Wafer glass sheet automatic aligning device

Abstract

The utility model discloses an automatic alignment device for a wafer glass sheet, which is characterized in that a mounting seat and a base are arranged, an identification mechanism, a bearing rotating mechanism and a lifting mechanism are integrated on the base, the bearing rotating mechanism can rotate through a rotating motor, and the lifting mechanism can lift and descend the bearing rotating mechanism; according to the device, the bearing table is arranged on the base, so that the bearing table can rotate and lift at the same time, a mechanical arm can conveniently place a grabbed wafer on the bearing table during lifting, meanwhile, the bearing table has the negative-pressure adsorption property and can stably adsorb the wafer, meanwhile, a centering guide mechanism is further arranged on the outer side of the bearing table, and the centering guide mechanism can guide the wafer to rotate and lift at the same time. According to the device, the wafer material sheet can be helped to return to the center coaxial with the bearing table and keep horizontal when descending from top to bottom along with the bearing table, so that the subsequent bearing table drives the wafer material sheet to rotate to be identified and coded by the device, and the whole device is simple in structure and high in practicability, has the characteristic of being installed at a narrow position and is low in maintenance cost.

Description

Technical Field

[0001] This utility model relates to the field of glass sheet technology, and in particular to an automatic alignment device for wafer glass sheets. Background Technology

[0002] In the wafer manufacturing process, the wafer carrier glass sheets (wafer wafers) placed arbitrarily in the material box need to be automatically oriented to a designated position for coding before scanning and inspection. This ensures accurate image acquisition during machine scanning, facilitating algorithm calculations. Currently, the wafer orientation process is performed on the inspection platform, which makes the equipment complex and expensive. This device uses a combination of an absolute encoder, a hollow motor, and a camera to pre-orient the glass sheets, which are then transferred to the inspection platform by a robotic arm. This design is simpler and has lower installation and maintenance costs. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide an automatic wafer glass sheet alignment device to solve the technical problems mentioned in the background art.

[0004] To solve the technical problem, this utility model adopts the following technical solution:

[0005] An automatic wafer glass plate alignment device includes a base and a mounting base. The mounting base is located at the upper end of the base and a high-precision camera assembly is mounted on the mounting base. The base is equipped with an identification mechanism, a receiving and rotating mechanism, and a lifting mechanism. The identification mechanism is located on one side of the upper surface of the base. The receiving and rotating mechanism includes a receiving platform and a rotary motor. The receiving platform has adsorption properties. The rotary motor is located inside the base and its output end is connected to the receiving platform. The base has a through slot for the receiving platform to extend out. The lifting mechanism is located inside the base and its output end is connected to the receiving and rotating mechanism to drive the receiving and rotating mechanism to move up and down.

[0006] Specifically, the receiving and rotating mechanism further includes a motor mounting base. A rotary motor is mounted on one side of the motor mounting base, and its output end is connected to the receiving platform via a flange. The lifting mechanism includes a stepper motor, a screw, a slide rail, and a slider. The slide rail is mounted on the inner wall of the base. The stepper motor is mounted on the lower end of the receiving and rotating mechanism and on the inner wall of the base. One side of the motor mounting base is fixedly connected to the slider, and the slider slides in conjunction with the slide rail. One side of the motor mounting base is also provided with a through hole that engages with the screw thread. The output end of the stepper motor is connected to the screw, and the rotation of the screw can drive the motor mounting base to slide up and down on the slide rail.

[0007] Specifically, the rotating shaft and flange of the rotary motor are provided with hollow ventilation holes, and the receiving platform has a negative pressure suction hole, which is connected to the ventilation hole.

[0008] Specifically, the negative pressure suction hole includes a main suction hole and a secondary suction hole, wherein the main suction hole is located inside the secondary suction hole, and a negative pressure suction groove is also connected to the outside of the main suction hole, and the negative pressure suction groove has a cross structure design.

[0009] Specifically, it also includes a centering and guiding mechanism, which consists of several limiting seats arranged in a circular array on the outside of the receiving platform. Each limiting seat includes a conical guide block and a circular abutment. The circular abutment is fixed to the base, and the conical guide block is fixedly arranged above the circular abutment.

[0010] Specifically, the identification mechanism is a double U-shaped laser beam sensor, and a coaxial light source is also installed on the mounting base at the lower end of the high-precision camera group.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0012] This device integrates an identification mechanism, a receiving and rotating mechanism, and a lifting mechanism on the base. The receiving and rotating mechanism can be rotated by a rotary motor, while the lifting mechanism can raise and lower the receiving and rotating mechanism. This allows the receiving platform to rotate and rise simultaneously, facilitating the placement of the gripped wafer onto the receiving platform by the robotic arm when it is raised. The receiving platform also has negative pressure adsorption properties, ensuring a stable hold on the wafer. Furthermore, a centering and guiding mechanism is located on the outside of the receiving platform, helping the wafer to align with the platform's center and remain horizontal as it descends. This allows the receiving platform to rotate the wafer for identification and encoding. The entire device has a simple structure, high practicality, is suitable for installation in confined spaces, and has low maintenance costs. Attached Figure Description

[0013] Figure 1 : This is a schematic diagram of the overall structure of this utility model patent. Figure 1 ;

[0014] Figure 2 : This is a schematic diagram of the overall structure of this utility model patent. Figure 2 ;

[0015] Figure 3 This is a schematic diagram of the base structure of this utility model patent;

[0016] Figure 4 : Schematic diagram of the receiving rotation mechanism and lifting mechanism in this utility model patent Figure 1 ;

[0017] Figure 5 : Schematic diagram of the receiving rotation mechanism and lifting mechanism in this utility model patent Figure 2 ;

[0018] Figure 6 This is a schematic diagram of the receiving platform, flange, and rotary motor structure in this utility model.

