Rapid chip testing device

Abstract

The utility model provides a chip rapid testing device, which comprises a chip testing module, a charging tray, a charging tray moving mechanism and a chip grabbing module, and is characterized in that the chip testing module comprises a testing jig and a pressing mechanism, the testing jig is used for placing and testing chips, the pressing mechanism is used for pressing the chips, and the charging tray is used for accommodating a plurality of chips; the tray moving mechanism is used for synchronously moving the test fixture and the tray in a first direction, and the chip grabbing module is used for enabling the chip to move between the tray and the test fixture. According to the chip rapid testing device provided by the utility model, the charging tray and the testing jig can be moved at the same time through the charging tray moving mechanism, the charging tray is always kept at a position adjacent to the testing jig, and the distance between the charging tray and the testing jig is relatively short, so that the testing period of a single chip is relatively short, the chip testing time is relatively short, and the chip testing efficiency is relatively high. In addition, the chip rapid testing device can be compatible with a manual testing jig, and the chip testing module can adopt an original manual testing jig.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip testing, and more specifically relates to a chip rapid testing device. Background Art

[0002] At present, CIS (CMOS Image Sensor) chips are tested manually with manual test fixtures in the fast packaging line to detect whether the packaged products are abnormal. In general fast packaging lines, manual testing of chips is used, specifically using tweezers to pick up the chips and place them in the manual test fixture for manual pressing and testing. The test time is long and the efficiency is relatively low, resulting in a long fast packaging verification time, which cannot meet the production cycle requirements of the fast packaging line. Utility Model Content

[0003] The purpose of the embodiment of the utility model is to provide a chip rapid testing device to solve the technical problems of long time and low efficiency of manual pressing test in the prior art.

[0004] In order to achieve the above-mentioned purpose, the technical solution adopted by the utility model is: to provide a chip rapid testing device, comprising:

[0005] A chip testing module, comprising a testing fixture and a pressing mechanism, wherein the testing fixture is used to place and test the chip, and the pressing mechanism is used to press down the chip;

[0006] A tray, used to accommodate a plurality of the chips;

[0007] A tray moving mechanism, used for synchronously moving the test fixture and the tray in a first direction;

[0008] The chip grabbing module is used to move the chip between the material tray and the test fixture.

[0009] In the above scheme, the chip rapid testing device includes a chip testing module, a tray, a tray moving mechanism and a chip grabbing module. The tray moving mechanism can move the test fixture and the tray in a first direction, and the chip grabbing module is used to move the chip between the tray and the test fixture. When testing the chip, the tray moving mechanism moves the tray and the test fixture to the bottom of the chip grabbing module, the chip grabbing module moves the chip from the tray to the test fixture, and then the pressing mechanism presses down the chip to test the chip. The tray moving mechanism can move the tray and the test fixture at the same time, keeping the tray always in the vicinity of the test fixture, and the distance between the two is close, so the test cycle of a single chip is short, so the chip test time is short and the efficiency is high. Moreover, the chip rapid testing device is also compatible with manual test fixtures, and the chip testing module can use the original manual test fixture.

[0010] Optionally, the chip grabbing module includes a nozzle moving mechanism, a nozzle feeding mechanism and a nozzle assembly for sucking the chip, the nozzle feeding mechanism is used to move the nozzle assembly in a vertical direction, and the nozzle moving mechanism is used to move the nozzle feeding mechanism and the nozzle assembly between the material tray and the test fixture.

[0011] In the above scheme, when the material tray and the test fixture are arranged along the second direction, the movement direction of the moving end of the suction nozzle moving mechanism is also the second direction, so that the chip can be moved between the material tray and the test fixture by moving the suction nozzle assembly. The direction of the moving end of the suction nozzle feeding mechanism is the vertical direction, which can drive the suction nozzle assembly to move in the vertical direction. Among them, the vertical direction is arranged perpendicular to the first direction and the second direction, and the first direction and the second direction are both horizontal directions. Through the setting of the suction nozzle moving mechanism, the suction nozzle assembly can be moved, so that the chip can be transferred between the material tray and the test fixture, and the chip can be quickly transferred.

[0012] Optionally, the chip grabbing module further includes a visual positioning component, the nozzle feeding mechanism and the visual positioning component are both fixed to the moving end of the nozzle moving mechanism, and the visual positioning component includes a shooting component for photographing the chip and a light source for providing shooting light.

[0013] In the above scheme, the nozzle feeding mechanism and the visual positioning component are both fixed to the moving end of the nozzle moving mechanism, that is, the nozzle feeding mechanism, the nozzle assembly and the visual positioning component move synchronously in the second direction, so that the positions of the nozzle assembly and the visual positioning component in the second direction are relatively fixed, and there is no need to repeatedly compensate and calibrate the coordinate systems of the nozzle assembly and the visual positioning component when taking and placing the chip.

[0014] Optionally, the material tray and the test fixture are spaced apart along a second direction, and the first direction and the second direction are perpendicular to each other.

