Probe cleaning device and wafer acceptance test equipment

Abstract

The utility model provides a probe cleaning device and wafer acceptance test equipment. The probe cleaning device comprises a gas inlet piece and a gas guide piece, and the gas inlet piece is used for providing cleaning gas; the air guide part is arranged above the probe card, an air inlet end of the air guide part is communicated with the air inlet part, an air guide channel is arranged in the air guide part and comprises a plurality of air outlet ends arranged at the bottom end part of the air guide part, and the air outlet ends correspond to tips of a plurality of probes in the probe card one to one; therefore, the clean gas sprayed out of the gas guide channel is blown towards the tip of the probe. According to the probe cleaning device, the tip of each probe can be independently purged, the cleaning efficiency and the cleaning effect of the probes are effectively improved, the probe card does not need to be disassembled, the effect of cleaning the probes in real time in the testing process is achieved, probe burning caused by short circuit of the tips of the probes can be effectively avoided, and the testing efficiency is improved. And meanwhile, the influence on the accuracy of a test result caused by contact resistance increase due to accumulation of metal scraps is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a probe cleaning device and wafer acceptance testing equipment. Background Art

[0002] Wafer Acceptance Test (WAT) can be used to monitor whether there are abnormalities in the wafer process. The probe station in the WAT equipment is a device that carries the wafer to move and cooperates with the tester to complete the test. A probe card is installed at the specified position of the probe station. The probe card is the connection channel between the chip under test and the tester in the wafer test. The WAT test structure is a cutting path or a specific area test pattern. The test pattern includes a test structure and a pinout pin (PAD) of the piercing device. During the test, the wafer is transferred to the chuck on the probe station by a robot, and the chuck drives the wafer to move to complete the piercing test. Specifically, the tip of the metal probe on the probe card contacts the PAD, and the signal of the tester is transmitted to the PAD. The test structure is connected to the PAD through the metal tip, and the electrical test of the corresponding structure can be performed. After the test, the test information is fed back to the tester to generate test data. By analyzing the test data, wafers with electrical abnormalities can be screened out.

[0003] During the WAT test, when the probe card is detached from the PAD, metal shavings are easily brought out and attached to the probe tips, which increases the contact resistance when testing other subsequent structures, affecting the test results. In addition, the probe tips on the probe card are usually arranged in a fan-shaped manner in the middle penetration area of ​​the probe card, and the probe tips are radially distributed with the middle penetration area of ​​the probe card as the center and extend in a direction away from the probe card surface. Therefore, the distance between adjacent probe tips is small, and the metal shavings between adjacent probe tips can easily cause two adjacent probes to short-circuit, resulting in burnt needles. Utility Model Content

[0004] The purpose of the utility model is to provide a probe cleaning device and a wafer acceptance test device, so as to individually purge the needle tip of each probe, thereby effectively improving the cleaning efficiency and cleaning effect of the probe. Moreover, the utility model does not need to disassemble the probe card, and the effect of real-time needle cleaning is achieved during the test process, which can effectively avoid the burning of the probe caused by a short circuit at the probe tip, and at the same time avoid the increase of contact resistance due to the accumulation of metal debris, which affects the accuracy of the test result.

[0005] To achieve the above-mentioned purpose, the probe cleaning device of the utility model includes an air inlet member and an air guide member, the air inlet member is used to provide cleaning gas; the air guide member is arranged above the probe card, and the air inlet end of the air guide member is connected to the air inlet member, an air guide channel is arranged in the air guide member, and the air guide channel includes a plurality of air outlet ends arranged at the bottom end of the air guide member, and the plurality of air outlet ends are arranged one-to-one corresponding to the needle tips of the plurality of probes in the probe card, so that the cleaning gas ejected from the air guide channel is swept toward the needle tips of the probes.

[0006] The wafer acceptance test equipment of the utility model comprises the probe cleaning device.

