Pressure sensor and electronic device

Abstract

The utility model provides a pressure sensor and electronic equipment. The pressure sensor comprises a first PCB in which a gas channel is formed, and the gas channel penetrates through a first outer wall surface and a second outer wall surface of the first PCB; and the sensor wafer is arranged on the first outer wall surface of the first PCB, the sensor wafer is electrically connected with the first PCB, the detection part of the sensor wafer directly faces the gas channel, and the sensor wafer is used for pressure detection. According to the pressure sensor provided by the invention, the sensor wafer can directly detect the external gas pressure through the gas channel on the first PCB without additionally arranging a gas nozzle, so that the structure of the pressure sensor is simplified.

Description

Technical Field

[0001] The present application relates to the technical field of pressure sensors, and in particular to pressure sensors and electronic devices. Background Art

[0002] A pressure sensor is a device used to measure the pressure of a medium such as a gas or liquid. They are widely used in industries such as industry, automotive, medical, aerospace, etc. to monitor and control pressure changes in the system.

[0003] When packaging the pressure sensor in the related art, the pressure sensor wafer is generally fixed on the air nozzle housing, and then a metal housing is placed outside for protection, which results in a high cost of the pressure sensor. Utility Model Content

[0004] The embodiments of the present application provide a pressure sensor and an electronic device, which can improve the technical problem of high packaging cost of the pressure sensor.

[0005] In a first aspect, an embodiment of the present application provides a pressure sensor, comprising:

[0006] A first PCB board is formed with a gas channel, wherein the gas channel runs through a first outer wall surface and a second outer wall surface of the first PCB board;

[0007] A sensor wafer is arranged on the first outer wall surface of the first PCB board. The sensor wafer is electrically connected to the first PCB board. A detection portion of the sensor wafer faces the gas channel. The sensor wafer is used for pressure detection.

[0008] In one embodiment, the pressure sensor includes a second PCB board, the second PCB board is covered on the first PCB board, and the sensor wafer is located between the first PCB board and the second PCB board.

[0009] In one embodiment, a mounting cavity is formed between the second PCB board and the first PCB board, the sensor wafer is mounted in the mounting cavity, and a vent hole is formed on the second PCB board, and the vent hole and the gas channel are both connected to the mounting cavity.

[0010] In one embodiment, a groove is formed on the second PCB board and / or the first PCB board, and the sensor wafer is mounted in the groove.

[0011] In one embodiment, a gap is provided between the sensor wafer and the second PCB board.

[0012] In one embodiment, the pressure sensor includes a dustproof member, and the dustproof member covers the vent hole.

[0013] In one embodiment, the pressure sensor includes a flexible waterproof membrane, the flexible waterproof membrane is sealed and connected to the second outer wall surface, a sealed cavity is formed between the flexible waterproof membrane and the second outer wall surface, and the gas channel is connected to the sealed cavity.

[0014] In one embodiment, a cross-sectional area of ​​the gas channel gradually decreases along a direction from the second outer wall surface to the first outer wall surface.

[0015] In one embodiment, the pressure sensor includes a wireless radio frequency wafer, the wireless radio frequency wafer is mounted on the first PCB board, the wireless radio frequency wafer is electrically connected to the sensor wafer, and the wireless radio frequency wafer is suitable for sending detection data of the sensor wafer to the terminal.

[0016] In a second aspect, an embodiment of the present application provides an electronic device, comprising the above-mentioned pressure sensor.