[0019] Figure 7 : This is a top view of the base structure in this utility model (a schematic diagram of the wafer material acting on the receiving platform);

[0020] In the diagram: base 10, mounting seat 20, high-precision camera group 201, recognition mechanism 100, receiving rotation mechanism 200, lifting mechanism 300, receiving platform 21, rotary motor 22, through groove 101, motor mounting seat 23, flange 24, stepper motor 31, screw 32, slide rail 33, slider 34, through hole 231, vent hole 241, negative pressure suction hole 210, main suction hole 211, secondary suction hole 212, negative pressure suction groove 213, centering and guiding mechanism 400, limiting seat 41, conical guide block 411, circular abutment 412, coaxial light source 202. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0022] refer to Figures 1 to 7 :

[0023] This utility model patent discloses an automatic wafer glass wafer alignment device, including a base 10 and a mounting base 20. The mounting base 20 is located at the upper end of the base 10 and has a cabinet structure. A high-precision camera group 201 is installed inside the cabinet structure. The high-precision camera group 201 is used to capture images of the wafer for system analysis. The base 10 is equipped with an identification mechanism 100, a receiving and rotating mechanism 200, and a lifting mechanism 300. The identification mechanism 100 is located on one side of the upper surface of the base 10 and is used to identify the cross-sectional position of the wafer and transmit information to the high-precision camera group 201 for material and code identification. The receiving and rotating mechanism 200 includes a receiving platform 21 and a rotary motor 22. The receiving platform 21 has adsorption properties. The adsorption properties can be achieved using suction cups, negative pressure adsorption mechanisms, or other components with controllable adsorption characteristics. The rotary motor 22 is located inside the base 10 and its output end is connected to the receiving platform 21 to drive the receiving platform 21 to rotate. The base 10 is provided with a through groove 101 for the receiving platform 21 to extend out. Preferably, the through groove 101 is a rectangular groove. The lifting mechanism 300 is located inside the base 10 and its output end is connected to the receiving rotation mechanism 200 to drive the receiving rotation mechanism 200 to rise and fall. When the receiving rotation mechanism 200 is driven to rise and fall, the receiving platform 21 is also driven to rise, so that the receiving platform 21 can extend to the upper end of the through groove 101. There are fewer obstacles here, which makes it easier for the robot to place the wafer material it has picked up onto the receiving platform 21.

[0024] The receiving and rotating mechanism 200 also includes a motor mounting base 23. A rotary motor 22 is mounted on one side of the motor mounting base 23, and its output end passes through the motor mounting base 23 and is finally connected to the receiving platform 21 via a flange 24. The lifting mechanism 300 includes a stepper motor 31, a screw 32, a slide rail 33, and a slider 34. The slide rail 33 is longitudinally mounted on the inner wall of the base 10. The stepper motor 31 is mounted on the lower end of the receiving and rotating mechanism 200 and the inner wall of the base 10 via a mounting bracket. One side of the motor mounting base 23 is fixedly connected to the slider 34, and the slider 34 slides in conjunction with the slide rail 33. The motor mounting base 200... One side of the screw 32 is also provided with a through hole 231 that is threaded to the screw 32. That is, the through hole 231 has a threaded structure or a nut is provided at the through hole 231. In some cases, the screw 32 can also be replaced with a lead screw. The output end of the stepper motor 31 is connected to the screw 32. The rotation of the stepper motor 31 drives the screw 32 to rotate. When the screw 32 rotates, it is threaded to the through hole 231, which forces the motor mounting base 23 to slide up and down with the screw 32. Because there is a slider 34 on the other side of the motor mounting base 23 that slides with the slide rail 33, the up and down sliding of the motor mounting base 23 is not easy to shake. Finally, it can drive the receiving platform 21 to slide up and down.

[0025] Specifically, in some optional embodiments, regarding the adsorption characteristics of the receiving platform 21, since the receiving platform 21 also needs to rotate, ordinary air pipes connected to the receiving platform 21 may become entangled. This embodiment provides an implementation scheme in which the rotating shaft of the rotary motor 22 and the flange 24 are both provided with hollow structure ventilation holes 241. The rotating shaft here has an upper end and a lower end. Its lower end is connected to the ventilation pipe through a bearing rotational sealing connection, and its upper end is connected to the flange 24. The receiving platform 21 has a negative pressure suction hole 210, which is connected to the ventilation hole 241. By drawing air through the compressor installed in the base 10, the receiving platform 21 can form a negative pressure environment, thereby possessing adsorption characteristics. In a certain optional embodiment, the receiving platform 21 can achieve its adsorption characteristics by setting an electric suction cup.

