Winding scrap removing device for planet carrier machining
By designing a planet carrier processing and removing chips, using the coordinated work of hand claws and air blowing devices, the problem of thin iron chips forming a mass and chips forming a mass and chips forming a mass in the processing of commercial vehicle planet carrier parts is solved, and efficient cleaning is achieved Chip wrapping improves the stability and production efficiency of the entire line.
Patent Information
- Application Number
- CN202420824872.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-20
- Publication Date
- 2025-02-14
- Estimated Expiration
- 2034-04-20
AI Technical Summary
During the automated processing of planet carrier parts for commercial vehicles, the slender iron chips produced by the fine boring process are prone to form balls and chips, which affects the clamping and process positioning of the automated hand claws, resulting in unstable operation of the entire line and after cleaning Difficulty in handling and affects the assembly and use of the planetary carrier.
A planetary carrier processing chip removal device is designed, including chip removal machine, hand claw fixing plate, air blowing control valve, air blowing device, etc., through the coordinated work of hand claw and air blowing device, the chip wrapping device on the surface of the planetary carrier is efficiently cleaned.
It realizes efficient cleaning of surface chips during automatic processing of planet carriers, improves the stability and rhythm requirements of the whole line operation, simplifies the subsequent cleaning process, and improves production efficiency and the quality and utilization of planet carriers.
Smart Images
Figure CN222471698U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of removing entangled chips from planetary carriers, in particular to a device for removing entangled chips during processing of planetary carriers. Background Art
[0002] The planetary carrier is one of the components of commercial vehicles. During the manufacturing process, it needs to go through multiple processes and links to produce qualified commercial vehicle products.
[0003] In traditional commercial planetary carrier parts automated processing, due to the limitations of workpiece material and tool, a large number of long and thin iron chips will be generated during the fine boring process. These long and thin iron chips are easy to form agglomerates and entangled chips, thus affecting the automated gripper clamping and the positioning of nearby processes. This problem is related to the smooth operation of the entire line, the beat requirements and the subsequent cleaning post-processing, and will also affect the normal assembly and use of the planetary carrier. Therefore, in response to this situation, the location and characteristics of the planetary carrier chip agglomerations and entangled chips are analyzed, and a special gripper mechanism is designed to handle the planetary carrier chip agglomerations. Utility Model Content
[0004] The purpose of the utility model is to solve the problem in the prior art that when planetary carrier parts are automatically processed, due to the limitations of workpiece materials and tool, a large amount of long and thin iron chips will be generated during the fine boring process. These long and thin iron chips are easy to agglomerate to form agglomerated chips and entangled chips, thereby affecting the automatic gripper clamping and the positioning of nearby processes. This problem is related to the smooth operation of the entire line, the beat requirements and the subsequent cleaning post-processing, and will also affect the normal assembly and use of the planetary carrier. A planetary carrier processing chip removal device is proposed.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a planetary carrier processing chip removal device, including a chip remover, a relay box is fixedly connected to the surface of one side of the chip remover, a plurality of air blowing control valves are fixedly connected to the surface of one side of the chip remover, a six-position valve island is fixedly connected to the surface of one side of the chip remover, an outer automatic door cylinder is fixedly connected to the surface of one side of the chip remover, the output end of the outer automatic door cylinder is fixedly connected to the outer door body, and the surface of the chip remover is located on one side of the outer door body and is provided with an outer door opening Detection sensor and outer door closing detection sensor, the inner wall of the chip remover is fixedly connected with an upper clamping cylinder, the inner wall of the chip remover has a guide frame with a rear automatic door lock, the inner wall of the chip remover is fixedly connected with a claw fixing plate, one side surface of the claw fixing plate is fixedly connected with a chip removing claw, one side surface of the chip removing claw is fixedly connected with a claw driving gear, the inner wall of the chip remover is fixedly connected with a claw cylinder, one side of the claw cylinder is fixedly connected with a claw moving cylinder, and the inner wall of the chip remover is provided with a positioning point air blow.
[0006] The effect achieved by the above components is that during the automatic processing of the planetary carrier, the tangled chips on its surface can be cleaned efficiently and fully, which further improves the running stability of the whole line, the beat requirements and the subsequent cleaning post-processing, improves the production efficiency, and also improves the quality and qualified utilization rate of the planetary carrier.
[0007] Preferably, the inner wall of the chip remover is provided with an intermediate air blow, and the intermediate air blow is located below the positioning point air blow.
[0008] The effect achieved by the above components is: through the setting of the intermediate air blowing, the middle position of the planetary carrier can be further cleaned during the chip removal process, so that it is not easy for iron chips to exist in the dead corners of the parts, thereby improving the use effect of the chip remover.