[0015] In the above scheme, the first direction and the second direction are perpendicular to each other, which firstly makes the layout of the chip rapid testing device simpler, and secondly makes the moving paths of the material tray, the test fixture, and the chip grabbing module easier to calculate, thereby reducing the calculation amount of the control center.

[0016] Optionally, there are two material trays, one of which is used to place untested chips, and the other is used to place tested chips, and both of the two material trays move synchronously with the test fixture.

[0017] In the above scheme, the tray for placing untested chips can be called the first tray, and the tray for placing tested chips can be called the second tray. After the test, the chips can be moved to the second tray through the chip grabbing module or other modules. The two trays move synchronously with the test fixture, and the two trays and the test fixture can be controlled simultaneously by a tray moving mechanism. The chips after the test can be transferred to the second tray through the chip grabbing module, thereby reducing the number of modules in the chip rapid testing device and the path of the chip transfer. The transfer of the chips to be tested and the transfer of the chips after the test are both carried out by the movement of the chip grabbing module in the second direction. The path of the chip is shorter, and the time for chip transfer is shorter. Correspondingly, the efficiency of chip testing is higher.

[0018] Optionally, the two material trays are respectively arranged on opposite sides of the test fixture in a second direction, and the first direction and the second direction are perpendicular to each other.

[0019] In the above scheme, the movement distance of the chip to be tested is roughly the same as the movement distance of the chip after the test is completed, so that the time of each action of the device is close to the same, and the action rhythm is easier to control. In other embodiments, the two material trays can also be set on the same side of the test fixture in the second direction.

[0020] Optionally, the tray transmission mechanism includes a tray drive, a screw driven by the tray drive, a nut seat threadedly connected to the screw seat, and a mounting plate fixed to the nut seat, the test fixture is fixed to the mounting plate, and the tray is placed on the mounting plate.

[0021] In the above scheme, by setting up a tray drive, a screw and a nut seat, the rotation of the tray drive can be converted into a translational movement of the nut seat and the mounting plate. The movement accuracy of the screw mechanism is relatively high, and the position of the mounting plate can be accurately controlled. In other words, the position of the chip in the tray and the position of the test fixture can be accurately controlled.

[0022] Optionally, the pressing mechanism comprises a pressing driving member, a flexible deformation portion and an upper box which are connected in sequence, and the upper box has a pressing sheet for pressing on the edge of the chip.

[0023] In the above scheme, by setting the pressing driving member, the upper box can be moved up and down, so that the chip can be pressed and tested. By setting the flexible deformation part, the flexible deformation part can be deformed when subjected to external force, and when the upper box contacts the chip, the impact of the upper box on the chip can be reduced to avoid damage to the chip.

[0024] Optionally, the flexible deformation portion is an airbag.

[0025] In the above solution, the flexible deformation part is an airbag, which can be deformed in the vertical direction and can also be deformed in the horizontal direction. By inflating the airbag, the airbag has a certain support capacity and a certain deformation capacity.

[0026] Optionally, the test fixture includes a test box, a test circuit board electrically connected to the test box, a probe seat electrically connected to the test circuit board, and a floating seat floated on the probe seat, wherein the floating seat has a receiving cavity for receiving the chip.

[0027] In the above scheme, the floating seat can buffer the downward pressure on the chip and ensure that the probe on the probe seat always maintains good contact with the chip. A spring can be arranged between the floating seat and the probe seat, and the spring can be deformed when subjected to pressure, so that the floating seat can float relative to the probe seat to buffer the pressure on the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 The three-dimensional structure of the chip rapid testing device provided by the embodiment of the utility model Figure 1 ;

[0030] Figure 2 A partial three-dimensional structural diagram of a chip rapid testing device provided by an embodiment of the utility model;

[0031] Figure 3 The three-dimensional structure of the chip rapid testing device provided by the embodiment of the utility model Figure 2 ;

[0032] Figure 4 A three-dimensional structural diagram of a chip grabbing module provided by an embodiment of the utility model;

[0033] Figure 5 A three-dimensional structural diagram of a nozzle feeding mechanism and a positioning assembly provided in an embodiment of the utility model;

[0034] Figure 6 A three-dimensional structural diagram of a nozzle feeding mechanism provided in an embodiment of the utility model;

[0035] Figure 7 A three-dimensional structural diagram of a pressing mechanism provided in an embodiment of the utility model;

[0036] Figure 8 A three-dimensional structural diagram of a test fixture provided in an embodiment of the utility model;

[0037] Fig. 9 An exploded structural diagram of a test fixture provided in an embodiment of the utility model;

[0038] Fig.10 A cross-sectional view of a test fixture provided in an embodiment of the utility model.

