Semiconductor heat transfer assembly and aerosol-generating device

Abstract

The embodiment of the utility model provides a semiconductor heat transfer assembly and an aerosol generating device. The semiconductor heat transfer assembly comprises a holder; a first conductive connector independent of the holder; a first conductive part and a second conductive part are arranged on the conductive carrier; the semiconductor assembly comprises an N-type semiconductor electrically connected with the first conductive part and a P-type semiconductor electrically connected with the second conductive part, and the N-type semiconductor and the P-type semiconductor in the semiconductor assembly are connected in series through a first conductive connecting piece; the holder is used for providing an acting force for clamping the first conductive connector and the semiconductor assembly between the holder and the conductive carrier; wherein the semiconductor assembly is configured to transfer at least a portion of heat on the holder to the electrically conductive carrier to heat the aerosol-generating article through the electrically conductive carrier.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of aerosol generation by heating without burning, and in particular to a semiconductor heat transfer component and an aerosol generating device. Background Art

[0002] Smoking articles (eg, cigarettes, cigars, etc.) burn tobacco during use to produce tobacco smoke. People have attempted to replace these tobacco-burning articles by creating products that release compounds without combustion.

[0003] An example of such a product is a heating device, which releases a compound by heating rather than burning a material. For example, the material may be an aerosol-generating article containing tobacco or other non-tobacco products, which may or may not contain nicotine.

[0004] The known heating device includes a heater, which uses the heater to generate a large amount of heat to heat the tobacco product. When the heater releases heat, the heat can only be transferred from the heater to the outside world. The heat transferred to the outside world includes two parts: one is the heat transferred to the tobacco product, which is absorbed and used by the tobacco product, so that the tobacco product produces smoke; the other is the heat dissipated to the environment, which cannot be absorbed and used by the tobacco product and belongs to heat loss. Usually, to bake a tobacco product, the heater needs to provide 1000J-1400J of heat, but the heat actually absorbed and used by the tobacco product is about 300J-350J. It can be seen that the heat utilization rate is less than 35%, and in some cases the utilization rate is even less than 25%. Utility Model Content

[0005] The present application provides a semiconductor heat transfer component and an aerosol generating device, which can improve energy utilization and facilitate assembly.

[0006] One embodiment of the present application provides a semiconductor heat transfer component, comprising:

[0007] Retaining parts;

[0008] a first conductive connecting member, independent of the retaining member;

[0009] a conductive carrier, on which a first conductive portion and a second conductive portion are disposed; and

[0010] A semiconductor component, comprising an N-type semiconductor electrically connected to the first conductive portion and a P-type semiconductor electrically connected to the second conductive portion, wherein the N-type semiconductor and the P-type semiconductor in the semiconductor component are connected in series via the first conductive connector;

[0011] The retaining member is used to provide a force to clamp the first conductive connector and the semiconductor component between the retaining member and the conductive carrier; wherein the semiconductor component is used to transfer at least part of the heat on the retaining member to the conductive carrier to heat the aerosol generating product through the conductive carrier.

[0012] One embodiment of the present application provides a semiconductor heat transfer component, comprising:

[0013] a first conductive connector;

[0014] A conductive carrier, comprising a flexible film, on which a first conductive portion and a second conductive portion are provided, and the flexible film is bent into a tube shape, in which opposite ends of the flexible film in a circumferential direction are overlapped and connected in the tube formed by bending the flexible film; and

[0015] A semiconductor component, comprising an N-type semiconductor electrically connected to the first conductive portion and a P-type semiconductor electrically connected to the second conductive portion, wherein the N-type semiconductor and the P-type semiconductor in the semiconductor component are connected in series via the first conductive connector;

[0016] The semiconductor component is used to transfer at least part of the heat on the holder to the conductive carrier, so as to heat the aerosol generating article through the conductive carrier.

[0017] One embodiment of the present application provides an aerosol generating device, comprising a first heat transfer component and a power supply component, wherein the first heat transfer component comprises the semiconductor heat transfer component, the positive electrode of the power supply component is electrically connected to the first conductive part, and the negative electrode is electrically connected to the second conductive part.

[0018] The above-mentioned semiconductor heat transfer component and aerosol generating device include a retaining member, a first conductive connecting member, a conductive carrier and a semiconductor component, the conductive carrier includes a first conductive part and a second conductive part, the semiconductor component includes an N-type semiconductor electrically connected to the first conductive part and a P-type semiconductor electrically connected to the second conductive part, and the N-type semiconductor and the P-type semiconductor in the semiconductor component are connected in series with each other through the first conductive connecting member.

[0019] Thus, when the first conductive part and the second conductive part obtain electricity, the semiconductor component can transfer at least part of the heat on the retaining member to the conductive carrier, so that the heat is gathered from the retaining member to the conductive carrier, and then the aerosol generating product is heated by the conductive carrier; this heating process is different from the situation in which the heat in the traditional heating method can only diffuse to the outside world. In this scheme, there is also heat transferred from the outside world, and the semiconductor heat transfer component can also directly heat the aerosol generating product, thereby greatly improving the heat utilization rate of the entire system.

[0020] At the same time, the first conductive connector is independent of the retaining member. Compared with forming the first conductive connector and the retaining member into an integral structure, when setting the retaining member, there is no need to align the conductive carrier fixed on the retaining member with the N-type semiconductor and the P-type semiconductor in the conductive carrier at the same time, thereby facilitating the assembly of the semiconductor heat transfer component, improving the assembly efficiency of the semiconductor heat transfer component, and preventing the electrical connection between the N-type semiconductor and the P-type semiconductor in the conductive carrier from being unstable. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.

[0022] Figure 1 is a schematic diagram of an aerosol generating device provided by an embodiment;

[0023] Figure 2 is a schematic diagram of some steps for forming a semiconductor heat transfer assembly provided by an embodiment;

[0024] Figure 3 is a schematic diagram of a plurality of semiconductor components connected in series in a semiconductor heat transfer component provided by an embodiment;

[0025] Figure 4 It is a schematic diagram of a semiconductor heat transfer assembly provided by an embodiment in which multiple semiconductor assemblies are connected in parallel with each other;

[0026] Figure 5 is a schematic diagram of a semiconductor heat transfer assembly provided in another embodiment in which multiple semiconductor assemblies are connected in parallel;

[0027] Figure 6 is a schematic diagram of a process of joining a semiconductor heat transfer component and a retaining member provided by an embodiment;

[0028] Figure 7 is a schematic diagram of a process of joining a semiconductor heat transfer assembly and a retaining member provided by another embodiment;

[0029] Figure 8 is a schematic diagram of a semiconductor heat transfer assembly provided by an embodiment;

[0030] Fig. 9 is a top view of a semiconductor heat transfer assembly provided by an embodiment;

[0031] Fig.10 is a schematic diagram of the connection between a first heat transfer component and a second heat transfer component provided by an embodiment;

[0032] Fig.11is a schematic diagram of a first heat transfer component, a second heat transfer component and a power supply component provided by an embodiment;

[0033] Fig.12 is a schematic diagram of the electrical connection between the first heat transfer component and the second heat transfer component and the power supply component provided by an embodiment;