[0009] Preferably, the inner wall of the chip remover is fixedly connected with a part mid-position air blow, and a lower middle air blow cylinder is fixed on one side surface of the chip remover, and the part mid-position air blow is located above the position of the positioning point air blow.
[0010] The effect achieved by the above components is: through the setting of the mid-position air blowing of the parts, the middle position of the planetary carrier can be further cleaned, so that the iron chips can be removed more cleanly and fully.
[0011] Preferably, an upper air-blowing movable cylinder is fixedly connected to one side of the inner wall of the chip remover, and a rotating air-blowing device is fixedly connected to the inner wall of the chip remover with holes all around, and the rotating air-blowing device in the holes all around is located above the mid-position air-blowing device of the part.
[0012] The effect achieved by the above components is: the setting of rotating air blowing in the surrounding holes cleans the working parts of the inner wall of the chip remover, so that the inner wall of the chip remover is better kept clean, thereby making it difficult for iron chips to damage the components.
[0013] Preferably, a plurality of evenly distributed screws are threadedly connected through the surface of the gripper fixing plate, and the plurality of screws are respectively threadedly connected to an inner wall of one side of the chip remover.
[0014] The effects achieved by the above components are: through the setting of the screws, the chip removing claw is more convenient to use and more convenient for daily inspection and maintenance, thereby ensuring the normal use of the chip remover.
[0015] Preferably, the inner wall of the chip remover is slidably connected with a chip trolley, and the chip trolley is located below the inner wall of the chip remover.
[0016] The effect achieved by the above components is: through the setting of the iron chip trolley, the iron chips on the planetary frame can be collected in the iron chip trolley after cleaning, so as to facilitate processing and improve the working efficiency of the chip remover.
[0017] Preferably, the cross-section of the crumb removing claw is in a "J" shape, and a plurality of evenly distributed anti-slip protrusions are provided on the surface of the crumb removing claw.
[0018] The effect achieved by the above components is: through the special structure and special surface setting of the chip removal claw, the chip removal claw can be more stable and firm when clamping the planetary carrier, and is not easy to loosen, thereby better handling iron chips and improving the handling effect.
[0019] Compared with the prior art, the advantages and positive effects of the utility model are:
[0020] In the utility model, during the automatic processing of the planetary carrier, the tangled chips on its surface can be cleaned efficiently and fully, which further improves the running stability of the whole line, the beat requirements and the subsequent cleaning post-processing, improves the production work efficiency, and also improves the quality and qualified utilization rate of the planetary carrier. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 A schematic diagram of the three-dimensional structure of this application;
[0022] Figure 2 This is a schematic diagram of some structures of this application;
[0023] Figure 3 For this application Figure 2 A schematic diagram of the side structure of
[0024] Figure 4 This is a schematic diagram of the structure of the air blowing part for removing entangled chips during processing of the planetary carrier in this application;
[0025] Figure 5 This is a schematic diagram of the structure of the chip removal claws for processing the planetary carrier in this application;
[0026] Figure 6 This is a schematic diagram of the operating system structure for the chip removal claws used in planetary frame processing in this application.
[0027] Legend: 1. Chip remover; 101. Relay box; 2. Six-position valve island; 3. Air-blowing control valve; 4. Iron chip trolley; 5. External automatic door cylinder; 6. Workpiece presence or absence detection sensor; 7. External door opening detection sensor; 8. External door closing detection sensor; 9. Upper air-blowing moving cylinder; 10. Upper clamping cylinder; 11. Rear automatic door lock; 12. Gripper cylinder; 13. Gripper moving cylinder; 14. Lower middle air-blowing cylinder; 15. Positioning point air blowing; 16. Part center air blowing; 17. Rotating air blowing in the surrounding holes; 18. Middle air blowing; 19. Chip removal gripper; 20. Gripper driving gear; 21. Gripper fixing plate; 22. External door body. DETAILED DESCRIPTION
[0028] Embodiment 1, as Figure 1 - Figure 6 As shown, a planetary carrier processing chip removal device includes a chip remover 1, a relay box 101 is fixedly connected to the surface of one side of the chip remover 1, a six-position valve island 2 is fixedly connected to the surface of one side of the chip remover 1, a plurality of air blowing control valves 3 are fixedly connected to the surface of one side of the chip remover 1, an outer automatic door cylinder 5 is fixedly connected to the surface of one side of the chip remover 1, an outer door body 22 is fixedly connected to the output end of the outer automatic door cylinder 5, an outer door opening detection sensor 7 and an outer door closing detection sensor 8 are provided on the surface of the chip remover 1 located on one side of the outer door body 22, an upper side pressing cylinder 10 is fixedly connected to the inner wall of