[0039] Among them, the reference numerals in the figure are:

[0040] 1-chip test module; 11-pressing mechanism; 111-pressing drive; 112-flexible deformation part; 113-upper box; 114-pressing sheet; 12-test fixture; 121-test box; 122-test circuit board; 123-probe seat; 124-floating seat; 1241-accommodating cavity; 125-positioning plate; 126-fixture frame; 2-material tray; 21-first material tray; 22-second material tray; 3-material tray moving mechanism; 31-material tray drive; 32-screw rod; 33-nut seat; 34-mounting plate; 35-first slide Rail; 4-chip grabbing module; 41-nozzle moving mechanism; 42-nozzle feeding mechanism; 421-second driving member; 422-driving wheel; 423-synchronous belt; 424-second slider; 425-second slide rail; 426-grabbing module fixing plate; 43-nozzle assembly; 431-nozzle seat; 432-elastic member; 433-nozzle body; 434-vacuum generator; 44-visual positioning assembly; 441-shooting assembly; 442-light source; 443-visual positioning body; 45-column; 5-workbench; 6-chip. DETAILED DESCRIPTION

[0041] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0042] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0043] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0044] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0045] CMOS image sensor (CIS) chips are chips that convert photons into electrons for digital processing and image signals into digital signals. They are mainly used to create images in digital cameras, digital CCTV cameras and digital camcorders, and are key components of digital cameras. Since the functions of cameras include taking pictures, recording videos, image recognition, and identity authentication, digital products have increasingly higher requirements for the performance of CMOS image sensor chips.

[0046] At present, CIS chips are tested manually with manual test fixtures in the fast packaging line to detect whether the packaged products are abnormal. In general fast packaging lines, manual testing of chips is used, specifically using tweezers to pick up the chips and place them in the manual test fixture for manual pressing and testing. The test time is long and the efficiency is relatively low, resulting in a long fast packaging verification time, which cannot meet the production cycle requirements of the fast packaging line.

[0047] In order to solve the above technical problems, the utility model proposes a new chip rapid testing device, which is suitable for the above-mentioned CIS chip and can also be suitable for other types of chips. The chip rapid testing device includes a chip testing module, a tray, a tray moving mechanism and a chip grabbing module. The tray and the test fixture can be synchronously moved to the chip grabbing module through the tray moving mechanism. The chip grabbing module moves the chip in the tray to the test fixture, and the pressing mechanism presses down the chip so that the test fixture can test the chip. By making the tray and the test fixture move synchronously, the movement path of the chip is shorter, the chip test rhythm is faster, and the test efficiency is higher.

[0048] The chip rapid testing device provided by the embodiment of the utility model is now described.

[0049] Please also read Figures 1 to 10 The chip rapid testing device includes a chip testing module 1, a material tray 2, a material tray moving mechanism 3 and a chip grabbing module 4.

[0050] The chip test module 1 is used to test the chip 6 to screen out defective products and ensure the production yield of the chip 6. The chip test module 1 includes a test fixture 12 and a pressing mechanism 11. The test fixture 12 is used to place and test the chip 6. When testing the chip 6, the chip 6 needs to be placed in the test fixture 12 first, and the pressing mechanism 11 presses down the chip 6 so that the chip 6 and the conductive parts such as the probes in the test fixture 12 have good conductive contact, so as to test the chip 6. The test fixture 12 is connected to the cable of the external device so that the test data can be uploaded and analyzed.

[0051] The tray 2 is used to accommodate multiple chips 6. The setting of the tray 2 can carry and transport multiple chips 6 at one time, avoiding high-frequency movement of chips 6 from a distant chip placement location, which can correspondingly reduce the waiting time when transporting chips 6 and improve the efficiency of chip 6 testing.

[0052] The tray moving mechanism 3 is used to move the tray 2 and the test fixture 12. The tray 2 and the test fixture 12 are driven by the tray moving mechanism 3 to move synchronously, and both move in the first direction. That is to say, when the tray moving mechanism 3 is working, the tray 2 and the test fixture 12 move at the same time, and the interval between the tray 2 and the test fixture 12 can be set closer. The movement path of the chip 6 is only from the tray 2 to the test fixture 12. Therefore, the movement path of the chip 6 is shorter. Therefore, the time required for the transfer of the chip 6 is shorter, and the test efficiency of the chip 6 is higher.

[0053] The chip grabbing module 4 is used to move the chip 6 between the tray 2 and the test fixture 12. When the tray moving mechanism 3 moves the tray 2 and the test fixture 12 close to the chip grabbing module 4, the chip grabbing module 4 can move the chip 6 between the tray 2 and the test fixture 12.

[0054] The test fixture 12 can be moved in the first direction by the tray moving mechanism 3, and the pressing mechanism 11 can only perform a downward pressing movement and cannot move in the first direction. Therefore, the test fixture 12 needs to be moved to the bottom of the pressing mechanism 11 before the chip 6 can be tested. In other words, the position of the chip 6 test is fixed. In order to avoid interference with the chip 6 test position, the chip 6 needs to be transferred to other positions in the first direction (transferred between the tray 2 and the test fixture 12).

