Display module and display device

Abstract

The utility model discloses a display module and a display device, and belongs to the technical field of display. The display module comprises a display panel which comprises a display area and a non-display area located on one side of the display area; the supporting film is located in a non-display area of the display panel; the flexible circuit board is connected to the non-display area of the display panel; the printed circuit board is connected with the flexible circuit board; wherein the display panel is in a flat state under the action of the supporting film. The yield and the utilization rate of the display module can be improved.

Description

Technical Field

[0001] The present application belongs to the field of display technology, and in particular, relates to a display module and a display device. Background Art

[0002] After the display panel is bound to the printed circuit board through the flexible circuit board, the material expands due to heat, and there is stress pulling on the flexible circuit board, which causes the display panel to warp. In turn, the display panel cannot be properly adsorbed on the vacuum adsorption platform, affecting subsequent processes such as cutting of the display panel, and further affecting the yield and utilization rate of the display panel. Utility Model Content

[0003] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a display module and a display device, which can improve the yield and utilization rate of the display module.

[0004] In a first aspect, the present application provides a display module, comprising:

[0005] The display panel comprises a display area and a non-display area located on one side of the display area;

[0006] A supporting film, located in a non-display area of ​​the display panel;

[0007] A flexible circuit board connected to a non-display area of ​​the display panel;

[0008] A printed circuit board connected to the flexible circuit board;

[0009] Wherein, the display panel is in a flat state under the action of the supporting film.

[0010] According to the display module of the present application, a support film is provided in the non-display area of ​​the display panel, so that when the printed circuit board is connected to the non-display area of ​​the display panel through the flexible circuit board, the display panel can withstand the tensile stress of the flexible circuit board under the action of the support film without warping, that is, the display panel remains flat, thereby improving the yield and utilization rate of the display module.

[0011] According to an embodiment of the present application, the non-display area includes a first binding area, the supporting film includes a first hollow area, and the orthographic projection of the first hollow area on the display panel covers the first binding area;

[0012] The display module further includes a driving chip, and the driving chip is connected to the first binding area.

[0013] According to an embodiment of the present application, the non-display area further includes a second binding area, the supporting film further includes a second hollow area, and the orthographic projection of the second hollow area on the display panel covers the second binding area;

[0014] The flexible circuit board is connected to the second binding area.

[0015] According to an embodiment of the present application, the non-display area further includes a bending area located at one side of the display area, and the first binding area and the second binding area are both located at a side of the bending area away from the display area;

[0016] The supporting film further includes a third hollow area, and the orthographic projection of the third hollow area on the display panel covers the bending area.

[0017] According to one embodiment of the present application, the Young's modulus of the supporting film is greater than the Young's modulus of the flexible circuit board.

[0018] According to one embodiment of the present application, the Young's modulus of the support film is between 2000 MPa and 4000 MPa.

[0019] According to an embodiment of the present application, the thickness of the supporting film is not greater than the thickness of the driving chip.

[0020] According to one embodiment of the present application, the thickness of the support film is between 0.15 mm and 0.25 mm.

[0021] According to one embodiment of the present application, the support membrane includes an organic high molecular polymer.

[0022] In a second aspect, the present application provides a display device, comprising the display module as described in the first aspect.

[0023] The above one or more technical solutions in the embodiments of the present application have at least one of the following technical effects:

[0024] By arranging a support film in the non-display area of ​​the display panel, when the printed circuit board is connected to the non-display area of ​​the display panel through the flexible circuit board, the display panel can withstand the tensile stress of the flexible circuit board under the action of the support film without warping, that is, the display panel remains flat, thereby improving the yield and utilization rate of the display module.

[0025] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0027] Figure 1 It is a schematic diagram of the structure of the display module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0028] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0029] The display module and the display device provided in the embodiments of the present application are described below with reference to the accompanying drawings.

[0030] Figure 1 A schematic diagram of the structure of a display module provided in an embodiment of the present application.

[0031] like Figure 1 As shown, the display module includes a display panel 1 , a support film 2 , a flexible circuit board 4 and a printed circuit board 5 .

