Electronickelling anode surface activation device for integrated circuit

Abstract

The utility model relates to an integrated circuit electronickelling anode surface activation device in the technical field of integrated circuit nickel electrode activation, which comprises an outer tank body and an inner tank body, the outer tank body is arranged on one side of the inner tank body, the outer tank body and the inner tank body are respectively provided with an anode and a cathode, the anode of the outer tank body is outer tank anode titanium blue, and the cathode of the outer tank body is outer tank anode titanium blue. And the cathode of the outer tank body is an outer tank cathode stainless steel mesh. A group of independent electrolytic baths are modified and erected on the basis of an existing outer bath body, the inner bath and the outer bath are in an electrolysis state constantly, impurities in plating liquid are separated out constantly, and meanwhile, the surface of an anode nickel cake is in a dissociation state constantly, so that adverse effects caused by passivation of an anode nickel layer and reduction of the quality of a nickel plating layer are eliminated; the service life of the liquid medicine is prolonged, and the production cost is reduced; however, in this way, production interruption and quality problems caused by nickel coating abnormity can be effectively avoided, the circulation time is saved, the product yield is improved, and the brought positive benefits far exceed the consumed cost.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit nickel electrode activation, in particular to an integrated circuit electroplating nickel anode surface activation device. Background Art

[0002] In the field of semiconductor manufacturing, wafer bumping electroplating is one of the key processes, among which nickel electroplating is widely used due to its good conductivity and mechanical properties. However, the metal nickel layer is very easy to passivate, forming a dense and thick passivation film, which is highly resistant to general activation treatment, making it difficult for organic acids to effectively activate the nickel layer. This passivation phenomenon not only occurs on the cathode, but is more common on the anode. Due to its continuous characteristics, if the equipment is not stopped and disassembled, the passivation phenomenon is often difficult to detect in time, which ultimately leads to a serious decline in product quality.

[0003] Pure nickel is a highly chemically active metal. Its high reactivity can be observed in powder state, but its reaction with air is relatively slow in bulk metal state. This is because a protective oxide layer, namely the passivation layer, is formed on the surface of nickel. The formation of anode passivation is due to the existence of this passivation layer. In addition, during the electroplating process, the passivation of the nickel layer on both the cathode and the anode will have an adverse effect on the quality of the coating. The passivated nickel layer will have pores between the lattices in the microstructure. The existence of this porosity makes the nickel layer and the base metal underneath more susceptible to corrosion, thereby reducing the corrosion resistance of the coating. Over time, these problems may lead to oxidation discoloration, water stains and rust, and even coating shedding, which seriously affect the reliability and performance of the product.

[0004] Therefore, solving the passivation problem of the nickel layer and improving the quality and stability of the nickel electroplating layer are of great significance to improving the overall performance of semiconductor devices and extending their service life. Utility Model Content

[0005] The utility model aims to solve the shortcomings in the prior art and provides an integrated circuit nickel electroplating anode surface activation device.

[0006] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: an integrated circuit electroplating nickel anode surface activation device, comprising an outer tank body and an inner tank body, the outer tank body is arranged on one side of the inner tank body, the outer tank body and the inner tank body are respectively provided with an anode and a cathode, the anode of the outer tank body is an outer tank anode titanium blue, the cathode of the outer tank body is an outer tank cathode stainless steel mesh, the outer tank anode titanium blue and the outer tank cathode stainless steel mesh are respectively arranged on both sides of the outer tank body, the anode of the inner tank body is an inner tank anode titanium blue, the cathode of the inner tank body is a clamp, the inner tank anode titanium blue and the clamp are respectively arranged on both sides of the inner tank body, a wafer is clamped in the clamp, anode nickel cakes are attached to the outer tank anode titanium blue and the inner tank anode titanium blue, the outer tank body and the inner tank body are connected by a circulating pump, and a plating solution is arranged in the inner tank body.

[0007] As a further description of the above technical solution:

[0008] The plating solution overflows from the upper part of the inner tank body, enters the outer tank body, and then returns to the inner tank body through a circulation pump.

[0009] As a further description of the above technical solution:

[0010] The length of the outer tank cathode stainless steel mesh is 25-35 cm and the width is 20-30 cm.

[0011] As a further description of the above technical solution:

[0012] The clamp is connected with an electrolysis fixture.

[0013] As a further description of the above technical solution:

[0014] The inner tank body and the outer tank body have an operating time of 24 hours. The inner tank body and the outer tank body are in an electrolytic state at all times, and impurities in the plating solution are precipitated at all times.

[0015] As a further description of the above technical solution:

[0016] The surfaces of the nickel cakes on the outer tank anode titanium blue and the inner tank anode titanium blue are always in a dissociated state, eliminating the passivation of the cathode and anode nickel layers.

[0017] As a further description of the above technical solution:

[0018] The temperature of the inner tank is 45±2°C, the voltage is 8-10V, and the current is 5A.

[0019] As a further description of the above technical solution:

[0020] The voltage of the outer tank is 5.5±1V, and the current is 6±0.5A.