the chip remover 1, and the chip remover 1 is fixedly connected to the outer door body 22. The inner wall of the chip remover 1 has a guide frame with a rear automatic door lock 11, the inner wall of the chip remover 1 is fixedly connected with a hand claw fixing plate 21, one side surface of the hand claw fixing plate 21 is fixedly connected with a chip removal hand claw 19, one side surface of the chip removal hand claw 19 is fixedly connected with a hand claw driving gear 20, the inner wall of the chip remover 1 is fixedly connected with a hand claw cylinder 12, one side of the hand claw cylinder 12 is fixedly connected with a hand claw moving cylinder 13, and the inner wall of the chip remover 1 is provided with a positioning point air blow 15. When the chip remover 1 is used to process the iron chips on the planetary frame, first, the workpiece material detection sensor 6 of the chip remover 1 will detect whether there is a workpiece that needs to be processed. The star frame workpiece, when detected, the outer door opening detection sensor 7 will give feedback to the outer automatic door cylinder 5, so that the outer automatic door cylinder 5 drives the outer door body 22 to open, and then the robot will place the workpiece to be cleaned on the workpiece positioning table inside the chip remover, and then the upper side clamping cylinder 10 will clamp the workpiece to the limit on the workpiece positioning table, and at the same time the robot will withdraw to a safe position, and the outer door closing detection sensor 8 will close the outer door body 22 again, that is, the gripper moving cylinder 13 will prompt the gripper driving gear 20 to drive the chip removal gripper 19 to operate, so as to realize the relative position change of the gripper and the workpiece, and then position The point air blow 15 will start blowing to remove iron chips, and then the middle air blow 18 will continue to operate. The subsequent part mid-position air blow 16 and the rotating air blow 17 in the surrounding holes will operate in succession to further blow the workpiece until the iron chips are removed. Then the outer door body 22 is reopened, and the above operation is repeated to take out the workpiece. At this time, during the automatic processing of the planetary carrier, the chips on its surface can be cleaned efficiently and fully, which further improves the smooth operation of the entire line, the beat requirements and the subsequent cleaning post-processing, while improving the production efficiency, the quality and qualified utilization rate of the planetary carrier are also improved.
[0029] Reference Figure 1 - Figure 5As shown, in this embodiment: the inner wall of the chip remover 1 is provided with an intermediate air blow 18, and the intermediate air blow 18 is located below the positioning point air blow 15. Through the setting of the intermediate air blow 18, the middle position of the planetary carrier can be further cleaned during the chip removal process, so that it is not easy for iron chips to exist in the dead corners of the parts, which improves the use effect of the chip remover 1. The inner wall of the chip remover 1 is fixedly connected with the part mid-position air blow 16, and the lower side middle air blow cylinder 14 is fixed on the surface of one side of the chip remover 1. The part mid-position air blow 16 is located above the positioning point air blow 15. Through the setting of the part mid-position air blow 16, the middle position of the planetary carrier can be further cleaned, so that the iron chips can be removed more cleanly and fully.
[0030] Reference Figure 1 - Figure 5 As shown, in the present embodiment: one side of the inner wall of the chip remover 1 is fixedly connected with an upper air-blowing movable cylinder 9, and the inner wall of the chip remover 1 is fixedly connected with a rotating air-blowing 17 in the surrounding holes, and the rotating air-blowing 17 in the surrounding holes is located above the mid-position air-blowing 16 of the part. The setting of the rotating air-blowing 17 in the surrounding holes cleans the working part of the inner wall of the chip remover 1, so that the inner wall of the chip remover 1 can be better ensured to be clean, so that it is not easy for iron filings to damage the components. The surface of the gripper fixing plate 21 is threadedly connected with a number of evenly distributed screws, and the several screws are respectively threadedly connected to the inner wall of one side of the chip remover 1. Through the setting of the screws, the chip removing gripper 19 is more convenient to use and more convenient for daily inspection and maintenance, thereby ensuring the normal use of the chip remover 1.
[0031] Reference Figure 1 - Figure 5 As shown, in this embodiment: the inner wall of the chip remover 1 is slidably connected with a chip trolley 4, and the chip trolley 4 is located below the inner wall of the chip remover 1. Through the setting of the chip trolley 4, the chips on the planetary frame can be collected in the chip trolley 4 after cleaning, so as to facilitate processing and improve the working efficiency of the chip remover 1. The cross-section of the chip removing claw 19 is "J" shaped, and the surface of the chip removing claw 19 is provided with a number of evenly distributed anti-slip protrusions. Through the special structure and special surface setting of the chip removing claw 19, the chip removing claw 19 can be more stable and firm when clamping the planetary frame, and is not easy to loosen, thereby better processing of chips and improving the processing effect.