[0034] Fig.13 is a schematic diagram of at least one first section of a conductive connection member extending longitudinally in a semiconductor heat transfer assembly provided by an embodiment;

[0035] In the figure:

[0036] 1. Aerosol-generating product; 11. Aerosol-forming substrate;

[0037] 2. Power supply assembly; 21. Power supply; 22. Circuit board;

[0038] 3. First heat transfer component; 31. Heat receiving end; 32. Heat transfer component; 33. Heat providing end; 34. Holder; 35. First conductive connector; 36. Semiconductor component; 37. Conductive carrier; 38. Heat pipe; 39. Conductive slurry;

[0039] 4. Second heat transfer component; 41. Second conductive connector; 421. Fourth conductive portion; 422. Fifth conductive portion. DETAILED DESCRIPTION

[0040] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only one area embodiment of the present application, not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0041] The terms "first", "second", "third" in the present application are only used for descriptive purposes, and cannot be interpreted as indicating or suggesting relative importance or implicitly indicating the quantity or order of the indicated technical features. In the present application embodiment, all directional indications (such as up, down, left, right, front, back ...) are only used to explain the relative position relationship or movement conditions between the components under a certain posture (as shown in the accompanying drawings), and if the posture changes, the directional indication also changes accordingly. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, the process, method, system, product or equipment comprising a series of steps or units is not limited to the steps or units listed, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or equipment.

[0042] Reference to "embodiments" herein means that the features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0043] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be one or more central elements therebetween. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0044] You can refer to Figure 1 One embodiment of the present application provides an aerosol generating device, which is a device that is coupled or interacts with an aerosol generating article 1 to form an inhalable aerosol.

[0045] As used herein, the term "aerosol-generating article" refers to an article comprising an aerosol-forming substrate 11 which, when heated, releases volatile compounds that can form an aerosol. In an embodiment, the aerosol-generating article is removably coupled to an aerosol-generating device. The article may be disposable or reusable.

[0046] The aerosol-forming substrate 11 may include a solid aerosol-forming substrate. The solid aerosol-forming substrate may include a tobacco-containing material containing volatile tobacco flavor compounds released from the aerosol-forming substrate when heated. The solid aerosol-forming substrate may include a non-tobacco material. The solid aerosol-forming substrate may include a tobacco-containing material and a non-tobacco material.

[0047] Aerosol formation matrix 11 can comprise liquid aerosol formation matrix.Liquid aerosol formation matrix can comprise the liquid of tobacco-containing material that contains volatile tobacco flavor component, can also be the liquid that comprises non-tobacco material.Liquid aerosol formation matrix can comprise water, solvent, ethanol, plant extract, spices, flavoring agent or vitamin mixture etc., and spices can comprise betel nut extract, menthol, European mint, green mint oil, various fruity fragrance components etc., but is not limited to this.Flavoring agent can comprise the composition that can provide various fragrance or local flavor to the user.Vitamin mixture can be the mixture that is mixed with at least one in vitamin A, vitamin B, vitamin C and vitamin E, but is not limited to this.

[0048] The aerosol generating device can be an electrically operated device, including a power supply assembly 2, the power supply assembly 2 includes a power supply 21 and a circuit board 22, the power supply 21 can include any suitable battery or battery cell, the circuit board 22 has one or more controllers, and the one or more controllers can control the power output of the power supply 21, such as controlling the sensory prompt in the aerosol generating device to generate sensory signals such as sound, light or vibration, or controlling other operations of the aerosol generating device.

[0049] The power supply assembly 2 may also include a positive electrode electrically connected to the positive electrode of the power supply 21 and a negative electrode electrically connected to the negative electrode of the power supply. Part of the power of the power supply assembly 2 may be output through the positive electrode and the negative electrode. The positive electrode and the negative electrode may be arranged on the circuit board 22, or the positive electrode and the negative electrode may be electrically connected to the circuit board 22. It should be noted that, in other embodiments, part of the power of the power supply assembly 2 may be directly output through the positive electrode and the negative electrode of the power supply 21. For the convenience of description, the power supply assembly 2 outputting power through its positive electrode + and negative electrode - described below includes outputting power through the positive electrode and the negative electrode of the power supply 21, or includes outputting power through the positive electrode and the negative electrode. In other words, the positive electrode + of the power supply assembly 2 described below is the positive electrode or the positive electrode of the power supply 21, and the negative electrode - of the power supply assembly 2 is the negative electrode or the negative electrode of the power supply 21.

[0050] The aerosol generating device includes a first heat transfer component 3, which has a heat receiving end 31, a heat providing end 33 and a heat transfer component 32. The heat transfer component 32 connects the heat receiving end 31 and the heat providing end 33. At least part of the heat on the heat providing end 33 can be transferred to the heat receiving end 31 by the heat transfer component 32, thereby increasing the temperature of the heat receiving end 31. The heat "transfer" mentioned here refers to increasing the heat on the heat receiving end 31 and reducing the heat on the heat providing end 33 in a non-heat transfer manner, and the amount of heat increase on the heat receiving end 31 is related to the amount of heat reduction on the heat providing end 33.

[0051] When the aerosol generating article 1 is coupled to the aerosol generating device, the first heat transfer component 3 is capable of being coupled to at least a portion of the aerosol generating article 1. When the first heat transfer component 3 is coupled to the aerosol generating article 1, at least a portion of the heat receiving end 31 is arranged on the outside of the aerosol generating article 1 or inserted into the inside of the aerosol generating article 1.

[0052] It should be noted that, in one embodiment, when the aerosol generating article 1 is coupled to the aerosol generating device, at least a portion of the first heat transfer component 3 is arranged outside the aerosol generating article 1, including: when the aerosol generating article 1 is coupled to the aerosol generating device, at least a portion of the heat receiving end 31 of the first heat transfer component 3 surrounds the circumferential periphery of the aerosol generating article 1. Based on this, as an example, reference can be made to Figure 1 The inner wall surface of the heat receiving end 31 of the first heat transfer component 3 defines at least a portion of the boundary of the accommodating cavity, and the accommodating cavity is used to accommodate at least a portion of the aerosol generating article 1. Alternatively, as an example, at least a portion of the heat receiving end 31 of the first heat transfer component 3 is configured to be tubular, and when the aerosol generating article 1 is coupled to the aerosol generating device, at least a portion of the aerosol generating article 1 is surrounded by the tubular heat receiving end.

[0053] Preferably, when the aerosol generating article 1 is joined to the first heat transfer component 3, at least a portion of the heat receiving end of the first heat transfer component 3 directly contacts the side surface of the aerosol generating article 1, so as to increase the heat transfer efficiency between the heat receiving end 31 and the side surface of the aerosol generating article 1 through direct contact, thereby helping to reduce losses.

[0054] In one embodiment, when the aerosol generating article 1 is coupled to the first heat transfer component 3, at least a portion of the heat receiving end 31 of the first heat transfer component 3 is arranged outside the aerosol generating article 1, including: when the aerosol generating article 1 is coupled to the aerosol generating device, at least a portion of the heat receiving end 31 of the first heat transfer component 3 is located longitudinally below the aerosol generating article 1, so as to be adjacent to the bottom of the aerosol generating article 1. Based on this, as an example, at least a portion of the heat receiving end 31 of the first heat transfer component 3 extends in the radial direction of the aerosol generating article 1, and is able to directly contact and support the bottom of the aerosol generating article 1 when the aerosol generating article 1 is coupled to the aerosol generating device, so as to increase the heat transfer efficiency between the heat receiving end and the bottom of the aerosol generating article 1 through direct contact.