[0032] The display panel 1 includes a display area 11 and a non-display area 12, and the non-display area 12 is located on one side of the display area 11. The display panel 1 may be an OLED display panel. The support film 2 is located in the non-display area 12 of the display panel 1 to ensure that the setting of the support film 2 does not affect the display effect of the display panel 1. The flexible circuit board 4 is bound and connected to the non-display area 12 of the display panel 1. The printed circuit board 5 is bound and connected to the flexible circuit board 4, so that the printed circuit board 5 is connected to the non-display area 12 of the display panel 1 through the flexible circuit board 4.

[0033] The display panel 1 is in a flat state under the action of the support film 2 .

[0034] After binding the printed circuit board 5, the flexible circuit board 4 is subjected to stress pulling due to the thermal expansion of the material. In the related art, the display panel 1 is easily warped by the stress pulling of the flexible circuit board 4. In this embodiment, a support film 2 is provided in the non-display area 12 of the display panel 1. Under the action of the support film 2, the display panel 1 can withstand the pulling stress of the flexible circuit board 4 without warping, that is, the display panel 1 is still in a flat state after binding the printed circuit board 5. Since the display panel 1 is in a flat state, the display panel 1 can be normally adsorbed on the vacuum adsorption platform, which improves the adsorption effect of the display panel 1 on the vacuum adsorption platform, ensures the subsequent process effects such as cutting, and improves the yield and utilization rate of the display panel.

[0035] In some embodiments, the display module further includes a driver chip (IC) 3, and the driver chip 3 is connected to the non-display area 12 of the display panel 1. The driver chip 3 can be bonded to the non-display area 12 of the display panel 1 by a bonding process.

[0036] In some embodiments, the non-display area 12 includes a first binding area 121, the supporting film 2 includes a first hollow area 21, and the orthographic projection of the first hollow area 21 on the display panel 1 covers the first binding area 121, so that the orthographic projection of the supporting film 2 on the display panel 1 does not overlap with the first binding area 121. The driving chip 3 is connected to the first binding area 121, thereby ensuring that the supporting film 2 does not interfere with the driving chip 3, and preventing the setting of the supporting film 2 from affecting the performance of the display module.

[0037] It should be noted that the non-display area 12 may include one or more first binding areas 121 , and the display module may include one or more driver chips 3 . The number of driver chips 3 may be the same as the number of first binding areas 121 , and each driver chip 3 is connected to a corresponding first binding area 121 .

[0038] In the case where the non-display area 12 includes multiple first binding areas 121, the support film 2 may include a first hollow area 21, and the orthographic projection of the first hollow area 21 on the display panel 1 covers the multiple first binding areas 121, so as to ensure that the first hollow area 21 does not overlap with each first binding area 121, thereby ensuring that the support film 2 does not interfere with each driving chip 3. The support film 2 may also include multiple first hollow areas 21, each first hollow area 21 corresponds to at least one first binding area 121, and the orthographic projection of each first hollow area 21 on the display panel 1 covers at least one first binding area 121 corresponding to it. The supporting film 2 may also include a plurality of first hollow areas 21, the number of the first hollow areas 21 may be the same as the number of the first binding areas 121, and the plurality of first hollow areas 21 and the plurality of first binding areas 121 may be arranged in one-to-one correspondence, and the orthographic projection of each first hollow area 21 on the display panel 1 covers its corresponding first binding area 121 to ensure that each first hollow area 21 has no overlap with its corresponding first binding area 121, thereby ensuring that there is no interference between the supporting film 2 and each driving chip 3.

[0039] It should be noted that, considering the influence of material tolerance and fitting tolerance, the distance between the boundary of the first hollow area 21 and the boundary of the first binding area 121 can be greater than or equal to 0.2 mm, that is, the distance between the boundary of the first hollow area 21 and the driving chip 3 can be greater than or equal to 0.2 mm.