[0055] When testing chip 6, the tray 2 and the test fixture 12 can be first moved to the operating end (i.e., the position of the loading worker) through the tray moving mechanism 3. The loading worker places the tray 2 filled with chips 6 on the tray moving mechanism 3. The tray moving mechanism 3 moves the tray 2 to the chip grabbing module 4. The chip grabbing module 4 grabs the chip 6 in the tray 2 and moves it to the test fixture 12. Then the tray moving mechanism 3 moves the test fixture 12 to the bottom of the pressing mechanism 11. The pressing mechanism 11 presses down the chip 6 in the test fixture 12 to test the chip 6. After the test is completed, the chip 6 can be removed by the chip grabbing module 4 and other mechanisms, and the next round of chip 6 testing can be carried out.

[0056] The chip rapid testing device in the above embodiment includes a chip testing module 1, a tray 2, a tray moving mechanism 3 and a chip grabbing module 4. The tray moving mechanism 3 can move the test fixture 12 and the tray 2 in a first direction. The chip grabbing module 4 is used to move the chip 6 between the tray 2 and the test fixture 12. When testing the chip 6, the tray moving mechanism 3 moves the tray 2 and the test fixture 12 to the bottom of the chip grabbing module 4, and the chip grabbing module 4 moves the chip 6 from the tray 2 to the test fixture 12, and then the pressing mechanism 11 presses down the chip 6 to test the chip 6. The tray moving mechanism 3 can move the tray 2 and the test fixture 12 at the same time, keeping the tray 2 always in the vicinity of the test fixture 12, and the distance between the two is close, so the test cycle of a single chip 6 is short, so the test time of the chip 6 is short and the efficiency is high. Moreover, the chip rapid testing device is also compatible with the manual test fixture 12, and the chip testing module 1 can use the original manual test fixture 12.

[0057] In some embodiments of the present invention, please refer to Figure 1 and Figure 2 , the tray 2 and the test fixture 12 are spaced apart along the second direction, the chip grabbing module 4 also moves the chip 6 in the second direction, and the movement direction of the moving end of the chip grabbing module 4 is the second direction. The first direction and the second direction are arranged at an angle, firstly, the chip rapid testing device can use the space in the second direction, making the layout of the chip rapid testing device more compact, and secondly, the tray 2 has sufficient layout space and is not easy to interfere with other structures.

[0058] In some embodiments, the first direction and the second direction are perpendicular to each other. Firstly, it makes the layout of the chip rapid testing device simpler, and secondly, it makes the moving path of the material tray 2, the test fixture 12, and the chip grabbing module 4 easier to calculate, which can reduce the calculation amount of the control center.

[0059] In some embodiments of the present invention, please refer to Figure 1 and Figure 2There are two trays 2, one of which is used to place untested chips 6, and the other is used to place tested chips 6. The tray 2 for placing untested chips 6 can be called a first tray 21, and the tray 2 for placing tested chips 6 can be called a second tray 22. The tested chips 6 can be moved to the second tray 22 by the chip grabbing module 4 or other modules.

[0060] Optionally, the two material trays 2 move synchronously with the test fixture 12, and the two material trays 2 and the test fixture 12 can be controlled simultaneously by a material tray moving mechanism 3. The chip 6 after the test can be transferred to the second material tray 22 by the chip grabbing module 4, thereby reducing the number of modules in the chip rapid testing device and the path of the chip 6 during transfer. The transfer of the chip 6 to be tested and the transfer of the chip 6 after the test are both performed by the movement of the chip grabbing module 4 in the second direction. The path of the chip 6 is shorter, and the time for transferring the chip 6 is shorter. Accordingly, the efficiency of the chip 6 test is higher.

[0061] Specifically, when testing the chip 6, the tray 2 and the test fixture 12 can be first moved to the operating end (i.e., the position of the loading worker) through the tray moving mechanism 3. The loading worker places the first tray 21 filled with chips 6 and the empty second tray 22 on the tray moving mechanism 3. The tray moving mechanism 3 moves the first tray 21 to the chip grabbing module 4. The chip grabbing module 4 grabs the chip 6 in the first tray 21 and moves it to the test fixture 12. Then, the tray moving mechanism 3 moves the test fixture 12 to the bottom of the pressing mechanism 11. The pressing mechanism 11 presses down the chip 6 in the test fixture 12 to test the chip 6. After the test is completed, the tray moving mechanism 3 moves the test fixture 12, the first tray 21, and the second tray 22 back to the chip grabbing module 4. The chip grabbing module 4 moves the tested chip 6 from the test fixture 12 to the second tray 22, and then the next round of chip 6 testing is carried out.

[0062] In some embodiments of the present invention, the first tray 21 moves synchronously with the test fixture 12, and the second tray 22 is fixed. In this embodiment, the chip 6 after the test can also be transferred by the chip grabbing module 4, and the movement path of the chip 6 is relatively long.