[0055] It should be noted that there is a gap between the surface of the heat receiving end of the first heat transfer component 3 and the surface of the aerosol generating article 1, but the gap is filled with gas and the gap is not greater than 0.5 mm, preferably not greater than 0.15 mm, which still falls within the meaning of "at least part of the heat receiving end is in direct contact with the aerosol generating article 1" as described in the present application. The efficiency of heat transfer is increased through "direct contact", energy loss is reduced, and energy utilization is improved.

[0056] Preferably, when the aerosol generating article 1 is placed in the aerosol generating device, there is no gap or only an air gap of no more than 0.5 mm between at least a portion of the heat receiving end 31 of the first heat transfer component 3 and the aerosol generating article 1, so that the heat receiving end 31 can directly heat the aerosol generating article 1.

[0057] Although the temperature of the heat receiving end 31 of the first heat transfer component 3 is higher than the temperature of the heat providing end 33 thereof when the first heat transfer component 3 is working, the heat is mainly transferred from the heat providing end 33 with a lower temperature to the heat receiving end 31 with a higher temperature due to the heat transfer component 32 transferring heat in a non-heat transfer manner, so that the heat on the heat receiving end 31 can be released more concentratedly in the direction of the aerosol generating product 1. Moreover, a smaller amount of electric energy can maintain a temperature difference between the heat receiving end 31 and the heat providing end 33. Therefore, compared with the traditional heating method in which the heat on the high-temperature element is released to the elements or environment with lower temperatures on the inner and outer sides or the upper and lower sides, it can reduce energy waste and power consumption.

[0058] In one embodiment of the present application, reference may be made to Figure 2-Figure 9 The first heat transfer component 3 includes a semiconductor heat transfer component, which has a holder 34, a first conductive connector 35, a semiconductor component 36 and a conductive carrier 37. One end of the semiconductor component 36 is electrically connected to the conductive carrier 37, and one end is electrically connected to the first conductive connector 35. The semiconductor component 36 can obtain power from the power supply component 2 through the conductive carrier 37. The holder 34 is connected to the first conductive connector 35.

[0059] After the semiconductor heat transfer component is electrically connected to the power supply component 2 and obtains power, the semiconductor component 36 can transfer at least part of the heat on the holder 34 and the first conductive connection member 35 to the conductive carrier 37 based on the Peltier effect, so that the temperature of the conductive carrier 37 increases, and there is a temperature difference between the conductive carrier 37 and the holder and the first conductive connection member 35. Then, the conductive carrier 37 can release heat or radiate infrared rays toward the aerosol generating article 1 in a heat transfer manner, so that the aerosol-forming substrate 11 generates aerosol. Of course, the conductive carrier 37 can also release heat to the air to heat the air, and the heated air flows into the aerosol-forming substrate 11 along the air path and heats the aerosol-forming substrate 11. Among them, the retaining member 34 and / or the first conductive connecting member 35 in the semiconductor heat transfer component are components of the heat providing end 33 of the first heat transfer component 3, the conductive carrier 37 is a component of the heat receiving end 31 of the first heat transfer component 3, and the semiconductor component 36 is a type of heat transfer component 32 of the first heat transfer component 3 or a component of the heat transfer component 32 of the first heat transfer component 3.

[0060] The conductive carrier 37 is provided with a first conductive portion 37A and a second conductive portion 37B, the first conductive portion 37A and the second conductive portion 37B are respectively a positive conductive portion and a negative conductive portion, and the positive conductive portion and the negative conductive portion are respectively used to electrically connect the positive electrode + and the negative electrode - of the power supply component. The semiconductor component 36 includes an N-type semiconductor 361 electrically connected to the first conductive portion 37A and a P-type semiconductor 362 electrically connected to the second conductive portion 37B, so that the N-type semiconductor 361 and the P-type semiconductor 362 in the semiconductor component 36 are respectively electrically connected to the conductive carrier 3, and the first conductive connecting member 35 electrically connects the N-type semiconductor 361 and the P-type semiconductor 362 in the same semiconductor component 36 at the same time, so that the N-type semiconductor 361 and the P-type semiconductor 362 in the same semiconductor component 36 are electrically connected to each other through the first conductive connecting member 35.

[0061] After the power supply component 2 outputs electricity through its positive pole + and negative pole -, at least part of the heat on the retaining member 34 and the first conductive connecting member 35 can be transferred to the conductive carrier 37 through the semiconductor component 36, thereby increasing the temperature of the conductive carrier 37 and making the temperature of the conductive carrier 37 higher than the temperature of the retaining member 34 and the first conductive connecting member 35.

[0062] Specifically, based on the Peltier effect, the semiconductor component 36 can transfer at least part of the heat on the holder 34 and the first conductive connection member 35 to the conductive carrier 37, so that the temperature of the conductive carrier 37 is increased, and a temperature difference is formed between the conductive carrier 37 and the holder 34. In other words, when the semiconductor component 36 is working, the semiconductor component 36 can make the temperature of the conductive carrier 37 higher than the temperature of the first conductive connection member 35 and the holder 34, and the more heat is lost from the first conductive connection member 35 and the holder 34, the more heat is added to the conductive carrier 37. When the semiconductor component 36 is working, at least part of the heat on the first conductive connection member 35 and the holder 34 is transferred to the conductive carrier 37 by the semiconductor component 36 in a non-heat transfer manner, which will reduce the temperature of the first conductive connection member 35 and the holder 34, thereby promoting the temperature of the first conductive connection member 35 and the holder 34 to absorb heat from the external environment, and reducing or inhibiting the first conductive connection member 35 and the holder 34 from losing heat to the external environment through heat transfer, thereby greatly improving energy utilization.

[0063] After testing, it is found that by using the above embodiment of the present application, only about 15J of energy is needed to raise the temperature of the conductive carrier 37 from the ambient temperature to 250°C within 5S, while under the same circumstances, if the existing resistance heating element, electromagnetic heating element or infrared heating element is used for heating, 70-90J of energy is needed. And by using the above embodiment of the present application, only 300J-700J of heat is needed to complete the baking of an aerosol generating product 1. Therefore, the energy and heat utilization rate is greatly improved, and the loss can be greatly reduced.

[0064] The heat transferred between the heat supply end 33 and the heat receiving end 31 basically satisfies the Peltier formula: Q = |Πn-Πp|*I, where Q is the heat, Πn and Πp are the Peltier coefficients of the N-type semiconductor 361 and the P-type semiconductor 362 in the semiconductor component 36, respectively, and I is the current output by the power supply component 2 to the N-type semiconductor 361 and the P-type semiconductor 362 in the semiconductor component. Therefore, the temperature difference between the heat supply end 33 and the heat receiving end 31 and the temperature of the heat receiving end 31 can be adjusted by controlling the output current I of the power supply component 2 to the semiconductor component 36.