[0017] Beneficial effects of the embodiments of the present application:

[0018] In an embodiment of the present application, a gas channel is formed at the first PCB board, and then the sensor wafer is mounted on the gas channel. The gas channel is used to directly transmit the external gas or gas pressure to the detection part of the sensor wafer, so that the sensor wafer can directly detect the external gas pressure through the gas channel on the first PCB board without the need to additionally set up a gas nozzle, thereby simplifying the structure of the pressure sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 This is one of the flow charts of the packaging method of the waterproof pressure sensor provided in the embodiment of the present application;

[0021] Figure 2 This is the second flow chart of the packaging method of the waterproof pressure sensor provided in the embodiment of the present application;

[0022] Figure 3 is a schematic diagram of the structure of a pressure sensor provided in an embodiment of the present application;

[0023] Figure 4 is one of the cross-sectional views of the pressure sensor provided in the embodiment of the present application;

[0024] Figure 5This is the second cross-sectional view of the pressure sensor provided in the embodiment of the present application. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise stated, the directional words such as "upper" and "lower" used generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; while "inside" and "outside" refer to the outline of the device.

[0026] Combine the following Figures 1 to 5 The pressure sensor and electronic device of the present application are described.

[0027] According to the embodiment of the first aspect of the present application, Figure 1 , the packaging methods of waterproof pressure sensors include:

[0028] Step 101 : forming a gas channel 11 on a first PCB board 1 , wherein the gas channel 11 runs through the first PCB board 1 .

[0029] It can be understood that by directly forming the gas channel 11 on the first PCB board 1, the gas can directly pass through the gas channel 11 on the first PCB board 1 from one side to the other side of the first PCB board 1. When the sensor wafer 2 is subsequently mounted on the first PCB board 1, the sensor wafer 2 can directly detect the external pressure through the gas channel 11, making the structure of the sensor simpler.

[0030] It is understandable that the first PCB board 1 may be punched by a punching device or any other suitable device to form a gas channel 11 on the first PCB board 1 .

[0031] Step 102 , obtaining a sensor wafer 2 , and mounting the sensor wafer 2 on one side of the first PCB board 1 , so that a detection portion of the sensor wafer 2 faces the gas channel 11 .

[0032] It can be understood that the sensor wafer 2 is installed on one side of the first PCB board 1, and the detection part of the sensor wafer 2 is facing the gas channel 11, so that the external gas pressure can directly act on the detection component of the sensor wafer 2 through the gas channel 11, so that the sensor wafer 2 can directly detect the external pressure.

[0033] It can be understood that the gas channel 11 runs through the side of the first PCB where the sensor wafer 2 is mounted, so that external gas or pressure can directly act on the sensor wafer 2 through the gas channel 11 .

[0034] Step 103 , obtaining a second PCB board 3 , and placing the second PCB board 3 on the sensor wafer 2 and connecting the second PCB board 3 to the first PCB board 1 , so as to package the sensor wafer 2 .

[0035] It can be understood that after the sensor wafer 2 is mounted on the first PCB board 1, the sensor wafer 2 is covered by the second PCB board 3, and the first PCB board 1 and the second PCB board 3 are fixedly connected together. That is, the second PCB is used as a cover to cover the sensor wafer 2 to package the sensor wafer 2.

[0036] According to the packaging method of the waterproof pressure sensor of the present application, when packaging the sensor wafer 2 to form the pressure sensor, a gas channel 11 is first formed at the first PCB board 1, and then the sensor wafer 2 is mounted on the gas channel 11, and the gas channel 11 is used to directly transmit the external gas or gas pressure to the detection part of the sensor wafer 2, so that the sensor wafer 2 can directly detect the external gas pressure through the gas channel 11 on the first PCB board 1, without the need to additionally set up a gas nozzle, thereby simplifying the structure of the pressure sensor. At the same time, the second PCB board 3 is covered on the sensor wafer 2 to realize the packaging of the sensor wafer 2 through the double PCB board. Compared with the metal shell on the sensor wafer 2, the cost of the PCB board is lower and easier to operate, which can effectively reduce the packaging cost of the pressure sensor. That is, the present application can effectively reduce the packaging cost of the pressure sensor by packaging the sensor wafer 2 with the double PCB board, and by directly forming the gas channel 11 on the PCB board for the sensor wafer 2 to detect the external pressure, the structure of the pressure sensor is simplified, and the volume and manufacturing cost of the pressure sensor can be effectively reduced.

