Double-sided copper-based copper-clad plate

Abstract

The utility model relates to the technical field of double-sided copper-based copper-clad plates, in particular to a double-sided copper-based copper-clad plate which comprises a copper substrate, an upper copper plate and a lower copper plate, supporting ribs and reinforcing ribs are sequentially arranged at the top and the bottom of the copper substrate, and heat dissipation through grooves are formed in the two sides of the copper substrate in a penetrating mode. Heat dissipation holes are formed in the inner walls of the heat dissipation through grooves and penetrate through the interiors of the supporting ribs, and an upper insulating layer connected in a bonding mode is arranged between the adjacent sides of the copper substrate and the upper copper plate. Therefore, the mutual bonding property of the upper copper plate and the lower copper plate with the upper insulating layer and the lower insulating layer is conveniently improved, the bending resistance and tensile structural strength of the copper substrate are conveniently improved, the elastic deformation capacity of the copper substrate is enhanced, the whole double-sided copper-based copper-clad plate has efficient circulating heat dissipation performance, and the double-sided copper-based copper-clad plate is very practical.

Description

Technical Field

[0001] The utility model relates to the technical field of double-sided copper-based copper-clad laminates, in particular to a double-sided copper-based copper-clad laminate. Background Art

[0002] Double-sided copper-based copper-clad laminate is a copper-clad metal copper substrate, which is very similar to the overall structure of double-sided aluminum substrate, and has electrical insulation and mechanical processing performance. Due to the difference in the properties of copper and aluminum and the corresponding PCB processing technology, double-sided copper substrate has more performance advantages than double-sided aluminum substrate. Under the same conditions, aluminum substrate is about 200W / mk, and copper substrate is about 400W / mk.

[0003] In the actual application of the double-sided copper-based copper-clad laminate in the prior art, since it does not have an adhesive attachment structure, a reinforcing support structure, and a heat dissipation structure, it is not convenient to improve the mutual bonding between the upper copper plate, the lower copper plate, the upper insulating layer, and the lower insulating layer. At the same time, it is not convenient to improve the bending and tensile strength of the copper substrate and enhance the elastic deformation capacity of the copper substrate. It is not convenient to make the entire double-sided copper-based copper-clad laminate have efficient and flowing heat dissipation performance, which further affects the service life of the double-sided copper-based copper-clad laminate.

[0004] Therefore, it is necessary to design a double-sided copper-based copper-clad laminate to solve the above-mentioned problems. Summary of the invention

[0005] The purpose of the utility model is to provide a double-sided copper-based copper-clad laminate, which is designed to have an adhesive attachment structure, a reinforced support structure and a heat dissipation structure to improve the mutual bonding between the upper copper plate, the lower copper plate and the upper insulating layer, the lower insulating layer, and to improve the bending and tensile strength of the copper substrate and enhance the elastic deformation capacity of the copper substrate, and to enable the entire double-sided copper-based copper-clad laminate to have efficient and flowing heat dissipation performance, thereby solving the problems raised in the above-mentioned background technology.

[0006] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0007] A double-sided copper-based copper-clad laminate comprises a copper substrate, an upper copper substrate and a lower copper substrate, wherein the top and bottom of the copper substrate are sequentially provided with support ribs and reinforcing ribs, both sides of the copper substrate are provided with heat dissipation grooves, the inner wall of the heat dissipation grooves is provided with heat dissipation holes through the inside of the support ribs, an upper insulating layer bonded and connected is provided between the copper substrate and the adjacent side of the upper copper plate, a lower insulating layer bonded and connected is provided between the copper substrate and the adjacent side of the lower copper plate, and a bonding and attachment structure is provided on the side of the upper copper plate close to the upper insulating layer and the side of the lower copper plate close to the lower insulating layer.

[0008] As a preferred solution of the utility model, a plurality of heat dissipation grooves are evenly spaced along the side end surface of the copper substrate, and a plurality of heat dissipation holes are evenly spaced along the inner longer side of the support rib.

[0009] As a preferred solution of the utility model, the support rib is an n-type metal plate structure, and a plurality of the support ribs are evenly spaced and distributed on the top and bottom of the copper substrate, and the reinforcing ribs are fixedly connected between two adjacent support ribs.

[0010] As a preferred solution of the utility model, a plurality of the reinforcing ribs are provided, and the plurality of the reinforcing ribs all adopt a grid-type reinforcing rib structure.

[0011] As a preferred solution of the utility model, the upper and lower surfaces of the upper insulating layer and the lower insulating layer are coated with glue using polyimide resin as a binder.