[0065] In one embodiment, when the semiconductor heat transfer assembly is coupled to the aerosol-generating article 1 , at least a portion of the conductive carrier 3 is disposed outside of the aerosol-generating article 1 or inserted into the interior of the aerosol-generating article 1 .

[0066] In one embodiment, a plurality of semiconductor components 36 are arranged between the heat supply end 33 and the heat receiving end 31 in the first heat transfer component 3. A conductive carrier 37 is included to electrically connect the plurality of semiconductor components 36; or, one or more semiconductor components 36 among the plurality of semiconductor components 36 are electrically connected to a conductive carrier 37, and one or more semiconductor components 36 are electrically connected to another conductive carrier 37, that is, the conductive carrier 37 has at least two.

[0067] When a conductive substrate 37 is electrically connected to a plurality of semiconductor components 36 at the same time, in one embodiment, reference may be made to Figure 2 and Figure 3, the conductive carrier 37 further includes a plurality of third conductive portions 37C, one third conductive portion 37C electrically connects the N-type semiconductor 361 in one semiconductor component 36, and at the same time electrically connects the P-type semiconductor 362 in another semiconductor component 36, that is, one third conductive portion 37C electrically connects two semiconductor components 36, so that the two semiconductor components 36 electrically connected thereto are connected in series, and so on, the plurality of semiconductor components 36 are connected in series between the first conductive portion 37A and the second conductive portion 37B through the plurality of third conductive portions 37C, and the first conductive portion 37A and the second conductive portion 37B are directly electrically connected to the N-type semiconductor 361 and the P-type semiconductor 362 in different semiconductor components 36, respectively. In one embodiment, with reference to Figure 4 and Figure 5 , multiple semiconductor components 36 are connected in parallel between the first conductive part 37A and the second conductive part 37B. Preferably, the first conductive part 37A is electrically connected to the N-type semiconductors 361 in the multiple semiconductor components 36 at the same time, and the second conductive part 37B is able to electrically connect the P-type semiconductors 362 in the multiple semiconductor components 36 at the same time.

[0068] In one embodiment, reference may be made to Figure 6-Figure 10 At least a portion of the conductive carrier 37 is configured to be tubular, so that a larger number of semiconductor groups 36 can be connected simultaneously and / or a larger heating area can be provided.

[0069] In one embodiment, the conductive carrier 36 can be bent. By bending the conductive carrier 36 , at least a portion of the conductive carrier 36 can be changed from a planar shape to a curved shape or a tubular shape.

[0070] Based on the ability of the conductive carrier 36 to be bent, as an example, the conductive carrier 36 includes a flexible printed circuit (FPC), the flexible printed circuit including two layers of insulating films and a plurality of conductors, part of the conductors constituting a first conductive portion 37A, part of the conductors constituting a second conductive portion 37B, and in some examples part of the conductors constituting a third conductive portion 37C.

[0071] The first conductive portion 37A is at least partially exposed outside the insulating film to form an electrode for electrically connecting to the positive electrode + of the power supply component 2, and the second conductive portion 37B is at least partially exposed outside the insulating film to form an electrode for electrically connecting to the negative electrode - of the power supply component 2.

[0072] The portion of the first conductive part 37A exposed outside the insulating film can also be directly electrically connected to the N-type semiconductor 361 in one or more semiconductor components 36, and the portion of the second conductive part 37B exposed outside the insulating film can also be directly electrically connected to the P-type semiconductor 362 in one or more semiconductor components 36.

[0073] Part of the first conductive portion 37A is disposed between two insulating films. The insulating films have supporting and protecting functions, and can prevent the first conductive portion 37A from being oxidized, and can also insulate the first conductive portion 37A from other conductive parts.

[0074] Similarly, a portion of the third conductive portion 37B may be disposed between two insulating films and partially exposed to electrically connect to the semiconductor device.

[0075] The insulating film may be a PI film (polyimide film) or a polyester film, and the thickness of the insulating film may be between 10 μm and 100 μm, preferably between 13 μm and 40 μm. Since the flexible circuit board has two layers of insulating films, the thickness of the flexible circuit board is about 1 mm or about 1.2 mm.

[0076] The conductor may be a copper foil. The conductor may be disposed on the insulating film by bonding, printing, coating, chemical deposition, physical deposition, electroplating, ion sputtering or ion implantation.

[0077] Based on the fact that the conductive carrier 37 can be bent, as an example, reference can be made to Figure 2-Figure 5 The conductive carrier 37 includes a flexible film 37D, on which the first conductive portion 37A and the second conductive portion 37B are disposed, and the flexible film 37D is used to hold the first conductive portion 37A and the second conductive portion 37B. Thus, one side of the first conductive portion 37A is bonded to the flexible film 37D, and the other side opposite to it is exposed, and one surface of the second conductive portion 37B is connected to the flexible film 37D, and the other surface opposite to it is exposed to 37D. Similarly, the third conductive portion 37C is also the same.

[0078] In this example, the conductive carrier 37 has one less insulating film than the flexible circuit board, so the conductive carrier 37 in this example has a smaller thickness. In this example, the thickness of the conductive carrier 37 is between 30 μm and 100 μm, preferably, the thickness of the conductive carrier 37 is between 40 μm and 80 μm, for example, the thickness of the conductive carrier is about 50 μm.

[0079] The smaller the thickness of the conductive carrier 37 is, the less heat the conductive carrier 37 itself consumes, so that more heat transferred to the conductive carrier 37 can be transferred to the aerosol generating article 1 .

[0080] The flexible film 37D may include a PI film or a polyester film. The thickness of the flexible film 37D may be between 10 μm and 100 μm, and preferably the thickness of the flexible film 37D is between 13 μm and 80 μm. The first conductive portion 37A and the second conductive portion 37B (and the third conductive portion 37C) may be disposed on the flexible film 37D by bonding, printing, coating, chemical deposition, physical deposition, electroplating, ion sputtering or ion implantation, and the first conductive portion 37A and the second conductive portion 37B (and the third conductive portion 37C) may be copper foil.

[0081] Based on the fact that the conductive carrier 37 can be bent, as an example, reference can be made to Fig. 9 In the tube formed by bending the flexible film 37D, the two opposite ends of the flexible film 37D in the circumferential direction are overlapped. Specifically, the conductive carrier 37, which is roughly planar, is first bent into a tube, so that one side of the flexible film 37D in the circumferential direction and the other side of the flexible film 37D in the circumferential direction overlap each other, and preferably at least one of the two is provided with adhesive, so that the two are adhered and fixed when overlapping each other, so that the conductive carrier 37 can maintain a tubular shape. In order to prevent the tube formed by bending the conductive carrier 37 from being too soft, the thickness of the flexible film 37 can be between 30 μm and 80 μm, for example, the thickness of the flexible film 37 can be about 50 μm.

[0082] Based on the fact that the conductive carrier 37 can be bent, as an example, reference can be made to Figure 6 and Figure 7 The semiconductor heat transfer component also includes a heat pipe 38, the heat receiving end 31 includes the heat pipe 38, the flexible film 37D is arranged close to the heat pipe 38, and the heat pipe 38 can support the flexible film 37D, so that the flexible film 37D maintains a preset shape and prevents the flexible film 37D from being too soft and deformed after the retaining member 34 is set.