[0037] It is understandable that after the second PCB board 3 is covered on the sensor wafer 2 , the second PCB board 3 and the first PCB board 1 are connected together using the existing packaging process, so that the packaging operation of the sensor wafer 2 can be achieved.

[0038] It is understandable that the second PCB board 3 can protect the sensor wafer 2 and the gold wire of the sensor wafer 2, and the first PCB substrate can be used to support the sensor wafer 2, the gold wire and the copper wire. Through the packaging method of the double PCB board of the present application, there is no need to set a shielding cover such as a metal shell on the sensor wafer 2, which can effectively save costs.

[0039] It is understandable that in the related art, the sensor wafer 2 is fixed on the gas nozzle housing, or fixed on the substrate, and then covered with a metal housing for protection. The structure is relatively complex, and the production process is relatively cumbersome, resulting in high costs. However, the present application directly opens a gas channel 11 on the first PCB board 1, omitting the gas nozzle housing structure, simplifying the structure of the pressure sensor, and reducing the volume of the pressure sensor. At the same time, the second PCB board 3 is used to cover and package the sensor wafer 2, eliminating the metal housing structure, thereby effectively reducing the packaging cost of the pressure sensor.

[0040] In one embodiment of the present application, Figure 2 , mounting the sensor wafer 2 on one side of the first PCB board 1, including:

[0041] Step 201, attaching the sensor wafer 2 to the first PCB board 1;

[0042] Step 202, electrically connecting the sensor wafer 2 to the first PCB board 1;

[0043] Step 203 , fixedly connecting the sensor wafer 2 to the first PCB board 1 .

[0044] It is understandable that when the sensor wafer 2 is mounted on one side of the first PCB board 1, the sensor wafer 2 is attached to the first PCB board 1 so that the sensor wafer 2 is set close to the first PCB board 1. The first PCB board 1 can support the sensor wafer 2. Then the sensor wafer 2 and the first PCB board 1 are electrically connected so that the circuits of the sensor wafer 2 and the first PCB board 1 are electrically connected together, so that the first PCB board 1 can obtain the detection data of the sensor wafer 2, so that the packaged pressure sensor can work normally. Then the sensor wafer 2 and the first PCB board 1 are fixedly connected together so that the sensor wafer 2 remains stable, so that the detection part of the sensor wafer 2 always remains facing the gas channel 11, and the accuracy of the detection of the sensor wafer 2 is ensured.

[0045] It is understandable that the sensor wafer 2 and the first PCB board 1 can be fixedly connected together by welding, bonding or any other suitable method.

[0046] In one embodiment of the present application, before the second PCB board 3 is covered on the sensor wafer 2 and connected to the first PCB board 1, the method includes:

[0047] The second PCB board 3 is punched to obtain a vent hole 31 , and the vent hole 31 is communicated with the gas channel 11 .

[0048] It is understandable that before the second PCB board 3 is used to cover the sensor wafer 2, the second PCB board 3 is first punched to obtain the vent hole 31 connected to the gas channel 11 on the second PCB board 3. When the external gas flows to the sensor wafer 2 through the gas channel 11, the gas pressure acts on the detection part of the sensor wafer 2. Since the gas channel 11 and the vent hole 31 are connected, the gas can flow from the gas channel 11 to the vent hole 31, and then flow from the vent hole 31 to the outside, ensuring that the gas can flow smoothly and ensuring that the external gas or pressure can act on the sensor wafer 2 smoothly.

[0049] It can be understood that the vent hole 31 runs through the second PCB board 3 , ensuring that the gas can return to the outside through the vent hole 31 .

[0050] In one embodiment of the present application, a method for packaging a waterproof pressure sensor includes:

[0051] A waterproof membrane is obtained, and the waterproof membrane is sealed and connected to a side of the first PCB board 1 facing away from the sensor wafer 2 , wherein the gas channel 11 is located between the waterproof membrane and the sensor wafer 2 .

