Infrared detector packaging assembly

Abstract

The utility model relates to the infrared detection field, and especially relates to an infrared detector packaging assembly comprising a packaging housing, an infrared chip and a sheet getter; the infrared chip is arranged in the cavity of the packaging shell; the sheet-shaped getter is arranged above the infrared chip, and the projection of the sheet-shaped getter covers the reference shielding area of the infrared chip and avoids the working area of the infrared chip. According to the utility model, the sheet-shaped getter is directly arranged above the infrared chip as a shielding layer to shield a reference shielding area, which needs to be subjected to light shielding processing, of the infrared chip in actual work, so that the sheet-shaped getter maintains the vacuum of the inner cavity of the assembly and also has the function of a light shielding sheet, the structure of the infrared detector packaging assembly is simplified, and the production cost is reduced. Meanwhile, compared with the prior art, the stacked sheet getter and infrared chip have the advantages that the ratio of the size of the infrared chip to the size of the whole packaging assembly is increased, and the size of the infrared detector packaging assembly is reduced.

Description

Technical Field

[0001] The utility model relates to the field of infrared detection, in particular to an infrared detector packaging component. Background Art

[0002] In recent years, the market potential of uncooled infrared detectors is huge, but their prices are generally on a downward trend. The number of companies engaged in mid- and low-end infrared thermal imaging products has gradually increased, intensifying market competition.

[0003] Uncooled infrared detectors are developing towards high sensitivity, high reliability, small size and low cost, which makes the packaging of uncooled infrared detectors very important, because the packaging of infrared detectors directly affects the performance, reliability, size and cost of the detectors. With the continuous development of technology, packaging technology is also constantly improving and optimizing. Among them, ceramic vacuum packaging technology is one of the mainstream packaging technologies for uncooled infrared. The advantages of ceramic vacuum packaging technology are mainly reflected in high reliability and good heat dissipation performance.

[0004] At present, the ceramic vacuum packaging of mainstream uncooled infrared detectors on the market is to fix the infrared chip and the sheet getter to the designated area of ​​the tube shell, and the two are usually set in parallel, and then the BLD (Blind) cover is mounted to shield the reference shielding area on the infrared chip. This ceramic vacuum packaging method places the sheet getter and the infrared chip in parallel and side by side, and high temperature is usually generated during the activation of the sheet getter. In order to avoid the influence of high temperature on the infrared chip, there is usually a certain distance between the sheet getter and the infrared chip, which further increases the size of the infrared detector packaging component, making it difficult to further reduce the size of the final infrared detector packaging component.

[0005] Therefore, how to further reduce the space occupied by the infrared detector packaging assembly is an urgent problem to be solved by those skilled in the art. Utility Model Content

[0006] The utility model aims to provide an infrared detector packaging component to solve the problem in the prior art that the infrared detector packaging component is large in size and is not conducive to device miniaturization.

[0007] In order to solve the above technical problems, the utility model provides an infrared detector packaging assembly, including a packaging shell, an infrared chip and a sheet-like getter;

[0008] The infrared chip is arranged in the cavity of the packaging shell;

[0009] The sheet-shaped getter is arranged above the infrared chip, and the projection of the sheet-shaped getter covers the reference shielding area of ​​the infrared chip.

[0010] Optionally, in the infrared detector packaging assembly, the sheet-like getter is a metal film getter.

[0011] Optionally, in the infrared detector packaging assembly, the inner edge of the cavity of the packaging shell includes a first step;

[0012] The sheet-like getter is placed on the first step.

[0013] Optionally, in the infrared detector packaging assembly, the sheet-like getter is fixedly connected to the first step;

[0014] or,

[0015] The first step includes a limit buckle;

[0016] The sheet-like getter includes a clamping end;

[0017] The clamping end cooperates with the limiting buckle to fix the position of the sheet-like getter.

[0018] Optionally, in the infrared detector packaging assembly, the sheet-like getter is a strip-like getter;

[0019] Both ends of the long axis of the strip-shaped getter include the clamping ends respectively.

[0020] Optionally, in the infrared detector packaging assembly, the inner edge of the cavity of the packaging shell includes a high platform electrode;

[0021] The sheet-like getter is disposed through the plateau electrode.

[0022] Optionally, in the infrared detector packaging assembly, the bonding finger of the packaging shell is arranged at the inner edge of the packaging shell;

[0023] or,

[0024] The inner edge of the cavity of the packaging shell further includes a second step;

[0025] The bonding fingers of the packaging shell are arranged on the second step;

[0026] The height of the second step is consistent with the thickness of the infrared chip; the pad of the infrared chip is electrically connected to the corresponding bonding finger.