[0063] In some embodiments of the present invention, please refer to Figure 1 and Figure 2, the two material trays 2 are respectively arranged on opposite sides of the test fixture 12 in the second direction, and the first direction and the second direction are perpendicular to each other. In this way, the movement distance of the chip 6 to be tested is roughly the same as the movement distance of the chip 6 after the test is completed, so that the time of each action of the device is close to the same, and the action rhythm is easier to control. In other embodiments, the two material trays 2 can also be arranged on the same side of the test fixture 12 in the second direction.

[0064] In some embodiments of the present invention, please refer to Figures 1 to 3 The chip rapid testing device also includes a workbench 5, on which the chip testing module 1, the tray moving mechanism 3 and the chip grabbing module 4 are all fixed. The workbench 5 is configured to provide an installation position for the chip testing module 1, the tray moving mechanism 3 and the chip grabbing module 4. By adjusting the height of the workbench 5, the chip rapid testing device can also be highly adapted to other devices of the assembly line.

[0065] In some embodiments of the present invention, please refer to Figure 2 and Figure 3 The tray moving mechanism 3 includes a tray driving member 31, a screw rod 32, a nut seat 33 and a mounting plate 34. The tray driving member 31 is the driving mechanism of the tray moving mechanism 3, and the mounting plate 34 is the moving end of the tray moving mechanism 3, which can output linear motion. The tray driving member 31 outputs rotational motion, and the screw rod 32 is driven to rotate by the tray driving member 31. Specifically, the moving end of the tray driving member 31 is fixedly connected to the screw rod 32, the nut seat 33 is threadedly connected to the screw rod 32, and the mounting plate 34 and the nut seat 33 are fixed to each other. When the tray moving mechanism 3 is working, the rotational motion of the tray driving member 31 drives the screw rod 32 to rotate, and the rotation of the screw rod 32 causes the nut seat 33 to translate, thereby causing the mounting plate 34 to translate.

[0066] The length direction of the screw rod 32 is parallel to the first direction, and the moving direction of the nut seat 33 is also parallel to the first direction, so that the mounting plate 34 can reciprocate in the first direction.

[0067] The test fixture 12 is fixed on the mounting plate 34, and the material tray 2 is placed on the mounting plate 34. The mounting plate 34 may be provided with a material tray position for placing the material tray 2, and the material tray 2 may be stably placed on the mounting plate 34 or removed from the mounting plate 34.

[0068] By setting the tray drive 31, the screw 32 and the nut seat 33, the rotation of the tray drive 31 can be converted into the translational movement of the nut seat 33 and the mounting plate 34. The movement accuracy of the screw mechanism is high, and the position of the mounting plate 34 can be accurately controlled. In other words, the position of the chip 6 in the tray 2 and the position of the test fixture 12 can be accurately controlled.

[0069] In some embodiments, the tray driving member 31 may be a mechanism such as a motor that can output rotational motion.

[0070] In some embodiments, in the tray moving mechanism 3 , the tray driving member 31 is fixed to the bottom surface of the workbench 5 , and both ends of the screw rod 32 are supported and arranged on the bottom surface of the workbench 5 .

[0071] Optionally, see Figure 2 A first slide rail 35 is provided on the top surface of the workbench 5, and the length direction of the first slide rail 35 is the first direction. A first slider is provided on the mounting plate 34, and the first slider is slidably connected to the first slide rail 35, so that the movement of the mounting plate 34 is restricted by the cooperation between the first slider and the first slide rail 35, so that the nut seat 33 and the mounting plate 34 only move in the first direction.

[0072] In some embodiments, the tray moving mechanism 3 includes a tray driving member 31 and a belt assembly, the tray 2 is disposed on a belt of the belt assembly, and the test fixture 12 is fixed on the belt of the belt assembly.

[0073] In some embodiments of the present invention, please refer to Figures 4 to 6 The chip grabbing module 4 includes a nozzle moving mechanism 41, a nozzle feeding mechanism 42 and a nozzle assembly 43 for sucking the chip 6. The nozzle feeding mechanism 42 is used to move the nozzle assembly 43 in the vertical direction, and the nozzle moving mechanism 41 is used to move the nozzle assembly 43 between the material tray 2 and the test fixture 12.

[0074] The nozzle moving mechanism 41, the nozzle feeding mechanism 42 and the nozzle assembly 43 are connected in sequence, the moving end of the nozzle moving mechanism 41 is connected to the nozzle feeding mechanism 42, and the moving end of the nozzle feeding mechanism 42 is connected to the nozzle assembly 43. The nozzle moving mechanism 41 is used to move the nozzle feeding mechanism 42 and the nozzle assembly 43 between the material tray 2 and the test fixture 12. When the material tray 2 and the test fixture 12 are arranged along the second direction, the moving direction of the moving end of the nozzle moving mechanism 41 is also the second direction, so that the chip 6 can be moved between the material tray 2 and the test fixture 12 by the moving nozzle assembly 43. The direction of the moving end of the nozzle feeding mechanism 42 is the vertical direction, which can drive the nozzle assembly 43 to move in the vertical direction. Among them, the vertical direction is perpendicular to the first direction and the second direction, and the first direction and the second direction are both horizontal directions. Through the setting of the nozzle moving mechanism 41, the nozzle assembly 43 can be moved, so that the chip 6 can be transferred between the material tray 2 and the test fixture 12, and the chip 6 can be quickly transferred.