[0083] The heat-conducting pipe 38 can absorb the heat of the flexible film 37D and transfer at least part of the absorbed heat to the aerosol-generating article 1 . The heat-conducting pipe 38 can directly contact the aerosol-generating article 1 .

[0084] The thermal conductivity of the heat pipe 38 is greater than or equal to 10 W / (m·k), and suitable heat pipes 38 include, but are not limited to, at least one or more of metal, graphite, graphene, diamond, silicon carbide, aluminum nitride, or thermally conductive polymers. Among them, metals include, but are not limited to, one or more of silver, copper, gold, aluminum, tungsten, zinc, molybdenum, nickel, iron, platinum, ferrite, alloys, or stainless steel, and thermally conductive polymers include, but are not limited to, thermally conductive silicone or thermally conductive silicone grease. The efficiency of the heat pipe in transferring heat to the aerosol generating article 1 is improved by making the heat pipe 38 have a larger thermal conductivity.

[0085] The semiconductor heat transfer component may also include a temperature detector, the detection head of the temperature detector is connected to the heat pipe 38, and is used to detect the temperature of the heat pipe 38. At the same time, the temperature detector is electrically connected to the controller on the circuit board 22 to transmit the temperature information of the heat pipe 38 detected by it to the controller. The controller can control the current or voltage provided by the power supply component 2 to the semiconductor heat transfer component according to the temperature information, and then adjust the temperature of the heat pipe 38, so that the heat pipe 38 can fully heat the aerosol generating product 1 and prevent the aerosol generating product 1 from being burnt. The temperature detector can be a thermocouple or a thermistor, and the temperature detector is not limited here.

[0086] The thickness of the heat pipe 38 can be less than or equal to 0.2 mm to reduce the heat consumption of the heat pipe 38 itself, so that the heat transferred from the flexible film 37D to the heat pipe 37 can be more transferred to the aerosol generating product 1 by the heat pipe 37, thereby improving the heat utilization rate.

[0087] It should be noted that, in other embodiments, at least a portion of the heat pipe 38 can transmit infrared rays, for example, at least a portion of the heat pipe 38 is made of glass or quartz. An infrared radiation layer is provided on the surface of the heat pipe 38 facing the conductive carrier 37. The infrared radiation layer can excite and radiate infrared rays after absorbing the heat of the conductive carrier 37. The infrared rays pass through the heat pipe 38 and are emitted toward the aerosol generating product 1, thereby using the infrared rays to heat the aerosol generating product 1. In this embodiment, it is optional and not mandatory that the conductive carrier 37 can be bent, it is optional and not mandatory that the conductive carrier 37 includes a flexible circuit board or includes a flexible film 37D, and the conductive carrier 37 can include a rigid material such as aluminum oxide, silicon carbide or aluminum nitride. In this embodiment, it is optional and not mandatory that the thickness of the heat pipe 38 is less than or equal to 0.2 mm, and the heat pipe 38 is mainly used to support the infrared radiation layer and allow infrared rays to pass through.

[0088] The retaining member 34 and the first conductive connecting member 35 are independent of each other, so during the process of assembling the semiconductor heat transfer assembly, the retaining member 34 and the first conductive connecting member 35 are assembled separately or one after the other. Figure 7 and Figure 8 The first conductive connector 35 and the semiconductor component 36 are clamped between the retaining member 34 and the conductive carrier 37. The retaining member 34 can provide a force to make the retaining member 34 and the first conductive connector 35 tightly attached and maintain connection. Based on this, the retaining member 34 can be assembled after the first conductive connector 35.

[0089] In one embodiment, reference may be made to Figure 2 , the assembly process of semiconductor heat transfer components includes:

[0090] S1. The flexible film 37D is unfolded into a plane, and the first conductive part 37A and the second conductive part 37B are arranged on the flexible film 37D. If the conductive carrier 37 further includes the third conductive part 37C, the third conductive part 37C is also arranged on the flexible film 37D, so as to form the conductive carrier 37. The first conductive part 37A and the second conductive part 37B (and the third conductive part 37C) can be formed by drying and curing the conductive paste coated on the flexible film 37D.

[0091] S2. Dispose a conductive paste 39 , such as copper conductive paste, silver conductive paste or conductive paste, on the exposed surfaces of the first conductive portion 37A, the second conductive portion 37B (and the third conductive portion 37C).

[0092] S3. Arrange the N-type semiconductor 361 and the P-type semiconductor 362 in the semiconductor component 36 on the conductive paste 39 on the first conductive part 37A, the second conductive part 37B (and the third conductive part 37C), and dry and solidify the conductive paste 39, for example, by using a reflow oven soldering device to solidify the conductive paste 39, so that the semiconductor component 36 is soldered and fixed to the first conductive part 37A, the second conductive part 37B (and the third conductive part 37C), and electrically connected.

[0093] S4. Dispose conductive paste on the ends of the N-type semiconductor 361 and the P-type semiconductor 362 facing away from the flexible film 37D, dispose the first conductive connector 35 on the semiconductor component 36, and partially support the first conductive connector 36 by the N-type semiconductor 361 in the semiconductor component 36, and partially support the P-type semiconductor 362 in the semiconductor component 36, dry and solidify the conductive paste, so that the first conductive connector 35 is bonded or welded to the end of the semiconductor component 36, so that the first conductive connector 35 is electrically connected to the N-type semiconductor 361 and the P-type semiconductor 362 in the semiconductor component 36 at the same time. Thus, the first conductive connector 35 may include a metal sheet, a metal wire or a metal strip.

[0094] A plurality of semiconductor components 36 and a plurality of first conductive connections 35 may be arranged on the flexible film 37D through steps S1 - S4 .

[0095] The semiconductor heat transfer assembly process also includes:

[0096] S5. Bend the flexible film 37D so that at least part of the flexible film 37D becomes tubular. The two opposite sides of the flexible film 37D may be overlapped so that the flexible film 37D partially overlaps the tube formed by bending the flexible film 37D.

[0097] S6 , assembling the retaining member 34 , so that the retaining member 34 clamps the first conductive connecting member 35 inwardly, so that the first conductive connecting member 35 and the semiconductor component 36 are clamped between the retaining member 34 and the conductive carrier 37 .

[0098] In one embodiment, see Figure 6 , maintain, 34 includes a soft film, which can be a PI film. The soft film or PI film can be wrapped around the periphery of the first conductive connector 35 and closely attached to the first conductive connector 35, so that the soft film or PI film remains connected to the first conductive connector 35.

[0099] In one embodiment, see Figure 7 The retaining member 34 includes a heat shrink tube, and the first conductive connector 35, the semiconductor component 6 and the conductive carrier 37 are inserted into the heat shrink tube, and then the heat shrink tube is shrunk by heat, so that the retaining member 34 is tightly attached to the first conductive connector 35 and remains connected to the first conductive connector 34.

[0100] In some embodiments, the retaining member 34 includes both a soft film and a heat shrink tube. The soft film is used for preliminary fixation, and then the heat shrink tube is put on to shrink the heat shrink tube.