[0027] Optionally, in the infrared detector packaging assembly, the infrared chip is disposed in the cavity of the packaging shell by dispensing or welding.

[0028] Optionally, in the infrared detector packaging assembly, the distance from the sheet-like getter to the upper surface of the infrared chip is greater than a first preset distance;

[0029] and / or

[0030] The distance from the sheet-like getter to the lower surface of the infrared window of the infrared detector package assembly is greater than a second preset distance.

[0031] Optionally, in the infrared detector packaging assembly, the first preset distance and / or the second preset distance ranges from 1 mm to 2 mm, including endpoint values.

[0032] The infrared detector packaging assembly provided by the utility model includes a packaging shell, an infrared chip and a sheet-like getter; the infrared chip is arranged in the cavity of the packaging shell; the sheet-like getter is arranged above the infrared chip, and the projection of the sheet-like getter covers the reference shielding area of ​​the infrared chip and avoids the working area of ​​the infrared chip. In the utility model, the sheet-like getter is directly arranged above the infrared chip as a shielding layer, shielding the reference shielding area of ​​the infrared chip that needs to be shielded in actual work, so that the sheet-like getter can maintain the vacuum of the cavity in the assembly while taking into account the function of the light shielding sheet, simplifying the structure of the infrared detector packaging assembly, and at the same time, the stacked sheet-like getter and infrared chip greatly increase the ratio of the size of the infrared chip to the size of the entire packaging assembly compared to the related art, and reduce the size of the infrared detector packaging assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 A structural explosion diagram of a specific implementation of the infrared detector packaging assembly provided by the utility model;

[0035] Figure 2 A top view of the structure of a specific implementation of the infrared detector packaging assembly provided by the utility model;

[0036] Figure 3 A top view of the structure of a specific implementation of the infrared detector packaging assembly provided by the utility model;

[0037] Figure 4 A structural cross-sectional view of a specific implementation of the infrared detector packaging assembly provided by the utility model;

[0038] Figure 5A structural cross-sectional view of a specific implementation of the infrared detector packaging assembly provided by the utility model;

[0039] Figure 6 A schematic flow chart of a specific implementation method of a method for producing an infrared detector packaging assembly provided by the utility model;

[0040] Figure 7 The present invention is a flowchart of a specific embodiment of a method for producing an infrared detector packaging assembly provided by the present invention.

[0041] In the figure, it includes 10-packaging shell, 11-first step, 12-limiting buckle, 13-second step, 14-bonding finger, 15-tube shell pin, 20-infrared chip, 21-reference shielding area, 30-sheet getter, 31-clamping end, 40-infrared window, 41-solder sheet. DETAILED DESCRIPTION

[0042] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0043] The core of the utility model is to provide an infrared detector packaging assembly, a structural schematic diagram of a specific implementation method is shown in FIG. Figures 1 to 5 As shown, it is called the specific embodiment 1, which includes a packaging shell 10, an infrared chip 20 and a sheet-like getter 30;

[0044] The infrared chip 20 is disposed in the cavity of the packaging shell 10;

[0045] The sheet-like getter 30 is disposed above the infrared chip 20 , and the projection of the sheet-like getter 30 covers the reference shielding area 21 of the infrared chip 20 and avoids the working area of ​​the infrared chip 20 .

[0046] In actual use, the infrared chip 20 is connected to the external circuit through the wiring in the packaging shell 10. In addition, it should be noted that the infrared detector packaging assembly is assumed to be placed horizontally during the packaging process in the utility model, and the surface receiving infrared radiation faces upward. The orientation description of each structure in the utility model is also based on this. Of course, in actual production, the infrared detector packaging assembly may not be placed horizontally, and the direction described in the above text can be changed accordingly. The working area of ​​the infrared chip 20 is the area where the infrared chip 20 needs to receive infrared rays when it is actually working.

[0047] Preferably, the sheet-like getter 30 is a metal film getter. The metal film getter is in sheet form, has strong air absorption performance, good corresponding ductility, and high structural strength. As a shielding member of the reference shielding area 21, the metal film getter has better working stability. At the same time, the metal film getter has a long service life and high reliability. It is also suitable for high-temperature activated working environments, which greatly improves the versatility of the infrared detector packaging assembly. The packaging shell 10 can be a ceramic tube shell.