[0007] The beneficial effects of the probe cleaning device and the wafer acceptance test equipment including the probe cleaning device of the utility model are as follows: the air guide is arranged above the probe card, the air guide channel includes a plurality of air outlets arranged at the bottom end of the air guide, and the plurality of air outlets are arranged in one-to-one correspondence with the needle tips of the plurality of probes in the probe card, that is, each needle tip of the probe is correspondingly provided with an air outlet, so that the needle tip of each probe has an air outlet to spray cleaning gas for separate purging, which is beneficial to improving the cleaning efficiency and cleaning effect of the probe, and can effectively prevent foreign matter from adhering to the probe. When foreign matter is attached to the probe, the foreign matter on the probe can also be efficiently removed. By arranging the plurality of gas outlets in one-to-one correspondence with the needle tips of the plurality of probes in the probe card, it is beneficial to blow the clean gas to the probe needle tips, thereby avoiding the scattering of the clean gas and improving the cleaning effect of the probe needle tips. Moreover, the utility model does not need to disassemble the probe card, and achieves the effect of real-time needle cleaning during the test process. The metal debris attached to the probe needle tip during the test process can be cleaned in time, thereby effectively avoiding the burning of the probe needle caused by a short circuit at the probe needle tip, and at the same time avoiding the increase in contact resistance due to the accumulation of metal debris, which affects the accuracy of the test results.

[0008] Preferably, the air inlet end of the air guide is connected to the air inlet at the middle of the top surface of the air guide, and the air guide channel includes a plurality of inclined air guide channels extending toward the bottom end of the air guide, and the end of the inclined air guide channel is the air outlet. The beneficial effect is that it is conducive to guiding the air flow direction and minimizing gas loss, thereby improving the cleaning efficiency and cleaning effect of the probe.

[0009] Preferably, the inclined air guide channel is extended from the air inlet end to the bottom end of the air guide member, and the inclined air guide channel is radially distributed in the air guide member along a direction inclined to the axis of the air guide member and away from the air inlet end, and the air outlet ends of several inclined air guide channels are respectively arranged in one-to-one correspondence with the needle tips of several probes, so that the cleaning gas ejected from each inclined air guide channel is individually purged toward the needle tip of the corresponding probe. Its beneficial effect is that the inclined air guide channels are radially distributed in the air guide member with the air inlet end as the center, and the probes are radially distributed with the central through hole of the probe card as the center and extend in a direction away from the surface of the probe card, that is, the inclined air guide channels correspond to the probes one-to-one, so that the cleaning gas ejected from each inclined air guide channel can be concentrated toward the needle tip of the corresponding probe for targeted cleaning, and the cleaning effect is better.

[0010] Preferably, the air guide channel also includes a radial air guide channel, one end of which is connected to the air inlet, and the other end of which is connected to the inclined air guide channel, and the inclined air guide channel is distributed in the air guide in a convergent shape along a direction inclined to the axis of the air guide and away from the air inlet end, and the outlet ends of several inclined air guide channels are respectively arranged in a one-to-one correspondence with the needle tips of several probes, so that the clean gas ejected from each inclined air guide channel is purged separately along the extension direction of the corresponding probe. The beneficial effect is that the inclined air guide channel corresponds to the probe at the same angle, so that the clean gas flow ejected from the inclined air guide channel is concentrated on the needle tip of the corresponding probe and purged along the needle outlet direction of the probe, which is conducive to cleaning the probe more cleanly.

[0011] Preferably, the probe cleaning device further comprises a fixing member, and the air guide member is arranged in the hollow cavity of the test head through the fixing member, the test head is located above the probe card, and the hollow cavity is arranged opposite to the probe card. Its beneficial effect is that the hollow cavity of the original test head of the wafer acceptance test equipment is fully utilized, the original components are slightly modified, the original layout of the wafer acceptance test equipment is not affected, and there is no need to add a new component for carrying the air guide member, and the investment cost is low.

[0012] Preferably, the probe cleaning device further comprises an exhaust assembly, the exhaust assembly comprises a connected exhaust hose and a gas collecting member, the exhaust hose is fixedly arranged in the machine cavity of the wafer acceptance test equipment, and the gas collecting member is arranged around the probe card. Its beneficial effects are: the space in the machine cavity is fully utilized to set the exhaust hose, the original components are slightly modified, the original layout of the wafer acceptance test equipment is not affected, and the wiring space is effectively saved; the gas collecting member is arranged on the upper surface of the probe card and around the probe, that is, a gas circulation is formed around the probe card, which can effectively collect gas, so that the gas carrying impurities can be vacuumed away to avoid the blown-off metal debris from contaminating the machine.