[0101] In one embodiment, step S5′ is used instead of S5. S5′ includes: making the flexible film 37D close to the heat-conducting pipe 38 and bending it into a pipe along the outer surface of the heat-conducting pipe 38. The pipe wall formed by bending the flexible film 37D can be closed or non-closed. The outer surface of the heat-conducting pipe 38 and / or the surface of the flexible film 37D facing the heat-conducting pipe 38 can be attached with glue, so that the flexible film 37D can be fixed on the heat-conducting pipe 38 by adhesion. The force provided by the retaining member 34 helps the flexible film 37D to be close to the heat-conducting pipe 38, or helps to fix the flexible film 37D on the heat-conducting pipe 38.

[0102] The first aspect of this application can be referred to Figure 3-Figure 8 , is to provide a semiconductor heat transfer component, the semiconductor heat transfer component has a plurality of semiconductor components 36, and at least two semiconductor components 36 are staggered in the longitudinal direction of the semiconductor heat transfer component, or staggered in the longitudinal direction of the aerosol generating article 1. The semiconductor heat transfer component may have the features of any of the above embodiments, but is not limited thereto.

[0103] Specifically, based on the first aspect, the semiconductor component 36 has multiple semiconductor components, some of the semiconductor components 36 are first semiconductor components 36A, and some of the semiconductor components 36 are second semiconductor components 36B. The first semiconductor components 36A and the second semiconductor components 36B are staggered in the longitudinal direction of the semiconductor heat transfer component, or staggered in the longitudinal direction of the aerosol generating product 1.

[0104] The first semiconductor component 36A may include one or more first semiconductor components 36A. When there are multiple first semiconductor components 36A, the multiple first semiconductor components 36A may be electrically connected to the same conductive carrier 37, and when the conductive carrier 37 is configured as a tube, the multiple first semiconductor components 36A may be arranged in a ring or "C" shape along the circumference of the tube.

[0105] As an example, see Figure 5 The plurality of first semiconductor components 36A are directly electrically connected to the first conductive portion 37A and the second conductive portion 37B, so that the plurality of first semiconductor components 36A are electrically connected in parallel between the first conductive portion 37A and the second conductive portion 37B on the conductive carrier 37 .

[0106] As an example, see Figure 4 The N-type semiconductor 361 in one of the multiple first semiconductor components 36A is directly electrically connected to the first conductive part 37A, the P-type semiconductor 362 in another first semiconductor component 36A is directly electrically connected to the second conductive part 37B, and the remaining N-type semiconductors 361 and P-type semiconductors 362 in the multiple first semiconductor components 36A are electrically connected to each other through one or more third conductive parts 37C, so that the multiple first semiconductor components 36A are electrically connected in series between the first conductive part 37A and the second conductive part 37B on the conductive carrier 37.

[0107] It should be noted that a direct electrical connection between a semiconductor component 36 and the first conductive part 37A and / or the second conductive part 37B means that the current in the circuit between the semiconductor component 36 and the first conductive part 37A and / or the second conductive part 37B hardly needs to flow through other semiconductor components 36; a direct electrical connection between an N-type semiconductor 361 and the first conductive part 37A means that the current in the circuit between the N-type semiconductor 361 and the first conductive part 37A hardly needs to flow through other N-type semiconductors 361 and P-type semiconductors 362; a direct electrical connection between a P-type semiconductor 361 and the second conductive part 37B means that the current in the circuit between the P-type semiconductor 362 and the second conductive part 37B hardly needs to flow through other N-type semiconductors 361 and P-type semiconductors 362.

[0108] The second semiconductor component 36B may have one or more. When there are multiple second semiconductor components 36B, the multiple second semiconductor components 36B may be electrically connected to the same conductive carrier 37, and when the conductive carrier 37 is configured as a tube, the multiple second semiconductor components 36B may be arranged in a ring or "C" shape along the circumference of the tube. Similarly, the multiple second semiconductor components 36B may be electrically connected in parallel between the first conductive portion 37A and the second conductive portion 37B on the conductive carrier 37; or, the multiple second semiconductor components 36B may be electrically connected in series between the first conductive portion 37A and the second conductive portion 37B on the conductive carrier 37.

[0109] In one embodiment, reference may be made to Figure 3-Figure 5 , the first semiconductor component 36A and the second semiconductor component 36B are electrically connected to the same conductive carrier 37. In other embodiments, the conductive carrier 37 electrically connected to the first semiconductor component 36A and the conductive carrier 37 electrically connected to the second semiconductor component 36B are independent of each other, and the two can be electrically connected to each other or spaced apart from each other.

[0110] In one embodiment, a plurality of first semiconductor components are connected in series, and a plurality of second semiconductor components are connected in parallel. In one embodiment, a plurality of first semiconductor components are connected in parallel, and a plurality of second semiconductor components are connected in series. Figure 4 , a plurality of first semiconductor components 36A are connected in series with each other, and a plurality of second semiconductor components 36B are also connected in series with each other. Figure 5 , multiple first semiconductor components 36A are connected in parallel to each other, and multiple second semiconductor components 36B are connected in parallel to each other.

[0111] In one embodiment, a plurality of first semiconductor components 36A are electrically connected to each other to form a first array, in which the plurality of first semiconductor components 36A can be connected in series or in parallel with each other; a plurality of second semiconductor components 36B are electrically connected to each other to form a second array, in which the plurality of second semiconductor components 36B can be connected in series or in parallel with each other.

[0112] As an example, see Figure 3 , between the first conductive part 37A and the second conductive part 37B, the first array and the second array are connected in series, including at least part of the first semiconductor component 36A and at least part of the second semiconductor component 36B connected in series between the first conductive part 37A and the second conductive part 37B, wherein the first conductive part 37A and the second conductive part 37B may belong to the same conductive carrier 37, or of course, may belong to different conductive carriers 37.

[0113] Specifically, for example, an N-type semiconductor 361 in the first array is directly electrically connected to the first conductive portion 37A, a P-type semiconductor 362 in the second array is directly electrically connected to the second conductive portion 37B, and a P-type semiconductor 362 in the first array is electrically connected to an N-type semiconductor 361 in the second array through one or more third conductive portions 37C.

[0114] As an example, see Figure 4 , between the first conductive part 37A and the second conductive part 37B, the first array is connected in parallel with the second array, including at least part of the first semiconductor component 36A and at least part of the second semiconductor component 36B connected in parallel between the first conductive part 37A and the second conductive part 37B, wherein the first conductive part 37A and the second conductive part 37B may belong to the same conductive carrier 37, or of course, may belong to different conductive carriers 37.

[0115] Specifically, for example, an N-type semiconductor 361 in the first array is directly electrically connected to the first conductive portion 37A, and a P-type semiconductor 362 in the first array is directly electrically connected to the second conductive portion 37B; an N-type semiconductor 361 in the second array is directly electrically connected to the first conductive portion 37A, and a P-type semiconductor 362 in the second array is directly electrically connected to the second conductive portion 37B.

[0116] In one embodiment, reference may be made to Figure 3-Figure 5 There are multiple first conductive connectors 35, the number of which can be equal to the number of semiconductor components 36, and each semiconductor component 36 has a first conductive connector 35 electrically connecting the N-type semiconductor 361 and the P-type semiconductor 362 in the semiconductor component 36, so that the first conductive connectors 35 electrically connected to different semiconductor components 36 are independent of each other.