[0048] As a preferred embodiment, the inner edge of the cavity of the packaging shell 10 includes a first step 11;

[0049] The sheet-like getter 30 is placed on the first step 11 .

[0050] The inner edge of the chamber refers to the edge position of the inner side of the chamber of the packaging shell 10. Of course, the first step 11 can surround the inner side of the entire chamber shell, or the step can be set only at the required position, which can be selected according to actual needs.

[0051] A step is set in the cavity of the packaging shell 10, which is easy to operate, and the step is set with high accuracy. The height of the step is controllable, and the process is relatively simple, which can greatly improve the production efficiency of the infrared detector packaging assembly. In addition, the first step 11 can also reduce the vibration and deformation of the sheet-like getter 30 in the height direction, prevent the sheet-like getter 30 from bending, and ensure working stability.

[0052] Of course, the sheet-like getter 30 and the first step 11 may be fixed in a welding manner or the like, such as firstly setting a positioning pad at a preset position of the first step 11, and then welding the sheet-like getter 30 to the positioning pad.

[0053] Preferably, the sheet-like getter 30 is fixedly connected to the first step 11;

[0054] or,

[0055] The first step 11 includes a limiting buckle 12;

[0056] The sheet-like getter 30 includes a clamping end 31;

[0057] The clamping end 31 cooperates with the limiting buckle 12 to fix the position of the sheet-like getter 30 .

[0058] According to the preferred embodiment, the sheet-like getter 30 can be directly fixed to the first step 11, and a buckle can be provided on the first step 11, and then the clamping end 31 of the sheet-like getter 30 is connected with the buckle to firmly fix the sheet-like getter 30 at the preset position of the first step 11, thereby preventing the infrared detector packaging assembly from being displaced by the limiting buckle 12 due to external impact during subsequent transportation, installation and actual use, thereby losing the shielding effect on the reference shielding area 21. At the same time, the installation of the limiting buckle 12 can also reduce the alignment time of the sheet-like getter 30 during installation, thereby further improving the production efficiency of the infrared detector packaging assembly. Of course, there is no limiting fit, which is not necessary, but it will be more reliable if it is.

[0059] Furthermore, the sheet-like getter 30 is a strip-like getter;

[0060] Both ends of the long axis of the strip-shaped getter include the clamping ends 31 respectively.

[0061] For reference Figure 1 , Figure 1 The exploded diagram of the structure of the infrared detector packaging assembly is shown in this preferred embodiment. The sheet-like getter 30 is in the shape of a long strip, and the snap-on end 31 is arranged at both ends of the strip, that is, the limit buckle 12 is arranged on the first steps 11 on the two opposite sides of the chamber of the packaging shell 10. This limit fixing method not only ensures the effectiveness and stability of the limit fixing, but also facilitates installation. Of course, sheet-like getters 30 of other shapes can also be selected according to actual needs, and the snap-on end 31 can be arranged at a suitable position according to the corresponding shape, and the utility model is not limited here.

[0062] As another preferred embodiment, the inner edge of the chamber of the packaging shell 10 includes a high platform electrode;

[0063] The sheet-like getter 30 is disposed through the plateau electrode.

[0064] In the preferred embodiment, a high-platform electrode is used to set up the sheet-like getter 30. The high-platform electrode refers to an electrode set up at a certain height in the chamber of the packaging shell 10. The high-platform electrode can be an electrode built up from the bottom surface of the chamber, or it can be an electrode directly extended from a certain height of the side wall of the chamber to form a contact surface with the sheet-like electrode. The high-platform electrode can be set at the same time as other electrode structures in the packaging shell 10, and the placement surface of the sheet-like getter 30 can be obtained without separate processing, which further improves the production efficiency of the infrared detector packaging assembly and simplifies the production process. Of course, the sheet-like getter 30 can also be set in other ways, and the utility model is not limited here.

[0065] In addition, the bonding fingers 14 of the package shell 10 are arranged at the inner edge of the package shell 10;

[0066] or,

[0067] The inner edge of the cavity of the packaging shell 10 further includes a second step 13;

[0068] The bonding finger 14 of the packaging shell 10 is arranged on the second step 13;

[0069] The height of the second step 13 is consistent with the thickness of the infrared chip 20 ; the pads of the infrared chip 20 are electrically connected to the corresponding bonding fingers 14 .