[0075] Specifically, when grabbing and transferring the chip 6, the nozzle moving mechanism 41 drives the nozzle feeding mechanism 42 and the nozzle assembly 43 to move, so that the nozzle assembly 43 moves to the top of the material tray 2 and faces the chip 6 to be grabbed, the nozzle feeding mechanism 42 drives the nozzle assembly 43 to move downward, sucks the chip 6, and then the nozzle feeding mechanism 42 drives the nozzle assembly 43 to move upward, the nozzle moving mechanism 41 drives the nozzle feeding mechanism 42 and the nozzle assembly 43 to move to the test fixture 12, so that the nozzle assembly 43 faces the accommodating cavity 1241 of the test fixture 12 for placing the chip 6, and then, the nozzle feeding mechanism 42 drives the nozzle assembly 43 to move downward to place the chip 6 in the accommodating cavity 1241. After the test of chip 6 is completed, the tray moving mechanism 3 first moves the test fixture 12 and the tray 2 to the chip grabbing module 4, and then the nozzle moving mechanism 41 moves the nozzle assembly 43 to the accommodating cavity 1241 facing the test fixture 12, and the nozzle feeding mechanism 42 drives the nozzle assembly 43 to move down to absorb the chip 6, and then the nozzle feeding mechanism 42 drives the nozzle assembly 43 to move up, and the nozzle moving mechanism 41 drives the nozzle feeding mechanism 42 and the nozzle assembly 43 to move, so that the nozzle assembly 43 moves to the second tray 22, and the tested chip 6 is placed in the second tray 22.

[0076] In some embodiments, see Figure 4 The length direction of the nozzle moving mechanism 41 is arranged along the second direction. The chip grabbing module 4 also includes two columns 45 fixed on the workbench 5. The two columns 45 are arranged in sequence along the second direction, and the two ends of the nozzle moving mechanism 41 are respectively connected to the two columns 45 and supported by the two columns 45, so that the nozzle moving mechanism 41 can be located above the material tray 2 and the test fixture 12.

[0077] In some embodiments, see Figure 4 The nozzle moving mechanism 41 includes a first driving member, a belt assembly and a slide. The first driving member drives the belt assembly to work, and the belt of the belt assembly moves horizontally. The slide is fixedly connected to the belt, so that the slide moves linearly, and the nozzle feeding mechanism 42 is fixed on the slide. Through the operation of the first driving member, the slide can be translated, so that the nozzle feeding mechanism 42 is translated. The moving direction of the slide is the second direction.

[0078] In some embodiments, see Figure 5 and Figure 6The nozzle feeding mechanism 42 includes a second driving member 421, a driving wheel 422, a driven wheel (not shown in the figure), a synchronous belt 423 and a second slide rail 425 and a second slider 424, and the nozzle assembly 43 is fixedly connected to the second slider 424. The moving end of the second driving member 421 is connected to the driving wheel 422, the synchronous belt 423 is wound around the driving wheel 422 and the driven wheel, and the second slider 424 is fixedly connected to the synchronous belt 423 and moves synchronously. When the second driving member 421 is working, the driving wheel 422 and the driven wheel move synchronously, so that the belt and the second slider 424 produce synchronous movement, thereby realizing the linear movement of the nozzle assembly 43. Among them, the second slide rail 425 is vertically arranged, so that the nozzle assembly 43 reciprocates in the vertical direction. The nozzle feeding mechanism 42 also includes a grabbing module fixing plate 426, which is vertically arranged. The second slide rail 425 is fixed on the grabbing module fixing plate 426. The second driving member 421 can also be fixed on the grabbing module fixing plate 426. The central supports of the driving wheel 422 and the driven wheel are arranged on the grabbing module fixing plate 426.

[0079] In some embodiments, see Figure 5 and Figure 6 The nozzle assembly 43 includes a nozzle seat 431, a nozzle body 433, an elastic member 432 and a vacuum generator 434. The elastic member 432 is arranged between the nozzle seat 431 and the nozzle body 433. The nozzle body 433 is used to suck the chip 6. The elastic member 432 is arranged to buffer the nozzle body 433. When the nozzle body 433 contacts the chip 6, an impact force will be generated on the chip 6. The arrangement of the elastic member 432 can reduce the impact force on the chip 6 when the nozzle body 433 contacts the chip 6, and can protect the chip 6. The elastic member 432 can be a deformable structural member such as a spring. The vacuum generator 434 is connected to the nozzle body 433. The vacuum generator 434 can suck air and generate a vacuum degree at the suction end of the nozzle body 433, so that the chip 6 can be sucked. When the chip 6 needs to be put down, the vacuum generator 434 breaks the vacuum degree at the suction end of the nozzle body 433, so that the chip 6 can be put down.

