and poor drying efficiency.
A tank-type drying structure is designed, and the drying tank chamber is divided into an air inlet chamber and a drying chamber through a first flow-sharing plate, and a flow-sharing distributed in the upper and lower directions is provided on the first flow-sharing plate. The holes, air inlet chamber and drying chamber are connected through these flow-sharing holes to ensure uniform distribution of the air flow.
Through uniformly distributed airflow, the drying efficiency is significantly improved, ensuring that each silicon wafer has a good drying effect. At the same time, the structure is simple and there is no need to operate the drying tank during the drying process.
Smart Images
Figure CN222465210U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of drying equipment, and in particular to a trough type drying structure. Background Art
[0002] In the wet process of solar cells, the last step of many processes is to dry the silicon wafers, such as the texturing process and the alkali polishing process, so as to proceed to the next process. In the prior art, the silicon wafers are usually placed in a drying tank of a trough drying structure, and hot air is introduced into the drying tank and blown toward the silicon wafers to dry the silicon wafers.
[0003] However, in the prior art, the air inlet of the hot air can only be blown to a fixed position, resulting in uneven drying effect of the hot air on the silicon wafers, which in turn leads to poor drying efficiency of the drying tank. Utility Model Content
[0004] In order to solve the deficiencies of the prior art, the purpose of the present application is to provide a trough type drying structure that can improve drying efficiency.
[0005] To achieve the above objectives, this application adopts the following technical solutions:
[0006] A trough type drying structure comprises a drying trough and a trough cover, the trough cover is used to close the drying trough, a first flow equalizing plate is arranged in the drying trough, the first flow equalizing plate divides the chamber of the drying trough into an air inlet chamber and a drying chamber, a plurality of groups of first flow equalizing holes distributed in the up and down directions are arranged on the first flow equalizing plate, the air inlet chamber and the drying chamber are connected through the first flow equalizing holes, an air inlet and an air outlet are arranged on the drying trough, the air inlet is connected to the air inlet chamber, and the air outlet is connected to the drying chamber.
[0007] Furthermore, a second flow equalizing plate is provided in the air inlet chamber for dividing the air inlet chamber into a first chamber and a second chamber. The first chamber is located above the second chamber. The second flow equalizing plate extends along the front and rear direction of the drying tank. The second flow equalizing plate is provided with a second flow equalizing hole connecting the first chamber and the second chamber.
[0008] Furthermore, the drying tank includes a fixing plate extending in the up-down direction, the fixing plate is arranged in the air inlet chamber, and the fixing plate is connected to the second flow equalizing plate.
[0009] Furthermore, an inclined air guide plate is provided in the drying chamber, the air guide plate is fixedly mounted on the bottom plate of the drying trough, the air outlet is provided on the bottom plate of the drying trough, and the air guide plate is provided between the first flow equalizing plate and the air outlet.
[0010] Furthermore, the number of the air inlet chambers is set to two, and the drying chamber is located between the two air inlet chambers.
[0011] Furthermore, the trough drying structure is equipped with a primary filter, a blower, a heater and a high-efficiency filter. The primary filter is connected to the heater through the blower, and the heater is connected to the air inlet through the high-efficiency filter.
[0012] Furthermore, the air outlet is connected to the inlet of the blower to form a circulation system from the outlet of the blower, the heater, the high-efficiency filter, the drying tank to the inlet of the blower.
[0013] Furthermore, a dehumidification port is provided on the side wall of the drying tank, and the dehumidification port is arranged close to the tank cover.
[0014] Furthermore, the outlet of the blower is also connected to at least one air duct branch, and the dehumidification port is connected to the outlet of the blower through the air duct branch.
[0015] Furthermore, a plurality of first flow balancing holes arranged in the up-down direction form a flow balancing portion, a plurality of groups of flow balancing portions are arranged on the first flow balancing portion, and the plurality of groups of flow balancing portions are evenly distributed in the front-to-back direction of the drying tank.
[0016] The trough-type drying structure uses the first flow equalizing plate to make the airflow flowing into the drying chamber more uniform. In addition, since the structure of the trough-type drying structure is simpler, there is no need to operate the drying trough during the drying process, thereby improving the drying efficiency of the drying trough and ensuring that any silicon wafer in the drying chamber has a good drying effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A schematic diagram of a trough drying structure provided for this application;
[0018] Figure 2 A schematic diagram of a partial structure of a trough drying structure provided by the present application from a first perspective;
[0019] Figure 3 A schematic diagram of the first flow equalizing plate in the trough drying structure provided in the present application;
[0020] Figure 4 A schematic diagram of a partial structure of a second viewing angle of the trough drying structure provided in the present application;
[0021] Figure 5 A schematic diagram of the trough drying structure and its peripheral components provided in this application;
[0022] Figure 6 This is a connection diagram of the trough drying structure and its peripheral components provided in this application. DETAILED DESCRIPTION
[0023] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.