[0052] It can be understood that when the sensor wafer 2 is packaged, the waterproof film is sealed and connected to the side of the first PCB board 1 facing away from the sensor wafer 2, so that the waterproof film covers the gas channel 11, making it impossible for external water vapor to enter the gas channel 11 through the side of the first PCB board 1 facing away from the sensor wafer 2, that is, water vapor cannot enter the sensor wafer 2 through the gas channel 11, thereby avoiding the pressure sensor from short-circuiting due to moisture, and improving the waterproof performance of the pressure sensor.

[0053] It can be understood that since the waterproof membrane will deform when subjected to pressure, when the waterproof membrane is subjected to external gas or liquid pressure, the waterproof membrane will deform in the direction close to the sensor wafer 2. At this time, the waterproof membrane will squeeze the gas between the waterproof membrane and the first PCB board 1, so that the sensor wafer 2 can detect the pressure. That is, the waterproof membrane can improve the waterproof performance of the pressure sensor while transmitting the external pressure to the sensor wafer 2, so that the pressure sensor can detect the external pressure.

[0054] According to an embodiment of the second aspect of the present application, Figure 3 and Figure 4 , the pressure sensor includes:

[0055] The first PCB board 1 is formed with a gas channel 11, and the gas channel 11 runs through the first outer wall surface and the second outer wall surface of the first PCB board 1;

[0056] The sensor wafer 2 is disposed on the first outer wall surface of the first PCB board 1 . The sensor wafer 2 is electrically connected to the first PCB board 1 . The detection portion of the sensor wafer 2 faces the gas channel 11 . The sensor wafer 2 is used for pressure detection.

[0057] According to the pressure sensor of the present application, a gas channel 11 is formed at the first PCB board 1, and then the sensor wafer 2 is mounted on the gas channel 11. The gas channel 11 is used to directly transmit the external gas or gas pressure to the detection part of the sensor wafer 2, so that the sensor wafer 2 can directly detect the external gas pressure through the gas channel 11 on the first PCB board 1 without the need to additionally set up a gas nozzle, thereby simplifying the structure of the pressure sensor.

[0058] It is understandable that the pressure sensor in the related art generally fixes the pressure sensing wafer on the gas nozzle housing, which has a relatively complex structure and a relatively troublesome production process. However, the present application directly opens the gas channel 11 on the first PCB board 1, omits the gas nozzle housing structure, simplifies the structure of the pressure sensor, and can save costs.

[0059] In one embodiment of the present application, Figure 4 and Figure 5 The pressure sensor includes a second PCB board 3 , the second PCB board 3 is covered on the first PCB board 1 , and the sensor wafer 2 is located between the first PCB board 1 and the second PCB board 3 .

[0060] It can be understood that the second PCB board 3 is covered on the sensor wafer 2 to realize the packaging of the sensor wafer 2 through double PCB boards. Compared with setting a metal shell on the sensor wafer 2, the PCB board has lower cost and is easier to operate, which can effectively reduce the packaging cost of the pressure sensor.

[0061] It is understandable that after the second PCB board 3 is covered on the sensor wafer 2 , the second PCB board 3 and the first PCB board 1 are connected together using the existing packaging process, so that the packaging operation of the sensor wafer 2 can be achieved.

[0062] In one embodiment of the present application, Figure 4 and Figure 5 An installation cavity 4 is formed between the second PCB board 3 and the first PCB board 1 , the sensor wafer 2 is installed in the installation cavity 4 , and a vent hole 31 is formed on the second PCB board 3 , and the vent hole 31 and the gas channel 11 are both connected to the installation cavity 4 .