[0032] Working principle: When the chip remover 1 is used to process the iron chips on the planetary carrier, first, the workpiece presence or absence detection sensor 6 of the chip remover 1 will detect whether there is a planetary carrier workpiece that needs to be processed. After detection, the outer door opening detection sensor 7 will give feedback to the outer automatic door cylinder 5, so that the outer automatic door cylinder 5 drives the outer door body 22 to open, and then the robot will place the workpiece to be cleaned on the workpiece positioning table inside the chip remover 1, and then the upper side clamping cylinder 10 will clamp the workpiece to the workpiece positioning table. At the same time, the robot will withdraw to a safe position, and the outer door closing detection sensor 8 will close the outer door body 22 again, that is, the claw moving cylinder 13 will prompt the claw driving gear 20 to drive the remover The chip-winding gripper 19 operates to achieve the change of the relative position of the gripper and the workpiece, and then the positioning point air blow 15 will operate to blow air to remove the iron chips, and then the middle air blow 18 will continue to operate, and the subsequent part mid-position air blow 16 and the rotating air blow 17 in the surrounding holes will operate in succession to further blow air to the workpiece until the iron chips are removed, and then the outer door body 22 is reopened, and the above operation is repeated to take out the workpiece. At this time, during the automatic processing of the planetary carrier, the chips on its surface can be cleaned efficiently and fully, which further improves the smooth operation of the entire line, the beat requirements and the subsequent cleaning post-processing, while improving the production efficiency, it also improves the quality and qualified utilization rate of the planetary carrier.
Claims
1. A chip removal device for planetary carrier machining, comprising a chip remover (1), characterized in that: A relay box (101) is fixedly connected to one side surface of the chip remover (1), a plurality of air blowing control valves (3) are fixedly connected to one side surface of the chip remover (1), a six-position valve island (2) is fixedly connected to one side surface of the chip remover (1), an outer automatic door cylinder (5) is fixedly connected to one side surface of the chip remover (1), an output end of the outer automatic door cylinder (5) is fixedly connected to an outer door body (22), and a surface of the chip remover (1) is located on the outer door body ( An outer door opening detection sensor (7) and an outer door closing detection sensor (8) are provided on one side of the door opening detection sensor (22); an upper pressing cylinder (10) is fixedly connected to the inner wall of the chip remover (1); a guide frame on the inner wall of the chip remover (1) has a rear automatic door lock (11); a hand claw fixing plate (21) is fixedly connected to the inner wall of the chip remover (1); a chip removing hand claw (19) is fixedly connected to one side of the hand claw fixing plate (21); and a chip removing hand claw (19) is fixedly connected to one side of the chip removing hand claw (19). A hand driving gear (20) is fixedly connected to the side surface, a hand claw cylinder (12) is fixedly connected to the inner wall of the chip remover (1), a hand claw moving cylinder (13) is fixedly connected to one side of the hand claw cylinder (12), a positioning point air blow (15) is arranged on the inner wall of the chip remover (1), an intermediate air blow (18) is arranged on the inner wall of the chip remover (1), and the intermediate air blow (18) is located below the positioning point air blow (15), and the inner wall of the chip remover (1) is fixedly connected There is a part mid-position air blow (16), a lower middle air blow cylinder (14) is fixed on one side surface of the chip remover (1), the part mid-position air blow (16) is located above the position of the positioning point air blow (15), an upper air blow moving cylinder (9) is fixedly connected to one side of the inner wall of the chip remover (1), and a rotating air blow (17) in a surrounding hole is fixedly connected to the inner wall of the chip remover (1), and the rotating air blow (17) in the surrounding hole is located above the part mid-position air blow (16).
2. A planetary carrier machining chip removal device according to claim 1, characterized in that: A plurality of evenly distributed screws are threadedly connected through the surface of the gripper fixing plate (21), and the plurality of screws are respectively threadedly connected to an inner wall of one side of the chip remover (1).
3. The device for removing debris from a planetary carrier according to claim 1, characterized in that: The inner wall of the chip remover (1) is slidably connected to a chip trolley (4), and the chip trolley (4) is located below the inner wall of the chip remover (1).
4. The device for removing debris from a planetary carrier according to claim 1, characterized in that: The cross section of the de-tangling claw (19) is in a "J" shape, and a plurality of evenly distributed anti-slip protrusions are arranged on the surface of the de-tangling claw (19).