Separating device for electrostatic chuck

Abstract

The utility model discloses a separating device for an electrostatic chuck, which belongs to the technical field of electrostatic chucks and comprises a supporting assembly, the supporting assembly comprises a first supporting rod and a second supporting rod, and a separating thin steel wire is arranged between the first supporting rod and the second supporting rod. A supporting assembly used for supporting an electrostatic chuck is arranged above the separating thin steel wire, the electrostatic chuck is obliquely arranged above the separating thin steel wire, and the separating thin steel wire is further connected with a heating wire. By arranging the separating thin steel wire, the electrostatic chuck substrate and the ceramic plate can be unsealed, and meanwhile the electrostatic chuck ceramic plate can be prevented from being damaged in the detaching process; by arranging a separating thin steel wire and a heating wire, the electrostatic chuck above the separating thin steel wire and the heating wire moves downwards under the action of gravity and is slowly separated; the electrostatic chuck is obliquely arranged above the separating thin steel wire, and the separating thin steel wire is mostly in contact with the substrate, so that the ceramic plate is prevented from being damaged in the separating process.

Description

Technical Field

[0001] The utility model relates to the technical field of electrostatic chucks, in particular to a separation device for electrostatic chucks. Background Art

[0002] An electrostatic chuck generally includes a ceramic plate and a substrate. An electrode is provided in the ceramic plate. The ceramic plate and the substrate are connected by bonding. If an error occurs after the ceramic plate and the substrate are assembled, or if the substrate is damaged after the ceramic plate and the substrate are bonded, the ceramic plate needs to be separated. When using an existing electrostatic chuck splitting device, the electrostatic chuck needs to be heated first to soften the glue layer between the ceramic plate and the substrate, and then a splitting device is used to split it. The existing splitting device generally includes a thin blade. When cutting it, the flatness of the blade is required to be high, and the requirements for the operator are also high. At the same time, the splitting speed is slow. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a separation device for an electrostatic chuck to improve the separation efficiency of the electrostatic chuck.

[0004] In order to solve the above technical problems, the technical solution of the utility model is:

[0005] A separation device for an electrostatic chuck comprises a support assembly, wherein the support assembly comprises a first support rod and a second support rod, a separation fine steel wire is arranged between the first support rod and the second support rod, a support assembly for supporting the electrostatic chuck is arranged above the separation fine steel wire, the electrostatic chuck is arranged obliquely above the separation fine steel wire, and the separation fine steel wire is also connected to a heating wire.

[0006] Preferably, both ends of the separation thin steel wire are provided with limit blocks, and the first support rod and the second support rod are provided with grooves matching with the separation thin steel wire.

[0007] Preferably, the first support rod and the second support rod are arranged on a support plate.

[0008] Preferably, the support assembly comprises a support rod, the support rod is arranged on the support plate, and a rope for hanging the electrostatic chuck is provided on the support rod.

[0009] Preferably, the support rod is located on one side of the axial direction of the separation thin steel wire.

[0010] Preferably, the electrostatic chuck comprises a substrate, a ceramic plate and a glue layer between the substrate and the ceramic plate, and the substrate is located at the upper left or upper right of the separation thin steel wire.

[0011] The above technical solution has the following beneficial effects:

[0012] By setting a separation fine steel wire, the electrostatic chuck substrate and the ceramic plate can be unsealed, and at the same time, damage to the electrostatic chuck ceramic plate during the separation process can be avoided;

[0013] By providing a separation fine steel wire and a heating wire, the electrostatic chuck above it moves downward under the action of gravity to slowly separate the electrostatic chuck ceramic plate and the substrate, which can improve the separation efficiency compared to the manual separation form;

[0014] The electrostatic chuck is tiltedly arranged above the separation thin steel wire, and the separation thin steel wire is mostly in contact with the substrate to avoid damaging the ceramic plate during the separation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic structural diagram of a separation device for an electrostatic chuck according to the utility model;

[0016] Figure 2 It is a schematic diagram of the structure including an electrostatic chuck and a separation thin steel wire. DETAILED DESCRIPTION

[0017] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0018] refer to Figure 1 , Figure 2 The separation device for the electrostatic chuck includes a support assembly, which includes a first support rod 2 and a second support rod 3. A separation fine steel wire 4 is provided between the first support rod 2 and the second support rod 3. A support assembly for supporting the electrostatic chuck is provided above the separation fine steel wire 4. The electrostatic chuck is tilted above the separation fine steel wire 4. The tilted setting of the electrostatic chuck allows the glue layer between the substrate 7 and the ceramic plate 8 of the electrostatic chuck to contact the separation fine wire 4 on the one hand. Under the gravity of the electrostatic chuck itself and the action of the separation fine wire 4, the separation fine wire can separate the electrostatic chuck. On the other hand, the separation fine wire 4 can damage the ceramic plate 8 of the electrostatic chuck during the separation process. The separation fine steel wire 4 is also connected to the heating wire 6. The heating wire 6 transfers heat to the separation fine steel wire 4 to melt the glue in the glue layer and separate the substrate 7 and the ceramic plate 8 faster.