[0026] Specifically, in order to improve the adsorption characteristics of the receiving platform 21, the negative pressure suction hole 210 includes a main suction hole 211 and a secondary suction hole 212, wherein the main suction hole 211 is located inside the secondary suction hole 212, and a negative pressure suction groove 213 is also connected to the outside of the main suction hole 211, and the negative pressure suction groove 213 is designed in a cross structure.

[0027] Specifically, when the wafer descends with the receiving platform 21 into the area identified by the recognition mechanism 100, the robotic arm may not be placed horizontally or at the coaxial center of the receiving platform 21. This will affect the recognition by the recognition mechanism 100 and ultimately the imaging and recognition by the high-precision camera group 201 above. Here, a centering and guiding mechanism 400 is provided. The centering and guiding mechanism 400 consists of several circumferentially arrayed limiting seats 41 distributed on the outside of the receiving platform 21. Each limiting seat 41 includes a conical guide block 411 and a circular abutment 412. The circular abutment 412 is fixed to the base 10, and the conical guide block 411 is fixedly positioned above the circular abutment 412. When the wafer descends with the receiving platform 21, the limiting seats 41 located on the outside of the receiving platform 21 form a circular arc area. When the wafer descends, the outer edge of the wafer first contacts... When the wafer touches the conical guide block 411, its guiding action helps to align the wafer, transforming it from a non-horizontal state to a horizontal one. Then, as the wafer falls onto the six circular bases 10, its circular position is aligned with the circular shape of the receiving platform 21. This is the optimal position for the identification mechanism 100 to recognize the wafer, and also the optimal position for the high-precision camera group 201 to capture images. After the centering and guiding action of the centering and guiding mechanism 400, the rotary motor 22 begins to rotate. When the dual U-shaped laser beam sensor detects the position of the wafer with a cut surface (each wafer has an arc surface and a cut surface, the cut surface being used for identification), the rotary motor 22 stops rotating and transmits information to the high-precision camera group 201 for material and code identification, thus completing the alignment process and providing the alignment position for subsequent high-precision processing.

[0028] Specifically, the identification mechanism 100 is a dual U-shaped laser beam sensor, and a coaxial light source 202 is also installed on the mounting base 20 and at the lower end of the high-precision camera group 201.

[0029] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.

Claims

1. A wafer glass sheet automatic rotation device, comprising a base and a mounting seat, wherein the mounting seat is located at the upper end of the base, and a high-precision camera group is installed on the mounting seat, characterized in that: An identification mechanism, a receiving and rotating mechanism and a lifting mechanism are installed on the base, wherein the identification mechanism is located on one side of the upper end surface of the base, the receiving and rotating mechanism includes a receiving platform and a rotating motor, wherein the receiving platform has an adsorption property, the rotating motor is located on the inner side of the base and its output end is connected to the receiving platform, the base is provided with a through slot for the receiving platform to extend out, the lifting mechanism is located on the inner side of the base and its output end is connected to the receiving and rotating mechanism to drive the receiving and rotating mechanism to rise and fall.

2. The automatic straightening device for a glass wafer according to claim 1, characterized in that: The supporting rotation mechanism also includes a motor mounting seat, the rotating motor is installed on one side of the motor mounting seat and its output end is connected to the supporting platform through a flange, the lifting mechanism includes a stepper motor, a screw, a slide rail and a slider, wherein the slide rail is installed on the inner wall of the base, the stepper motor is installed on the lower end of the supporting rotation mechanism and the inner wall of the base, one side of the motor mounting seat is fixedly connected to the slider, the slider and the slide rail are slidably matched, one side of the motor mounting seat is also provided with a through hole matched with the screw thread, the output end of the stepper motor is connected to the screw, and the rotation of the screw can drive the motor mounting seat to slide up and down on the slide rail.

3. The automatic straightening device for a glass wafer according to claim 2, characterized in that: The rotating shaft and flange of the rotating motor are both provided with hollow structure vent holes, and the receiving platform is provided with negative pressure suction holes, which are connected with the vent holes.

4. The automatic straightening device for a glass wafer according to claim 3, characterized in that: The negative pressure suction hole comprises a main suction hole and a secondary suction hole, wherein the main suction hole is located on the inner side of the secondary suction hole, and the outer side of the main suction hole is also connected to a negative pressure suction groove, and the negative pressure suction groove is designed in a cross structure.

5. The automatic straightening device for a glass wafer according to any one of claims 1 to 4, characterized in that: It also includes a centering and aligning mechanism, which is composed of a number of limit seats distributed in a circular array on the outside of the receiving platform, wherein each limit seat includes a conical guide block and a circular stop seat, the circular stop seat is fixed to the base, and the conical guide block is fixedly arranged above the circular stop seat.

6. The automatic straightening device for a glass wafer according to any one of claims 1 to 4, characterized in that: The identification mechanism is a double U-shaped laser beam sensor, and a coaxial light source is also installed on the mounting seat and at the lower end of the high-precision camera group.

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