[0024] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features.
[0025] The present application provides a trough drying structure 10, which includes a drying trough 11 and a trough cover 12. The drying trough 11 is in a rectangular box shape, and the trough cover 12 is used to close the drying trough 11. Specifically, one side of the trough cover 12 is hinged to the drying trough 11. When the trough cover 12 is covered at the opening of the drying trough 11, the drying trough 11 can be closed. In order to clearly illustrate the technical solution of the present application, the following is also provided: Figure 1 The up-down, left-right, and front-back directions shown are used as the up-down, left-right, and front-back directions of the trough type drying structure 10 .
[0026] like Figure 2 As shown, as an implementation, the drying tank 11 includes a first flow equalizing plate 111, and the first flow equalizing plate 111 divides the chamber of the drying tank 11 into an air inlet chamber 112 and a drying chamber 113. The drying tank 11 is provided with an air inlet 114 for air intake and an air outlet 115 for air discharge, wherein the air inlet 114 is communicated with the air inlet chamber 112, and the air outlet 115 is communicated with the drying chamber 113.
[0027] like Figure 3 As shown, specifically, the first flow equalizing plate 111 is provided with a plurality of groups of first flow equalizing holes 1111 distributed along the up and down directions. It should be noted that the first flow equalizing holes 1111 are through holes penetrating the first flow equalizing plate 111, and the air inlet chamber 112 and the drying chamber 113 are connected through the first flow equalizing holes 1111.
[0028] Furthermore, a plurality of first flow equalizing holes 1111 arranged in the up-down direction form a flow equalizing portion 1112 , a plurality of groups of flow equalizing portions 1112 are provided on the first flow equalizing plate 111 , and the plurality of groups of flow equalizing portions 1112 are evenly distributed along the front-to-back direction of the drying tank 11 .
[0029] Exemplarily, multiple silicon wafers can be fixed in the drying tank 11. When the silicon wafers are fixed in the drying tank 11, the end surface of each silicon wafer is substantially perpendicular to the front-rear direction of the drying tank 11. There is a gap between any two silicon wafers for airflow to pass through. Each group of flow equalizers 1112 faces the gap between two adjacent silicon wafers, and the airflow blown out by the flow equalizers 1112 dries the silicon wafers.
[0030] Through the above arrangement, a uniform airflow can be provided in the drying chamber 113 , so that a plurality of silicon wafers can be dried, ensuring that each silicon wafer has a good drying effect, thereby improving the drying efficiency of the drying tank 11 .
[0031] like Figure 2 As shown, preferably, the first flow equalizing plate 111 is detachably arranged in the drying tank 11. In order to realize the above assembly method, the drying tank 11 is further provided with an inner wall 116 for fixing the first flow equalizing plate 111, and at least one end of the first flow equalizing plate 111 is connected to the inner wall 116 of the drying tank 11.
[0032] Optionally, the connection method between the first flow equalizing plate 111 and the inner wall 116 of the drying tank 11 includes but is not limited to bolt connection, clamping, hinged connection, etc. Any connection method that can achieve the detachable first flow equalizing plate 111 is within the protection scope required by this application.
[0033] As an implementation, the number of the air inlet chambers 112 is set to two, and the drying chamber 113 is located between the two air inlet chambers 112, so that airflow enters the drying chamber 113 from two directions opposite to each other, so that convection is formed in the drying chamber 113, thereby improving the drying efficiency of the drying tank 11.
[0034] Exemplarily, two first flow equalizing plates 111 are provided in the drying tank 11 , and the chamber of the drying tank 11 is divided from left to right into an air inlet chamber 112 , a drying chamber 113 and another air inlet chamber 112 by the two flow equalizing plates.
[0035] Although the present application shows that the drying tank 11 is divided into two air inlet chambers 112 by setting two first flow equalizing plates 111, it does not mean that the drying tank 11 can only be set as Figure 2 The two air inlet chambers 112 are shown. Optionally, by respectively providing corresponding first flow equalizing plates 111 on the upper and lower sides of the drying chamber 113 to form more air inlet chambers 112, this is still within the protection scope required by the present application and will not be described in detail here.
[0036] like Figure 2 As shown, as an implementation, the drying tank 11 further includes an air guide plate 117, which is disposed in the drying chamber 113. One end of the air guide plate 117 is fixedly connected to the bottom plate of the drying tank 11, and the other end of the air guide plate 117 is tilted upward and connected to the inner wall 116 of the drying tank 11 or the first flow equalizing plate 111.