[0019] Both ends of the separation thin steel wire 4 are provided with limit blocks 5, and the first support rod 2 and the second support rod 3 are provided with grooves that match the separation thin steel wire 4. The two ends of the separation thin steel wire 4 are respectively connected to the limit blocks 5, and then the separation thin wire 4 is inserted into the groove, which is convenient for installing and removing the separation thin wire 4. In other implementations of this embodiment, the first support rod 2 and the second support rod 3 can be telescopic rods. If the electrostatic chuck is large and cannot be completely separated after adjusting the position once, the first support rod 2 and the second support rod 3 can be extended;

[0020] The first support rod 2 and the second support rod 3 are arranged on the support plate 1;

[0021] The support assembly includes a support rod 10, which is arranged on the support plate 1. The support rod 10 is provided with a rope 9 for hanging the electrostatic chuck. The rope 9 is connected to the electrostatic chuck through the mounting hole on the base plate 7. When separating, the electrostatic chuck is tilted, and the glue layer at the lower end contacts the separation thin steel wire 4, and the upper end is hung by the rope 9. After a period of time, the rope 9 is lengthened to allow the electrostatic chuck to continue to be separated. In other implementations of this embodiment, the mounting hole on the base plate 7 is first connected by the rope 9. After separation to a certain position, the rope is connected to the mounting hole on the other side of the base plate 7 for separation until all separation is completed;

[0022] The support rod 10 is located on one side of the axis direction of the separation thin steel wire 4. In order to allow the electrostatic chuck to tilt, the substrate 7 is located on the upper left or upper right of the separation thin steel wire 4, so that most of the gravity of the electrostatic chuck acts on the separation thin steel wire 4 through the substrate 7, avoiding damage to the ceramic plate 8 during the separation process;

[0023] The electrostatic chuck comprises a substrate 7, a ceramic plate 8 and a glue layer between the substrate 7 and the ceramic plate 8, wherein the substrate 7 is located at the upper left or upper right of the separation thin steel wire 4;

[0024] By providing the separation thin steel wire 4, the base plate 7 and the ceramic plate 8 of the electrostatic chuck can be disassembled, and at the same time, damage to the ceramic plate 8 of the electrostatic chuck can be avoided during the disassembly process;

[0025] By providing a separation thin steel wire 4 and a heating wire 6, the electrostatic chuck above them moves downwards and slowly separates under the action of gravity;

[0026] The electrostatic chuck is tiltedly arranged above the separation thin steel wire 4, and the separation thin steel wire 4 is mostly in contact with the substrate 7, so as to avoid damaging the ceramic plate 8 during the separation process.

[0027] The above is a detailed description of the embodiments of the present invention in conjunction with the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions and variations of these embodiments are made without departing from the principles and spirit of the present invention, and still fall within the scope of protection of the present invention.

Claims

1. A separation device for an electrostatic chuck, characterized in that: It includes a support assembly, which includes a first support rod and a second support rod, a separation thin steel wire is provided between the first support rod and the second support rod, a support assembly for supporting an electrostatic chuck is provided above the separation thin steel wire, the electrostatic chuck is obliquely arranged above the separation thin steel wire, and the separation thin steel wire is also connected to the heating wire.

2. A separation device for an electrostatic chuck according to claim 1, characterized in that: Limit blocks are provided at both ends of the separation thin steel wire, and grooves matching with the separation thin steel wire are provided on the first support rod and the second support rod.

3. A separation device for an electrostatic chuck according to claim 2, characterized in that: The first support rod and the second support rod are arranged on a support plate.

4. A separation device for an electrostatic chuck according to claim 3, characterized in that: The support assembly includes a support rod, the support rod is arranged on the support plate, and a rope for hanging the electrostatic chuck is provided on the support rod.

5. A separation device for an electrostatic chuck according to claim 4, characterized in that: The support rod is located on one side of the axis direction of the separation thin steel wire.

6. A separation device for an electrostatic chuck according to claim 5, characterized in that: The electrostatic chuck comprises a substrate, a ceramic plate and a glue layer between the substrate and the ceramic plate, and the substrate is located on the upper left or upper right of the separation thin steel wire.

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