[0080] In some embodiments of the present invention, please refer to Figure 4 and Figure 5The chip grabbing module 4 also includes a visual positioning component 44, which is used to position the chip 6, assist the nozzle component 43 in positioning the position of the chip 6, and facilitate the nozzle component 43 to more accurately pick up the chip 6. The nozzle feeding mechanism 42 and the visual positioning component 44 are both fixed to the moving end of the nozzle moving mechanism 41, that is, the nozzle feeding mechanism 42, the nozzle component 43 and the visual positioning component 44 move synchronously in the second direction, so that the positions of the nozzle component 43 and the visual positioning component 44 in the second direction are relatively fixed, and there is no need to repeatedly compensate and calibrate the coordinate systems of the nozzle component 43 and the visual positioning component 44 when picking up and placing the chip 6.

[0081] Specifically, when the suction nozzle assembly 43 is moved to face the material tray 2 and the corresponding chip 6 is sucked, it is necessary to first take a picture of the material tray 2, determine the position of the chip 6 in the form of a picture, and then calculate the distance that the suction nozzle assembly 43 needs to move in the second direction through the position information, and then the suction nozzle moving mechanism 41 moves the suction nozzle assembly 43 to the corresponding position.

[0082] By setting the visual positioning component 44, the nozzle component 43 can more accurately position the chip 6, avoiding the displacement error generated when the material tray 2 is placed, which may cause the nozzle component 43 to be unable to align with the chip 6.

[0083] The visual positioning component 44 includes a shooting component 441 and a light source 442. The shooting component 441 is used to take pictures of the chip 6 in the tray 2, and can also take pictures of the test fixture 12 and the chip 6 therein, so that the chip 6 to be absorbed can be positioned. The light source 442 is used to provide light for the chip 6 so that the shooting component 441 has a clear field of view when shooting the chip 6. The shooting component 441 may include a camera and a lens group, and the lens group is used to adjust the shooting focal length so that the camera has a clear shooting field of view. The visual positioning component 44 also includes a visual positioning body 443, which can analyze and calculate the photographed pictures to obtain information such as the coordinates of the chip to be absorbed.

[0084] In some embodiments of the present invention, please refer to Figure 7, the pressing mechanism 11 includes a pressing drive 111, a flexible deformation part 112 and an upper box 113. The pressing drive 111, the flexible deformation part 112 and the upper box 113 are connected in sequence, the pressing drive 111 is the driving structure of the pressing mechanism 11, the flexible deformation part 112 can be flexibly deformed, and the upper box 113 is used to press the edge of the chip 6 in the test fixture 12, so that the chip 6 can be pressed and fixed in the test fixture 12, and have good contact with the probe in the test fixture 12 to ensure the normal test of the chip 6. Specifically, the upper box 113 has a pressing piece 114 for pressing on the edge of the chip 6. When the pressing drive 111 is working, it will drive the flexible deformation part 112 and the upper box 113 to move in the vertical direction. Specifically, when testing the chip 6, the pressing drive 111 drives the upper box 113 to move downward, the upper box 113 is pressed on the edge of the chip 6, and then the test fixture 12 tests the chip 6. After the test is completed, the pressing drive 111 drives the upper box 113 to move upward and leave the test fixture 12.

[0085] By setting the pressing driving member 111, the upper box 113 can be moved up and down, so as to press the chip 6 and test the chip 6. By setting the flexible deformation part 112, the flexible deformation part 112 can be deformed when subjected to external force. When the upper box 113 contacts the chip 6, the impact of the upper box 113 on the chip 6 can be reduced to avoid damage to the chip 6.

[0086] In some embodiments, the flexible deformation part 112 can be deformed in the vertical direction or in the horizontal direction, which can not only alleviate the impact force in the vertical direction, but also alleviate the impact force in the horizontal direction. In particular, when the upper box 113 and the chip 6 have a certain error in the horizontal direction and are not completely aligned in the horizontal direction, the deformation of the flexible deformation part 112 can compensate for the error and alleviate the impact in the horizontal direction to avoid damaging the chip 6.

[0087] In some embodiments, see Fig. 9 The pressing sheet 114 is frame-shaped and is pressed onto the edge of the chip 6 without affecting the central test area of ​​the chip 6 .

[0088] In some embodiments, the pressing driving member 111 may be a cylinder or other mechanism capable of outputting linear motion.

[0089] In some embodiments, the flexible deformation portion 112 is an airbag, which can be deformed in the vertical direction and can also be deformed in the horizontal direction. By inflating the airbag, the airbag has a certain support capacity and a certain deformation capacity.

[0090] In some embodiments, the flexible deformation part 112 is disc-shaped, so that there are no corners on the circumference of the flexible deformation part 112, and wrinkles will not be generated when the flexible deformation part 112 is deformed. Therefore, the disc-shaped flexible deformation part 112 has a longer service life, and under the same force, the deformation degree of each part is also the same.