[0037] Furthermore, the air outlet 115 is disposed on the bottom plate of the drying tank 11 , and the air guide plate 117 is disposed between the first flow equalizing plate 111 and the air outlet 115 .
[0038] It can be understood that the airflow in the drying chamber 113 is guided to the air outlet 115 by the air guide plate 117 , and the airflow is discharged from the drying chamber 113 through the air outlet 115 to form an airflow circulation, thereby improving the drying efficiency of the drying tank 11 .
[0039] like Figure 4 As shown, as an implementation, a second flow equalizing plate 118 is provided in the air inlet chamber 112 to divide the air inlet chamber 112 into a first chamber 1121 and a second chamber 1122. The second flow equalizing plate 118 extends along the front-to-back direction of the drying tank 11, wherein the first chamber 1121 is located above the second chamber 1122. The second flow equalizing plate 118 is provided with a second flow equalizing hole connecting the first chamber 1121 and the second chamber 1122.
[0040] Furthermore, an air inlet 114 is provided on the bottom plate of the drying tank 11. When viewed from the top and bottom, the air inlet 114 is basically located in the middle of the air inlet chamber 112. In order to prevent the airflow from directly entering the air inlet chamber 112 through the first flow equalizing hole 1111 of the first flow equalizing plate 111 and entering the drying chamber 113, which results in a larger airflow at the position of the drying chamber 113 close to the air inlet 114 and a smaller airflow at the position of the drying chamber 113 far from the air inlet 114, a second flow equalizing plate 118 is provided so that the airflow passing through the air inlet 114 can be evenly distributed to the air inlet chamber 112, and then evenly circulates from the air inlet chamber 112 to the drying chamber 113, thereby improving the drying efficiency of the drying tank 11.
[0041] For example, according to Figure 1 From the direction of the trough drying structure 10 defined in the figure, the airflow enters the air inlet chamber 112 upward from the air inlet 114, and the movement of the airflow is hindered by the second flow equalizing plate 118, so that the airflow flows in the front and rear directions of the air inlet chamber 112 until it is evenly distributed in the air inlet chamber 112.
[0042] like Figure 4 As shown, specifically, the drying tank 11 includes a fixing plate 119 extending at least partially in the up-down direction, and one side of the fixing plate 119 is fixedly arranged on the side wall of the drying tank 11. The fixing plate 119 is arranged in the air inlet chamber 112, and at least one end of the fixing plate 119 is fixedly connected to the second flow equalizing plate 118.
[0043] It should be noted that since the second flow equalizing plate 118 is a plate-shaped component, in order to prevent the second flow equalizing plate 118 from shaking, falling off, etc. under the influence of airflow, the stability of the second flow equalizing plate 118 can be improved by using a fixing plate 119, so that the second flow equalizing plate 118 can better guide the airflow to be evenly distributed in the air inlet chamber 112.
[0044] In the embodiment of the present application, the second flow equalizing plate 118 is detachably arranged on the fixed plate 119, and the fixed plate 119 is at least partially arranged in the middle of the air inlet chamber 112. Two second flow equalizing plates 118 are arranged in the air inlet chamber 112, and the two second flow equalizing plates 118 are arranged on the front and rear sides of the fixed plate 119 respectively. Since the yield strength of the plate-like component is inversely proportional to its force-bearing area, the deformation resistance of the second flow equalizing plate 118 is improved by shortening the length of each second flow equalizing plate 118 extending in the front-to-back direction. In addition, by providing a modular and detachable second flow equalizing plate 118, it is convenient to clean and maintain it.
[0045] like Figure 5 As shown, as an implementation method, the trough drying structure 100 is also equipped with a primary filter 20, a blower 30, a heater 40 and a high-efficiency filter 50. The primary filter 20 is connected to the heater 40 through the blower 30. Under the action of the blower 30, the air enters the primary filter 20 through the bottom plate grille of the primary filter 20, and is discharged from the outlet of the primary filter 20 after being filtered by the filter element of the primary filter 20, and connected to the inlet of the blower 30. The air enters the blower 30, is accelerated by the blower 30, and is discharged from the outlet of the blower 30, and connected to the inlet of the heater 40.
[0046] Furthermore, the heater 40 is connected to the air inlet 114 through the high efficiency filter 50. The air enters the heater 40 for heating, the temperature can reach 120°C, and then enters the inlet of the high efficiency filter 50. The air enters the high efficiency filter 50 for secondary filtration, and then enters the air inlet 114 at the bottom of the drying tank 11.