[0013] Preferably, the fixing member includes a fixing portion and a bearing portion, the fixing portion is fixedly arranged on the inner wall of the hollow cavity of the test head, and the bearing portion is arranged perpendicular to the fixing portion to bear and support the air guide member. The beneficial effect is that the structure is simple, the air guide member can be placed on the bearing portion, and it is simple and convenient to install the air guide member in the hollow cavity of the test head.

[0014] Preferably, the fixing member is in an inverted L-shaped structure, and at least two fixing members are provided, and at least two fixing members are arranged in the hollow cavity of the test head at equal intervals. The beneficial effect is that the fixing member has a simple structure, and the fixing member is easy and convenient to install and fix in the hollow cavity of the test head.

[0015] Preferably, the bearing part includes an annular structure or at least two arc-shaped structures, the at least two arc-shaped structures are arranged around the inner wall of the hollow cavity of the test head at intervals along the circumferential direction, and the fixing part is provided with at least two, at least two fixing parts are arranged perpendicular to the annular structure at equal intervals, or at least two fixing parts are arranged perpendicularly to the at least two arc-shaped structures in a one-to-one correspondence. The beneficial effect is that it is conducive to stably supporting the air guide.

[0016] Preferably, the radial air guide channel includes at least one of an annular air guide channel, a disc-shaped air guide channel, an arc-shaped air guide channel and a linear air guide channel. The beneficial effect is that it is conducive to guiding the clean gas to flow to the inclined air guide channel, so that the clean gas flow is concentrated on the needle tip of the probe and swept along the needle exit direction of the probe, which is conducive to cleaning the probe more cleanly.

[0017] Preferably, the gas collecting member comprises at least one of an annular collecting member, an arc-shaped collecting member and a funnel-shaped collecting member, which has the beneficial effect of improving the gas collecting effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of a wafer acceptance test device in the prior art;

[0019] Figure 2It is a schematic diagram of assembling the probe cleaning device of the first embodiment of the utility model in the wafer acceptance test equipment;

[0020] Figure 3 for Figure 2 A schematic diagram of the flow direction of the cleaning gas in the probe cleaning device shown;

[0021] Figure 4 A schematic diagram of the flow direction of the cleaning gas in the probe cleaning device of the second embodiment of the utility model;

[0022] Figure 5 It is a schematic diagram of assembling the air guide member and the fixing member in the probe cleaning device according to an embodiment of the utility model. DETAILED DESCRIPTION

[0023] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0024] In order to overcome the problems existing in the prior art, the embodiments of the utility model provide a probe cleaning device and a wafer acceptance test equipment to individually purge the needle tip of each probe, effectively improving the cleaning efficiency and cleaning effect of the probe. Moreover, the utility model does not need to disassemble the probe card, and achieves the effect of real-time needle cleaning during the test process, which can effectively avoid the burning of the probe caused by a short circuit at the probe tip, and at the same time avoids the increase of contact resistance due to the accumulation of metal debris, which affects the accuracy of the test results.

[0025] Figure 1 The figure is a schematic diagram of the structure of wafer acceptance test equipment in the prior art.

[0026] In the prior art, reference Figure 1The wafer acceptance test equipment includes a machine 100 and a test head 200. A probe card 110 is provided at the top of the machine 100. A probe (not shown in the figure) is provided in the middle penetration area of ​​the probe card 110. The needle ends of the probes (not shown in the figure) are usually arranged in a fan-shaped manner in the middle penetration area of ​​the probe card 110. The needle tips of the probes (not shown in the figure) are radially distributed with the middle penetration area of ​​the probe card 110 as the center and extend in a direction away from the surface of the probe card 110. A compressed air (CDA) supply end 120 and a vacuum valve (PV) 130 are provided at the bottom of the machine 100. The test head 200 is located above the top of the machine 100. The test head 200 includes a hollow cavity 210, and the hollow cavity 210 is arranged opposite to the probe card 110, that is, the hollow cavity 210 is located directly above the probe card 110.