[0117] In one embodiment, reference may be made to Fig.13 At least one first conductive connecting member 35 extends along the longitudinal direction of the semiconductor heat transfer component, or extends along the longitudinal direction of the aerosol generating product 1, and simultaneously electrically connects the N-type semiconductor 361 and the P-type semiconductor 362 in a first semiconductor component 36A and the N-type semiconductor 361 and the P-type semiconductor 362 in a second semiconductor component 36B, so that the first semiconductor component 36A and the second semiconductor component 36B share the same first conductive connecting member 35.

[0118] It should be noted that the semiconductor component may also include a third semiconductor component, a fourth semiconductor component...an Mth semiconductor component, where M is an integer greater than or equal to 3, and the Mth semiconductor component is staggered with the first semiconductor component or the second semiconductor component in the longitudinal direction of the semiconductor heat transfer component, or is staggered with the longitudinal direction of the aerosol generating product.

[0119] In such Figure 3 and Figure 4 In the illustrated embodiment, the conductive carrier 37 is electrically connected to a plurality of semiconductor components 36 at the same time, but the conductive carrier 36 has only one first conductive portion 37A and only one second conductive portion 37B. The plurality of semiconductor components 36 can be connected in series or in parallel between the first conductive portion 37A and the second conductive portion 37B, or part of them can be connected in series and the rest can be connected in parallel. The controller can detect the electrical parameters between the first conductive portion 37A and the second conductive portion 37B, such as voltage, current or resistance, by being electrically connected to the first conductive portion 37A and the second conductive portion 37B, and calculate the temperature of the conductive carrier 37 based on the corresponding relationship between the electrical parameters and the temperature, and can control the power provided by the power supply component 2 to the first conductive portion 37A and the second conductive portion 37B based on the temperature, so as to regulate the temperature of the conductive carrier 37.

[0120] The second aspect of the present application is to provide an aerosol generating device, which can refer to Figure 10-12 The aerosol generating device further comprises a second heat transfer assembly 4. The second heat transfer assembly 4 is capable of providing heat to the holder 34 in the first heat transfer assembly 3. In the first heat transfer assembly 3, at least part of the heat on the holder 34 is transferred to the conductive carrier 37 by the semiconductor assembly 36 of the first heat transfer assembly 3, so that the temperature of the conductive carrier 37 is higher than the temperature of the holder 34, and there is a temperature difference between the conductive carrier 37 and the holder 34, and the temperature difference between the conductive carrier 37 and the holder 34 is mainly related to the current magnitude provided by the power supply assembly 2 to the semiconductor assembly 36 in the first heat transfer assembly 3. Therefore, under the premise that the current magnitude remains unchanged, increasing the temperature of the holder 34 in the first heat transfer assembly 3 helps to increase the temperature of the conductive carrier 37.

[0121] Based on the second aspect, in one embodiment, at least part of the heat provided by the second heat transfer component 4 to the retaining member in the first heat transfer component 3 is heat transferred by the second heat transfer component 4 in a non-heat transfer manner.

[0122] Specifically, the second heat transfer component 4 includes a second conductive connector 42, a fourth conductive portion 421 disposed on the retaining member 34, and a fifth conductive portion 422 disposed on the retaining member 34. Similar to the first heat transfer component 3, the second heat transfer component 4 also includes a semiconductor component. The semiconductor component 43 in the second heat transfer component 4 includes an N-type semiconductor 431 electrically connected to the fourth conductive portion 421 and a P-type semiconductor 432 electrically connected to the fifth conductive portion 422. The second conductive connector 41 simultaneously electrically connects the N-type semiconductor 431 and the P-type semiconductor 432 of the semiconductor component 43 in the second heat transfer component 4, so that the N-type semiconductor 431 and the P-type semiconductor 432 of the semiconductor component 43 in the second heat transfer component 4 are connected in series with each other through the second conductive connector 4.

[0123] The semiconductor component 43 in the second heat transfer component 4 can transfer at least part of the heat on the second conductive connector 41 to the retaining member 34, thereby increasing the temperature of the retaining member 34. The aerosol generating device may further include a structural member or a supporting member 44, which can connect the second conductive connector 41 or support the second conductive connector 41, and can exchange heat with the second conductive connector 41, so that when the second heat transfer component 4 is working, at least part of the heat on the structural member or the supporting member 44 can be absorbed by the second conductive connector 41 and then transferred to the retaining member 34 through the semiconductor component 43 in the second heat transfer component 4. The structural member or the supporting member 44 may include a housing of the aerosol generating device, a battery holder for holding or supporting the power source 21, a second heat transfer component holder for holding or supporting the second heat transfer component 4, or others.

[0124] The semiconductor component 43 in the second heat transfer component 4 may have one or more semiconductor components. When the semiconductor component 43 in the second heat transfer component 4 has more than one semiconductor component, some of the semiconductor components 43 may be staggered in the longitudinal direction of the aerosol generating article 1 relative to other semiconductor components 43, or at least some of the semiconductor components 43 may be arranged in a ring or "C" shape and arranged around the first heat transfer component 3 or around the aerosol generating article 1.

[0125] When there are multiple semiconductor components 43 in the second heat transfer component 4, at least some of the semiconductor components 43 can be connected in series or in parallel, or some of the semiconductor components 43 can be connected in series and some of the semiconductor components 43 can be connected in parallel.

[0126] In one embodiment, reference may be made to Fig.11, the first heat transfer component 3 and the second heat transfer component 4 both have a plurality of semiconductor components, the fourth conductive portion 421 can pass through the retaining member 43 to be electrically connected to one or more first conductive connecting members 35 in the first heat transfer component 3, and / or the fifth conductive portion 422 can pass through the retaining member 34 to be electrically connected to one or more first conductive connecting members 35 in the first heat transfer component 3, so that at least part of the semiconductor components 36 in the first heat transfer component 2 are connected in series with at least part of the semiconductor components 43 in the second heat transfer component 4, or at least part of the semiconductor components 36 in the first heat transfer component 3 are connected in parallel with at least part of the semiconductor components 43 in the second heat transfer component 6. In other words, at least part of the semiconductor components 36 in the first heat transfer component 3 are connected in series with at least part of the semiconductor components 43 in the second heat transfer component 4 or are connected in parallel between the first conductive portion 37A and the second conductive portion 37B. Based on this, the first heat transfer component 3 and the second heat transfer component 4 can both obtain power from the power supply component 2 through the first conductive portion 37A and the second conductive portion 37B in the first heat transfer component 3.

[0127] It should be noted that, in other embodiments, reference may be made to Fig.12 The positive pole + of the power supply component 2 is electrically connected to the fourth conductive part 421, and the negative pole - is electrically connected to the fifth conductive part 422. The power supply component 2 provides power to the semiconductor component 43 in the second heat transfer component 4 through the fourth conductive part 421 and the fifth conductive part 422, so that the semiconductor component 43 in the second heat transfer component 4 can transfer heat to the retaining member 34.