[0047] Specifically, the air outlet 115 of the drying tank 11 is connected to the inlet of the blower 30. After entering the drying tank 11, the high-temperature and high-speed air passes through the horizontally installed second flow equalizing plate 118 and the vertically installed first flow equalizing plate 111, and evenly enters the drying chamber 113. The high-temperature and high-speed air is evenly and fully in contact with the silicon wafers, and the silicon wafers are quickly dried. Under the action of the air guide plate 117, the air in the drying chamber 113 flows out from the air outlet 115 at the bottom of the drying tank 11 and is connected to the inlet of the blower 30, thereby forming a circulation system from the outlet of the blower 30, the heater 40, the high-efficiency filter 50, the trough-type drying structure 10 to the inlet of the blower 30.
[0048] In order to facilitate understanding of the technical solution of the present application, the following is also provided: Figure 6 The schematic diagram of the connection of the trough drying structure 100 and its peripheral components is shown, wherein the direction of the arrow indicates the flow direction of the airflow.
[0049] As an optional implementation, a dehumidification port (not shown) is further provided on the side wall of the drying tank 11 , and the dehumidification port is arranged close to the tank cover 12 .
[0050] It can be understood that the steam formed by the evaporation of the liquid attached to the silicon wafer moves upward, and the steam can be discharged from the drying chamber 113 in time through the dehumidification port arranged near the slot cover 12 to ensure the dryness in the drying chamber 113 and improve the drying efficiency of the silicon wafer.
[0051] Specifically, at least one duct branch 301 is connected to the inlet of the blower 30, and the dehumidification port of the drying tank 11 is connected to the blower 30 through the duct branch 301. The hot air from the duct branch 301 can be used to dehumidify and achieve a better drying effect.
[0052] In summary, the present application evenly distributes the airflow into the drying chamber 113 by setting the first flow equalizing plate 111 and the second flow equalizing plate 118, so that any silicon wafer in the drying chamber 113 has good drying efficiency, thereby improving the drying efficiency of the trough drying structure 100. In addition, since the structure of the drying trough 11 is relatively simple, the drying trough 11 does not need to be operated during the silicon wafer drying process, and it is still possible to ensure that there is uniform airflow in the drying chamber 113 to dry the silicon wafers.
[0053] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.
Claims
1. A trough type drying structure, comprising a drying trough and a trough cover, wherein the trough cover is used to close the drying trough, characterized in that: A first flow equalizing plate is provided in the drying tank, and the first flow equalizing plate divides the chamber of the drying tank into an air inlet chamber and a drying chamber. The first flow equalizing plate is provided with a plurality of groups of first flow equalizing holes distributed in the up and down directions, and the air inlet chamber and the drying chamber are connected through the first flow equalizing holes. An air inlet and an air outlet are provided on the drying tank, and the air inlet is connected to the air inlet chamber, and the air outlet is connected to the drying chamber.
2. The trough drying structure according to claim 1, characterized in that: The air inlet chamber is provided with a second flow equalizing plate for dividing the air inlet chamber into a first chamber and a second chamber, the first chamber is located above the second chamber, the second flow equalizing plate extends along the front-to-back direction of the trough drying structure, and the second flow equalizing plate is provided with a second flow equalizing hole connecting the first chamber and the second chamber.
3. The trough drying structure according to claim 2, characterized in that: The drying tank includes a fixing plate extending along the up-down direction, the fixing plate is arranged in the air inlet chamber, and the fixing plate is connected to the second flow equalizing plate.
4. The trough drying structure according to claim 1, characterized in that: The drying chamber is provided with an inclined air guide plate, the air guide plate is fixedly mounted on the bottom plate of the drying tank, the air outlet is arranged on the bottom plate of the drying tank, and the air guide plate is arranged between the first flow equalizing plate and the air outlet.
5. The trough drying structure according to claim 1, characterized in that: The number of the air inlet chambers is set to two, and the drying chamber is located between the two air inlet chambers.
6. The trough drying structure according to claim 1, characterized in that: The trough drying structure is equipped with a primary filter, a blower, a heater and a high-efficiency filter. The primary filter is connected to the heater through the blower, and the heater is connected to the air inlet through the high-efficiency filter.
7. The trough drying structure according to claim 6, characterized in that: The air outlet is connected to the inlet of the blower to form a circulation system from the outlet of the blower, the heater, the high-efficiency filter, the trough-type drying structure to the inlet of the blower.
8. The trough drying structure according to claim 6, characterized in that: A dehumidification port is provided on the side wall of the drying tank, and the dehumidification port is arranged close to the tank cover.
9. The trough drying structure according to claim 8, characterized in that: The outlet of the blower is also connected to at least one air duct branch, and the dehumidification port is connected to the outlet of the blower through the air duct branch.
10. The trough drying structure according to claim 1, characterized in that: A plurality of the first flow balancing holes arranged along the up-down direction form a flow balancing portion, a plurality of groups of the flow balancing portions are provided on the first flow balancing plate, and the plurality of groups of the flow balancing portions are evenly distributed along the front-to-back direction of the drying tank.