[0012] As a preferred solution of the utility model, the adhesive attachment structure is specifically composed of a plurality of triangular pyramid convex parts that are directionally distributed and orderly arranged along the bottom of the upper copper plate and the top of the lower copper plate.

[0013] Beneficial effect: In view of the problem that the double-sided copper-based copper-clad laminate in the prior art does not have an adhesive attachment structure, a reinforcing support structure, and a heat dissipation structure, thereby failing to improve the mutual bonding between the upper copper plate, the lower copper plate, the upper insulating layer, and the lower insulating layer, and failing to improve the copper substrate's anti-bending and anti-tensile structural strength and enhance the copper substrate's elastic deformation capacity, and failing to make the entire double-sided copper-based copper-clad laminate have efficient heat dissipation performance, in the utility model, the support ribs arranged at the upper and lower ends of the copper substrate are combined with the reinforcing ribs of the grid-type reinforcing rib structure, so as to facilitate improving the copper substrate's anti-bending and anti-tensile structural strength and enhance the copper substrate's elastic deformation capacity, and through the heat dissipation grooves arranged on the copper substrate Cooperating with the heat dissipation holes that run through the support ribs, the entire double-sided copper-based copper-clad laminate has efficient and flowing heat dissipation performance. At the same time, the upper copper plate and the lower copper plate are provided with a bonding and attachment structure composed of a number of triangular pyramid convex parts that are directional, distributed and orderly arranged, which is convenient for improving the mutual bonding between the upper copper plate, the lower copper plate and the upper insulating layer and the lower insulating layer. The structure is simple and has a bonding and attachment structure, a reinforced support structure and a heat dissipation structure, thereby facilitating the improvement of the mutual bonding between the upper copper plate, the lower copper plate and the upper insulating layer and the lower insulating layer, and at the same time, it is convenient to improve the bending and tensile strength of the copper substrate and enhance the elastic deformation capacity of the copper substrate, and facilitate the entire double-sided copper-based copper-clad laminate to have efficient and flowing heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of a double-sided copper-based copper-clad laminate of the utility model;

[0015] Figure 2This is an overall side view of a double-sided copper-based copper-clad laminate of the utility model;

[0016] Figure 3 This is a schematic diagram of the copper base plate, support ribs and reinforcing rib structure of a double-sided copper-based copper-clad laminate of the utility model;

[0017] Figure 4 The utility model is a schematic diagram of a lower copper plate and a bonding and attachment structure of a double-sided copper-based copper-clad laminate.

[0018] In the figure: 1. copper base plate; 101. heat dissipation groove; 102. heat dissipation hole; 2. support ribs; 3. reinforcing ribs; 4. upper insulating layer; 5. upper copper plate; 6. lower insulating layer; 7. lower copper plate; 8. adhesive attachment structure. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant literature, and several embodiments of the present invention are given. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0021] It should be noted that when an element is referred to as being "fixed on" another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used in this article are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field of the present invention. The terms used in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used in this article includes any and all combinations of one or more related listed items.

[0023] See also Figure 1-4 , the utility model provides a technical solution:

[0024] A double-sided copper-based copper-clad laminate comprises a copper substrate 1, an upper copper plate 5 and a lower copper plate 7. Support ribs 2 and reinforcing ribs 3 are sequentially arranged on the top and bottom of the copper substrate 1. Heat dissipation grooves 101 are provided on both sides of the copper substrate 1. Heat dissipation holes 102 are provided on the inner wall of the heat dissipation grooves 101 through the support ribs 2. An upper insulating layer 4 is provided between the adjacent side of the copper substrate 1 and the upper copper plate 5. A lower insulating layer 6 is provided between the adjacent side of the copper substrate 1 and the lower copper plate 7. Adhesive attachment structures 8 are provided on the side of the upper copper plate 5 close to the upper insulating layer 4 and the side of the lower copper plate 7 close to the lower insulating layer 6.

[0025] like Figure 1 , Figure 2 and Figure 3 As shown, specifically, a plurality of heat dissipation grooves 101 are evenly spaced along the side end surface of the copper substrate 1, and a plurality of heat dissipation holes 102 are evenly spaced along the inner longer side direction of the support rib 2. The support rib 2 is an n-type metal plate structure, and a plurality of support ribs 2 are evenly spaced at the top and bottom of the copper substrate 1. The reinforcing ribs 3 are fixedly connected between two adjacent support ribs 2. A plurality of reinforcing ribs 3 are provided in total, and the plurality of reinforcing ribs 3 all adopt a grid-type reinforcing rib structure. The support ribs 2 provided at the upper and lower ends of the copper substrate 1 are combined with the reinforcing ribs 3 with a grid-type reinforcing rib structure, so as to improve the bending and tensile strength of the copper substrate 1 and enhance the elastic deformation capacity of the copper substrate 1. The heat dissipation grooves 101 provided on the copper substrate 1 are combined with the heat dissipation holes 102 that pass through the support ribs 2, so as to make the entire double-sided copper-based copper clad laminate have efficient heat dissipation performance.