[0040] In some embodiments, the non-display area 12 further includes a second binding area 122, and the supporting film 2 further includes a second hollow area 22, and the orthographic projection of the second hollow area 22 on the display panel 1 covers the second binding area 122, so that the orthographic projection of the supporting film 2 on the display panel 1 does not overlap with the second binding area 122. The flexible circuit board 4 is connected to the second binding area 122, so as to ensure that the supporting film 2 and the flexible circuit board 4 do not interfere with each other, and avoid the setting of the supporting film 2 affecting the performance of the display module. Among them, the flexible circuit board 4 can be bound and connected to the second binding area 122 through a binding process, and the printed circuit board 5 can be bound and connected to the flexible circuit board 4 through a binding process, so that the printed circuit board 5 is connected to the second binding area 122 of the display panel 1 through the flexible circuit board 4. The flexible circuit board 4 can be an FPC (Flexible Printed Circuit), and the printed circuit board 5 can be a PCB (Printed Circuit Board).

[0041] It should be noted that the non-display area 12 may include one or more second binding areas 122, and the display module may include one or more flexible circuit boards 4. The number of flexible circuit boards 4 may be the same as the number of second binding areas 122, and each flexible circuit board 4 is connected to a corresponding second binding area 122.

[0042] In the case where the non-display area 12 includes a plurality of second binding areas 122, the support film 2 may include a second hollow area 22, and the orthographic projection of the second hollow area 22 on the display panel 1 covers the plurality of second binding areas 122, so as to ensure that the second hollow area 22 does not overlap with each second binding area 122, thereby ensuring that the support film 2 does not interfere with the flexible circuit board 4. The support film 2 may also include a plurality of second hollow areas 22, each second hollow area 22 corresponds to at least one second binding area 122, and the orthographic projection of each second hollow area 22 on the display panel 1 covers at least one second binding area 122 corresponding thereto. The support film 2 may also include a plurality of second hollow areas 22, the number of the second hollow areas 22 may be the same as the number of the second binding areas 122, and the plurality of second hollow areas 22 and the plurality of second binding areas 122 may be arranged in one-to-one correspondence, and each second hollow area 22 does not overlap with the second binding area 122 corresponding thereto, thereby ensuring that the support film 2 does not interfere with the flexible circuit board 4.

[0043] It should be noted that, considering the influence of material tolerance and fitting tolerance, the minimum distance between the boundary of the second hollow area 22 and the boundary of the second binding area 122 can be greater than or equal to 0.2 mm, that is, the distance between the boundary of the second hollow area 22 and the flexible circuit board 4 is greater than or equal to 0.2 mm.

[0044] In some embodiments, the non-display area 12 further includes a bending area, the bending area is located on one side of the display area 11, and the first binding area 121 and the second binding area 122 are both located on the side of the bending area away from the display area 11. The first binding area 121 and the second binding area 122 can be arranged on the backlight side of the display area 11 through the bending area to reduce the border of the display module.

[0045] The support film 2 may further include a third hollow area, the orthographic projection of the third hollow area on the display panel 1 covers the bending area, so that the orthographic projection of the support film 2 on the display panel 1 does not overlap with the bending area to avoid affecting the bending performance of the display panel 1 in the bending area.

[0046] It should be noted that, considering the influence of material tolerance and fitting tolerance, the distance between the boundary of the third hollow area and the boundary of the bending area may be greater than or equal to 0.2 mm.

[0047] In some embodiments, the Young's modulus of the support film 2 is greater than the Young's modulus of the flexible circuit board 4. Young's modulus is a physical quantity that describes the material's ability to resist deformation. When a material is subjected to positive stress, positive strain will be generated. Young's modulus refers to the ratio of the positive stress per unit cross-sectional area to the positive strain when the material is subjected to positive stress. In other words, the deformation resistance of the support film 2 is greater than the deformation resistance of the flexible circuit board 4, so that the support film 2 can withstand the tensile stress of the flexible circuit board 4, so that the display panel 1 can withstand the tensile stress of the flexible circuit board 4 under the action of the support film 2 without warping.

[0048] In some embodiments, the Young's modulus of the support film 2 is between 2000 MPa and 4000 MPa. For example, the Young's modulus of the support film 2 is 2900 MPa.