[0091] In some embodiments of the present invention, the upper box 113 is provided with a first positioning portion, and the test fixture 12 has a second positioning portion. When the upper box 113 is crimped onto the test fixture 12, the first positioning portion and the second positioning portion are plugged into each other to position the two. One of the first positioning portion and the second positioning portion is a positioning hole, and the other is a positioning pin.

[0092] In some embodiments of the present invention, please refer to Fig. 9 and Fig.10 The test fixture 12 includes a test box 121, a test circuit board 122, a probe seat 123 and a floating seat 124. The test box 121 and the test circuit board 122 are electrically connected, the test circuit board 122 and the probe seat 123 are electrically connected, the floating seat 124 is floatingly arranged on the probe seat 123, and can move toward the probe seat 123 when subjected to pressure, and the floating seat 124 has a receiving cavity 1241 for accommodating the chip 6. Specifically, the chip 6 is placed in the receiving cavity 1241 of the floating seat 124, the lower box is pressed on the chip 6, and the chip 6 is subjected to downward pressure, so that the floating seat 124 moves toward the probe seat 123, and the test points on the chip 6 contact the probes on the probe seat 123, so that the test box 121, the test circuit board 122, the probe seat 123, and the chip 6 are electrically conductive, and then the chip 6 can be tested.

[0093] The floating seat 124 can buffer the downward pressure on the chip 6 and ensure that the probes on the probe seat 123 always keep good contact with the chip 6 .

[0094] In some embodiments, a spring is disposed between the floating seat 124 and the probe seat 123 . The spring can be deformed when subjected to pressure, so that the floating seat 124 can float relative to the probe seat 123 , buffering the pressure on the chip 6 .

[0095] In some embodiments, a probe hole is provided on the floating seat 124 for a probe to pass through, so that the chip 6 on the floating seat 124 can contact with the probe.

[0096] In some embodiments, the test fixture 12 further includes a stacked positioning plate 125 and a fixture frame 126, the probe seat 123 and the test circuit board 122 are respectively fixed on opposite sides of the positioning plate 125, and the probe of the probe seat 123 passes through the positioning plate 125 to be electrically connected to the circuit board. The floating seat 124 is arranged in the fixture frame 126, and the floating seat 124 can move relative to the fixture frame 126. Through the arrangement of the positioning plate 125 and the fixture frame 126, the probe seat 123, the test circuit board 122, the floating seat 124, etc. can be reasonably arranged and installed.

[0097] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A chip rapid testing device, characterized in that: include: A chip testing module, comprising a testing fixture and a pressing mechanism, wherein the testing fixture is used to place and test the chip, and the pressing mechanism is used to press down the chip; A tray, used to accommodate a plurality of the chips; A tray moving mechanism, used for synchronously moving the test fixture and the tray in a first direction; The chip grabbing module is used to move the chip between the material tray and the test fixture.

2. The chip rapid testing device according to claim 1, characterized in that: The chip grabbing module includes a nozzle moving mechanism, a nozzle feeding mechanism and a nozzle assembly for sucking the chip, the nozzle feeding mechanism is used to move the nozzle assembly in a vertical direction, and the nozzle moving mechanism is used to move the nozzle feeding mechanism and the nozzle assembly between the material tray and the test fixture.

3. The chip rapid testing device according to claim 2, characterized in that: The chip grabbing module also includes a visual positioning component. The nozzle feeding mechanism and the visual positioning component are both fixed to the moving end of the nozzle moving mechanism. The visual positioning component includes a shooting component for taking pictures of the chip and a light source for providing shooting light.

4. The chip rapid testing device according to claim 1, characterized in that: The material tray and the test fixture are spaced apart along a second direction, and the first direction and the second direction are perpendicular to each other.

5. The chip rapid testing device according to claim 1, characterized in that: There are two material trays, one of which is used to place untested chips, and the other is used to place tested chips, and both of the two material trays move synchronously with the test fixture.

6. The chip rapid testing device as claimed in claim 5, characterized in that: The two material trays are respectively arranged on opposite sides of the test fixture in a second direction, and the first direction and the second direction are perpendicular to each other.

7. The chip rapid testing device according to claim 1, characterized in that: The tray transmission mechanism includes a tray driving member, a screw driven by the tray driving member, a nut seat threadedly connected to the screw seat, and a mounting plate fixed to the nut seat, the test fixture is fixed to the mounting plate, and the tray is placed on the mounting plate.

8. The chip rapid testing device according to any one of claims 1 to 7, characterized in that: The pressing mechanism comprises a pressing driving member, a flexible deformation portion and an upper box which are connected in sequence, and the upper box has a pressing sheet for pressing on the edge of the chip.

9. The chip rapid testing device according to claim 8, characterized in that: The flexible deformation part is an airbag.

10. The chip rapid testing device according to any one of claims 1 to 7, characterized in that: The test fixture comprises a test box, a test circuit board electrically connected to the test box, a probe seat electrically connected to the test circuit board, and a floating seat floatingly arranged on the probe seat, wherein the floating seat has a receiving cavity for receiving the chip.

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