[0027] Figure 2 It is a schematic diagram of assembling the probe cleaning device of the first embodiment of the utility model in the wafer acceptance test equipment; Figure 3 for Figure 2 A schematic diagram of the flow direction of the cleaning gas in the probe cleaning device shown; Figure 4 This is a schematic diagram of the flow direction of the cleaning gas in the probe cleaning device of the second embodiment of the utility model.

[0028] In some embodiments of the present invention, reference Figures 2 to 4 The probe cleaning device includes an air guide 1 and an air inlet 2, wherein the air inlet 2 is used to provide cleaning gas; the air guide 1 is arranged above the probe card 110, and the air inlet end 11 of the air guide 1 is connected to the air inlet 2, and an air guide channel 12 is arranged in the air guide 1, and the air guide channel 12 includes a plurality of air outlet ends 121 arranged at the bottom end 13 of the air guide 1, and the plurality of air outlet ends 121 are arranged one-to-one with the needle tips of the plurality of probes 111 in the probe card 110, so that the cleaning gas ejected from the air guide channel 12 is swept toward the needle tips of the probes 111.

[0029] Specifically, the air guide 1 is arranged above the probe card 110, and the air guide channel 12 includes a plurality of air outlets 121 arranged at the bottom end 13 of the air guide 1, and the plurality of air outlets 121 are arranged one-to-one with the needle tips of the plurality of probes 111 in the probe card 110, that is, the needle tip of each probe 111 is correspondingly provided with an air outlet 121, so that the needle tip of each probe 111 has an air outlet 121 to spray out the cleaning gas for separate purging, which is beneficial to improving the cleaning efficiency and cleaning effect of the probe 111, and can effectively prevent foreign matter from adhering to the probe 111. When foreign matter is attached to the probe 111, it can also Foreign matter on the probe 111 can be efficiently removed by arranging the plurality of gas outlets 121 in one-to-one correspondence with the needle tips of the plurality of probes 111 in the probe card 110, which is conducive to blowing the clean gas to the needle tips of the probes 111, avoiding the scattering of the clean gas, and improving the cleaning effect of the needle tips of the probes 111. In addition, the utility model does not need to disassemble the probe card 110, and achieves the effect of real-time needle cleaning during the test process, and can timely clean the metal debris attached to the needle tips of the probes 111 during the test, thereby effectively avoiding the burning of the needle caused by the short circuit of the needle tips of the probes 111, and at the same time avoiding the increase of contact resistance due to the accumulation of metal debris to affect the accuracy of the test results.

[0030] In some embodiments of the present invention, reference Figure 2 One end of the air inlet member 2 is connected to the air guide member 1, and the other end of the air inlet member 2 is connected to a compressed air (CDA) supply end 120 provided at the bottom of the machine 100 for conveying gas.

[0031] In some embodiments of the present invention, the cleaning gas is compressed air (CDA).

[0032] In some embodiments of the present invention, reference Figures 2 to 4 The air inlet end 11 of the air guide member 1 is connected to the air inlet member 2 in the middle of the top surface of the air guide member 1, and the air guide channel 12 includes a plurality of inclined air guide channels 122 extending toward the bottom end 13 of the air guide member 1. The end of the inclined air guide channel 122 is the air outlet end 121, which is beneficial to guiding the direction of the air flow and minimizing gas loss, thereby improving the cleaning efficiency and cleaning effect of the probe 111.

[0033] In some embodiments of the present invention, reference Figure 2 and Figure 3The inclined air guiding channel 122 extends from the air inlet end 11 to the bottom end portion 13 of the air guiding member 1, and the inclined air guiding channel 122 is radially distributed in the air guiding member 1 along a direction inclined to the axis of the air guiding member 1 and away from the air inlet end 11, and the air outlet ends 121 of several inclined air guiding channels 122 are respectively arranged in one-to-one correspondence with the needle tips of several probes 111, so that the cleaning gas ejected from each inclined air guiding channel 122 is purged separately toward the needle tip of the corresponding probe 111. That is, the inclined air guiding channels 122 are radially distributed in the air guiding member 1 with the air inlet end 11 as the center, and the probes 111 are radially distributed with the central through hole of the probe card 110 as the center and extend in a direction away from the surface of the probe card 110, that is, the inclined air guiding channels 122 correspond one-to-one with the probes 111, so that the cleaning gas ejected from each inclined air guiding channel 122 can be concentrated toward the needle tip of the corresponding probe 111 for targeted cleaning, resulting in a better cleaning effect.