[0128] It should be noted that the aerosol generating device may include a third heat transfer component, a fourth heat transfer component...an Nth heat transfer component, where N is an integer greater than 1, and the Nth heat transfer component can provide heat to the N-1th heat transfer component, and the temperature increases step by step from the Nth heat transfer component to the first heat transfer component, so that among all the heat transfer components, the temperature of the conductive carrier in the first heat transfer component is the highest.

[0129] It should be noted that the preferred embodiments of the present application are given in the specification and drawings of the present application, but are not limited to the embodiments described in the specification. Furthermore, it is possible for a person of ordinary skill in the art to make improvements or changes based on the above description, and all such improvements and changes should fall within the scope of protection of the claims attached to the present application.

Claims

1. A semiconductor heat transfer component, characterized in that: include: Retaining parts; a first conductive connecting member, independent of the retaining member; A conductive carrier, on which a first conductive portion and a second conductive portion are disposed; and A semiconductor component, comprising an N-type semiconductor electrically connected to the first conductive portion and a P-type semiconductor electrically connected to the second conductive portion, wherein the N-type semiconductor and the P-type semiconductor in the semiconductor component are connected in series via the first conductive connector; The retaining member is used to provide a force to clamp the first conductive connector and the semiconductor component between the retaining member and the conductive carrier; wherein the semiconductor component is used to transfer at least part of the heat on the retaining member to the conductive carrier to heat the aerosol generating product through the conductive carrier.

2. The semiconductor heat transfer assembly according to claim 1, wherein: The conductive carrier includes a flexible film, and the first conductive portion and the second conductive portion are disposed on the flexible film, wherein the flexible film is bent into a tube shape.

3. The semiconductor heat transfer assembly according to claim 2, wherein: The semiconductor heat transfer assembly further comprises a heat-conducting pipe, the retaining member provides a force for holding the flexible film against the heat-conducting pipe, and the heat-conducting pipe is used to contact the aerosol-generating article.

4. The semiconductor heat transfer assembly according to claim 3, wherein: The semiconductor heat transfer component also includes a temperature detector, and a detection head of the temperature detector is connected to the heat pipe.

5. The semiconductor heat transfer assembly according to claim 3, wherein: The heat pipe meets at least one of the following conditions: The thermal conductivity of the heat pipe is greater than or equal to 10W / (m·k); The heat conducting pipe is made of metal; and The thickness of the heat conducting pipe is less than or equal to 0.2 mm.

6. The semiconductor heat transfer assembly according to claim 2, wherein: In the tube formed by bending the flexible film, opposite ends of the flexible film in the circumferential direction are overlapped and connected.

7. The semiconductor heat transfer assembly according to claim 2, wherein: The thickness of the flexible film is between 10 μm and 100 μm.

8. The semiconductor heat transfer assembly according to claim 2, wherein: The flexible film includes a PI film.

9. The semiconductor heat transfer assembly according to claim 2, wherein: The retaining member comprises a heat shrink tube; or The retaining member includes a soft film, and the soft film surrounds the periphery of the first conductive connecting member.

10. The semiconductor heat transfer assembly according to claim 1, wherein: The N-type semiconductor and / or the P-type semiconductor in the semiconductor component is electrically connected to the conductive carrier by welding; and / or The first conductive connection member is electrically connected to the N-type semiconductor and the P-type semiconductor in the semiconductor component respectively by welding.

11. The semiconductor heat transfer assembly according to any one of claims 1 to 10, characterized in that: The semiconductor component has a plurality of parts, and the conductive carrier further includes a plurality of third conductive parts; The third conductive part electrically connects two of the semiconductor components, and a plurality of the semiconductor components are connected in series between the first conductive part and the second conductive part through a plurality of the third conductive parts, and the first conductive part and the second conductive part are directly electrically connected to the N-type semiconductor and the P-type semiconductor in different semiconductor components, respectively.

12. The semiconductor heat transfer assembly according to any one of claims 1 to 10, characterized in that: There are a plurality of the semiconductor components, and the plurality of the semiconductor components are connected in parallel between the first conductive part and the second conductive part.

13. The semiconductor heat transfer assembly according to any one of claims 1 to 10, characterized in that: The semiconductor components include a plurality of first semiconductor components and a second semiconductor component. The first semiconductor component and the second semiconductor component are staggered in the longitudinal direction of the semiconductor heat transfer component.

14. The semiconductor heat transfer assembly according to claim 13, wherein: There are a plurality of the first semiconductor components, and the plurality of the first semiconductor components are connected in series between the first conductive portion and the second conductive portion; and / or There are a plurality of the second semiconductor components, and the plurality of the second semiconductor components are connected in series between the first conductive portion and the second conductive portion.

15. The semiconductor heat transfer assembly according to claim 14, wherein: At least part of the first semiconductor components and at least part of the second semiconductor components are connected in series between the first conductive portion and the second conductive portion; or At least part of the first semiconductor component and at least part of the second semiconductor component are connected in parallel between the first conductive portion and the second conductive portion.

16. The semiconductor heat transfer assembly according to claim 13, wherein: There are a plurality of first conductive connecting members, and each of the semiconductor components has a first conductive connecting member that electrically connects the N-type semiconductor and the P-type semiconductor in the semiconductor component; or The first conductive connecting member extends in the longitudinal direction of the semiconductor heat transfer component and electrically connects the N-type semiconductor and the P-type semiconductor in the first semiconductor component and the N-type semiconductor and the P-type semiconductor in the second semiconductor component.

17. A semiconductor heat transfer component, characterized in that: include: a first conductive connector; A conductive carrier, comprising a flexible film, on which a first conductive portion and a second conductive portion are disposed, and the flexible film is bent into a tube shape, wherein opposite ends of the flexible film in a circumferential direction are overlapped and connected in the tube formed by bending the flexible film; and A semiconductor component, comprising an N-type semiconductor electrically connected to the first conductive portion and a P-type semiconductor electrically connected to the second conductive portion, wherein the N-type semiconductor and the P-type semiconductor in the semiconductor component are connected in series via the first conductive connector; The semiconductor component is used to transfer at least part of the heat on the first conductive connection to the conductive carrier, so as to heat the aerosol generating product through the conductive carrier.

18. An aerosol generating device, characterized in that: It comprises a first heat transfer component and a power supply component, wherein the first heat transfer component comprises the semiconductor heat transfer component according to any one of claims 1 to 17, wherein the positive pole of the power supply component is electrically connected to the first conductive part, and the negative pole is electrically connected to the second conductive part.

19. The aerosol generating device according to claim 18, wherein: The aerosol generating device further comprises a second heat transfer component for transferring heat to a retaining member in the first heat transfer component; The second heat transfer assembly comprises: a second conductive connection member; a fourth conductive portion and a fifth conductive portion disposed on the retaining member; The semiconductor component includes an N-type semiconductor electrically connected to the fourth conductive part and a P-type semiconductor electrically connected to the fifth conductive part, and the N-type semiconductor and the P-type semiconductor in the semiconductor component are connected in series through the second conductive connecting member.

20. The aerosol generating device according to claim 19, wherein: At least part of the semiconductor components in the first heat transfer component and at least part of the semiconductor components in the second heat transfer component are connected in series or in parallel between the first conductive portion and the second conductive portion; or The positive electrode of the power supply component is electrically connected to the fourth conductive part, and the negative electrode is electrically connected to the fifth conductive part.

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