[0063] It can be understood that a mounting cavity 4 is formed between the first PCB board 1 and the second PCB board 3, so that the sensor wafer 2 can be mounted between the first PCB board 1 and the second PCB board 3. At the same time, a vent hole 31 is formed on the second PCB board 3, so that the vent hole 31 is connected to the gas channel 11, so that when the external gas flows to the sensor wafer 2 through the gas channel 11, the gas pressure acts on the detection part of the sensor wafer 2. Since the gas channel 11 and the vent hole 31 are connected, the gas can flow from the gas channel 11 to the vent hole 31, and then flow from the vent hole 31 to the outside, ensuring that the gas can flow smoothly, ensuring that the external gas or pressure can act on the sensor wafer 2 smoothly.

[0064] In one embodiment of the present application, a gap is provided between the sensor wafer 2 and the second PCB board 3 .

[0065] It is understandable that a gap is left between the sensor wafer 2 and the second PCB board 3 so that the sensor wafer 2 has a deformation space, and the sensor wafer 2 can better cope with the deformation caused by pressure, so that the sensor wafer 2 can better detect the gas pressure.

[0066] It can be understood that the gap refers to the gap between the side of the sensor wafer 2 facing the second PCB board 3 and the second PCB board 3 .

[0067] In one embodiment of the present application, Figure 4 and Figure 5 The pressure sensor includes a dustproof member 5 , and the dustproof member 5 covers the vent hole 31 .

[0068] It is understandable that by providing the dustproof member 5 on the vent hole 31 , the dustproof member 5 can prevent external dust from entering the vent hole 31 , that is, can prevent external dust from entering the sensor wafer 2 , thereby avoiding the sensor wafer 2 from being affected.

[0069] In one embodiment of the present application, a groove is formed on the second PCB board 3 and / or the first PCB board 1 , and the sensor wafer 2 is mounted in the groove.

[0070] It can be understood that by forming a groove on the first PCB board 1 and / or the first PCB board 1 and installing the sensor wafer 2 in the groove, the groove can play a certain limiting role on the sensor wafer 2.

[0071] In one embodiment of the present application, Figure 4 and Figure 5 The pressure sensor includes a flexible waterproof membrane 6, which is sealed and connected to the second outer wall surface. A sealed cavity is formed between the flexible waterproof membrane 6 and the second outer wall surface, and the gas channel 11 is connected to the sealed cavity.

[0072] It can be understood that a flexible waterproof membrane 6 is sealed and connected to the second outer wall surface of the first PCB board 1, that is, the flexible waterproof membrane 6 can cover the gas channel 11, so that external water vapor cannot enter the gas channel 11 through the second outer wall surface, that is, water vapor cannot enter the sensor wafer 2 through the gas channel 11, thereby avoiding the pressure sensor from short-circuiting due to moisture, etc., thereby improving the waterproof performance of the pressure sensor.

[0073] It can be understood that since the flexible waterproof membrane 6 will deform when subjected to pressure, when the flexible waterproof membrane 6 is subjected to external gas or liquid pressure, the flexible waterproof membrane 6 will deform in the direction close to the sensor wafer 2. At this time, the flexible waterproof membrane 6 will squeeze the gas between the flexible waterproof membrane 6 and the second outer wall surface, so that the sensor wafer 2 can detect the pressure. That is, the flexible waterproof membrane 6 can improve the waterproof performance of the pressure sensor while transmitting the external pressure to the sensor wafer 2, so that the pressure sensor can detect the external pressure.

[0074] In one embodiment of the present application, the cross-sectional area of ​​the gas channel 11 gradually decreases along the direction from the second outer wall surface to the first outer wall surface.

[0075] It is understandable that the cross-sectional area of ​​the gas channel 11 is designed to be smaller as it is closer to the sensor wafer 2 , so that the gas channel 11 can concentrate the gas to the detection part of the sensor wafer 2 , thereby ensuring the detection accuracy of the sensor wafer 2 .

[0076] Exemplarily, the gas channel 11 is, for example, a trumpet-shaped gas channel 11 .

[0077] In one embodiment of the present application, the pressure sensor includes a wireless RF wafer, which is mounted on a first PCB board 1 and is electrically connected to a sensor wafer 2 . The wireless RF wafer is suitable for sending detection data of the sensor wafer 2 to a terminal.