[0034] In some embodiments of the present invention, reference Figure 4 , the air guide channel 12 also includes a radial air guide channel 123, one end of which is connected to the air inlet 2, and the other end of which is connected to the inclined air guide channel 122, and the inclined air guide channel 122 is distributed in the air guide 1 in a convergent shape along the direction inclined to the axis of the air guide 1 and away from the air inlet end 11, and the outlet ends 121 of several inclined air guide channels 122 are respectively arranged in a one-to-one correspondence with the needle tips of several probes 111, so that the clean gas ejected from each inclined air guide channel 122 is purged separately along the extension direction of the corresponding probe 111. That is, the inclined air guide channel 122 corresponds to the probe 111 at the same angle, so that the clean gas flow ejected from each inclined air guide channel 122 is concentrated on the needle tip of the corresponding probe 111 and purged along the needle outlet direction of the probe 111, which is conducive to cleaning the probe 111 more cleanly.

[0035] In some embodiments of the utility model, the radial air guide channel includes at least one of an annular air guide channel, a disc-shaped air guide channel, an arc-shaped air guide channel and a linear air guide channel. This is conducive to guiding the clean gas to flow toward the inclined air guide channel, so that the clean gas flow is concentrated on the needle tip of the probe and swept along the needle exit direction of the probe, which is conducive to cleaning the probe more cleanly.

[0036] In some specific embodiments of the present utility model, reference Figure 4The radial air guide channel 123 includes a disc-shaped air guide channel. One end of the disc-shaped air guide channel is connected to the air inlet member 2 through the air inlet end 11, and the other end of the disc-shaped air guide channel is provided with a plurality of air guide ports to be connected to a plurality of the inclined air guide channels 122 respectively.

[0037] In some other specific embodiments of the utility model, the radial air-guiding channel includes an annular air-guiding channel and at least two linear air-guiding channels, the annular air-guiding channel is arranged close to the edge of the air-guiding member, and the at least two linear air-guiding channels radially extend from the air inlet end to the edge of the air-guiding member, that is, the at least two linear air-guiding channels are radially distributed in the air-guiding member along the radial direction of the air-guiding member with the air inlet end as the center, and one end of the at least two linear air-guiding channels is connected to the air inlet member through the air inlet end, and the other end of the at least two linear air-guiding channels is connected to the annular air-guiding channel, and the annular air-guiding channel is provided with a plurality of air-guiding ports, which are respectively connected to a plurality of the inclined air-guiding channels.

[0038] In some specific embodiments of the utility model, the radial air guide channels include a plurality of straight air guide channels, and the plurality of straight air guide channels radially extend from the air inlet end to the edge of the air guide member, one end of the plurality of straight air guide channels is connected to the air inlet member through the air inlet end, and the other ends of the plurality of straight air guide channels are respectively connected to the plurality of inclined air guide channels one by one.

[0039] In the embodiment of the present invention, the radial direction is a direction perpendicular to the axial direction of the air guide member 1 .

[0040] In some embodiments of the present invention, reference Figures 2 to 4 The probe cleaning device also includes an exhaust component 3, and the exhaust component 3 includes a connected exhaust hose 31 and a gas collecting part 32. The exhaust hose 31 is fixedly arranged in the cavity of the machine 100 of the wafer acceptance test equipment, and the space in the cavity of the machine 100 is fully utilized to set the exhaust hose 31. The original components are slightly modified, and the original layout of the wafer acceptance test equipment is not affected, which effectively saves wiring space. The gas collecting part 32 is arranged around the probe card 110, that is, a gas circulation is formed around the probe card 110, which can effectively collect gas, so that the gas carrying impurities can be vacuumed away to avoid the blown-off metal debris from contaminating the machine 100.

[0041] In some specific embodiments of the present invention, the gas collecting member 32 is disposed on the upper surface of the top end of the platform 100 or above the top end of the platform 100 .