[0070] For reference Figures 1 to 3 In this preferred embodiment, the bonding finger 14 is raised to the same height as the top surface of the infrared chip 20 by setting the second step 13, which can greatly simplify the difficulty of electrical connection between the pad and the bonding finger 14. Of course, the pad and the bonding finger 14 can be connected by gold wire bonding or other methods, which is not limited in the present invention. Figure 2 and Figure 3 for Figure 1 A top view of Figure 2 is a top view of the sheet-like getter 30 shielded, Figure 3 This is a top view after removing the sheet-like getter 30. Figure 3 The second step 13 is not located inside the cavity that completely surrounds the packaging shell 10, but is only arranged on the side corresponding to the edge of the infrared chip 20 with the pad, which can be changed as needed in actual use. Figure 4 for Figure 2 The cross-sectional diagram along the dotted line B is shown in Fig. Figure 5 for Figure 2 Of course, the height of the second step 13 may be different from the thickness of the infrared chip 20, or the bonding finger may be directly disposed on the inner edge of the package shell 10 to simplify the production process, which is not limited in the present invention.

[0071] Preferably, the infrared chip 20 is disposed in the cavity of the packaging shell 10 by dispensing or welding.

[0072] The dispensing or welding speed is fast, the process is mature, and it can ensure that the infrared chip 20 and the packaging shell 10 are firmly connected, taking into account both high production speed and good working stability. Of course, the dispensing and welding in this preferred embodiment are only means for fixing the infrared chip and the packaging shell 10, and the electrical connection between the two can be achieved by gold wire bonding and other methods, which is not limited in this utility model.

[0073] The infrared detector packaging assembly provided by the utility model comprises a packaging shell 10, an infrared chip 20 and a sheet-like getter 30; the infrared chip 20 is arranged in the cavity of the packaging shell 10; the sheet-like getter 30 is arranged above the infrared chip 20, and the projection of the sheet-like getter 30 covers the reference shielding area 21 of the infrared chip 20 and avoids the working area of ​​the infrared chip 20. In the utility model, the sheet-like getter 30 is directly arranged above the infrared chip 20 as a shielding layer, shielding the reference shielding area 21 of the infrared chip 20 that needs to be shielded in actual work, so that the sheet-like getter 30 can maintain the vacuum of the cavity in the assembly while taking into account the function of the light shielding sheet, simplifying the structure of the infrared detector packaging assembly, and at the same time, the stacked sheet-like getter 30 and the infrared chip 20 greatly increase the ratio of the size of the infrared chip to the size of the entire packaging assembly compared with the related art, and reduce the size of the infrared detector packaging assembly.

[0074] On the basis of the first embodiment, the positional relationship between the sheet-like getter 30 and other structures is further limited to obtain a second embodiment, the corresponding structural schematic diagram of which is the same as that of the first embodiment, and is referred to as the second embodiment, including a packaging shell 10, an infrared chip 20 and a sheet-like getter 30;

[0075] The infrared chip 20 is disposed in the cavity of the packaging shell 10;

[0076] The sheet-like getter 30 is disposed above the infrared chip 20 , and the projection of the sheet-like getter 30 covers the reference shielding area 21 of the infrared chip 20 and avoids the working area of ​​the infrared chip 20 ;

[0077] The distance between the sheet-like getter 30 and the upper surface of the infrared chip 20 is greater than a first preset distance;

[0078] and / or

[0079] The distance between the sheet-like getter 30 and the lower surface of the infrared window 40 of the infrared detector package assembly is greater than a second preset distance.

[0080] The difference between this embodiment and the above embodiment is that the distance from the sheet-like getter 30 to other structures is preset in this embodiment, and the remaining structures are the same as those in the above embodiment, which will not be described in detail here.

[0081] In this specific embodiment, the sheet-like getter 30, the infrared window 40 and the infrared chip 20 are all separated and the minimum distance from the sheet-like getter 30 to the two is specified. It should be noted that the first preset distance and the second preset distance mentioned above refer to the distance in the vertical direction, that is, the distance perpendicular to the plane direction of the infrared detector package assembly.

[0082] Please refer to Figure 1 The infrared window 40 does not refer to the opening area on the packaging shell 10, but is a transparent structure that covers the infrared ray entrance and can be fixed to the packaging shell 10 by means of a solder sheet 41 or the like. In addition, the upper surface of the infrared chip 20 refers to the surface of the infrared chip 20 close to the infrared window 40.