[0021] The utility model has the following beneficial effects:

[0022] 1. In the utility model, a group of independent electrolytic cells are modified and set up on the basis of the existing outer tank body, and the inner tank is synchronously matched to replace the electrolytic fixture for electrolysis during the interval of non-production, so that the inner and outer tanks are always in the state of electrolysis, and the impurities in the plating solution are always precipitated. At the same time, the surface of the anode nickel cake is always in a dissociated state, so as to eliminate the adverse effects caused by the passivation of the anode nickel layer and the deterioration of the quality of the nickel plating layer;

[0023] 2. In the utility model, the impurities in the plating solution can be continuously precipitated through the continuous electrolysis state of the inner and outer tanks, which not only prolongs the service life of the solution but also helps to reduce production costs;

[0024] 3. In the utility model, the inner and outer tanks are in a state of continuous electrolysis. Although the anode nickel cake will be gradually consumed due to continuous electrolysis, this method can effectively avoid production interruptions and quality problems caused by abnormal nickel plating. The saved cycle time and improved product yield, as well as the recyclability of stainless steel and nickel blocks, bring positive benefits that far outweigh the cost of consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 The utility model is a schematic diagram of the structure of the integrated circuit nickel electroplating anode surface activation device.

[0026] Legend:

[0027] 1. Outer tank body; 2. Inner tank body; 3. Outer tank anode titanium blue; 4. Outer tank cathode stainless steel mesh; 5. Inner tank anode titanium blue; 6. Fixture; 7. Wafer; 8. Anode nickel cake; 9. Circulation pump; 10. Plating solution. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] Reference Figure 1The utility model provides an embodiment: an integrated circuit electroplating nickel anode surface activation device, comprising an outer tank body 1 and an inner tank body 2. The outer tank body 1 is arranged on one side of the inner tank body 2, and the outer tank body 1 and the inner tank body 2 are respectively provided with an anode and a cathode. The outer tank body 1 and the inner tank body 2 perform electrolytic reactions at all times through their respective cathodes and anodes. The anode of the outer tank body 1 is an outer tank anode titanium blue 3, and the cathode of the outer tank body 1 is an outer tank cathode stainless steel mesh 4. The outer tank anode titanium blue 3 and the outer tank cathode stainless steel mesh 4 are respectively arranged on both sides of the outer tank body 1, the anode of the inner tank body 2 is an inner tank anode titanium blue 5, and the cathode of the inner tank body 2 is a clamp 6. The inner tank anode titanium blue 5 and the clamp 6 are respectively arranged on both sides of the inner tank body 2, and a wafer 7 is clamped in the clamp 6. Anode nickel cakes 8 are attached to the outer tank anode titanium blue 3 and the inner tank anode titanium blue 5. The outer tank body 1 and the inner tank body 2 are connected through a circulating pump 9, and a plating solution 10 is arranged in the inner tank body 2.

[0030] The plating solution 10 overflows from the upper part of the inner tank body 2, enters the outer tank body 1, and then returns to the inner tank body 2 through the circulation pump 9. The outer tank body 1 and the inner tank body 2 are connected by the circulation pump 9 to ensure that the plating solution 10 circulates between the two tanks, thereby achieving continuous precipitation of impurities. The outer tank body 1 maintains a constant plating liquid level through the overflow effect of the inner tank body 2 to make the distribution of electric lines more even.

[0031] The length of the outer tank cathode stainless steel mesh 4 is 25-35 cm and the width is 20-30 cm.

[0032] The fixture 6 is connected with an electrolytic jig, and electrolysis is performed by the electrolytic jig during the intervals when there is no production, so that the inner and outer tanks are always in an electrolytic state, and impurities in the plating solution 10 are precipitated at all times.

[0033] During electrolysis, the cathode stainless steel mesh of the outer tank is a stainless steel mesh for fake plating, the purpose of which is to remove impurities in the plating solution 10 and maintain the activation of the anode nickel cake 8, while the cathode of normal electroplating is a wafer product. The cathode reactions of the two tanks are the same. The difference is that the geometric shape of the normal electroplating tank is designed and the quality is controlled, while the electrolytic tank has no such design and is only used to assist the chemical reaction.

[0034] The following reactions occur at the cathodes of the two cells:

[0035] Ni 2+ +2e - →Ni,

[0036] 2H + +2e - →H2↑(vice).

[0037] The following reactions occur at the anodes of the two cells:

[0038] Ni-2e - →Ni 2+ ,

[0039] 2H2O-4e - →O2↑+4H + (vice),

[0040] 2Cl - -2e - →Cl2↑(sub).

[0041] The operation time of the inner tank body 2 and the outer tank body 1 is 24 hours. The inner tank body 2 and the outer tank body 1 are in an electrolytic state at all times, and the impurities in the plating solution 10 are precipitated at all times.

[0042] The surfaces of the nickel cakes on the outer tank anode titanium blue 3 and the inner tank anode titanium blue 5 are always in a dissociated state, and oxidation-reduction reactions occur to generate Ni2+ which enters the plating solution 10 to eliminate the passivation of the cathode and anode nickel layers.