[0078] It is understandable that the sensor wafer 2 sends the detection data to the wireless RF wafer, and the wireless RF wafer can send the pressure data to the main control device through the external antenna. In this embodiment, the wireless RF wafer and the sensor wafer 2 are integrated on the first PCB board 1, which improves the integration of the pressure sensor, combines multiple functions into one chip, meets the actual needs of customers, facilitates product application, and reduces packaging costs and product volume. The product can be miniaturized.

[0079] It is understandable that the digital conditioning wafer and the MCU can also be integrated into the first PCB board 1, and the sensor wafer 2, the digital conditioning wafer, the MCU and the wireless RF wafer are electrically connected in sequence. The digital conditioning wafer processes the detection data of the sensor wafer 2 and sends it to the MCU, and then the MCU sends the data to the wireless RF wafer, so that the wireless RF wafer can send the pressure data to the main control device through an external antenna, further improving the integration of the pressure sensor.

[0080] According to an embodiment of the third aspect of the present application, an electronic device includes the above-mentioned pressure sensor.

[0081] According to the electronic device of the present application, a gas channel 11 is formed at the first PCB board 1, and then the sensor wafer 2 is mounted on the gas channel 11. The gas channel 11 is used to directly transmit the external gas or gas pressure to the detection part of the sensor wafer 2, so that the sensor wafer 2 can directly detect the external gas pressure through the gas channel 11 on the first PCB board 1 without the need to additionally set up a gas nozzle, thereby simplifying the structure of the pressure sensor.

[0082] The embodiments of the present application are introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method and core idea of ​​the present application. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A pressure sensor, characterized in that: include: A first PCB board is formed with a gas channel, wherein the gas channel runs through a first outer wall surface and a second outer wall surface of the first PCB board; A sensor wafer is arranged on the first outer wall surface of the first PCB board. The sensor wafer is electrically connected to the first PCB board. A detection portion of the sensor wafer faces the gas channel. The sensor wafer is used for pressure detection.

2. The pressure sensor according to claim 1, characterized in that: The pressure sensor includes a second PCB board, the second PCB board is covered on the first PCB board, and the sensor wafer is located between the first PCB board and the second PCB board.

3. The pressure sensor according to claim 2, characterized in that: An installation cavity is formed between the second PCB board and the first PCB board, the sensor wafer is installed in the installation cavity, and a vent hole is formed on the second PCB board, and the vent hole and the gas channel are both connected to the installation cavity.

4. The pressure sensor according to claim 2, characterized in that: The second PCB board and / or the first PCB board is formed with a groove, and the sensor wafer is installed in the groove.

5. The pressure sensor according to claim 2, characterized in that: A gap is provided between the sensor wafer and the second PCB board.

6. The pressure sensor according to claim 3, characterized in that: The pressure sensor comprises a dustproof member, and the dustproof member covers the vent hole.

7. The pressure sensor according to any one of claims 1 to 6, comprises a flexible waterproof membrane, wherein the flexible waterproof membrane is sealed and connected to the second outer wall surface, a sealed cavity is formed between the flexible waterproof membrane and the second outer wall surface, and the gas channel is connected to the sealed cavity.

8. The pressure sensor according to any one of claims 1 to 6, characterized in that: The cross-sectional area of ​​the gas channel gradually decreases along the direction from the second outer wall surface to the first outer wall surface.

9. The pressure sensor according to any one of claims 1 to 6, wherein the pressure sensor comprises a wireless radio frequency wafer, wherein the wireless radio frequency wafer is mounted on the first PCB board, wherein the wireless radio frequency wafer is electrically connected to the sensor wafer, and wherein the wireless radio frequency wafer is suitable for sending detection data of the sensor wafer to a terminal.

10. An electronic device, characterized in that: Comprising the pressure sensor according to any one of claims 1 to 9.

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