[0083] The distance between the sheet-like getter 30 and the lower surface of the infrared window 40 of the infrared detector package assembly is set to be greater than the second preset distance, and the distance between the sheet-like getter 30 and the upper surface of the infrared chip 20 is set to be greater than the first preset distance, so that there is a certain size of interval between the three, which can ensure that the heat generated by the sheet-like getter 30 during the air intake process will not be directly transferred to the infrared chip 20 and / or the infrared window 40, avoiding damage to the device and improving the measurement accuracy of the infrared chip 20. At the same time, the size of the component in the height direction is increased to a certain extent in this specific implementation. This structure will also increase the distance between the focal plane array of the infrared chip 20 and the infrared window 40, which can further improve the defect tolerance rate of the infrared window 40, improve the finished product yield and work stability.

[0084] Specifically, the range of the first preset distance and / or the second preset distance is 1 mm to 2 mm, including endpoint values, such as any one of 1.0 mm, 1.5 mm or 2.0 mm. The above distance range is the optimal range obtained after a large number of theoretical calculations and actual tests. In the above range, the thickness of the component will not be increased too much to affect the installation, and the heat dissipation of the sheet-like getter 30 during the air intake process can be fully considered. Of course, other parameter ranges can also be selected according to actual conditions, and the utility model is not limited here.

[0085] The utility model also provides a method for producing an infrared detector packaging assembly, a flow chart of a specific implementation method thereof is shown as follows Figure 6 As shown, it is called specific implementation method three, including:

[0086] S101: placing the infrared chip in the cavity of the packaging shell.

[0087] This step can be divided into two steps: fixing the infrared chip 20 and electrically connecting the infrared chip 20 to the packaging shell 10 .

[0088] S102: placing a sheet-like getter above the infrared chip so that the projection of the sheet-like getter covers a reference shielding area of ​​the infrared chip.

[0089] The specific location of the sheet-like getter 30 can be found in the above description of the structure of the infrared detector packaging assembly, which will not be described in detail here.

[0090] S103: vacuum-seal the packaging shell provided with the sheet-like getter to obtain the infrared detector packaging assembly.

[0091] Preferably, the vacuum sealing of the packaging shell 10 provided with the sheet-like getter 30 comprises:

[0092] The packaging shell 10 provided with the sheet-like getter 30 is vacuum baked in a vacuum oven, and then the infrared window 40 is fixedly connected to the packaging shell 10 to complete the vacuum sealing.

[0093] The vacuum baking has a better vacuum effect, has lower equipment requirements, is low cost, is suitable for large-scale mass production, ensures sufficient exhaust, and makes it easier to maintain the vacuum during the use of subsequent products. Of course, other vacuum sealing methods can also be selected according to actual conditions, and the utility model will not be repeated here.

[0094] Furthermore, the step of fixing the infrared window 40 to the packaging shell 10 includes:

[0095] The infrared window 40 and the packaging shell 10 are vacuum welded by using a solder sheet 41 .

[0096] Using solder sheet 41 for welding in a vacuum environment can greatly reduce the difficulty of welding and improve the success rate of welding. At the same time, the welding can achieve stronger sealing and better working stability. Of course, the fixed connection of the infrared window 40 can also be achieved by other means, which is not limited in the present invention.

[0097] The production method of the infrared detector packaging assembly in this specific embodiment produces the infrared detector packaging assembly in the previous text, and the two are mutually comparative. Therefore, please refer to the previous text for the technical solution and corresponding production process of the infrared detector packaging assembly, which will not be elaborated here.

[0098] Combined with the previous description of the structure, the following example is given below. The corresponding flow chart is as follows Figure 7 As shown:

[0099] Step 1: fix the infrared chip to the ceramic tube shell through a fixture using glue or solder sheets; the infrared chip has an infrared chip ACT (active, working) pixel area and an infrared chip BLD (reference shielding) area.

[0100] Step 2: Connect the pad of the infrared chip to the bonding finger on the second step of the ceramic shell by gold wire bonding or other methods. The electrical signal further passes through the bonding finger to reach the shell pin 15 and then connects to the external circuit.

[0101] Step 3: Use the upper limit buckle on the first step of the ceramic shell to fix the position of the metal flake getter, and spot weld the metal flake getter to the metal pad on the first step of the ceramic shell; the first step of the ceramic shell slows down the vibration and deformation of the metal flake getter in the Z direction, and prevents the metal flake getter from bending, thereby destroying the regional pixels in the reference shielding area; the first step of the ceramic shell is not metallized except for the metal pad position. The Z direction (height direction) dimension of the metal flake getter from the infrared chip is greater than 1mm, and the Z direction dimension of the metal flake getter from the infrared window is greater than 1mm. Therefore, the technical solution increases the dimension of the packaged detector in the Z direction to a certain extent, that is, the height of the ceramic shell is increased. This structure will also increase the distance between the focal plane array of the non-cooled infrared detector and the infrared window, which can further improve the defect tolerance rate of the infrared window; the metal flake getter is located directly above the BLD area of ​​the infrared chip, and is used to shield and prevent infrared radiation from irradiating the BLD area of ​​the infrared chip.