[0043] The inner tank body 2 is set with a specific temperature and voltage, and the outer tank body 1 also has its corresponding voltage and current settings to optimize the electrolysis efficiency. The temperature of the inner tank body 2 is 45±2℃, the voltage is 8-10V, and the current is 5A. The voltage of the outer tank body 1 is 5.5±1V and the current is 6±0.5A.

[0044] Working principle: During the electrolysis process, the anodes of the inner tank body 2 and the outer tank body 1 undergo oxidation reactions, releasing Ni2+ into the plating solution 10. At the same time, side reactions may also occur at the anode, such as the oxidation of water to generate oxygen and hydrogen ions. The outer tank cathode stainless steel mesh 4 serves as a false plating cathode, and its main function is to remove impurities in the plating solution 10, such as generating hydrogen through a reduction reaction to help clean the plating solution 10. Through continuous electrolysis, the surface of the anode nickel cake 8 remains in a dissociated state, effectively eliminating the passivation of the cathode and cathode nickel layers, thereby improving the quality and stability of the electroplating layer. The circulation pump 9 ensures that the plating solution 10 circulates between the inner and outer tanks, allowing impurities to overflow from the inner tank body 2 and enter the outer tank body 1, and return to the inner tank body 2 after being processed by the outer tank cathode stainless steel mesh 4. The inner tank body 2 and the outer tank body 1 are designed to operate continuously for 24 hours to achieve continuous impurity precipitation and elimination of nickel layer passivation;

[0045] The copper is continuously electrolyzed, and the device effectively removes impurities in the plating solution 10, reduces the porosity of the electroplating layer, and improves the density and uniformity of the electroplating layer. Impurities are removed by electrolysis, which reduces the consumption of the plating solution, prolongs the service life of the solution, and reduces production costs. By eliminating the passivation of the anode nickel layer, production interruptions caused by quality problems of the electroplating layer are reduced, and production efficiency is improved. The design of the device also takes into account the recyclability of materials, reduces waste emissions in the production process, and meets the requirements of modern production for environmental protection. The design of the outer tank body 1 and the inner tank body 2 simplifies the maintenance of the equipment. By regularly replacing the stainless steel mesh 4 and the anode nickel cake 8, the long-term stable operation of the equipment can be maintained. By improving the electroplating quality and production efficiency, the device can bring significant economic benefits, while also reducing the cost of long-term operation.

[0046] The innovative method of the utility model can be widely applied to various wafer nickel electroplating processes.

[0047] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An integrated circuit nickel electroplating anode surface activation device, comprising an outer tank body (1) and an inner tank body (2), characterized in that: The outer tank body (1) is arranged on one side of the inner tank body (2); the outer tank body (1) and the inner tank body (2) are respectively provided with an anode and a cathode; the anode of the outer tank body (1) is an outer tank anode titanium blue (3); the cathode of the outer tank body (1) is an outer tank cathode stainless steel mesh (4); the outer tank anode titanium blue (3) and the outer tank cathode stainless steel mesh (4) are respectively arranged on both sides of the outer tank body (1); the anode of the inner tank body (2) is an inner tank anode titanium blue (5), the cathode of the inner tank body (2) is a fixture (6), the inner tank anode titanium blue (5) and the fixture (6) are respectively arranged on two sides of the inner tank body (2), a wafer (7) is clamped in the fixture (6), an anode nickel cake (8) is attached to the outer tank anode titanium blue (3) and the inner tank anode titanium blue (5), the outer tank body (1) and the inner tank body (2) are connected by a circulation pump (9), and a plating solution (10) is arranged in the inner tank body (2).

2. The integrated circuit nickel electroplating anode surface activation device according to claim 1, characterized in that: The plating solution (10) overflows from the upper part of the inner tank body (2), enters the outer tank body (1), and then returns to the inner tank body (2) through the circulation pump (9).

3. The integrated circuit nickel electroplating anode surface activation device according to claim 2, characterized in that: The outer tank cathode stainless steel mesh (4) has a length of 25-35 cm and a width of 20-30 cm.

4. The integrated circuit nickel electroplating anode surface activation device according to claim 3, characterized in that: The clamp (6) is connected to an electrolysis fixture.

5. The integrated circuit nickel electroplating anode surface activation device according to claim 4, characterized in that: The inner tank body (2) and the outer tank body (1) have an operating time of 24 hours. The inner tank body (2) and the outer tank body (1) are always in an electrolytic state, and the impurities in the plating solution (10) are precipitated at all times.

6. The integrated circuit nickel electroplating anode surface activation device according to claim 5, characterized in that: The surfaces of the nickel cakes on the outer tank anode titanium blue (3) and the inner tank anode titanium blue (5) are always in a dissociated state, eliminating the passivation of the cathode and anode nickel layers.

7. The integrated circuit nickel electroplating anode surface activation device according to claim 6, characterized in that: The temperature of the inner tank body (2) is 45±2°C, the voltage is 8-10V, and the current is 5A.

8. The integrated circuit nickel electroplating anode surface activation device according to claim 7, characterized in that: The voltage of the outer tank (1) is 5.5±1V, and the current is 6±0.5A.

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