[0049] In some embodiments, the thickness of the support film 2 is not greater than the thickness of the driver chip 3, so that when the display module is assembled in the whole machine, the support film 2 does not interfere with the relevant parts of the whole machine. It should be noted that, if the space of the whole machine allows, the thickness of the support film 2 can also be greater than the thickness of the driver chip 3, as long as the support film 2 does not interfere with the relevant parts of the whole machine. If the space of the whole machine allows, the thickness of the support film 2 is as thick as possible, further ensuring that the support film 2 can withstand the pulling stress of the flexible circuit board 4.

[0050] In some embodiments, the thickness of the support film 2 is between 0.15 mm and 0.25 mm. For example, the thickness of the driving chip 3 is 0.2 mm, and the thickness of the support film 2 is 0.15 mm or 0.2 mm.

[0051] In some embodiments, the support film 2 includes organic polymers, such as PET (Polyethyleneterephthalate), etc. The support film 2 may also include other materials, as long as the support film 2 can withstand the tensile stress of the flexible circuit board 4, which is not specifically limited here.

[0052] In some embodiments, the display module further includes a polarizer, and the polarizer is located on one side of the display panel 1. The polarizer may be located in the display area 11 of the display panel 1.

[0053] In some embodiments, the display panel 1 may include a substrate, a driving circuit layer, an anode layer, a pixel definition layer, a light-emitting unit, a cathode layer and an encapsulation layer. The driving circuit layer is located on one side of the substrate, the anode layer is located on the side of the driving circuit layer away from the substrate, and the pixel definition layer is located on the side of the anode layer away from the substrate and covers the driving circuit layer. The anode layer includes a plurality of anodes distributed in an array, the pixel definition layer includes a plurality of sub-pixel openings distributed in an array, and the plurality of sub-pixel openings are arranged one-to-one with the plurality of anodes, and the light-emitting unit is located in the sub-pixel opening. The cathode layer is located on the side of the pixel definition layer away from the substrate and covers the light-emitting unit in the sub-pixel opening, and the encapsulation layer is located on the side of the cathode layer away from the substrate. It should be noted that the display panel 1 may also include other film layers, which are not specifically limited here.

[0054] In some embodiments, the driving circuit layer may include a buffer layer, an active layer, a first driving insulating layer, a first gate, a second driving insulating layer, a second gate, an interlayer dielectric layer, a source and a drain, a first flat layer, and a second flat layer, which are sequentially arranged between the substrate and the anode layer. The source and the drain penetrate the interlayer dielectric layer, the second driving insulating layer, and the first driving insulating layer and are connected to the active layer. The anode layer penetrates the second flat layer and the first flat layer and is connected to the source and the drain. It should be noted that the driving circuit layer may also include other film layers, which are not specifically limited here.

[0055] In some embodiments, the encapsulation layer may include a first encapsulation sublayer, a second encapsulation sublayer, and a third encapsulation sublayer arranged in sequence. The first encapsulation sublayer and the third encapsulation sublayer may be vapor deposition layers, and the second encapsulation sublayer may be an inkjet printing layer. It should be noted that the encapsulation layer may also include other film layers, which are not specifically limited here.

[0056] According to the display module provided in the embodiment of the present application, a support film is provided in the non-display area of ​​the display panel, so that when the printed circuit board is connected to the non-display area of ​​the display panel through the flexible circuit board, the display panel can withstand the tensile stress of the flexible circuit board under the action of the support film without warping, thereby improving the adsorption effect of the display panel on the vacuum adsorption platform and improving the yield and utilization rate of the display module.

[0057] Accordingly, an embodiment of the present application further provides a display device, comprising the display module in the above embodiment. The display module comprises:

[0058] The display panel 1 comprises a display area 11 and a non-display area 12 located on one side of the display area 11;

[0059] A supporting film 2 is located in a non-display area 12 of the display panel 1;

[0060] A flexible circuit board 4 connected to the non-display area 12 of the display panel 1;

[0061] A printed circuit board 5 connected to the flexible circuit board 4;

[0062] Wherein, the display panel 1 is in a flat state under the action of the support film 2 .