[0042] In some specific embodiments of the present invention, the exhaust hose 31 is connected to the exhaust vacuum valve (PV) 130, and the exhaust hose 31 is fixed to the inner wall of the cavity of the machine 100 through a wire buckle.

[0043] In some embodiments of the utility model, the gas collector includes at least one of an annular collector, an arc collector and a funnel collector, which is conducive to improving the gas collection effect. Wherein, the shape and number of the gas collector are selected according to the need, on the premise of not interfering with the mechanical movement of parts in the wafer acceptance test equipment.

[0044] In some embodiments of the present invention, a plurality of arc-shaped collecting members are provided and are arranged around the probe card 110 at equal intervals.

[0045] In some embodiments of the present invention, a plurality of funnel-shaped collecting members are provided and are arranged around the probe card 110 at equal intervals.

[0046] In some specific embodiments of the present utility model, reference Figures 2 to 4 The gas collecting member 32 includes two funnel-shaped collecting members, and the two funnel-shaped collecting members are relatively arranged on the symmetrical sides of the probe 111, so that a circulation is formed around the probe card to collect the gas mixed with metal debris, thereby improving the gas collection effect.

[0047] In some other specific embodiments of the utility model, the gas collecting piece includes two arc-shaped collecting pieces and two funnel-shaped collecting pieces, and the two arc-shaped collecting pieces and the two funnel-shaped collecting pieces are equally spaced around the probe 111, so that a circulation is formed around the probe card to collect gas mixed with metal debris, thereby improving the gas collection effect.

[0048] In some specific embodiments of the present invention, the gas collecting member 32 includes an annular collecting member, and the annular collecting member is disposed around the probe 111 .

[0049] Figure 5 It is a schematic diagram of assembling the air guide member and the fixing member in the probe cleaning device according to an embodiment of the utility model.

[0050] In some embodiments of the present invention, reference Figure 2 and Figure 5 The probe cleaning device further includes a fixing member 4, and the air guide member 1 is disposed in the hollow cavity 210 of the test head 200 through the fixing member 4. The test head 200 is located above the probe card 110, and the hollow cavity 210 is disposed opposite to the probe card 110. The hollow cavity 210 of the original test head 200 of the wafer acceptance test equipment is fully utilized, and the original components are slightly modified, and the original layout of the wafer acceptance test equipment is not affected. There is no need to add a new component for carrying the air guide member 1, and the investment cost is low.

[0051] In some embodiments of the present invention, reference Figure 5 The fixing member 4 includes a fixing portion 41 and a bearing portion 42, wherein the fixing portion 41 is fixedly disposed on the inner wall of the hollow cavity 210 of the test head 200, and the bearing portion 42 is disposed perpendicularly to the fixing portion 41 to bear and support the air guide 1. The structure is simple, and the air guide 1 can be placed on the bearing portion 42, and it is simple and convenient to install the air guide 1 in the hollow cavity 210 of the test head 200.

[0052] In some embodiments of the present invention, reference Figure 5 The fixing member 4 is in an inverted L-shaped structure, and at least two fixing members are provided, and at least two fixing members 4 are arranged at equal intervals in the hollow cavity 210 of the test head 200. The fixing member 4 has a simple structure, and it is simple and convenient to install and fix the fixing member 4 in the hollow cavity 210 of 200.

[0053] In some embodiments of the utility model, the bearing part includes an annular structure or at least two arc-shaped structures, the at least two arc-shaped structures are arranged around the inner wall of the hollow cavity of the test head at intervals along the circumferential direction, and the fixing part is provided with at least two, at least two fixing parts are arranged perpendicular to the annular structure at equal intervals, or at least two fixing parts are arranged perpendicularly to the at least two arc-shaped structures in a one-to-one correspondence. This is conducive to the stable support of the air guide.

[0054] In some specific embodiments of the utility model, the bearing portion includes an annular structure, and at least two fixing portions are provided, and at least two fixing portions are arranged at equal intervals and perpendicular to the annular structure, which is conducive to stable support of the air guide.