[0026] like Figure 1 , Figure 2 and Figure 4 As shown, preferably, the upper and lower surfaces of the upper insulating layer 4 and the lower insulating layer 6 are coated with glue using polyimide resin as a binder, and the bonding structure 8 is specifically composed of a number of triangular pyramidal convex parts that are directionally distributed and orderly arranged along the bottom of the upper copper plate 5 and the top of the lower copper plate 7. By arranging the bonding structure 8 composed of a number of triangular pyramidal convex parts that are directionally distributed and orderly arranged on the upper copper plate 5 and the lower copper plate 7, it is convenient to improve the mutual bonding between the upper copper plate 5, the lower copper plate 7 and the upper insulating layer 4, and the lower insulating layer 6.

[0027] To sum up, firstly, by the support ribs 2 arranged at the upper and lower ends of the copper substrate 1 and the reinforcement ribs 3 with a grid-type reinforcement rib structure, it is convenient to improve the bending and tensile strength of the copper substrate 1 and enhance the elastic deformation capacity of the copper substrate 1, and by the heat dissipation groove 101 arranged on the copper substrate 1 and the heat dissipation hole 102 penetrating the support rib 2, it is convenient to make the entire double-sided copper-based copper-clad laminate have efficient heat dissipation performance, and at the same time, the upper copper plate 5 and the lower copper plate 7 are provided with a bonding structure 8 composed of a number of triangular pyramid convex parts arranged in a directional distribution and in an orderly manner, so as to improve the mutual bonding between the upper copper plate 5, the lower copper plate 7 and the upper insulating layer 4 and the lower insulating layer 6. The utility model is not only simple in structure but also has a bonding structure, a reinforcing support structure and a heat dissipation structure, so as to facilitate the improvement of the mutual bonding between the upper copper plate, the lower copper plate and the upper insulating layer and the lower insulating layer, and at the same time, it is convenient to improve the bending and tensile strength of the copper substrate and enhance the elastic deformation capacity of the copper substrate, and facilitate the entire double-sided copper-based copper-clad laminate to have efficient heat dissipation performance, which is very practical.

[0028] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A double-sided copper-based copper-clad laminate, comprising a copper substrate (1), an upper copper plate (5) and a lower copper plate (7), characterized in that The top and bottom of the copper substrate (1) are provided with support ribs (2) and reinforcing ribs (3) in sequence; heat dissipation grooves (101) are provided through both sides of the copper substrate (1); heat dissipation holes (102) are provided on the inner wall of the heat dissipation grooves (101) through the support ribs (2); an upper insulating layer (4) bonded to the adjacent side of the copper substrate (1) and the upper copper plate (5) is provided; a lower insulating layer (6) bonded to the adjacent side of the copper substrate (1) and the lower copper plate (7) is provided; and a bonding structure (8) is provided on the side of the upper copper plate (5) close to the upper insulating layer (4) and the side of the lower copper plate (7) close to the lower insulating layer (6).

2. A double-sided copper-based copper-clad laminate according to claim 1, characterized in that: A plurality of heat dissipation grooves (101) are evenly spaced and distributed along the side end surface of the copper base plate (1), and a plurality of heat dissipation holes (102) are evenly spaced and opened along the inner longer side of the support rib (2).

3. A double-sided copper-based copper-clad laminate according to claim 1, characterized in that: The support rib (2) is an n-type metal plate structure, and a plurality of the support ribs (2) are arranged at equal intervals on the top and bottom of the copper substrate (1), and the reinforcing rib (3) is located between two adjacent support ribs (2) and is fixedly connected.

4. A double-sided copper-based copper-clad laminate according to claim 3, characterized in that: A plurality of the reinforcing ribs (3) are provided, and the plurality of reinforcing ribs (3) all adopt a grid-type reinforcing rib structure.

5. The double-sided copper-based copper-clad laminate according to claim 1, characterized in that: The upper and lower surfaces of the upper insulating layer (4) and the lower insulating layer (6) are coated with glue using polyimide resin as a bonding agent.

6. The double-sided copper-based copper-clad laminate according to claim 1, characterized in that: The adhesive attachment structure (8) is specifically composed of a plurality of triangular pyramid convex parts that are directionally distributed and orderly arranged along the bottom of the upper copper plate (5) and the top of the lower copper plate (7).

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