[0063] According to the display device provided in the embodiment of the present application, a support film is provided in the non-display area of ​​the display panel, so that when the printed circuit board is connected to the non-display area of ​​the display panel through the flexible circuit board, the display panel can withstand the tensile stress of the flexible circuit board under the action of the support film without warping, thereby improving the adsorption effect of the display panel on the vacuum adsorption platform and improving the yield and utilization rate of the display module.

[0064] In some embodiments, the display module further includes a driving chip 3 , and the driving chip 3 is connected to the non-display area 12 of the display panel 1 .

[0065] In some embodiments, the non-display area 12 includes a first binding area 121 , the supporting film 2 includes a first hollow area 21 , the orthographic projection of the first hollow area 21 on the display panel 1 covers the first binding area 121 , and the driving chip 3 is connected to the first binding area 121 .

[0066] In some embodiments, the non-display area 12 further includes a second binding area 122, and the supporting film 2 further includes a second hollow area 22, and the orthographic projection of the second hollow area 22 on the display panel 1 covers the second binding area 122. The flexible circuit board 4 is connected to the second binding area 122.

[0067] In some embodiments, the non-display area 12 further includes a bending area located on one side of the display area 11, and the first binding area 121 and the second binding area 122 are both located on the side of the bending area away from the display area 11. The supporting film 2 further includes a third hollow area, and the orthographic projection of the third hollow area on the display panel 1 covers the bending area.

[0068] In some embodiments, the Young's modulus of the support film 2 is greater than the Young's modulus of the flexible circuit board 4 .

[0069] In some embodiments, the Young's modulus of the support film 2 is between 2000 MPa and 4000 MPa.

[0070] In some embodiments, the thickness of the supporting film 2 is not greater than the thickness of the driving chip 3 .

[0071] In some embodiments, the thickness of the support film 2 is between 0.15 mm and 0.25 mm.

[0072] In some embodiments, the support film 2 includes an organic high molecular polymer.

[0073] The display device provided in the embodiment of the present application can be applied to any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, etc.

[0074] The terms "first", "second", etc. in the specification and claims of this application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are generally of the same type, and the number of objects is not limited. For example, the first object can be one or more.

[0075] In the description of the present application, “plurality” means two or more.

[0076] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0077] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that: include: The display panel comprises a display area and a non-display area located on one side of the display area; A supporting film, located in a non-display area of ​​the display panel; A flexible circuit board connected to a non-display area of ​​the display panel; A printed circuit board connected to the flexible circuit board; Wherein, the display panel is in a flat state under the action of the supporting film.

2. The display module according to claim 1, characterized in that: The non-display area includes a first binding area, the supporting film includes a first hollow area, and the orthographic projection of the first hollow area on the display panel covers the first binding area; The display module further includes a driving chip, and the driving chip is connected to the first binding area.

3. The display module according to claim 2, characterized in that: The non-display area further includes a second binding area, the supporting film further includes a second hollow area, and the orthographic projection of the second hollow area on the display panel covers the second binding area; The flexible circuit board is connected to the second binding area.

4. The display module according to claim 3, characterized in that: The non-display area further includes a bending area located at one side of the display area, and the first binding area and the second binding area are both located at a side of the bending area away from the display area; The supporting film further includes a third hollow area, and the orthographic projection of the third hollow area on the display panel covers the bending area.

5. The display module according to any one of claims 1 to 4, characterized in that: The Young's modulus of the supporting film is greater than the Young's modulus of the flexible circuit board.

6. The display module according to claim 5, characterized in that: The Young's modulus of the support film is between 2000 MPa and 4000 MPa.

7. The display module according to any one of claims 2 to 4, characterized in that: The thickness of the supporting film is not greater than the thickness of the driving chip.

8. The display module according to claim 7, characterized in that: The thickness of the support film is between 0.15 mm and 0.25 mm.

9. The display module according to any one of claims 1 to 4, characterized in that: The supporting film comprises an organic high molecular polymer.

10. A display device, characterized in that: Comprising a display module as described in any one of claims 1-9.

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