[0055] In other embodiments of the utility model, the bearing portion includes at least two arc-shaped structures, and the at least two arc-shaped structures are circumferentially spaced around the inner wall of the hollow cavity of the test head. The fixing portions are provided with at least two, and the at least two fixing portions are vertically arranged in a one-to-one correspondence with the at least two arc-shaped structures, which is conducive to stable support of the air guide.

[0056] In some embodiments of the present invention, the wafer acceptance test equipment includes the probe cleaning device.

[0057] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A probe cleaning device, characterized in that: include: An air inlet member for providing clean gas; An air guide member is arranged above the probe card, and the air inlet end of the air guide member is connected to the air inlet member. An air guide channel is arranged in the air guide member, and the air guide channel includes a plurality of air outlet ends arranged at the bottom end of the air guide member, and the plurality of air outlet ends are arranged in one-to-one correspondence with the needle tips of the plurality of probes in the probe card, so that the cleaning gas ejected from the air guide channel is swept toward the needle tips of the probes.

2. The probe cleaning device according to claim 1, characterized in that: The air inlet end of the air guide is connected to the air inlet in the middle of the top surface of the air guide, and the air guide channel includes a plurality of inclined air guide channels extending toward the bottom end of the air guide, and the end of the inclined air guide channel is the air outlet.

3. The probe cleaning device according to claim 2, characterized in that: The inclined air guide channel extends from the air inlet end to the bottom end of the air guide member, and the inclined air guide channel is radially distributed in the air guide member along a direction inclined to the axis of the air guide member and away from the air inlet end. The air outlet ends of several of the inclined air guide channels are respectively arranged in one-to-one correspondence with the needle tips of several of the probes, so that the cleaning gas ejected from each of the inclined air guide channels can be individually purged toward the needle tip of the corresponding probe.

4. The probe cleaning device according to claim 2, characterized in that: The air guide channel also includes a radial air guide channel, one end of which is connected to the air inlet member, and the other end of which is connected to the inclined air guide channel, and the inclined air guide channel is distributed in the air guide member in a convergent shape along a direction inclined to the axis of the air guide member and away from the air inlet end, and the air outlet ends of several of the inclined air guide channels are respectively arranged in one-to-one correspondence with the needle tips of several of the probes, so that the clean gas ejected from each of the inclined air guide channels can be purged separately along the extension direction of the corresponding probe.

5. The probe cleaning device according to claim 1, characterized in that: It also includes a fixing member, through which the air guide member is arranged in the hollow cavity of the test head. The test head is located above the probe card, and the hollow cavity is arranged opposite to the probe card.

6. The probe cleaning device according to claim 1, characterized in that: It also includes an exhaust component, which includes a connected exhaust hose and a gas collecting piece. The exhaust hose is fixedly arranged in the machine cavity of the wafer acceptance test equipment, and the gas collecting piece is arranged around the probe card.

7. The probe cleaning device according to claim 5, characterized in that: The fixing member includes a fixing portion and a bearing portion. The fixing portion is fixedly arranged on the inner wall of the hollow cavity of the test head, and the bearing portion is vertically arranged with the fixing portion to bear and support the air guide member.

8. The probe cleaning device according to claim 5 or 7, characterized in that: The fixing member is in an inverted L-shaped structure. There are at least two fixing members, and at least two fixing members are arranged in the hollow cavity of the test head at equal intervals.

9. The probe cleaning device according to claim 7, characterized in that: The bearing portion includes an annular structure or at least two arc-shaped structures, and the at least two arc-shaped structures are circumferentially spaced around the inner wall of the hollow cavity of the test head. The fixing portions are provided with at least two, and at least two of the fixing portions are equally spaced and perpendicular to the annular structure, or at least two of the fixing portions are perpendicularly arranged in a one-to-one correspondence with the at least two arc-shaped structures.

10. The probe cleaning device according to claim 4, characterized in that: The radial air guiding channel includes at least one of an annular air guiding channel, a disc-shaped air guiding channel, an arc-shaped air guiding channel and a straight-line air guiding channel.

11. The probe cleaning device according to claim 6, characterized in that: The gas collecting piece includes at least one of an annular collecting piece, an arc-shaped collecting piece and a funnel-shaped collecting piece.

12. A wafer acceptance test device, characterized in that: The invention comprises a probe cleaning device as claimed in any one of claims 1 to 11.

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