[0102] Step 4: vacuum bake the structure completed in step 3 in a vacuum oven to ensure sufficient exhaust so that the vacuum can be maintained more easily during the use of subsequent products.

[0103] Step 5, using the solder sheet and the infrared window to perform vacuum welding with the structure after step 4 to form a closed cavity;

[0104] Step six, activate the metal flake getter and perform FT test.

[0105] The production method of the infrared detector packaging assembly provided by the utility model is as follows: an infrared chip is arranged in the cavity of a packaging shell; a sheet-like getter is arranged above the infrared chip so that the projection of the sheet-like getter covers the reference shielding area of ​​the infrared chip; and the packaging shell in which the sheet-like getter is arranged is vacuum-sealed to obtain the infrared detector packaging assembly. In the utility model, the sheet-like getter is directly arranged above the infrared chip as a shielding layer, shielding the reference shielding area of ​​the infrared chip that needs to be shielded in actual work, so that the sheet-like getter can maintain the vacuum in the cavity of the assembly while taking into account the function of the light shielding sheet, simplifying the structure of the infrared detector packaging assembly, and at the same time, the stacked sheet-like getter and infrared chip greatly increase the ratio of the size of the infrared chip to the size of the entire packaging assembly compared to the related art, thereby reducing the size of the infrared detector packaging assembly.

[0106] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0107] It should be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0108] The infrared detector packaging assembly provided by the utility model is introduced in detail above. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. An infrared detector packaging assembly, characterized in that: It comprises a packaging shell (10), an infrared chip (20) and a sheet-like getter (30); The infrared chip (20) is arranged in the cavity of the packaging shell (10); The sheet-like getter (30) is arranged above the infrared chip (20), and the projection of the sheet-like getter (30) covers the reference shielding area (21) of the infrared chip (20) and avoids the working area of ​​the infrared chip (20).

2. The infrared detector packaging assembly according to claim 1, characterized in that: The sheet-like getter (30) is a metal film getter.

3. The infrared detector packaging assembly according to claim 1, characterized in that: The inner edge of the cavity of the packaging shell (10) comprises a first step (11); The sheet-like getter (30) is placed on the first step (11).

4. The infrared detector packaging assembly according to claim 3, characterized in that: The sheet-like getter (30) is fixedly connected to the first step (11); or, The first step (11) includes a limiting buckle (12); The sheet-shaped getter (30) comprises a clamping end (31); The clamping end (31) cooperates with the limiting buckle (12) to fix the position of the sheet-like getter (30).

5. The infrared detector packaging assembly according to claim 4, characterized in that: The sheet-like getter (30) is a strip-like getter; Both ends of the long axis of the strip-shaped getter respectively include the clamping ends (31).

6. The infrared detector packaging assembly according to claim 1, characterized in that: The inner edge of the chamber of the packaging shell (10) comprises a high platform electrode; The sheet-like getter (30) is arranged via the high platform electrode.

7. The infrared detector packaging assembly according to claim 1, characterized in that: The bonding fingers (14) of the packaging shell (10) are arranged on the inner edge of the packaging shell (10); or, The inner edge of the cavity of the packaging shell (10) further includes a second step (13); The bonding finger (14) of the packaging shell (10) is arranged on the second step (13); The height of the second step (13) is consistent with the thickness of the infrared chip (20); and the bonding pad of the infrared chip (20) is electrically connected to the corresponding bonding finger (14).

8. The infrared detector packaging assembly according to claim 1, characterized in that: The infrared chip (20) is arranged in the cavity of the packaging shell (10) by dispensing glue or welding.

9. The infrared detector package assembly according to any one of claims 1 to 8, characterized in that: The distance between the sheet-like getter (30) and the upper surface of the infrared chip (20) is greater than a first preset distance; and / or The distance from the sheet-like getter (30) to the lower surface of the infrared window (40) of the infrared detector packaging assembly is greater than a second preset distance.

10. The infrared detector packaging assembly according to claim 9, characterized in that: The first preset distance and / or the second preset distance ranges from 1 mm to 2 mm, including endpoint values.

Images